MT25QL128ABB8E12-0AUT - 128Mb SPI NOR Flash 133MHz | Micron
部品番号: MT25QL128ABB8E12-0AUT ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $5.86 | $5.86 |
| 10 | $5.27 | $52.70 |
| 100 | $4.71 | $471.00 |
| 500 | $4.24 | $2,120.00 |
| 1,000 | $3.82 | $3,820.00 |
| 3,000 | $3.62 | $10,860.00 |
MT25QL128ABB8E12-0AUT 概要
A serial NOR flash memory is a non-volatile storage device that stores code and data with byte-level random access over a serial peripheral interface (SPI). In the memory hierarchy, NOR flash sits alongside DRAM and SRAM as code-storage media, distinguished by its execute-in-place (XIP) capability, which lets processors boot directly from the array without copying code to RAM first.
Key features of the MT25Q family include quad I/O (x4 bus-width) operation that quadruples effective throughput compared with single-lane SPI, 133 MHz clock frequency for high read bandwidth, and 45nm process technology that reduces cost per bit while preserving NOR endurance and reliability. The automotive-rated (-AUT) suffix targets AEC-grade deployment with extended -40C to +125C operation.
Technically, the device is organized as 128 Mbit with multiple I/O command support (extended SPI and dual/quad protocols), supplied at a nominal 3.0V VDD, and housed in a 6.00 x 8.00 x 1.20 mm 24-ball thermally enhanced PBGA on a 5 x 5 ball array. The BGA ball-grid attachment provides robust solder joints and good signal integrity for high-frequency SPI buses compared with leaded packages.
Typical applications include automotive infotainment and ADAS code storage, FPGA and SoC boot flashes, industrial PLC firmware banks, and networking equipment configuration storage, where XIP execution and fast quad reads shorten boot times.
For design, hold RESET and the DQ2/DQ3 HOLD pins at defined levels during power-up, and verify that your host controller supports the Micron MT25Q extended-SPI command set before substitution.
This page synthesizes distributor pricing, same-footprint drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
ドロップイン代替品: MT25QL128ABB8E12-0AUT — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MT25QL128ABB8E12-0AUT （同一形状・フットプリント） — 相違点: Supply Voltage, Interface, Memory Type, Package, Density.
クイック比較ツール — 並列比較する代替部品を選択:
MT25QL512ABB8E12-0AUT
✅ ドロップイン✓ 在庫あり
$10.55 / 個
データシートを見る →MT25QL01GBBB8E12-0AUT
✅ ドロップイン✓ 在庫あり
$4.65 / 個
データシートを見る →MT25QL02GCBB8E12-0AUT
✅ ドロップイン✓ 在庫あり
$7.65 / 個
データシートを見る →MT25QU128ABB8E12-0AUT
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MT25QU512ABB8E12-0AUT
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →MT25QL128ABB8E12-0AUT 最大定格＆電気的特性
| Density | 128 Mbit (16 MB) |
| メモリタイプ | Serial NOR Flash |
| インターフェース | SPI - Quad I/O (x4) |
| 最大クロック周波数 | 133 MHz |
| 電源電圧 | 3.0 V (nominal) |
| Technology | 45 nm |
| パッケージ | 24-T-PBGA (6x8 mm), 5x5 ball array |
| Package Dimensions | 6.00 x 8.00 x 1.20 mm |
| FBGA Code | RW318 |
| 動作温度 | -40C to +125C |
| Automotive Grade | Yes (-AUT suffix) |
| Bus Width | x4 (Quad I/O) |
| 実装タイプ | Surface Mount (BGA) |
| Execute In Place (XIP) | Supported (serial NOR) |
| RoHS ステータス | Compliant |
MT25QL128ABB8E12-0AUT 6.00 x 8.00 x 1.20 mm ピン配置ガイド
MT25QL128ABB8E12-0AUT (6.00 x 8.00 x 1.20 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MT25QL128ABB8E12-0AUT.
詳細は データシート をご参照ください。
主な用途
MT25QL128ABB8E12-0AUT の用途: 6 件s: Automotive Infotainment and Cluster Code Storage, FPGA Configuration Storage, Industrial PLC and Automation Firmware Bank, Networking and Communication Equipment, Embedded Linux / IoT Gateway Boot Media, Test and Measurement Instrument Firmware.
Automotive Infotainment and Cluster Code Storage
The MT25QL128ABB8E12-0AUT's -AUT automotive rating (-40C to +125C) and 128Mb density make it a strong fit for boot and application code in automotive infotainment head units and digital clusters. Its 133 MHz quad-I/O interface delivers roughly four times the read bandwidth of single-lane SPI at the same clock, cutting boot time when the host processor executes code in place (XIP) directly from the NOR array. Placed on the QSPI bus of an automotive SoC with 3.0V I/O signaling, the 24-ball T-PBGA package survives under-hood-adjacent thermal profiles. Designers should budget erase/program latency into firmware update routines, as NOR sector erase times dominate OTA update windows.
おすすめ
FPGA Configuration Storage
The MT25QL128ABB8E12-0AUT serves as a configuration bitstream flash for FPGAs and SoCs that support Micron MT25Q/QSPI boot modes. At 128Mb it stores multiple configuration images for a mid-size FPGA, enabling multi-image fallback via a programmable address offset on the QSPI bus. The 133 MHz quad-I/O read rate directly reduces FPGA configuration time versus x1 SPI loading; at x4 this can shave hundreds of milliseconds from power-on-to-operational latency. The 24-ball T-PBGA 6x8 mm footprint fits tightly beside the FPGA on dense boards. Verify the host FPGA configuration controller supports the MT25Q extended-SPI read command set, and hold RESET deassertion until VDD is stable per the datasheet power-up sequence.
おすすめ
Industrial PLC and Automation Firmware Bank
In industrial programmable logic controllers, motor drives, and automation modules, the MT25QL128ABB8E12-0AUT stores firmware, parameter sets, and event logs. The extended -40C to +125C operating range covers unventilated control cabinets where ambient temperatures approach automotive limits, and the 45nm NOR technology provides the reliability expected for non-volatile code storage. Quad-I/O reads at 133 MHz let the host MCU or MPU boot quickly after power cycles common in factory environments. The 3.0V supply integrates cleanly with 3.3V-tolerant industrial logic (verify absolute maximum ratings). Use dual-bank firmware layout across the 16 MB array to enable safe in-field updates with rollback capability on corruption.
おすすめ
Networking and Communication Equipment
Routers, switches, and base-station line cards use the MT25QL128ABB8E12-0AUT for boot loader, network OS image, and configuration storage. The 133 MHz quad-I/O interface shortens time-to-boot, an important metric for carrier equipment availability targets, while XIP execution reduces DRAM sizing for the boot stage. The 24-ball T-PBGA package offers robust solder joints under thermal cycling typical of telecom racks with forced-air cooling. Its 3.0V nominal supply aligns with standard 3.3V logic domains used on control planes. Designers should place 100 nF decoupling close to each supply ball and keep the SPI clock trace short and length-matched against DQ lines for full-speed quad operation.
おすすめ
Embedded Linux / IoT Gateway Boot Media
Embedded Linux gateways and IoT edge devices boot from the MT25QL128ABB8E12-0AUT using U-Boot plus a compressed kernel image staged into RAM. The 16 MB density typically holds a two-stage bootloader, a redundant kernel slot, and a device tree, with application payloads offloaded to eMMC or NAND. Quad-I/O reads at 133 MHz reduce boot-loader and kernel fetch time materially versus x1 SPI. The 24-ball T-PBGA (6x8 mm) footprint conserves board area on gateway modules. Engineers should enable MT25Q quad commands in the bootloader and confirm the flash's power-up timing meets the host SoC reset sequence, since early SPI transactions before flash-ready cause boot failures.
おすすめ
Test and Measurement Instrument Firmware
Bench instruments, data loggers, and modular measurement hardware use the MT25QL128ABB8E12-0AUT to store calibration constants, firmware, and self-test routines. NOR byte-level random access supports direct execution of calibration code paths and in-place reading of lookup tables without RAM staging, and the 133 MHz quad interface keeps instrument power-on self-test fast. The -40C to +125C rating covers bench and light-industrial environments with margin. The 24-ball T-PBGA withstands repeated thermal cycles from instrument warm-up. Preserve a protected sector region for factory calibration data, and implement a CRC check over the firmware image at every boot to detect corruption from unexpected power loss.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MT25QL128ABB8E12-0AUT — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MT25QL512ABB8E12-0AUT | MT25QL01GBBB8E12-0AUT | MT25QL02GCBB8E12-0AUT | MT25QU128ABB8E12-0AUT | MT25QU512ABB8E12-0AUT |
|---|---|---|---|---|---|---|
| Package | 24-T-PBGA (6x8 mm) | 24-T-PBGA (6x8 mm) - same | 24-T-PBGA (6x8 mm) - same | 24-T-PBGA (6x8 mm) - same | 24-T-PBGA (6x8 mm) - same | 24-T-PBGA (6x8 mm) - same |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Density | 128 Mbit (16 MB) | 512 Mbit (64 MB) | 1 Gbit (128 MB) | 2 Gbit (256 MB) | 128 Mbit (16 MB) | 512 Mbit (64 MB) |
| Supply Voltage | 3.0 V (nominal) | 3.0 V (nominal) | 3.0 V (nominal) | 3.0 V (nominal) | 1.8 V (nominal) | 1.8 V (nominal) |
| Max Clock Frequency | 133 MHz | 133 MHz | 133 MHz | 133 MHz | 133 MHz | 133 MHz |
| Interface | SPI - Quad I/O (x4) | SPI - Quad I/O (x4) | SPI - Quad I/O (x4) | SPI - Quad I/O (x4) | SPI - Quad I/O (x4) | SPI - Quad I/O (x4) |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
主な差別化要因
- Automotive temperature rating in a 24-ball T-PBGA （vs Winbond W25Q128JV)
- 133 MHz quad-I/O throughput for fast boot （vs MT25QL128ABA8E12-0AAT (lower-speed variant family))
- Footprint-compatible density scaling （vs MT25QL512ABB8E12-0AUT)
設計ノート
As a 24-ball BGA, this device requires a precise land pattern per the Micron package outline (6.00 x 8.00 mm, 5x5 ball array, 1.20 mm height). Place 100 nF ceramic decoupling capacitors within 2-3 mm of the VDD balls, one per supply pair, plus a bulk 4.7-10 uF capacitor near the device. Inspect BGA solder joints with X-ray or AOI in production - optical inspection alone cannot verify ball reflow. Follow the datasheet land-pattern dimensions exactly; do not shrink pads for density, as this jeopardizes solder wetting on the thermally enhanced T-PBGA.
At the full 133 MHz quad-I/O clock, keep the SPI bus short (preferably under 100 mm total) and treat SCLK as a controlled-impedance line. Length-match DQ0-DQ3 to SCLK within a few tens of millimeters and series-terminate the clock (22-33 ohm) if reflections appear. Ensure solid return paths under the bus - avoid routing QSPI traces across plane splits. If quad reads show bit errors at temperature extremes, reduce the clock or verify that the host drive strength and IBIS-based timing analysis support full-frequency margin at -40C and +125C.
Do not substitute MT25QL (3.0V) and MT25QU (1.8V) family parts on the same footprint without changing the supply rail - the families are not electrically interchangeable despite identical packages. Observe the datasheet power-up sequence: hold RESET/HOLD pins at defined levels until VDD is stable, or the device may enter an undefined state. Verify the host controller command set matches the MT25Q extended-SPI quad protocol before second-sourcing to Winbond W25Q128JV or Infineon S25FL128S, whose quad command opcodes differ from Micron's.
コンプライアンス情報
RoHS compliant per LCSC datasheet listing. Automotive suffix (-AUT) indicates -40C to +125C rating per Micron catalog; formal AEC-Q100 qualification documents must be requested from Micron. REACH and halogen-free status not stated in provided web data.
