N9H30F71IEC - 300MHz ARM926EJ-S MPU 216-LQFP | Nuvoton
料号： N9H30F71IEC ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $13.66 | $13.66 |
| 10 | $13.1 | $131.00 |
| 100 | $12.4 | $1,240.00 |
| 500 | $11.7 | $5,850.00 |
| 1,000 | $11.05 | $11,050.00 |
N9H30F71IEC 概述
A microprocessor (MPU) sits at the top of the embedded computing hierarchy: an MPU executes an operating system and application code from external or stacked memory, unlike a microcontroller (MCU) which relies on internal flash. The ARM926EJ-S core is an ARMv5TE 32-bit RISC processor with Jazelle and DSP extensions, a mature architecture widely used in industrial HMI, networking, and consumer equipment.
Key features of the N9H30F71IEC include the 300 MHz ARM926EJ-S core, system-in-package 128 MB DDR-II DRAM, and a rich peripheral set: 11 sets of UART, SDIO/eMMC interface, NAND Flash interface, 24-bit LCD controller, 2 sets of CAN, 2 sets of 10/100 Mbps Ethernet MAC, and a High-Speed USB 2.0 host/device controller. This connectivity density allows single-chip designs for networked human-machine interfaces.
The system-in-package construction stacking DDR-II die directly on the 216-pin LQFP substrate reduces PCB area, shortens high-speed DDR routing, and lowers EMI - significant advantages over discrete MPU-plus-DRAM solutions.
Typical applications include industrial HMI touch panels, networked gateways using the dual Ethernet MAC, CANbus instrumentation via the dual CAN controllers, and portable devices leveraging the integrated LCD controller.
Design consideration: the stacked DDR-II memory is pre-configured, which simplifies DDR bring-up, but thermal evaluation of the 24x24 mm LQFP at 300 MHz operation is still recommended for enclosed products.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： N9H30F71IEC ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
N9H30F63IEC
✅ 直接替换📋 参考替代料（不在目录中）
N9H30F61IEC
✅ 直接替换📋 参考替代料（不在目录中）
N9H30K63IEC
✅ 直接替换📋 参考替代料（不在目录中）
N9H30F71IEC 最大额定值与电气特性
| Core Processor | ARM926EJ-S |
| Core Size | 32-Bit, 1 Core |
| 最大时钟频率 | 300 MHz |
| Program Memory | External / NAND Flash interface |
| Stacked Memory | 128 MB DDR-II |
| 封装 | 216-LQFP (24x24 mm), SiP with DDR-II |
| UART | 11 sets |
| CAN | 2 sets |
| Ethernet MAC | 2 x 10/100 Mbps |
| USB | High-Speed USB 2.0 host / device |
| LCD Controller | 24-bit interface |
| Storage Interfaces | SDIO / eMMC, NAND Flash |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
| Product Status | Active |
N9H30F71IEC 216-lqfp (24x24 mm), sip with ddr-ii 引脚配置指南
N9H30F71IEC（216-lqfp (24x24 mm), sip with ddr-ii 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： N9H30F71IEC.
请参阅 数据手册 以查看完整引脚配置。
典型应用
N9H30F71IEC 适用于 6 应用s: Industrial HMI Touch Panels, Industrial Network Gateways, Portable Data Acquisition Devices, CANbus Instrumentation Nodes, Medical Monitoring Equipment, Smart Home and IoT Controllers.
Industrial HMI Touch Panels
The N9H30F71IEC fits industrial HMI designs because its 24-bit LCD controller drives modern TFT touch panels directly, while the stacked 128 MB DDR-II memory supports graphical UI frameworks without external DRAM layout effort. The 300 MHz ARM926EJ-S core provides rendering headroom for animation and multi-layer graphics. In a typical design the LCD controller connects to the panel via RGB parallel interface, resistive or capacitive touch is handled through UART or SPI-connected touch controllers using the 11 available UARTs, and the dual 10/100 Mbps Ethernet MACs allow the HMI to double as a networked gateway. The system-in-package DDR-II stacking shortens memory routing and lowers EMI, easing enclosure EMC compliance. The trade-off is that the ARM926EJ-S core is an ARMv5TE-class CPU, so ultra-high-resolution video playback should be avoided.
推荐
Industrial Network Gateways
The N9H30F71IEC is a strong fit for protocol-conversion gateways because it integrates two independent 10/100 Mbps Ethernet MACs and two CAN controller sets in a single 300 MHz ARM926EJ-S device. A gateway design can bridge CANopen fieldbus traffic to Modbus TCP or MQTT over Ethernet using external PHY chips on the MACs and CAN transceivers on the CAN controllers. The 11 UARTs handle legacy RS-232/RS-485 device integration, and the High-Speed USB 2.0 host port supports configuration or logging storage on USB drives. The 128 MB stacked DDR-II provides ample buffering for protocol stacks and message queues. Performance consideration: line-rate 100 Mbps bridging is achievable for typical industrial traffic, but full wire-speed routing is beyond the ARM9 core class.
推荐
Portable Data Acquisition Devices
For portable and handheld data-acquisition instruments, the N9H30F71IEC reduces board area through its stacked 128 MB DDR-II SiP construction, allowing a compact single-processor design with display, storage, and connectivity. The 24-bit LCD controller presents measurement results on a color panel, the SDIO/eMMC interface stores logged data on removable or embedded flash cards, and the NAND Flash interface holds the application firmware. The 300 MHz ARM926EJ-S core processes sensor datastreams delivered over the UARTs or USB 2.0 device port. The single-chip memory integration eliminates DDR routing entirely, which shortens development cycles and improves signal integrity in small enclosures. Power design should consider that 300 MHz MPU-class operation consumes more current than MCU-class parts, so battery sizing or duty-cycling strategies are recommended.
推荐
CANbus Instrumentation Nodes
The dual CAN controllers of the N9H30F71IEC make it a natural host processor for CAN-based instrumentation such as factory sensors, vehicle diagnostics, and building automation nodes. Unlike MCU-class CAN devices, this MPU brings 128 MB stacked DDR-II and a Linux-capable 300 MHz core, enabling complex data logging, local HMI display via the 24-bit LCD controller, and Ethernet backhaul through the dual 10/100 Mbps MACs. A typical node pairs the CAN controllers with external transceivers such as the UJA1169 series, connects sensors through UART or USB, and logs to eMMC via the SDIO interface. The stacked memory SiP improves EMI behavior in electrically noisy industrial cabinets. Designers should validate CAN bit-timing and transceiver selection against the target network's baud rate and node count.
推荐
Medical Monitoring Equipment
Medical patient monitors and diagnostic devices benefit from the N9H30F71IEC combination of display control, connectivity, and computational capability. The 24-bit LCD controller renders waveforms and patient data on color panels, the stacked 128 MB DDR-II supports GUI frameworks and buffering of high-rate biosignal data, and the High-Speed USB 2.0 controller interfaces measurement modules or exports records. The 11 UARTs connect multi-parameter sensor front-ends, while the dual Ethernet MACs enable integration with hospital networks. The 300 MHz ARM926EJ-S core runs the real-time display and analysis loops. Developers should note that medical designs additionally require isolation, EMC, and safety compliance at the system level; the MPU itself provides no isolation, so external digital isolators and power isolation are mandatory on patient-connected interfaces.
推荐
Smart Home and IoT Controllers
For smart home controllers and IoT hubs, the N9H30F71IEC provides a Linux-class ARM9 platform with all the connectivity needed for residential gateways. The dual 10/100 Mbps Ethernet MACs support wired backhaul and sub-network feeds, the High-Speed USB 2.0 host port accommodates Zigbee or Thread dongles and storage, and the 11 UARTs interface legacy RS-485 or sensor modules. The 24-bit LCD controller enables wall-panel products with touch UI, using the stacked 128 MB DDR-II for graphics. The SDIO interface supports Wi-Fi module attachment for wireless connectivity. The SiP package's reduced EMI profile simplifies certification in consumer products. Consideration: for battery-powered sensors, the MPU-class power consumption at 300 MHz favors mains-powered hub placements rather than coin-cell endpoints.
推荐
推荐产品汇总
工程参考数据： N9H30F71IEC ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | N9H30F63IEC | N9H30F61IEC | N9H30K63IEC |
|---|---|---|---|---|
| Package | 216-LQFP (24x24 mm) SiP with DDR-II | 216-LQFP (24x24 mm) - same | 216-LQFP (24x24 mm) - same | 216-LQFP (24x24 mm) - same |
| Brand | Nuvoton Technology | Nuvoton Technology | Nuvoton Technology | Nuvoton Technology |
| Core / Frequency | ARM926EJ-S, 300 MHz | ARM926EJ-S, 300 MHz | ARM926EJ-S, 300 MHz | ARM926EJ-S, 300 MHz |
| UART Sets | 11 | 11 | 11 | 11 |
| CAN Controllers | 2 sets | 2 sets | 2 sets | 2 sets |
| Ethernet MAC | 2 x 10/100 Mbps | 2 x 10/100 Mbps | 2 x 10/100 Mbps | 2 x 10/100 Mbps |
| USB | HS USB 2.0 host/device | HS USB 2.0 host/device | HS USB 2.0 host/device | HS USB 2.0 host/device |
| Lifecycle Status | Active | Active | Active | Active |
关键差异点
- Maximum stacked DDR-II density in the N9H30 family （对比 N9H30F63IEC)
- SiP memory integration vs discrete MPU solutions （对比 N9H30F61IEC)
- Highest connectivity density in class （对比 N9H30K63IEC)
设计说明
Although the N9H30F71IEC stacks its 128 MB DDR-II die on-package, eliminating board-level DDR2 routing, the NAND Flash, LCD RGB, and Ethernet RMII/MII buses still run at high edge rates on the PCB. Keep LCD RGB traces length-matched to within a few hundred mils skew and route Ethernet RMII as a controlled-impedance 50-ohm group with a solid reference plane. Place Ethernet PHY chips (required for the 10/100 Mbps MACs) within 5 cm of the MPU with series termination per the PHY vendor layout guide.
An ARM926EJ-S core running at 300 MHz plus DDR-II requires multiple regulated rails (core, I/O, and DDR termination). Use a dedicated buck regulator for the core rail with at least 30% margin above measured worst-case current, and add bulk capacitance near the LQFP power pins to handle load transients during cache-miss bursts. Power sequencing between core and I/O rails should follow the N9H30 Series datasheet power-up requirements; per-rail monitoring with a supervisor such as a reset IC on the 3.3 V rail is recommended.
Do not assume cross-brand substitution for this part: no pin-compatible third-party equivalents were found in cross-reference data, so second-sourcing must stay within the N9H30 family. When changing between N9H30F71IEC and family variants such as N9H30F63IEC, the order code changes the stacked DDR-II density - re-verify your bootloader memory map and Linux device-tree memory size. Also confirm the thermal profile of the 24x24 mm LQFP in enclosed housings at 300 MHz continuous operation.
合规信息
RoHS compliance per distributor listing conventions; REACH and halogen-free status not stated in the provided data and must be confirmed with Nuvoton.
