P5010NXE7VNB - QorIQ 64-Bit Power Arch SoC, 2GHz | NXP
部品番号: P5010NXE7VNB ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $1450 | $1,450.00 |
| 10 | $1380 | $13,800.00 |
| 100 | $1290 | $129,000.00 |
| 500 | $1180 | $590,000.00 |
| 1,000 | $1095 | $1,095,000.00 |
P5010NXE7VNB 概要
A System-on-Chip (SoC) is a single silicon die that combines a CPU complex, memory controllers, high-speed serial I/O, platform glue logic, and security engines - replacing what traditionally required a separate MPU, northbridge, southbridge, and PHY. The QorIQ P5 family sits in NXP's high-end communications processor hierarchy: e5500 core -> P5010/P5020 SoC -> QorIQ P-series -> Power Architecture networking portfolio. By collapsing these functions onto one die, the P5010NXE7VNB simplifies board layout, lowers BOM cost, and reduces typical line-card power versus a multi-chip equivalent.
Key features include a single e5500 64-bit core running at up to 2.0 GHz, dual DDR3/DDR3L controllers with 64-bit + ECC support up to 1866 MT/s, integrated 10GbE-aware Ethernet MACs, hardware pattern-matching and SEC crypto accelerators, and an extended operating temperature range of 0C to 105C. The 1295-ball FCPBGA exposes every high-speed SerDes lane and is engineered for top-side thermal management.
Technically the e5500 core introduces out-of-order execution, hypervisor-aware virtualization, and AltiVec-compatible SIMD, paired with a coherent fabric that links the core, accelerator engines, and I/O controllers. Compared with discrete CPU-plus-chipset designs, the integrated I/O offload engines and SEC engine reduce host CPU overhead for encryption, deep-packet inspection, and queue management workloads typical of enterprise networking.
The P5010NXE7VNB fits NGFW/UTM appliances, industrial control and energy-management gateways, wireless baseband controllers, single-board compute modules, network attached storage controllers, and defense/aerospace secure communications. In each of these, the integrated accelerator engines let the main core focus on control-plane work while bulk I/O and crypto tasks are offloaded on-die.
When designing the board, pay close attention to the multi-rail power-sequencing requirement and to the high-density 1295-ball BGA fan-out, which typically needs microvia HDI PCB technology. Pair the DDR3 controllers with matched-impedance fly-by routing for signal integrity at 1866 MT/s.
ドロップイン代替品: P5010NXE7VNB — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: P5010NXE7VNB （同一形状・フットプリント） — 相違点: Ethernet, Hardware Acceleration, Number of Cores.
クイック比較ツール — 並列比較する代替部品を選択:
P5020NXE7VNB
✅ ドロップイン✓ 在庫あり
$361.12 / 個
データシートを見る →P5020NXN7VNB
✅ ドロップイン📋 参考代替品（カタログ未掲載）
P5010NXN7VNB
✅ ドロップイン📋 参考代替品（カタログ未掲載）
P5040NXE7VNB
✅ ドロップイン📋 参考代替品（カタログ未掲載）
P5040NXN7VNB
✅ ドロップイン📋 参考代替品（カタログ未掲載）
P5010NXE7VNB 最大定格＆電気的特性
| Core Architecture | Power Architecture e5500 (64-bit) |
| Number of Cores | 1 |
| Maximum Core Frequency | 2.0 GHz |
| Memory Controller | DDR3/DDR3L with ECC, up to 1866 MT/s |
| High-Speed Serial I/O | PCIe Gen2/Gen3, Serial RapidIO (SRIO) |
| Ethernet | Integrated multi-port Gigabit Ethernet MACs |
| Hardware Acceleration | Pattern-matching and SEC crypto engines |
| Security Engine | SEC (cryptographic offload) integrated |
| 動作温度範囲 | 0C to 105C |
| パッケージ | 1295-ball FCPBGA (37.5x37.5 mm) |
| 実装タイプ | Surface Mount (BGA) |
| Revision | Rev 2.0 |
| Suppliers Listed | NXP, Freescale (original manufacturer) |
P5010NXE7VNB 1295-ball fcpbga (37.5x37.5 mm) ピン配置ガイド
P5010NXE7VNB (1295-ball fcpbga (37.5x37.5 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: P5010NXE7VNB.
詳細は データシート をご参照ください。
主な用途
P5010NXE7VNB の用途: 6 件s: Next-Generation Firewall and UTM Appliances, Industrial Control and Energy-Management Gateways, Wireless Base Station Baseband Controllers, Single-Board Compute Modules for Defense Systems, Network Attached Storage Controllers, Secure Communications Gateways for Smart Energy.
Next-Generation Firewall and UTM Appliances
The P5010NXE7VNB fits enterprise NGFW and UTM appliances where the SEC crypto engine offloads IPSec, TLS/DTLS, and MACsec while the e5500 core handles policy lookup and session management. At 2.0 GHz single core throughput with hardware pattern-matching offload, the chip can sustain multi-Gbps encrypted throughput for SME firewall appliances. Compared to discrete CPU-plus-crypto-assist designs, the integrated SEC reduces PCIe-attached accelerator slots and BOM cost. Designers should provision at least 4 GB of DDR3 with ECC for routing-table and connection-tracking tables, and verify the chassis airflow budget holds the junction below 105C under worst-case load.
おすすめ
Industrial Control and Energy-Management Gateways
The P5010NXE7VNB fits industrial gateways and energy-management controllers where deterministic single-core processing, serial RapidIO backplane links, and hardware crypto for protocol authentication are required. The 0C to 105C junction range works for indoor industrial enclosures, while the hardware SEC engine accelerates secure protocols like IEC 61850, DNP3-S, and TLS for SCADA telemetry. Compared with discrete CPU-plus-coprocessor designs, the integrated SEC and SERDES reduce card real-estate. Engineers should validate thermal margins in the chosen enclosure and route the DDR3 fly-by topology to meet 1866 MT/s signal-integrity targets.
おすすめ
Wireless Base Station Baseband Controllers
In LTE and 5G small-cell baseband controllers the P5010NXE7VNB runs PHY-layer scheduling and Layer-2 protocol stacks while PCIe Gen 2/3 lanes link to RF front-end ASICs and SRIO connects DSP co-processors. The e5500 core's AltiVec SIMD accelerates FFT, turbo-decoding, and beamforming calculations, and the hardware pattern-matching engine assists deep packet classification. For a small-cell design the SoC combines what would otherwise need an MPU plus a separate accelerator chip. Site designers should plan for matched-impedance SerDes routing and verify the fan-out of the 1295-ball FCPBGA needs microvia HDI PCB.
おすすめ
Single-Board Compute Modules for Defense Systems
The P5010NXE7VNB suits defense and aerospace SBC designs where SEC crypto acceleration and ruggedized single-board reliability are mandatory. The integrated SEC engine accelerates Suite-B and Suite-A cryptography, while the multi-port Gigabit Ethernet MACs feed packet-classification pipelines. Compared with power-hungry x86 SBCs the SoC's lower power and integrated I/O make it useful for SWaP-C constrained platforms. Defense-grade variants may need extended-temperature variants like P5010NXN7VNB. Designers should validate the supply chain through authorized distributors per anti-counterfeit mandates.
おすすめ
Network Attached Storage Controllers
In NAS and SAN controllers the P5010NXE7VNB serves as a system-on-chip for RAID processing and file-system management, with integrated Gigabit Ethernet MACs feeding NIC bonding pipelines and SRIO attaching SAS expander silicon. Hardware-accelerated SEC offloads encrypted-file-system primitives, and the e5500 core handles metadata journaling. Compared with a discrete MIPS or ARM SoC + companion ASICs, the integrated I/O reduces board layers. Designers should provision ECC DDR3 with fly-by topology at 1600-1866 MT/s and consider PCIe Gen 3 lanes for SAS-12G bandwidth.
おすすめ
Secure Communications Gateways for Smart Energy
Smart-energy concentrators and substation gateways use the P5010NXE7VNB to aggregate IEC 61850 traffic, run authenticated DNP3 and TLS tunnels, and forward to control-center SCADA. The SEC engine provides hardware root-of-trust and bulk RSA/ECC acceleration for certificate management, while the multi-port GbE MACs aggregate field-bus uplinks. The 0C to 105C junction range works for outdoor cabinets with appropriate enclosure design. For sub-freezing deployments choose the -40C extended temperature variant. Engineers should verify platform firmware conforms to the IEC 62443 cyber-security standard.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: P5010NXE7VNB — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | P5020NXE7VNB | P5020NXN7VNB | P5010NXN7VNB | P5040NXE7VNB | P5040NXN7VNB |
|---|---|---|---|---|---|---|
| Package | 1295-ball FCPBGA (37.5x37.5 mm) | 1295-ball FCPBGA (37.5x37.5 mm) - same | 1295-ball FCPBGA (37.5x37.5 mm) - same | 1295-ball FCPBGA (37.5x37.5 mm) - same | 1295-ball FCPBGA (37.5x37.5 mm) - same | 1295-ball FCPBGA (37.5x37.5 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Number of Cores | 1 (single) | 2 (dual) | 2 (dual) | 1 (single) | 4 (quad) | 4 (quad) |
| Core Architecture | Power e5500 64-bit | Power e5500 64-bit | Power e5500 64-bit | Power e5500 64-bit | Power e5500 64-bit | Power e5500 64-bit |
| Maximum Core Frequency | 2.0 GHz | 2.0 GHz | 2.0 GHz | 2.0 GHz | 2.0 GHz | 2.0 GHz |
| Memory Interface | DDR3/DDR3L up to 1866 MT/s with ECC | DDR3/DDR3L up to 1866 MT/s with ECC | DDR3/DDR3L up to 1866 MT/s with ECC | DDR3/DDR3L up to 1866 MT/s with ECC | DDR3/DDR3L up to 1866 MT/s with ECC | DDR3/DDR3L up to 1866 MT/s with ECC |
| Operating Temperature Range | 0C to 105C | 0C to 105C | -40C to 105C | -40C to 105C | 0C to 105C | -40C to 105C |
| High-Speed Serial I/O | PCIe Gen2/Gen3 + SRIO | PCIe Gen2/Gen3 + SRIO | PCIe Gen2/Gen3 + SRIO | PCIe Gen2/Gen3 + SRIO | PCIe Gen2/Gen3 + SRIO | PCIe Gen2/Gen3 + SRIO |
主な差別化要因
- Lowest cost single-core option in the QorIQ P5 family （vs P5020NXE7VNB)
- Same package as the multi-core siblings （vs P5040NXE7VNB)
- Integrated SEC engine vs discrete crypto accelerator alternative （vs External PCIe crypto accelerator cards)
- Power e5500 64-bit vs older PowerQUICC generations （vs PowerQUICC III / MPC series)
設計ノート
Estimated: the 1295-ball FCPBGA (37.5x37.5 mm) at 0.5-0.75 mm pitch typically requires a microvia HDI stack-up with at least 8-10 layers to fan out all SerDes lanes and DDR3 address/command traces. Use matched-impedance fly-by routing on DDR3 address/command/control at 1866 MT/s with target impedance of 50 ohms single-ended for address/command and 100 ohms differential for data. Estimating a 14-layer stack-up is more realistic for PCIe Gen 3 + SRIO + multi-port GbE designs. Decoupling must include bulk 220 uF polymer capacitors near the SoC plus 100 nF X7R capacitors within 1-2 mm of each supply ball cluster.
Estimated: at full single-core 2.0 GHz load with all SerDes lanes active, expect 8-15 W of TDP depending on DVFS state, with junction temperature rise of approximately 30-40 C/W theta_JA worst-case without a heatsink. A top-side heatsink with thermal interface material is recommended for chassis airflow below 1 m/s. Designers should budget 15-20 C of thermal margin between the 105C upper junction limit and the worst-case inlet temperature. A 4-6 mm aluminum heatsink with TIM thermal interface material handles typical 8-15 W dissipation in a 1 m/s airflow environment.
The P5010NXE7VNB requires multi-rail power sequencing (typically 0.9 V core, 1.0/1.1 V DDR3, 1.8 V SerDes analog, 3.3 V I/O). Per the QorIQ P5 hardware guide, the core voltage must ramp before the SerDes analog rail, and the DDR supply must track the core rail within +/-50 mV. Use a multi-phase digital PWM controller for the core rail (sourcing 15-25 A peak) and a separate LDO for the SerDes analog supply to minimize noise coupling. Expected: bulk decoupling at the point-of-load should be 4x 220 uF polymer caps plus 30x 100 nF X7R ceramics spread under the 1295-ball footprint.
Anti-counterfeiting: given the long lead times and high unit cost of the P5010NXE7VNB, several gray-market sources advertise new-NXP stock at deep discounts. Always procure from authorized NXP distributors (DigiKey, Mouser, AVNET, Arrow) or NXP-direct to ensure factory-traceability per AS6081 / AS5553 counterfeiting-prevention standards. RoHS/SEC compliance testing may add 1-2 weeks for full-traceable orders.
コンプライアンス情報
Compliance fields marked unknown because the Verified Web Data did not include specific RoHS, REACH, or AEC-Q100 ratings for the P5010NXE7VNB; the part is an industrial/communications SoC, not an automotive-grade chip (AEC-Q100 not applicable).
