MT25QU01GBBB8E12E-0AUT - 1Gb SPI NOR Flash 133MHz | Micron
部品番号: MT25QU01GBBB8E12E-0AUT ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $6.2 | $6.20 |
| 10 | $5.6 | $56.00 |
| 100 | $4.95 | $495.00 |
| 500 | $4.4 | $2,200.00 |
| 1,000 | $3.95 | $3,950.00 |
MT25QU01GBBB8E12E-0AUT 概要
Serial NOR flash is a non-volatile memory category that stores code and data without power, accessed over a serial peripheral interface (SPI) rather than a parallel bus. Within the memory hierarchy, it sits alongside SPI NAND and parallel NOR as code-storage media, and is widely used as boot memory for processors, microcontrollers, FPGAs, and SoCs where reliability, fast random access, and execute-in-place (XIP) capability matter more than raw density.
Key features of this device include quad I/O (QIO) and dual I/O (DIO) command sets that reduce pin count while multiplying effective bandwidth, a 133 MHz maximum clock for high-throughput code shadowing, a 1.8 V core supply suited to low-power and battery-operated designs, and the industrial-extended automotive temperature range. The MT25Q family architecture provides uniform 64 KB (and 4 KB subsector) erasability with page programming, supporting efficient firmware update strategies.
Technically, the MT25QU01GB uses Micron's multi-I/O serial flash core with standard SPI, dual SPI, and quad SPI protocols, allowing a single footprint to serve designs ranging from basic x1 boot code storage to high-bandwidth quad-I/O XIP execution. The BGA ball grid array improves board-level reliability versus SOIC packages and supports automated optical inspection in automotive production flows.
Typical applications include automotive infotainment and ADAS boot code storage, FPGA configuration memory, embedded Linux/RTOS root code storage, and industrial control systems requiring extended temperature operation.
Design-wise, verify hold and setup timing at 133 MHz quad operation, and implement a stable 1.8 V rail with adequate decoupling; deep power-down modes help meet low standby power budgets.
This page synthesizes distributor pricing tiers, drop-in alternatives from the same Micron MT25Q family, and practical design notes beyond what the manufacturer datasheet provides.
ドロップイン代替品: MT25QU01GBBB8E12E-0AUT — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MT25QU01GBBB8E12E-0AUT （同一形状・フットプリント） — 相違点: Interface, Organization, Memory Type, Write Protection, Mounting Type.
クイック比較ツール — 並列比較する代替部品を選択:
MT25QU01GBBB8E12-0AUT
✅ ドロップイン✓ 在庫あり
$7.1 / 個
データシートを見る →MT25QL01GBBB8E12-0AUT
✅ ドロップイン✓ 在庫あり
$4.65 / 個
データシートを見る →MT25QU512ABB8E12-0AUT
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →MT25QU02GCBB8E12-0AUT
✅ ドロップイン✓ 在庫あり
$10.9 / 個
データシートを見る →MT25QL02GCBB8E12-0AUT
✅ ドロップイン✓ 在庫あり
$7.65 / 個
データシートを見る →MT25QU01GBBB8E12E-0AUT 最大定格＆電気的特性
| メモリタイプ | NOR Flash, Serial (SPI) |
| Density | 1 Gbit (128 MB) |
| メモリ構成 | 128M x 8 |
| 電源電圧 | 1.8 V |
| Max Clock Frequency | 133 MHz |
| インターフェース | SPI, Dual SPI, Quad SPI (x1/x2/x4) |
| パッケージ | 24-ball T-PBGA (6 x 8 mm) |
| FBGA Code | RW320 |
| 動作温度 | -40C to +125C |
| 実装タイプ | Surface Mount (BGA) |
| Automotive Grade | Yes (AUT suffix) |
| Product Longevity Program | No |
| Marking Code | RW320 |
| Access Type | Execute-in-place (XIP) capable |
| Program/Erase Architecture | Page program with 4 KB subsector / 64 KB sector erase |
MT25QU01GBBB8E12E-0AUT 24-ball t-pbga (6 x 8 mm) ピン配置ガイド
MT25QU01GBBB8E12E-0AUT (24-ball t-pbga (6 x 8 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MT25QU01GBBB8E12E-0AUT.
詳細は データシート をご参照ください。
主な用途
MT25QU01GBBB8E12E-0AUT の用途: 6 件s: FPGA Configuration Storage, Automotive Infotainment and ADAS Boot Memory, Embedded Linux / RTOS Root Code Storage, Industrial Control and Automation Systems, Networking and Communication Equipment, Smart Meters and IoT Edge Devices.
FPGA Configuration Storage
The MT25QU01GBBB8E12E-0AUT stores FPGA bitstreams with 1 Gbit capacity - enough for multiple full configuration images plus a golden fallback image. Its quad SPI interface at 133 MHz delivers four bits per clock, minimizing configuration time at power-up, which matters for systems with strict boot deadlines such as automotive camera modules and industrial drives. The 4 KB subsector erase lets firmware updaters rewrite the active image without disturbing the golden image in adjacent sectors. Placed on the same 1.8 V rail as the FPGA bank, it avoids level shifters; verify the FPGA's quad-SPI controller supports the MT25Q continuous-read (XIP) command set for fastest loading.
おすすめ
Automotive Infotainment and ADAS Boot Memory
With the AUT suffix and a -40C to +125C operating range, this device targets automotive-grade code storage for infotainment SoCs, ADAS domain controllers, and gateway modules. NOR flash is preferred over NAND for boot partitions because of its fast random access and high reliability, and the 1 Gbit density comfortably holds bootloader, RTOS image, and calibration data. The 24-ball 6 x 8 mm PBGA survives automotive vibration and thermal cycling better than gull-wing packages. Designers should budget for a stable 1.8 V rail with low-ESR decoupling near the BGA and confirm AEC qualification certificates with Micron for production release.
おすすめ
Embedded Linux / RTOS Root Code Storage
For embedded Linux or RTOS systems, the MT25QU01GBBB8E12E-0AUT serves as the root code-storage medium holding the kernel, device tree, and compressed root filesystem. The 133 MHz quad SPI bus provides read bandwidth that keeps XIP or shadow-to-RAM boot times in the sub-second range, while 128 MB capacity suits minimalist Linux builds. Page program with 4 KB subsector erase enables wear-managed journalling filesystems such as JFFS2 or littlefs. Because NOR offers better bad-block behavior than NAND at this density, it is a strong choice when reliability outweighs capacity. Pair with DRAM for runtime execution.
おすすめ
Industrial Control and Automation Systems
Industrial PLCs, motor drives, and factory automation controllers use this device for firmware and parameter storage, benefiting from the extended -40C to +125C temperature rating that covers sealed enclosures near heat sources. The 1.8 V supply reduces overall system power versus 3 V NOR, easing thermals in passively cooled cabinets. Uniform 64 KB sector erase supports structured firmware layouts with versioned parameter blocks. Its BGA package withstands industrial vibration on rotating machinery. Designers should implement CRC-protected dual firmware banks to enable safe over-the-network updates in the field without a service visit.
おすすめ
Networking and Communication Equipment
Routers, switches, and base-station line cards boot from serial NOR flash, and this device's quad SPI at 133 MHz shortens link-bring-up time while 1 Gbit holds bootloader plus network OS images. The low 1.8 V rail integrates cleanly with modern networking SoCs and reduces noise coupling on dense boards. In telecom designs where unplanned downtime is costly, NOR's high read endurance and deterministic access latency make it the trusted boot medium ahead of eMMC or NAND. Layout-wise, keep the quad-SPI traces short and length-matched under the BGA to preserve signal integrity at 133 MHz.
おすすめ
Smart Meters and IoT Edge Devices
Smart energy meters, gateways, and IoT edge nodes store firmware, metering logs, and security keys in this 1 Gbit NOR flash. The 1.8 V operation aligns with battery-backed and energy-harvesting power budgets, and deep power-down modes minimize standby drain between wake cycles. The automotive temperature rating comfortably exceeds the -40C to +85C outdoor metering envelope, adding margin for enclosure solar heating. A dedicated sector can hold cryptographic keys with 4 KB granularity so firmware updates never touch the secure region. Verify the host MCU's QSPI controller timing at 133 MHz or clock down for margin.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MT25QU01GBBB8E12E-0AUT — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MT25QU01GBBB8E12-0AUT | MT25QL01GBBB8E12-0AUT | MT25QU512ABB8E12-0AUT | MT25QU02GCBB8E12-0AUT | MT25QL02GCBB8E12-0AUT |
|---|---|---|---|---|---|---|
| Package | 24-T-PBGA (6x8 mm) | 24-T-PBGA (6x8 mm) - same | 24-T-PBGA (6x8 mm) - same | 24-T-PBGA (6x8 mm) - same | 24-T-PBGA (6x8 mm) - same | 24-T-PBGA (6x8 mm) - same |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Density | 1 Gbit | 1 Gbit | 1 Gbit | 512 Mb | 2 Gb | 2 Gb |
| Supply Voltage | 1.8 V | 1.8 V | 3.0 V | 1.8 V | 1.8 V | 3.0 V |
| Max Clock Frequency | 133 MHz | 133 MHz | 133 MHz | 133 MHz | 133 MHz | 133 MHz |
| I/O Width | x1/x2/x4 | x1/x2/x4 | x1/x2/x4 | x1/x2/x4 | x1/x2/x4 | x1/x2/x4 |
主な差別化要因
- Automotive temperature range in same footprint （vs MT25QL128ABB8E12-0AUT)
- 1.8 V operation for low-power systems （vs MT25QL01GBBB8E12-0AUT)
- High density in small 6 x 8 mm BGA （vs MT25QU512ABB8E12-0AUT)
設計ノート
Route the quad SPI bus (SCLK, SI/SO, WP#/IO2, HOLD#/IO3, CS#) as short, length-matched traces beneath the 24-ball PBGA. At 133 MHz, keep trace stubs under 50 mm and add series termination (22-33 ohm) on SCLK if the host driver is strong. Ball assignment follows the Micron MT25Q datasheet ballout table; do not assume the pinout transfers from other vendors' 24-ball BGA NOR parts without verification.
Supply the device from a clean 1.8 V rail (per Mouser: 1.8 Volts) with a 100 nF ceramic capacitor placed within 2 mm of the VCC balls plus a 4.7 uF bulk capacitor per device. Active read and program/erase currents peak during quad operation - size the regulator for the datasheet's worst-case program current, not just standby. If sharing the rail with the host SoC, add a ferrite bead to isolate flash switching transients from sensitive analog rails.
HOLD#/IO3 must be driven high (or pulled up) during standard SPI operation or the device will enter hold mode and stall transfers. WP#/IO2 must likewise be high unless write protection is intended - an accidental low disables quad output mode in some command sets. During firmware updates, never power-cycle mid-erase; implement a status-flag check after every erase/program operation and reserve a golden boot sector as recovery insurance.
The 24-ball T-PBGA is a thermally enhanced package and serial NOR dissipates little power in typical read use (tens of mW), so heatsinking is not required. However, in solder-reflow and automotive under-hood conditions, verify that junction temperature stays within the -40C to +125C rating by summing ambient extremes with self-heating, which is minimal for this device class. Estimated: even at 30 mW dissipation, junction rise above ambient is well under 1 C/W-magnitude concern for this package.
コンプライアンス情報
AUT suffix denotes automotive temperature flow (-40C to +125C) per Micron datasheet listing. RoHS/REACH/lead-free status was not stated in retrieved distributor data - confirm via Micron product page compliance documents. Product Longevity Program: No per DigChip data excerpt.
