N9H30F71IEC - 300MHz ARM926EJ-S MPU 216-LQFP | Nuvoton
部品番号: N9H30F71IEC ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $13.66 | $13.66 |
| 10 | $13.1 | $131.00 |
| 100 | $12.4 | $1,240.00 |
| 500 | $11.7 | $5,850.00 |
| 1,000 | $11.05 | $11,050.00 |
N9H30F71IEC 概要
A microprocessor (MPU) sits at the top of the embedded computing hierarchy: an MPU executes an operating system and application code from external or stacked memory, unlike a microcontroller (MCU) which relies on internal flash. The ARM926EJ-S core is an ARMv5TE 32-bit RISC processor with Jazelle and DSP extensions, a mature architecture widely used in industrial HMI, networking, and consumer equipment.
Key features of the N9H30F71IEC include the 300 MHz ARM926EJ-S core, system-in-package 128 MB DDR-II DRAM, and a rich peripheral set: 11 sets of UART, SDIO/eMMC interface, NAND Flash interface, 24-bit LCD controller, 2 sets of CAN, 2 sets of 10/100 Mbps Ethernet MAC, and a High-Speed USB 2.0 host/device controller. This connectivity density allows single-chip designs for networked human-machine interfaces.
The system-in-package construction stacking DDR-II die directly on the 216-pin LQFP substrate reduces PCB area, shortens high-speed DDR routing, and lowers EMI - significant advantages over discrete MPU-plus-DRAM solutions.
Typical applications include industrial HMI touch panels, networked gateways using the dual Ethernet MAC, CANbus instrumentation via the dual CAN controllers, and portable devices leveraging the integrated LCD controller.
Design consideration: the stacked DDR-II memory is pre-configured, which simplifies DDR bring-up, but thermal evaluation of the 24x24 mm LQFP at 300 MHz operation is still recommended for enclosed products.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
ドロップイン代替品: N9H30F71IEC — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
N9H30F63IEC
✅ ドロップイン📋 参考代替品（カタログ未掲載）
N9H30F61IEC
✅ ドロップイン📋 参考代替品（カタログ未掲載）
N9H30K63IEC
✅ ドロップイン📋 参考代替品（カタログ未掲載）
N9H30F71IEC 最大定格＆電気的特性
| Core Processor | ARM926EJ-S |
| Core Size | 32-Bit, 1 Core |
| 最大クロック周波数 | 300 MHz |
| Program Memory | External / NAND Flash interface |
| Stacked Memory | 128 MB DDR-II |
| パッケージ | 216-LQFP (24x24 mm), SiP with DDR-II |
| UART | 11 sets |
| CAN | 2 sets |
| Ethernet MAC | 2 x 10/100 Mbps |
| USB | High-Speed USB 2.0 host / device |
| LCD Controller | 24-bit interface |
| Storage Interfaces | SDIO / eMMC, NAND Flash |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant |
| Product Status | Active |
N9H30F71IEC 216-lqfp (24x24 mm), sip with ddr-ii ピン配置ガイド
N9H30F71IEC (216-lqfp (24x24 mm), sip with ddr-ii パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: N9H30F71IEC.
詳細は データシート をご参照ください。
主な用途
N9H30F71IEC の用途: 6 件s: Industrial HMI Touch Panels, Industrial Network Gateways, Portable Data Acquisition Devices, CANbus Instrumentation Nodes, Medical Monitoring Equipment, Smart Home and IoT Controllers.
Industrial HMI Touch Panels
The N9H30F71IEC fits industrial HMI designs because its 24-bit LCD controller drives modern TFT touch panels directly, while the stacked 128 MB DDR-II memory supports graphical UI frameworks without external DRAM layout effort. The 300 MHz ARM926EJ-S core provides rendering headroom for animation and multi-layer graphics. In a typical design the LCD controller connects to the panel via RGB parallel interface, resistive or capacitive touch is handled through UART or SPI-connected touch controllers using the 11 available UARTs, and the dual 10/100 Mbps Ethernet MACs allow the HMI to double as a networked gateway. The system-in-package DDR-II stacking shortens memory routing and lowers EMI, easing enclosure EMC compliance. The trade-off is that the ARM926EJ-S core is an ARMv5TE-class CPU, so ultra-high-resolution video playback should be avoided.
おすすめ
Industrial Network Gateways
The N9H30F71IEC is a strong fit for protocol-conversion gateways because it integrates two independent 10/100 Mbps Ethernet MACs and two CAN controller sets in a single 300 MHz ARM926EJ-S device. A gateway design can bridge CANopen fieldbus traffic to Modbus TCP or MQTT over Ethernet using external PHY chips on the MACs and CAN transceivers on the CAN controllers. The 11 UARTs handle legacy RS-232/RS-485 device integration, and the High-Speed USB 2.0 host port supports configuration or logging storage on USB drives. The 128 MB stacked DDR-II provides ample buffering for protocol stacks and message queues. Performance consideration: line-rate 100 Mbps bridging is achievable for typical industrial traffic, but full wire-speed routing is beyond the ARM9 core class.
おすすめ
Portable Data Acquisition Devices
For portable and handheld data-acquisition instruments, the N9H30F71IEC reduces board area through its stacked 128 MB DDR-II SiP construction, allowing a compact single-processor design with display, storage, and connectivity. The 24-bit LCD controller presents measurement results on a color panel, the SDIO/eMMC interface stores logged data on removable or embedded flash cards, and the NAND Flash interface holds the application firmware. The 300 MHz ARM926EJ-S core processes sensor datastreams delivered over the UARTs or USB 2.0 device port. The single-chip memory integration eliminates DDR routing entirely, which shortens development cycles and improves signal integrity in small enclosures. Power design should consider that 300 MHz MPU-class operation consumes more current than MCU-class parts, so battery sizing or duty-cycling strategies are recommended.
おすすめ
CANbus Instrumentation Nodes
The dual CAN controllers of the N9H30F71IEC make it a natural host processor for CAN-based instrumentation such as factory sensors, vehicle diagnostics, and building automation nodes. Unlike MCU-class CAN devices, this MPU brings 128 MB stacked DDR-II and a Linux-capable 300 MHz core, enabling complex data logging, local HMI display via the 24-bit LCD controller, and Ethernet backhaul through the dual 10/100 Mbps MACs. A typical node pairs the CAN controllers with external transceivers such as the UJA1169 series, connects sensors through UART or USB, and logs to eMMC via the SDIO interface. The stacked memory SiP improves EMI behavior in electrically noisy industrial cabinets. Designers should validate CAN bit-timing and transceiver selection against the target network's baud rate and node count.
おすすめ
Medical Monitoring Equipment
Medical patient monitors and diagnostic devices benefit from the N9H30F71IEC combination of display control, connectivity, and computational capability. The 24-bit LCD controller renders waveforms and patient data on color panels, the stacked 128 MB DDR-II supports GUI frameworks and buffering of high-rate biosignal data, and the High-Speed USB 2.0 controller interfaces measurement modules or exports records. The 11 UARTs connect multi-parameter sensor front-ends, while the dual Ethernet MACs enable integration with hospital networks. The 300 MHz ARM926EJ-S core runs the real-time display and analysis loops. Developers should note that medical designs additionally require isolation, EMC, and safety compliance at the system level; the MPU itself provides no isolation, so external digital isolators and power isolation are mandatory on patient-connected interfaces.
おすすめ
Smart Home and IoT Controllers
For smart home controllers and IoT hubs, the N9H30F71IEC provides a Linux-class ARM9 platform with all the connectivity needed for residential gateways. The dual 10/100 Mbps Ethernet MACs support wired backhaul and sub-network feeds, the High-Speed USB 2.0 host port accommodates Zigbee or Thread dongles and storage, and the 11 UARTs interface legacy RS-485 or sensor modules. The 24-bit LCD controller enables wall-panel products with touch UI, using the stacked 128 MB DDR-II for graphics. The SDIO interface supports Wi-Fi module attachment for wireless connectivity. The SiP package's reduced EMI profile simplifies certification in consumer products. Consideration: for battery-powered sensors, the MPU-class power consumption at 300 MHz favors mains-powered hub placements rather than coin-cell endpoints.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: N9H30F71IEC — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | N9H30F63IEC | N9H30F61IEC | N9H30K63IEC |
|---|---|---|---|---|
| Package | 216-LQFP (24x24 mm) SiP with DDR-II | 216-LQFP (24x24 mm) - same | 216-LQFP (24x24 mm) - same | 216-LQFP (24x24 mm) - same |
| Brand | Nuvoton Technology | Nuvoton Technology | Nuvoton Technology | Nuvoton Technology |
| Core / Frequency | ARM926EJ-S, 300 MHz | ARM926EJ-S, 300 MHz | ARM926EJ-S, 300 MHz | ARM926EJ-S, 300 MHz |
| UART Sets | 11 | 11 | 11 | 11 |
| CAN Controllers | 2 sets | 2 sets | 2 sets | 2 sets |
| Ethernet MAC | 2 x 10/100 Mbps | 2 x 10/100 Mbps | 2 x 10/100 Mbps | 2 x 10/100 Mbps |
| USB | HS USB 2.0 host/device | HS USB 2.0 host/device | HS USB 2.0 host/device | HS USB 2.0 host/device |
| Lifecycle Status | Active | Active | Active | Active |
主な差別化要因
- Maximum stacked DDR-II density in the N9H30 family （vs N9H30F63IEC)
- SiP memory integration vs discrete MPU solutions （vs N9H30F61IEC)
- Highest connectivity density in class （vs N9H30K63IEC)
設計ノート
Although the N9H30F71IEC stacks its 128 MB DDR-II die on-package, eliminating board-level DDR2 routing, the NAND Flash, LCD RGB, and Ethernet RMII/MII buses still run at high edge rates on the PCB. Keep LCD RGB traces length-matched to within a few hundred mils skew and route Ethernet RMII as a controlled-impedance 50-ohm group with a solid reference plane. Place Ethernet PHY chips (required for the 10/100 Mbps MACs) within 5 cm of the MPU with series termination per the PHY vendor layout guide.
An ARM926EJ-S core running at 300 MHz plus DDR-II requires multiple regulated rails (core, I/O, and DDR termination). Use a dedicated buck regulator for the core rail with at least 30% margin above measured worst-case current, and add bulk capacitance near the LQFP power pins to handle load transients during cache-miss bursts. Power sequencing between core and I/O rails should follow the N9H30 Series datasheet power-up requirements; per-rail monitoring with a supervisor such as a reset IC on the 3.3 V rail is recommended.
Do not assume cross-brand substitution for this part: no pin-compatible third-party equivalents were found in cross-reference data, so second-sourcing must stay within the N9H30 family. When changing between N9H30F71IEC and family variants such as N9H30F63IEC, the order code changes the stacked DDR-II density - re-verify your bootloader memory map and Linux device-tree memory size. Also confirm the thermal profile of the 24x24 mm LQFP in enclosed housings at 300 MHz continuous operation.
コンプライアンス情報
RoHS compliance per distributor listing conventions; REACH and halogen-free status not stated in the provided data and must be confirmed with Nuvoton.
