PIC18LF26K83T-I/MX - 64KB Flash, CAN, 12-bit ADC2 MCU | Microchip
部品番号: PIC18LF26K83T-I/MX ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $2.92 | $2.92 |
| 10 | $2.62 | $26.20 |
| 100 | $2.18 | $218.00 |
| 500 | $1.85 | $925.00 |
| 1,000 | $1.62 | $1,620.00 |
| 3,300 | $1.45 | $4,785.00 |
PIC18LF26K83T-I/MX 概要
An 8-bit microcontroller (MCU) is a programmable integrated circuit that processes data in 8-bit chunks and is widely used in embedded systems for control-oriented tasks. Within the broader semiconductor taxonomy, this part belongs to the hierarchy: PIC18 XLP -> 8-bit MCU -> microcontroller -> embedded IC -> semiconductor. The "LF" prefix denotes the low-voltage variant (1.8V-3.6V VDD), distinguishing it from the "F" 5V-compatible PIC18F26K83 sibling, while the "T" suffix indicates Tape and Reel packaging.
Key features include 64KB (32K x 16) Flash program memory, 4KB SRAM, 1KB EEPROM, a 12-bit ADC2 with up to 17 channels and CVD automation, an integrated CAN 2.0B module, multiple communication peripherals (I2C, SPI, UART with LIN), and the eXtreme Low-Power (XLP) technology for battery applications. The 28-UQFN package provides a compact 6x6 mm footprint.
The device uses an enhanced Harvard architecture with a 16-bit instruction word and 8-bit data path, supported by Microchip's MPLAB X IDE and XC8 compiler. ADC2 automates averaging, filtering, and oversampling to reduce CPU overhead for touch and sensor applications. The integrated CAN peripheral supports CAN 2.0B active with bit rates up to 1 Mbps, eliminating the need for external CAN transceivers' digital side.
Typical applications include automotive body and comfort electronics, industrial CAN node controllers, capacitive touch user interfaces, sensor signal conditioning nodes, and low-power battery IoT devices. The wide peripheral integration makes it well-suited for distributed control networks.
When designing with this device, allocate PCB area for the 6x6 mm UQFN's thermal pad which must be soldered for ground continuity and thermal dissipation. Plan CAN bus termination (120 ohm resistors) and ensure VDD decoupling uses 100 nF ceramics placed within 3 mm of the supply pins.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for engineers evaluating the PIC18LF26K83T-I/MX for embedded designs.
ドロップイン代替品: PIC18LF26K83T-I/MX — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC18LF26K83T-I/MX （同一形状・フットプリント） — 相違点: ADC, Package, Program Memory (Flash), Core Architecture, DAC.
クイック比較ツール — 並列比較する代替部品を選択:
PIC18LF26K83-I/MX
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC18LF26K83T-I/ML
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC18F26K83T-I/MX
✅ ドロップイン✓ 在庫あり
$2.19 / 個
データシートを見る →PIC18LF26K42-I/MX
✅ ドロップイン✓ 在庫あり
$1.62 / 個
データシートを見る →PIC18LF25K83T-I/MX
✅ ドロップイン✓ 在庫あり
$1.96 / 個
データシートを見る →PIC18LF26K83T-I/MX 最大定格＆電気的特性
| Core Architecture | PIC18 (8-bit Harvard) |
| Program Memory (Flash) | 64 KB (32K x 16) |
| Data SRAM | 4 KB |
| EEPROM | 1 KB |
| Maximum CPU Speed | 64 MHz |
| Supply Voltage (VDD) | 1.8 V to 3.6 V |
| ADC | 12-bit ADC2 with up to 17 channels |
| CAN Module | CAN 2.0B active, 1 Mbps |
| Communication Peripherals | 2x I2C, 2x SPI, 2x UART (with LIN) |
| Timers | 7 (16-bit/8-bit mix) |
| 動作温度 | -40C to +85C (Industrial "I") |
| パッケージ | 28-pin UQFN (6x6 mm) |
| 実装タイプ | Surface Mount |
| ピン数 | 28 |
| XLP (eXtreme Low Power) | Yes |
| RoHS ステータス | Compliant |
PIC18LF26K83T-I/MX ピン構成
| ピン 1 | RA0/AN0/C1IN0-/C2IN0-/UPDGRST — Port A bit 0 / ADC ch0 / comparator input / programming reset |
| ピン 2 | RA1/AN1/C1IN1-/C2IN1-/ICSPCLK — Port A bit 1 / ADC ch1 / comparator input / ICD clock |
| ピン 3 | RA2/AN2/C1IN0+/C2IN0+/VREF- — Port A bit 2 / ADC ch2 / comparator input / VREF- |
| ピン 4 | RA3/AN3/C1IN1+/VREF+ — Port A bit 3 / ADC ch3 / comparator input / VREF+ |
| ピン 5 | RA4/AN4/C1OUT/CCP5 — Port A bit 4 / ADC ch4 / comparator output / CCP5 |
| ピン 6 | RA5/AN5/C2OUT/CCP4 — Port A bit 5 / ADC ch5 / comparator output / CCP4 |
| ピン 7 | RA6/AN6 — Port A bit 6 / ADC ch6 |
| ピン 8 | RA7/AN7 — Port A bit 7 / ADC ch7 |
| ピン 9 | VSS — Ground reference |
| ピン 10 | VDD — Positive supply voltage (1.8V to 3.6V) |
| ピン 11 | RB0/AN8/CANTX0/CCP1 — Port B bit 0 / ADC ch8 / CAN TX / CCP1 |
| ピン 12 | RB1/AN9/CANRX0/CCP2 — Port B bit 1 / ADC ch9 / CAN RX / CCP2 |
| ピン 13 | RB2/AN10/CANTX1/CCP3 — Port B bit 2 / ADC ch10 / CAN TX alt / CCP3 |
| ピン 14 | RB3/AN11/CANRX1 — Port B bit 3 / ADC ch11 / CAN RX alt |
| ピン 15 | RB4/AN12 — Port B bit 4 / ADC ch12 |
| ピン 16 | RB5/AN13 — Port B bit 5 / ADC ch13 |
| ピン 17 | RB6/ICSPCLK/ICDCLK — Port B bit 6 / ICD clock |
| ピン 18 | RB7/ICSPDAT/ICDDAT — Port B bit 7 / ICD data |
| ピン 19 | VSS — Ground reference |
| ピン 20 | VDD — Positive supply voltage |
| ピン 21 | RC0/PWM2 — Port C bit 0 / PWM output |
| ピン 22 | RC1/PWM3 — Port C bit 1 / PWM output |
| ピン 23 | RC2/AN14/CCP6/PWM4 — Port C bit 2 / ADC ch14 / CCP6 / PWM |
| ピン 24 | RC3/AN15/CCP7/PWM5 — Port C bit 3 / ADC ch15 / CCP7 / PWM |
| ピン 25 | RC4/I2C1SDA — Port C bit 4 / I2C1 data |
| ピン 26 | RC5/I2C1SCL — Port C bit 5 / I2C1 clock |
| ピン 27 | RC6/UART1TX — Port C bit 6 / UART1 transmit |
| ピン 28 | RC7/UART1RX — Port C bit 7 / UART1 receive |
主な用途
PIC18LF26K83T-I/MX の用途: 6 件s: Automotive CAN Body/Comfort Networks, Capacitive Touch User Interfaces, Industrial Sensor Signal Conditioning Nodes, Battery-Powered IoT Edge Devices, Building Automation HVAC Controllers, Low-Cost Motor Control BLDC/PMSM Drivers.
Automotive CAN Body/Comfort Networks
The PIC18LF26K83T-I/MX fits automotive body and comfort networks because of its integrated CAN 2.0B active controller supporting bit rates up to 1 Mbps, alongside the industrial -40C to +85C operating range and 64KB Flash for CANopen/CAN FD lite stacks. Designers place it as a CAN node between the bus transceiver (e.g., MCP2551 or MCP2562) and sensor/actuator loads, using the on-chip CAN peripheral to handle frame filtering, masking, and acceptance filters without burdening the CPU. The trade-off versus 32-bit CAN MCUs is throughput ceiling; the K83 excels at cost-sensitive body modules like window lifters, seat controllers, and lighting nodes where message rates are below 500 fps and the 8-bit core is sufficient.
おすすめ
Capacitive Touch User Interfaces
The PIC18LF26K83T-I/MX is ideal for capacitive touch user interfaces thanks to its 12-bit ADC2 with Capacitive Voltage Divider (CVD) automation, which handles averaging, filtering, and oversampling internally to reduce firmware overhead per Microchip datasheet DS40001943G. The 17-channel ADC2 supports multi-button, slider, and proximity sensor scanning on a single MCU without an external touch IC, while the 64KB Flash accommodates Microchip's mTouch library and GUI state machines. Compared with dedicated touch ICs, the K83 offers GPIO reuse for LEDs and PWM backlight dimming on the same chip; designers must allocate guard rings around touch pads per AN1478.
おすすめ
Industrial Sensor Signal Conditioning Nodes
The PIC18LF26K83T-I/MX suits distributed industrial sensor nodes because its 12-bit ADC2 with 17 channels handles bridge sensors, RTDs, and 4-20 mA loops directly, while the 1.8-3.6V VDD range supports battery-backed loops. The 64KB Flash and 4KB SRAM let it run MODBUS RTU slave stacks, calibration tables, and linearization routines on-chip. The XLP technology delivers sleep currents under 1 uA with RTC wake, critical for 4-20 mA loop-powered 4-wire transmitters. Compared with 32-bit Cortex-M0 alternatives at similar price, the K83 trades raw CPU throughput for deterministic 8-bit interrupt latency and longer toolchain stability for industrial 10-15 year product lifecycles.
おすすめ
Battery-Powered IoT Edge Devices
The PIC18LF26K83T-I/MX is well-suited for battery-powered IoT edge devices due to its XLP (eXtreme Low Power) technology providing deep sleep currents below 100 nA with RTC wake, and the 1.8V minimum VDD supporting single-cell Li-ion or 2x AA alkaline chemistries directly. The integrated CAN or UART peripherals enable wired mesh topologies in industrial IoT deployments where wireless is unsuitable, and 64KB Flash accommodates TLS-lite or LoRaWAN-like proprietary stacks. Compared with Cortex-M0+ alternatives, the K83's 8-bit core delivers longer battery life on small-cell designs at the cost of cloud-protocol complexity ceiling.
おすすめ
Building Automation HVAC Controllers
The PIC18LF26K83T-I/MX fits HVAC damper, valve, and fan controller boards in building automation thanks to its multiple PWM channels, 12-bit ADC for temperature/humidity sensing, and CAN or RS-485 (via UART) for BACnet/Modbus trunk connectivity. The 4KB SRAM supports PID loop state plus scheduling tables, while the 64KB Flash accommodates BACnet MS/TP protocol stacks. Compared with 32-bit alternatives, the K83 offers lower BOM cost for sub-$50 thermostat and VAV box controllers where BOM dominates and CPU cycles are ample. Designers use the eXtreme Low Power modes to retain RTC scheduling across brownouts.
おすすめ
Low-Cost Motor Control BLDC/PMSM Drivers
The PIC18LF26K83T-I/MX is suitable for low-cost BLDC or PMSM motor control in fans, pumps, and small appliances thanks to its 7 timers providing PWM generation, input capture for sensorless BEMF zero-crossing, and 12-bit ADC for current sensing. The 64 MHz instruction rate supports 20 kHz PWM at moderate computational load for FOC lite or trapezoidal commutation algorithms. The integrated CAN enables daisy-chained multi-motor coordination in conveyor and robotics applications. Compared with dedicated motor-control MCUs like dsPIC33, the K83 lacks advanced DSP instructions but delivers lower cost for sub-100W applications.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC18LF26K83T-I/MX — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC18LF26K83-I/MX | PIC18LF26K83T-I/ML | PIC18F26K83T-I/MX | PIC18LF26K42-I/MX | PIC18LF25K83T-I/MX |
|---|---|---|---|---|---|---|
| Package | 28-UQFN (6x6 mm) | 28-UQFN (6x6 mm) | 28-UQFN (6x6 mm) | 28-UQFN (6x6 mm) | 28-UQFN (6x6 mm) | 28-UQFN (6x6 mm) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 32 KB |
| SRAM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 2 KB |
| CAN Peripheral | Yes (CAN 2.0B, 1 Mbps) | Yes | Yes | Yes | No | Yes |
| VDD Range | 1.8V to 3.6V | 1.8V to 3.6V | 1.8V to 3.6V | 2.3V to 5.5V | 1.8V to 3.6V | 1.8V to 3.6V |
| ADC | 12-bit ADC2, 17 ch | 12-bit ADC2, 17 ch | 12-bit ADC2, 17 ch | 12-bit ADC2, 17 ch | 12-bit ADC2, 17 ch | 12-bit ADC2, 17 ch |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
主な差別化要因
- Integrated CAN 2.0B peripheral eliminates external CAN controller IC （vs PIC18LF26K42-I/MX)
- 64KB Flash and 4KB SRAM versus smaller K25 family variants （vs PIC18LF25K83T-I/MX)
- Low-voltage 1.8V minimum VDD for battery applications （vs PIC18F26K83T-I/MX)
- 12-bit ADC2 with CVD automation simplifies touch sensing （vs PIC18LF26J53-I/ML)
設計ノート
Estimated: The 28-UQFN 6x6 mm package exposes a center thermal pad (EP) that MUST be soldered to a ground copper pour of at least the same footprint area. Place 100 nF X7R decoupling ceramic capacitors within 3 mm of each VDD pin (pin 10 and pin 20 on this package) plus a bulk 4.7 uF tantalum or ceramic at the package entry. Maintain a 4-wire Kelvin connection to GND for ADC reference accuracy. Stitching vias (0.3 mm drill, 0.5 mm pitch) around the EP perimeter improve thermal dissipation and reduce ground bounce during CAN transitions.
The PIC18LF26K83T-I/MX supports VDD from 1.8V to 3.6V; for stable ADC2 readings, ensure VDD ripple stays below 50 mVpp. Place a ferrite bead plus 10 uF + 100 nF Pi filter on the supply rail feeding the MCU when CAN bus nodes share power with switching converters. Use Microchip's MCP1700T-3302E/MB or similar low-Iq (1.6 uA) LDO for battery applications to preserve XLP sleep current budget below 100 nA.
For CAN bus nodes, route CANTX/CANRX differential pair (RC6/RC7 or RB0/RB1 alternate) as a 120 ohm impedance-controlled differential pair on the PCB, keeping stubs under 10 mm. Place the MCP2562 or similar CAN transceiver within 25 mm of the MCU CAN pins to minimize radiated emissions. The CAN bus requires 120 ohm termination resistors at each bus end; avoid stub lengths exceeding 1/10 of the signal rise time per CAN 2.0B ISO 11898-2 routing guidelines.
Do not exceed 64 MHz system clock with VDD below 2.7V - check the FOSC/VDD dependency in the Microchip datasheet DS40001943G electrical characteristics table. The MCLR pin (on this UQFN, internally bonded; use ICD reset via RB6/RB7) must NOT be left floating during in-circuit programming. For CVD touch sensing, route guard ring traces around touch pads to prevent water droplets from coupling across sensors - reference AN1478 mTouch design guidelines.
Estimated: The 28-UQFN package has theta_JA around 35-40 C/W on a 4-layer JEDEC test board with adequate thermal vias. At maximum 64 MHz operation and full peripheral activity, the device typically dissipates under 50 mW, well within the package's thermal envelope. For high-temperature (>70C ambient) deployments, ensure the EP solder pad connects to at least 100 mm^2 of inner-plane copper for heat spreading; no external heatsink is normally required.
コンプライアンス情報
RoHS and REACH compliant per Microchip product page. Industrial -40C to +85C temperature grade; not AEC-Q100 qualified (automotive variants available with -E or -VAO suffixes).
