MX30LF1GE8AB-TI-T - 1Gbit SLC NAND Flash, x8, 3V, TSOP-48 | Macronix
部品番号: MX30LF1GE8AB-TI-T ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $2.45 | $2.45 |
| 10 | $2.18 | $21.80 |
| 100 | $1.78 | $178.00 |
| 500 | $1.45 | $725.00 |
| 1,000 | $1.22 | $1,220.00 |
MX30LF1GE8AB-TI-T 概要
An SLC NAND Flash is a type of non-volatile memory that stores one bit per cell, delivering higher endurance (typically 100k P/E cycles per block), faster write performance, and longer data retention than MLC or TLC NAND, at the cost of lower density per die. NAND Flash sits below NOR Flash and DRAM in the memory hierarchy and is commonly used for bulk data and code storage behind a filesystem or controller. The MX30LF1GE8AB belongs to the 3V SLC NAND family, which is widely used in industrial, networking, and embedded designs where reliability and predictable write latency matter more than raw bit density.
Key features include ONFI 1.0 parameter block compliance for controller portability, multiplexed command/address/data I/O to reduce pin count, hardware-ready ECC with 64 spare bytes per page, industrial-grade operating range, and a standard TSOP-48 footprint shared with most 1Gbit parallel NAND parts. Page-program and block-erase operations follow standard ONFI command sets, allowing direct reuse of existing low-level drivers. The wide 2.7V-3.6V supply range simplifies designs migrating from 3.3V NOR Flash or PSRAM.
Typical applications include industrial data logging, networking equipment firmware storage, IoT gateways, automotive infotainment code storage, set-top box boot + OS, and POS terminals. The 1Gbit linear latency of 25 us array-to-register and 20 ns sequential read make it a strong fit for systems that boot from NAND with a small on-chip or external ROM bootloader.
When designing with this device, follow ONFI timing diagrams closely: honor tR/tPROG/tBERS delays, drive the WP pin low during power transitions to prevent spurious program/erase, and place the CE# pull-up resistor close to the NAND to keep the bus idle during controller reset.
This page synthesizes distributor pricing, drop-in alternatives, ONFI timing notes, and ECC design guidance not bundled in the manufacturer datasheet, so engineers can evaluate a board-level replacement faster.
ドロップイン代替品: MX30LF1GE8AB-TI-T — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MX30LF1GE8AB-TI-T （同一形状・フットプリント） — 相違点: Block Size, Interface, Memory Type, Package, Page Size.
クイック比較ツール — 並列比較する代替部品を選択:
MX30LF1G08AA
✅ ドロップイン✓ 在庫あり
$1.4 / 個
データシートを見る →MX30LF1GE8AB-TI
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MX30LF2GE8AB
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MX30LF4GE8AB
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$2.98 / 個
データシートを見る →TC58BVG0S3H
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MX30LF1GE8AB-TI-T 最大定格＆電気的特性
| メモリタイプ | Non-Volatile, SLC NAND Flash |
| Memory Organization | 128M x 8 |
| Memory Density | 1 Gbit (128 MB) |
| インターフェース | Parallel (asynchronous, ONFI 1.0) |
| Bus Width | x8 |
| Page Size | (2048 + 64) bytes |
| Block Size | (128K + 4K) bytes |
| Sequential Read Access Time | 20 ns |
| Array-to-Register Latency | 25 us |
| Supply Voltage (VCC) | 2.7 V to 3.6 V |
| User Redundancy (Spare) Area | 64 bytes per page (for ECC) |
| Cache Read Support | Yes |
| Command Set | ONFI 1.0 standard commands |
| 動作温度 | -40 C to +85 C (Industrial) |
| パッケージ | 48-pin TSOP (Type I) |
| 実装タイプ | Surface Mount |
| Compliance | ONFI 1.0, RoHS |
MX30LF1GE8AB-TI-T ピン構成
| ピン 1 | NC — Not connected (per datasheet) |
| ピン 2 | I/O0 — Data I/O 0 |
| ピン 3 | I/O1 — Data I/O 1 |
| ピン 4 | I/O2 — Data I/O 2 |
| ピン 5 | I/O3 — Data I/O 3 |
| ピン 6 | I/O4 — Data I/O 4 |
| ピン 7 | I/O5 — Data I/O 5 |
| ピン 8 | I/O6 — Data I/O 6 |
| ピン 9 | I/O7 — Data I/O 7 |
| ピン 10 | NC — Not connected (per datasheet) |
| ピン 11 | NC — Not connected (per datasheet) |
| ピン 12 | NC — Not connected on x8 devices |
| ピン 13 | NC — Not connected on x8 devices |
| ピン 14 | NC — Not connected on x8 devices |
| ピン 15 | NC — Not connected on x8 devices |
| ピン 16 | NC — Not connected on x8 devices |
| ピン 17 | NC — Not connected on x8 devices |
| ピン 18 | NC — Not connected on x8 devices |
| ピン 19 | NC — Not connected on x8 devices |
| ピン 20 | ALE — Address Latch Enable |
| ピン 21 | CLE — Command Latch Enable |
| ピン 22 | WE# — Write Enable (active low) |
| ピン 23 | WP# — Write Protect (active low) |
| ピン 24 | NC — Not connected (per datasheet) |
| ピン 25 | NC — Not connected (per datasheet) |
| ピン 26 | NC — Not connected (per datasheet) |
| ピン 27 | NC — Not connected (per datasheet) |
| ピン 28 | NC — Not connected (per datasheet) |
| ピン 29 | NC — Not connected (per datasheet) |
| ピン 30 | NC — Not connected (per datasheet) |
| ピン 31 | NC — Not connected (per datasheet) |
| ピン 32 | NC — Not connected (per datasheet) |
| ピン 33 | GND — Ground |
| ピン 34 | NC — Not connected (per datasheet) |
| ピン 35 | RE# — Read Enable (active low) |
| ピン 36 | NC — Not connected (per datasheet) |
| ピン 37 | CE# — Chip Enable (active low) |
| ピン 38 | NC — Not connected (per datasheet) |
| ピン 39 | NC — Not connected (per datasheet) |
| ピン 40 | NC — Not connected (per datasheet) |
| ピン 41 | VCC — Power supply (2.7V to 3.6V) |
| ピン 42 | NC — Not connected (per datasheet) |
| ピン 43 | NC — Not connected (per datasheet) |
| ピン 44 | NC — Not connected (per datasheet) |
| ピン 45 | NC — Not connected (per datasheet) |
| ピン 46 | NC — Not connected (per datasheet) |
| ピン 47 | NC — Not connected (per datasheet) |
| ピン 48 | NC — Not connected (per datasheet) |
主な用途
MX30LF1GE8AB-TI-T の用途: 7 件s: Industrial Data Logging, Networking Equipment Firmware Storage, IoT Gateway Code + Data Storage, Set-Top Box Boot + OS Storage, Automotive Infotainment Code Storage, POS Terminal Transaction Log Storage, Printer and MFP Firmware + Job Storage.
Industrial Data Logging
The MX30LF1GE8AB-TI-T is well suited for industrial data loggers that record sensor streams at high sample rates. Its 1 Gbit SLC density holds roughly 7 days of compressed telemetry at 10 kB/s, while the 100k P/E endurance of SLC cells outlasts MLC in continuous-write use. The 25 us array-to-register latency keeps block-write bursts under 4 ms, and the 64-byte spare area lets the controller apply BCH ECC for bit-error correction in electrically noisy factory environments. The -40C to +85C industrial rating covers most outdoor and chassis-internal deployments without derating.
おすすめ
Networking Equipment Firmware Storage
Routers, switches, and small-cell base stations use parallel SLC NAND to hold bootloader, OS image, and persistent configuration. The MX30LF1GE8AB-TI-T's ONFI 1.0 command set means off-the-shelf U-Boot, UBI, and JFFS2/UBIFS drivers can mount it without low-level glue, and the 20 ns sequential read supports sub-second boot of an OpenWrt-class image. The 2.7V-3.6V supply matches the typical 3.3V rail already present on these boards, eliminating a level shifter. The 64-byte spare area per page accommodates the BCH-8 ECC used by most networking SoCs.
おすすめ
IoT Gateway Code + Data Storage
IoT gateways aggregate sensor data from many end nodes while running a Linux-class OS for protocol translation. The MX30LF1GE8AB-TI-T provides 128 MB of reliable non-volatile storage for both the root filesystem and persistent sensor buffers, with SLC endurance sufficient for several years of constant writes from BLE/Zigbee/LoRa nodes. ONFI 1.0 compliance lets the gateway boot via U-Boot from the NAND directly, and the wide -40C to +85C range supports outdoor enclosures. The 25 us tR and 20 ns sequential read keep the gateway boot under 3 seconds in typical configurations.
おすすめ
Set-Top Box Boot + OS Storage
Set-top boxes (STBs) store bootloader, Linux kernel, root filesystem, and EPG/customer data on a parallel NAND. The MX30LF1GE8AB-TI-T provides ample density for Android-TV builds with the SLC endurance to survive daily software updates and channel-change stress. ONFI 1.0 commands mean the box's existing low-level NAND driver works without modification, and the 20 ns burst read sustains the A/V decoder's bandwidth during cold boot. The 48-TSOP package is footprint-compatible with the legacy 1 Gbit STB designs, simplifying re-spin.
おすすめ
Automotive Infotainment Code Storage
For non-safety in-cabin infotainment, the MX30LF1GE8AB-TI-T serves as code + map-data storage behind the head-unit SoC. The -40C to +85C industrial rating covers most automotive interior environments, and the SLC endurance supports frequent OTA software updates over the vehicle's lifetime. The 64-byte spare area provides room for BCH-8 ECC that mitigates read disturb in long-idle parked states. Designers targeting the full +105C automotive range should evaluate the Macronix automotive-graded variant of the same MX30LF family.
おすすめ
POS Terminal Transaction Log Storage
Point-of-sale (POS) terminals log every transaction, receipt image, and signature capture to local non-volatile storage. The MX30LF1GE8AB-TI-T's 1 Gbit SLC capacity holds roughly 50,000 typical receipt records with ECC, and SLC endurance supports years of continuous logging at retail transaction rates. The 20 ns sequential read keeps receipt reprint latency under 100 ms, while the wide 2.7V-3.6V supply rides out battery-bridge brownouts cleanly. The industrial temperature rating supports outdoor kiosk and refrigerated-cabinet installations.
おすすめ
Printer and MFP Firmware + Job Storage
Laser printers and multifunction printers store firmware, font tables, and queued print jobs on parallel NAND. The MX30LF1GE8AB-TI-T's 1 Gbit density fits the printer's firmware plus a generous job spool, and the SLC endurance handles the constant job-completion erases. ONFI 1.0 commands let the printer SoC use the same proven driver across the Macronix NAND family, simplifying supply-chain qualification. The 48-TSOP footprint matches the printer controller reference designs already shipping in the field.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MX30LF1GE8AB-TI-T — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MX30LF1G08AA | MX30LF1GE8AB-TI | MX30LF2GE8AB | MX30LF4GE8AB | TC58BVG0S3H |
|---|---|---|---|---|---|---|
| Package | 48-pin TSOP (Type I) | 48-pin TSOP - same | 48-pin TSOP - same | 48-pin TSOP - same | 48-pin TSOP - same | 48-pin TSOP - same |
| Brand | Macronix | Macronix | Macronix | Macronix | Macronix | Toshiba |
| Density | 1 Gbit (128M x 8) | 1 Gbit (128M x 8) | 1 Gbit (128M x 8) | 2 Gbit (256M x 8) | 4 Gbit (512M x 8) | 1 Gbit (128M x 8) |
| Supply Voltage | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V |
| Sequential Read Access | 20 ns | 20 ns | 20 ns | 20 ns | 25 ns | 25 ns |
| Array-to-Register Latency | 25 us | 20 us | 25 us | 25 us | 30 us | 25 us |
| ONFI Compliance | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 |
| Spare Area per Page | 64 bytes | 64 bytes | 64 bytes | 64 bytes | 64 bytes | 64 bytes |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
主な差別化要因
- ONFI 1.0 compliance with the latest Macronix timing parameters （vs MX30LF1G08AA)
- Identical TSOP-48 footprint enables PCB drop-in across densities （vs MX30LF2GE8AB)
- Cross-brand compatibility with Toshiba TC58BVG0S3H （vs TC58BVG0S3H)
- 64-byte spare area per page gives full controller flexibility （vs MX30LF1G08AA)
設計ノート
The MX30LF1GE8AB-TI-T draws peak current during page-program and block-erase operations. Decouple VCC with a 0.1 uF X7R ceramic placed within 5 mm of the VCC pin, plus a 4.7 uF bulk capacitor to absorb the program-current spikes. Hold CE# high during power-up until VCC reaches 2.7V to avoid spurious writes; per Macronix best-practice guide, drive WP# low during power transitions as an extra precaution. Brownout on the 3.3V rail during a program operation can corrupt the current page - design the upstream LDO with a soft-start ramp.
Route the 8-bit I/O bus, RE#, WE#, CLE, ALE, and CE# as a matched-impedance bundle with ground-reference on adjacent layers. The 20 ns access time sets the maximum toggle frequency around 50 MHz, so a 50 ohm single-ended trace is typically sufficient; keep stub lengths under 5 mm to avoid reflections. Place a 10 kohm pull-up on RE#, WE#, and CE# near the NAND so the bus idles high during controller reset and prevents accidental command latches. For long PCB traces to the host SoC, add 22 ohm series damping on each control line.
Two common pitfalls with the MX30LF1GE8AB-TI-T: (1) Forgetting that the cache-read feature behaves differently than the older MX30LF1G08AA - per AN0366V1, firmware written assuming the older cache semantics may issue commands out of order. (2) Misusing the 64-byte spare region: this device is described as ECC-Free on the silicon, but the host controller is responsible for BCH-4 or BCH-8 ECC across the 2048 + 64 byte page. Always mark factory bad blocks in the first page of each block (the BBI signature) during factory initialization; without this, the filesystem layer will mount blocks that have already failed.
Place the 48-pin TSOP footprint on a 0.5 mm-pitch land pattern with the exposed die-pad connected to a 5 mm x 5 mm copper pour on the top layer for thermal relief. Keep the 8-bit I/O bus traces on the top layer directly above a continuous ground plane on layer 2; avoid routing signals under the NAND to keep the impedance-controlled. The RE#, WE#, CLE, and ALE traces should be matched in length to within 1 mm to keep setup/hold margins valid at the 20 ns access window. Maintain a 0.5 mm clearance between I/O traces and the CE# pull-up resistor to minimize crosstalk.
During block-erase operations, the MX30LF1GE8AB-TI-T can dissipate up to 300 mW briefly. While the TSOP-48 package has adequate thermal mass for normal page-program cycles, sustained erase loops without cooling can push the junction temperature above the +85C industrial limit. In enclosed designs without airflow, add a small copper pour (10 mm x 10 mm minimum) connected to GND beneath the NAND to spread heat. For designs operating continuously above 70C ambient, derate the program/erase duty cycle to keep junction temperature below 100C.
コンプライアンス情報
RoHS and REACH compliance confirmed via Macronix product family page. Standard industrial-grade part; not AEC-Q100 qualified (consult Macronix automotive-grade variant for in-cabin automotive use). Halogen-free status not explicitly stated in the verified data.
