MT68A512M32DF-28:A - GDDR7 16Gbit 28Gbps | Micron
部品番号: MT68A512M32DF-28:A ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $70.3125 | $70.31 |
| 10 | $50.7813 | $507.81 |
| 100 | $44.9219 | $4,492.19 |
| 500 | $42.9688 | $21,484.40 |
| 1,000 | $41.0156 | $41,015.60 |
MT68A512M32DF-28:A 概要
GDDR7 (Graphics Double Data Rate 7) is the latest generation of high-bandwidth graphics DRAM, succeeding GDDR6 and GDDR6X. Graphics DRAM sits within the broader memory hierarchy of volatile semiconductor memory: DRAM -> synchronous DRAM -> graphics DRAM -> GDDR family. Unlike DDR5, which prioritizes capacity per channel for CPUs, GDDR prioritizes aggregate bandwidth for GPU workloads, using wider per-device interfaces and PAM3 signaling introduced in the GDDR7 generation to raise per-pin data rates.
Key features of this device include the 16 Gbit density (2GB per chip), a 32-bit memory organization, and the 28 Gbps data rate, which matches the memory speed used by NVIDIA GeForce RTX 50 series cards such as the RTX 5060. The TFBGA package provides the short, controlled-impedance ball-out required for multi-gigabit signal integrity on graphics PCBs.
Architecturally, GDDR7 devices retain a SDRAM-style bank/row/column core while adopting PAM3 (3-level pulse amplitude modulation) I/O, which transmits three bits over two cycles and reduces the required clock frequency relative to NRZ signaling at equivalent bandwidth. This lowers power and EMI at 28 Gbps while supporting the trainability and error-tolerance features expected in modern GPU memory subsystems.
Typical applications include discrete graphics cards for gaming and workstation platforms, AI inference accelerators, video capture and broadcast equipment, and high-performance edge computing modules that require multi-hundred-GB/s memory bandwidth per chip.
A key design consideration is supply chain risk: this exact part was marked EOL in September 2026 as Micron shifts 2GB GDDR7 capacity to denser 24Gb (3GB) devices, so new designs should qualify alternate density or speed grades early and secure last-time-buy inventory.
This page synthesizes distributor listings, lifecycle reporting, and drop-in alternative guidance not found on a single manufacturer page, providing engineers a consolidated sourcing and design view.
ドロップイン代替品: MT68A512M32DF-28:A — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
MT68A512M32DF-32:A
📋 参考代替品（カタログ未掲載）
MT68A512M32DF-16:A
📋 参考代替品（カタログ未掲載）
MT68A1G32DF-28:A
📋 参考代替品（カタログ未掲載）
MT68A512M32DF-28:A 最大定格＆電気的特性
| メモリタイプ | SDRAM - GDDR7 Graphics DRAM |
| メモリサイズ | 16 Gbit (2 GB) |
| Memory Organization | 32 (x32) |
| データレート | 28 Gbps (per pin, effective) |
| インターフェース | Parallel, GDDR7 (PAM3) |
| パッケージ | TFBGA (266-ball) |
| 実装タイプ | Surface Mount |
| Technology | DRAM |
| Supplier Device Package | TFBGA |
| Base Part Number | MT68A512M32DF |
| Speed Grade Suffix | -28 (28 Gbps) |
| ライフサイクル状態 | End of Life (announced September 2026) |
MT68A512M32DF-28:A tfbga ピン配置ガイド
MT68A512M32DF-28:A (tfbga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MT68A512M32DF-28:A.
詳細は データシート をご参照ください。
主な用途
MT68A512M32DF-28:A の用途: 6 件s: Discrete Graphics Cards (Gaming), AI Inference Accelerators, Video Capture and Broadcast Systems, Workstation Graphics, Networking and Security Appliances, Medical Imaging and Diagnostics.
Discrete Graphics Cards (Gaming)
The MT68A512M32DF-28:A was designed for mainstream discrete gaming GPUs such as the NVIDIA GeForce RTX 5060, whose 28 Gbps memory clock matches this chip's speed grade exactly. Eight devices on a 256-bit bus provide 8GB and roughly 896 GB/s of aggregate bandwidth, sufficient for 1080p/1440p gaming frame buffers and textures. The PAM3-based GDDR7 interface reduces signaling power versus GDDR6 at equivalent bandwidth, which matters in power-constrained consumer card designs. Board designers place the chips around the GPU with matched-length fly-by routing; the trade-off is stricter eye-margin validation than GDDR6 layouts.
おすすめ
AI Inference Accelerators
Edge AI inference cards and accelerator modules use GDDR7 for its high bandwidth-per-watt and moderate cost versus HBM. The 28 Gbps data rate and 32-bit interface of the MT68A512M32DF-28:A deliver about 112 GB/s per device, letting a ring of four to eight chips feed transformer or CNN inference engines with several hundred GB/s. The 2GB per package suits models quantized to INT8/FP8. Designers should note that EOL status makes this part unsuitable for new accelerator programs; qualify the active 24Gb (3GB) GDDR7 devices instead, using this part only for sustaining existing builds.
おすすめ
Video Capture and Broadcast Systems
Multi-channel 4K/8K video capture, frame synchronization, and broadcast playout systems require large, fast frame buffers. The MT68A512M32DF-28:A provides 16Gbit per chip; grouping several devices yields tens of gigabytes of frame store at over 100 GB/s per chip, enough to hold multiple uncompressed 4K60 frames with headroom for real-time overlays and format conversion. GDDR7's high bandwidth avoids the refresh bottlenecks of DDR4/DDR5 DIMM-based designs in embedded broadcast appliances. Since the part is EOL, broadcast OEMs should lock in last-time-buy quantities or migrate frame-store designs to the 3GB GDDR7 packages.
おすすめ
Workstation Graphics
Professional workstation GPUs for CAD, DCC, and simulation use GDDR7 to combine near-HBM bandwidth with cost-effective capacity scaling. The 32-bit MT68A512M32DF-28:A allows board designers to populate 4, 8, or 16 chips for 8GB to 32GB frame buffers at 28 Gbps, delivering up to roughly 1.8 TB/s on a 512-bit design. Thermal design centers on the TFBGA package and its thermal interface to the card heatsink, keeping junction temperature within datasheet limits under sustained CUDA/OpenGL loads. Workstation vendors sustaining existing boards should verify remaining distributor stock, as 2GB GDDR7 supply narrowed after the September 2026 discontinuation.
おすすめ
Networking and Security Appliances
High-throughput network inspection, firewall, and 5G datapath appliances use GDDR7 as deep packet buffer memory. The 28 Gbps per-pin rate and 112 GB/s per device bandwidth of the MT68A512M32DF-28:A let a compact buffer subsystem absorb 400GbE line-rate bursts that would overflow DDR4-based buffering at equivalent latency. The PAM3 interface also reduces pin count and signal-integrity complexity versus GDDR6X. Because these appliances have long service lives and the chip is EOL, designers should size a last-time-buy to cover the appliance's support lifetime or requalify the buffer subsystem on active 3GB GDDR7 devices.
おすすめ
Medical Imaging and Diagnostics
Ultrasound, digital radiography, and real-time diagnostic imaging pipelines demand very fast, deep line- and frame-buffer memory. A ring of MT68A512M32DF-28:A devices supplies multi-hundred-GB/s buffering that keeps beamforming, reconstruction, and display pipelines from starving at high frame rates. GDDR7's per-chip density simplifies buffer expansion: two chips give 4GB per imaging channel. Medical platforms carry long certification cycles, so the September 2026 EOL designation is significant - design teams should secure verified shelf stock for the certification period and document the MT68A1G32DF-class 3GB GDDR7 parts as the forward migration path.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MT68A512M32DF-28:A — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MT68A512M32DF-32 | MT68A512M32DF-16 | MT68A1G32DF-28 |
|---|---|---|---|---|
| Package | TFBGA (266-ball) | A: TFBGA (266-ball) - same | A: TFBGA (266-ball) - same | A: TFBGA (266-ball) - same |
| Brand | Micron Technology | A: Micron Technology | A: Micron Technology | A: Micron Technology |
| Density | 16 Gbit (2 GB) | A: 16 Gbit (2 GB) | A: 16 Gbit (2 GB) | A: 24 Gbit (3 GB) |
| Organization | 32 (x32) | A: 32 (x32) | A: 32 (x32) | A: 32 (x32) |
| Data Rate | 28 Gbps | A: 32 Gbps | A: 16 Gbps | A: 28 Gbps |
| Memory Type | GDDR7 (PAM3) | A: GDDR7 (PAM3) | A: GDDR7 (PAM3) | A: GDDR7 (PAM3) |
| Drop-in on Same Footprint | - | A: Yes - speed grade only | A: Yes - requires downclocked timings | A: Yes - timing/BOM requalification for new density |
主な差別化要因
- 28 Gbps speed grade aligned with RTX 5060-class GPUs （vs MT68A512M32DF-32:A)
- Cost-efficient 2GB per package （vs MT68A1G32DF-28:A (3GB class))
- Lower power and EMI via PAM3 signaling at 28 Gbps （vs MT68A512M32DF-16:A)
- End-of-Life status reduces forward supply （vs MT68A1G32DF-28:A)
設計ノート
GDDR7 at 28 Gbps uses PAM3 signaling, which is substantially more sensitive to channel loss, crosstalk, and reference-plane discontinuities than GDDR6 NRZ at comparable rates. Follow the GPU vendor reference design for trace impedance, length matching within each data group, and via minimization under the TFBGA fanout. Eye-scan/equalization training must be re-validated whenever a different speed grade (e.g., -32:A) is populated, even though the footprint is identical.
GDDR7 devices use separate VDD and VDDQ rails; exact voltage values must be taken from the Micron MT68A512M32DF datasheet rather than assumed from GDDR6 values. Estimated: at multi-hundred-GB/s sustained workloads each 2GB package dissipates several watts, so plan a shared power stage with bulk and 0.1uF-class ceramic decoupling per device close to the balls. Verify per-rail current from the datasheet IDD specifications before finalizing the VRM.
Supply-chain pitfall: both the -28:A and -32:A 2GB GDDR7 parts were designated End of Life in September 2026, so designs qualified on them face finite supply. Do not start new layouts on this part; if a last-time-buy is taken, over-procure against expected service-life demand plus attrition. Also avoid mixing speed grades across a single memory bus unless the memory controller is trained per-device - use homogeneous populations on each channel.
Although the TFBGA body is small, sustained graphics workloads transfer significant heat into the PCB. Estimated: a multi-layer board with solid internal copper planes and thermal vias under the package spreads heat effectively; follow the GPU reference design's copper area and airflow assumptions. Verify junction temperature against the datasheet thermal resistance for the chosen stackup, and confirm thermal interface coverage over the populated memory array in card-level thermal simulation.
コンプライアンス情報
Compliance details were not present in the retrieved distributor/manufacturer data. Micron typically publishes RoHS/REACH/conflict-minerals declarations per part on its product page; verify before regulatory sign-off.
