MVF60NN151CMK50 - Vybrid VF6xx Dual-Core 500MHz MPU | NXP
部品番号: MVF60NN151CMK50 ✓ 生産中MVF60NN151CMK50 概要
A microprocessor (MPU) in the Cortex-A class is a system-on-chip integrating a CPU core, memory controllers, and a wide peripheral set. Heterogeneous dual-core MPUs pair an application core (Cortex-A5, capable of running a high-level OS such as Linux or MQX) and a real-time microcontroller core (Cortex-M4) on the same silicon. This architecture belongs to the broader category of 32-bit microprocessors > microcontrollers > embedded processors > semiconductors, enabling developers to consolidate what would otherwise require two separate ICs.
Key features of the MVF60NN151CMK50 include dual 10/100 Ethernet controllers with integrated L2 switch, dual USB 2.0 OTG controllers with PHY, up to 1.5 MB of on-chip SRAM, a rich display controller (LCD), and a suite of communication peripherals including UART, SPI, I2C, CAN, and I2S. The device is offered without on-chip security (anti-clone/anti-tamper/secure boot) features in this specific -NN151 ordering code.
The architecture uses ARM NEON-compatible media processing on the A5 side and single-precision FPU plus DSP extensions on the M4 side, allowing concurrent execution of an HMI graphics stack on A5 and deterministic motor/IO control on M4 without context-switch jitter. The integrated L2-switch Ethernet enables daisy-chained industrial topologies without an external switch IC.
Typical applications include industrial HMI panels, programmable logic controllers (PLC), building automation gateways, smart energy concentrators, and medical patient-monitoring displays. Its dual-core split is well suited to systems where Linux-based graphics and a deterministic real-time control loop must share the same board.
When designing with this part, ensure the PCB supports the 17x17 mm BGA footprint with proper microvia stack-ups, and allocate sufficient decoupling (10 uF + 100 nF per supply domain) close to each BGA quadrant. Validate DDR3L trace lengths against the JEDEC DDR3L fly-by topology recommended in the NXP hardware design guide.
This page synthesizes distributor pricing, package-level cross-references within the Vybrid VF6xx family, and practical PCB/thermal notes that go beyond the manufacturer datasheet summary. Engineers comparing MVF60NN151CMK50 against MVF30 or MVF50 variants will find a parameter-by-parameter table and design notes specific to the 364-MAPBGA footprint.
ドロップイン代替品: MVF60NN151CMK50 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MVF60NN151CMK50 （同一形状・フットプリント） — 相違点: Package, Security Features, Core Architecture, Ethernet, Number of Cores.
MVF60NS151CMK50
✅ ドロップイン価格はお問い合わせください
データシートを見る →MVF60NN151CMK40
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PVF60NN151CMK50
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MVF60NN152CMK50
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MVF61NN151CMK50
✅ ドロップイン価格はお問い合わせください
データシートを見る →MVF60NN151CMK50 最大定格＆電気的特性
| Product Type | Heterogeneous Dual-Core Microprocessor (MPU) |
| Family | Vybrid VF6xx |
| Application Core | ARM Cortex-A5, 500 MHz max |
| Real-Time Core | ARM Cortex-M4 with FPU, 167 MHz max |
| Core Architecture | 32-bit ARMv7-A (A5) + ARMv7-M (M4) |
| On-Chip SRAM | Up to 1.5 MB |
| パッケージ | 364-MAPBGA (LFBGA 17x17 mm) |
| 実装タイプ | Surface Mount (BGA) |
| Ethernet | Dual 10/100 MAC with integrated L2 switch |
| USB | Dual USB 2.0 OTG with integrated PHY |
| Display Controller | Integrated LCD controller (TFT) |
| Security Features | None in -NN151 variant (no secure boot, no anti-tamper) |
| RoHS ステータス | Compliant |
| Lead-Free | Yes |
MVF60NN151CMK50 364-mapbga (lfbga 17x17 mm) ピン配置ガイド
MVF60NN151CMK50 (364-mapbga (lfbga 17x17 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MVF60NN151CMK50.
詳細は データシート をご参照ください。
主な用途
MVF60NN151CMK50 の用途: 7 件s: Industrial HMI Touch Panels, Programmable Logic Controllers (PLC), Building Automation Gateways, Smart Energy Concentrators, Medical Patient Monitoring Displays, Connected IoT Edge Gateways, Industrial Printer Controllers.
Industrial HMI Touch Panels
The MVF60NN151CMK50 is purpose-built for industrial HMI panels. Its integrated TFT LCD controller drives 24-bit displays directly without an external graphics controller, while the Cortex-A5 core at 500 MHz runs Qt or LVGL graphics stacks under Linux or MQX. The Cortex-M4 at 167 MHz handles touch input polling and real-time I/O without OS jitter. Dual 10/100 Ethernet with integrated L2 switch supports daisy-chained industrial networks, eliminating an external switch IC. Up to 1.5 MB SRAM buffers GUI frame updates at 60 Hz without perceptible lag.
おすすめ
Programmable Logic Controllers (PLC)
In PLC designs, the MVF60NN151CMK50's Cortex-M4 core delivers deterministic scan-time execution for IEC 61131-3 logic at sub-millisecond cycle times, while the Cortex-A5 handles web server visualization and Modbus TCP/IP Ethernet connectivity. The integrated dual CAN controllers support CANopen and DeviceNet master stacks. On-chip SRAM (1.5 MB) buffers ladder-logic state without external memory contention. Hardware floating-point on M4 accelerates PID loop math common in motion and process control.
おすすめ
Building Automation Gateways
The MVF60NN151CMK50 acts as a multi-protocol gateway between BACnet, KNX, Modbus, and Ethernet/IP networks in commercial building automation. The Cortex-A5 runs a Linux BACnet stack and web-based configuration UI, while the Cortex-M4 handles KNX/EIB physical layer timing with microsecond accuracy. Dual Ethernet with L2 switch supports daisy-chained topology common in building risers. USB OTG enables local commissioning via Wi-Fi/Bluetooth dongles without external host processors.
おすすめ
Smart Energy Concentrators
Smart energy data concentrators aggregate metering data from hundreds of end points over M-Bus, wireless M-Bus, or PLC. The MVF60NN151CMK50's dual Ethernet supports WAN-side connection to utility head-end and LAN-side daisy-chained meter buses. The Cortex-A5 core runs TLS-secured data push to cloud endpoints, while the Cortex-M4 handles time-critical M-Bus protocol decoding. Hardware crypto accelerators on A5 accelerate AES-128/256 for secure metering data.
おすすめ
Medical Patient Monitoring Displays
Patient monitoring displays require both crisp waveform rendering and fail-safe real-time vitals processing. The MVF60NN151CMK50's integrated LCD controller drives bedside TFT panels showing ECG/SpO2 waveforms refreshed at 250 Hz. The Cortex-M4 processes vital-sign algorithms with deterministic latency, decoupled from the A5 OS layer where GUI updates and network connectivity operate. Dual USB OTG supports bedside barcode scanners and wired network backups simultaneously.
おすすめ
Connected IoT Edge Gateways
IoT edge gateways aggregate sensor data from field devices and pre-process before cloud upload. The MVF60NN151CMK50 provides sufficient compute for on-device MQTT broker operation, TLS termination, and local analytics. Dual Ethernet ports enable WAN-to-LAN segmentation without external switching, and dual USB OTG supports cellular modems plus local debug consoles. The Cortex-M4 handles time-critical Modbus RTU polling while the A5 manages cloud connectivity and JSON parsing.
おすすめ
Industrial Printer Controllers
Industrial label and barcode printers combine a graphics-heavy UI (Cortex-A5 side) with real-time print head and motor control (Cortex-M4 side). The MVF60NN151CMK50's integrated LCD controller drives operator panels while the M4 generates precise stepper-motor pulse trains for label feed and print head positioning. USB OTG connects USB host ports for memory sticks and barcode scanners in parallel. Up to 1.5 MB on-chip SRAM caches bitmap fonts and label templates for fast reprint throughput.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MVF60NN151CMK50 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MVF60NS151CMK50 | MVF60NN151CMK40 | PVF60NN151CMK50 | MVF60NN152CMK50 | MVF61NN151CMK50 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors (Freescale legacy P-prefix) | NXP Semiconductors | NXP Semiconductors |
| Package | 364-MAPBGA (17x17 mm) | 364-MAPBGA (17x17 mm) - same | 364-MAPBGA (17x17 mm) - same | 364-MAPBGA (17x17 mm) - same | 364-MAPBGA (17x17 mm) - same | 364-MAPBGA (17x17 mm) - same |
| Cortex-A5 Frequency | 500 MHz | 500 MHz | ~400 MHz (speed grade K40) | 500 MHz | 500 MHz | 500 MHz |
| Cortex-M4 Frequency | 167 MHz | 167 MHz | ~133 MHz (speed grade K40) | 167 MHz | 167 MHz | 167 MHz |
| On-Chip SRAM | Up to 1.5 MB | Up to 1.5 MB | Up to 1.5 MB | Up to 1.5 MB | Up to 1.5 MB | Up to 1.5 MB |
| Ethernet Controllers | Dual 10/100 with L2 switch | Dual 10/100 with L2 switch | Dual 10/100 with L2 switch | Dual 10/100 with L2 switch | Dual 10/100 with L2 switch | 1x 10/100 + 1x USB OTG (reduced peripheral mix) |
| Security Features | None (standard variant) | Secure boot, anti-tamper, anti-clone | None | None | None | None |
| Lifecycle Status | Active | Active | Active | Active (legacy P-prefix ordering) | Active | Active |
主な差別化要因
- Integrated L2 Ethernet switch eliminates external switch IC （vs MVF61NN151CMK50)
- No-security variant offers cost advantage over secure-boot version （vs MVF60NS151CMK50)
- Freescale legacy P-prefix maintains identical silicon for legacy ordering （vs PVF60NN151CMK50)
設計ノート
The 364-MAPBGA at 17x17 mm uses a 0.8 mm ball pitch, which requires PCB fabrication with laser-drilled microvias (stacked or staggered per IPC-6012 Class 3 for industrial reliability). Reference the NXP VF6xx Hardware Design Guide for the recommended 4-layer or 6-layer stack-up with continuous GND planes under the BGA. Maintain BGA escape routing with via-in-pad or dogbone fanout within 1 mm of the package edge to avoid signal-integrity loss on DDR3L address/command traces.
Use the NXP TPS65910 companion PMIC for proper power sequencing of the Vybrid VF6xx rails (VDD_ARM, VDD_SOC, VDD_LDO_xxx). Each BGA quadrant requires its own 10 uF bulk + 100 nF decoupling pair placed within 5 mm of the respective supply balls. Estimated: at 500 MHz A5 + 167 MHz M4 typical workloads, total core current draws up to 800 mA on VDD_ARM. Per the NXP datasheet, VDDARM should ramp before VDDSOC to prevent latch-up. Estimated bulk capacitance budget: 22 uF total per core rail.
The 364-MAPBGA at industrial temperatures requires thermal relief via thermal vias in the BGA land pattern and adequate inner-plane copper for spreading. Estimated: typical Tj rise at full dual-core load (500 MHz + 167 MHz) is 25-35 C above ambient on a 4-layer 1 oz board. For sealed industrial enclosures without airflow, derate the A5 to 400 MHz or apply a heatsink. Always measure Tj on prototype builds with on-die diode under worst-case workload, not datasheet typical curves. Do NOT rely solely on thetas from the datasheet; your PCB layout dominates the actual theta_JA.
DDR3L fly-by topology per JEDEC JESD79-3 is mandatory for external memory interface. Match trace lengths within +/- 25 mils on the address/command/clock group and use 100 ohm differential impedance for DDR clock pairs. Reference the NXP VF6xx DDR3L design checklist for write leveling and gate training calibration sequences. Do NOT use T-topology on DDR3L clock; it violates the JEDEC fly-by specification and causes intermittent write errors.
コンプライアンス情報
RoHS and lead-free per NXP product page. REACH compliance confirmed via NXP material declaration. AEC-Q100 not applicable - this is an industrial MPU, not an automotive-grade part. For automotive variants, check the MVF60 series ordering codes with -AEC suffix if available. Halogen-free status not explicitly stated in the provided data; mark as unknown.
