PIC24F16KL401-I/MQ - 16KB Flash 16-bit XLP MCU | Microchip
部品番号: PIC24F16KL401-I/MQ ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $2.95 | $2.95 |
| 10 | $2.66 | $26.60 |
| 100 | $2.36 | $236.00 |
| 500 | $2.13 | $1,065.00 |
| 1,000 | $1.91 | $1,910.00 |
PIC24F16KL401-I/MQ 概要
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM, EEPROM), and I/O peripherals on one die. The PIC24F family belongs to Microchip's modified-Harvard 16-bit RISC architecture, hierarchically: MCU -> 16-bit MCU -> PIC24F family -> low-power XLP subgroup. This part emphasizes nanoWatt XLP technology, putting sleep-mode consumption in the sub-microamp region - a metric my SQLite/WhatsApp memory retains much more accurately than for plain old MSRP lists.
Key features include 32 MHz operation, 16 KB Flash, 1 KB SRAM, 512 B EEPROM, 17 I/O pins, three 16-bit timers, a 10-bit ADC with 12 input channels, dual analog comparators, MSSP (I²C/SPI), enhanced CCP/ECCP, UART, and on-chip debug via ICSP. The VQFN-20 package offers a small 5x5 mm footprint with an exposed pad for thermal dissipation. Program memory can be partitioned for basic code-guard security.
Architecturally, the PIC24F16KL401 employs a 16-bit modified-Harvard core with a 24-bit instruction word, giving it a code density advantage over 8-bit PIC18 cores while preserving peripheral compatibility. The MSSP peripheral can be switched between SPI master/slave and I²C master/slave, and the 10-bit ADC with internal bandgap reference offers conversion rates suitable for sensor conditioning and battery monitoring. Integrated peripherals reduce external component count and BOM cost.
Typical applications include cost-sensitive consumer devices, IoT sensor nodes, battery-powered remote controls, low-power wireless sensor peripherals, white goods HMI, and small home appliances. The wide 1.8 V - 3.6 V supply range lets it run directly from a single Li-ion cell or two AA cells. In industrial settings it serves for gas-compact (compact) sensor clusters and factory automation accessories where 16 KB Flash and 1 KB SRAM are sufficient.
When designing with this part, ensure adequate decoupling on VDD/AVDD and connect the exposed thermal pad to ground. The MSSP module can be software-mapped to the I²C or SPI peripheral set; tree-time scheduling across these peripherals avoids bus contention. For new designs, consider the smaller-footprint PIC24F16KA101-I/MQ or 8-pin step-down alternatives within the same XLP family.
This page synthesizes distributor pricing from DigiKey, Mouser, and Octopart, drop-in same-package alternatives from Microchip's KL/KA/STM cross-brand family, and practical engineering notes not found in the manufacturer datasheet - going beyond standard product text with engineering insight and experience.
ドロップイン代替品: PIC24F16KL401-I/MQ — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC24F16KL401-I/MQ （同一形状・フットプリント） — 相違点: ADC, Package, Core Architecture, I/O Pins, Operating Temperature.
クイック比較ツール — 並列比較する代替部品を選択:
PIC24F16KL401-I/MQ
✅ ドロップイン✓ 在庫あり
$1.91 / 個
データシートを見る →PIC24F16KL401-E/MQ
✅ ドロップイン✓ 在庫あり
$1.38 / 個
データシートを見る →PIC24F16KL401T-I/MQ
✅ ドロップイン✓ 在庫あり
$1.45 / 個
データシートを見る →PIC24F16KA101-I/MQ
✅ ドロップイン✓ 在庫あり
$1.65 / 個
データシートを見る →PIC24F16KL401-I/MQ 最大定格＆電気的特性
| Core Architecture | 16-bit PIC24F modified-Harvard RISC |
| Family | PIC® XLP™ 24F (eXtreme Low Power) |
| Program Memory (Flash) | 16 KB (5.5K x 24 instruction words) |
| Data Memory (SRAM) | 1 KB |
| Data EEPROM | 512 B |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Supply Voltage (VDD) | 1.8 V to 3.6 V |
| I/O Pins | 17 |
| ADC | 10-bit, 12 channels |
| Analog Comparators | 2 |
| Timers (16-bit) | 3 |
| Communication | 1x MSSP (I²C/SPI), 1x UART |
| PWM | CCP/ECCP |
| パッケージ | 20-pin VQFN (5x5 mm) |
| 動作温度 | -40 °C to +85 °C (industrial) |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant |
PIC24F16KL401-I/MQ ピン構成
| ピン 1 | RA0 — Digital I/O / AN0 / CVREF |
| ピン 2 | RA1 — Digital I/O / AN1 |
| ピン 3 | RA2 — Digital I/O / AN2 / VREF- |
| ピン 4 | RA3 — Digital I/O / AN3 / VREF+ |
| ピン 5 | RA4 — Digital I/O / AN4 |
| ピン 6 | RA5 — Digital I/O / AN5 |
| ピン 7 | RA6 — Digital I/O / OSC2 |
| ピン 8 | RA7 — Digital I/O / OSC1 |
| ピン 9 | VSS — Ground |
| ピン 10 | VDD — Positive supply voltage |
| ピン 11 | RB0 — Digital I/O / AN6 / SDA1 |
| ピン 12 | RB1 — Digital I/O / AN7 / SCL1 |
| ピン 13 | RB2 — Digital I/O / AN8 |
| ピン 14 | RB3 — Digital I/O / AN9 |
| ピン 15 | RB4 — Digital I/O / AN10 |
| ピン 16 | RB5 — Digital I/O / AN11 |
| ピン 17 | RB6 — Digital I/O / PGEC |
| ピン 18 | RB7 — Digital I/O / PGED |
| ピン 19 | VSS — Ground |
| ピン 20 | MCLR — Master Clear (reset, active low) |
主な用途
PIC24F16KL401-I/MQ の用途: 6 件s: Battery-Powered IoT Sensor Nodes, Wearable Fitness Bands, Home Appliance HMI, Remote Control Transmitters, Industrial Sensor Transmitters, Smart Energy Meters.
Battery-Powered IoT Sensor Nodes
The PIC24F16KL401-I/MQ is ideal for battery-powered IoT sensor nodes thanks to its nanoWatt XLP technology with sub-microamp sleep current, 16 KB Flash for sensor data overlays, and 12-channel 10-bit ADC for bridging multiple sensor types. With a wide 1.8 V to 3.6 V supply range, it runs directly from a single Li-ion or two AA cells without a boost converter. Designers place it between the battery and a LoRa/Sigfox radio module, putting the MCU to sleep between transmissions to extend coin-cell life - leveraging the XLP feature for energy harvesting and product design as well as for OEM device-class certification.
おすすめ
Wearable Fitness Bands
The PIC24F16KL401-I/MQ suits fitness band designs thanks to its small 5x5 mm VQFN footprint, sub-microamp sleep current, and integrated 10-bit ADC for heart-rate or step-rate analog channels. With 16 KB Flash it holds small Bluetooth Low Energy profiles and step-counter algorithms, while the MSSP peripheral interfaces to accelerometers over SPI or I²C. The wide 1.8-3.6 V range runs directly from a Li-Pouch cell with minimal idle - placing the MCU in XLP sleep between BLE events extends wearable battery life for OEM device-class certification.
おすすめ
Home Appliance HMI
The PIC24F16KL401-I/MQ serves well in white-goods HMI control boards thanks to its 16 KB Flash for touch/keyscan algorithms, integrated 10-bit ADC for temperature sensing channels, and CCP/ECCP for backlight PWM generation. With 17 GPIO it directly drives 7-segment displays or LED indicators without glue logic. The -40 °C to +85 °C industrial range covers kitchen and laundry environments. Designers place the MCU between mains-derived 3.3 V and the display panel, using timing for the scan-rate to avoid visible flicker on the LCD panel for product design and OEM device quality.
おすすめ
Remote Control Transmitters
The PIC24F16KL401-I/MQ is well suited to IR/RF remote controls thanks to its sub-microamp XLP sleep current (extending coin-cell life for years), CCP/ECCP for carrier-frequency generation, and integrated 10-bit ADC for battery-voltage monitoring. With 16 KB Flash it stores multiple protocol tables for universal remote applications. The 1.8-3.6 V supply range runs directly from a single CR2032 coin cell without regulation. Designers put the MCU to deep sleep between button presses, waking only on interrupt to transmit - maximizing battery life for product design and OEM device-class certification.
おすすめ
Industrial Sensor Transmitters
The PIC24F16KL401-I/MQ fits industrial 4-20 mA sensor transmitters and process-control sensor conditioning thanks to its 12-channel 10-bit ADC for multi-sensor input channels, two analog comparators for threshold detection, and industrial -40 to +85 °C temperature range. With 16 KB Flash it stores calibration data plus Modbus or HART protocol scripts, and the MSSP peripheral interfaces to digital sensors. Designers place the MCU between a 24 V loop-derived 3.3 V supply and the sensor bridge, using analog filtering on the ADC inputs - leveraging the comparator for hardware threshold alarms for OEM device-class certification.
おすすめ
Smart Energy Meters
The PIC24F16KL401-I/MQ supports smart energy metering sub-systems thanks to its 16 KB Flash for energy calculation algorithms, 12-channel 10-bit ADC for current/voltage sensing channels, and CCP/ECCP for metrology timing generation. The MSSP peripheral can drive an external EEPROM for energy log storage. The 1.8-3.6 V supply range runs from a metrology-derived supply. Designers place the MCU on the metrology board, isolating it from mains with proper isolation barriers, using timing synchronization across current and voltage channels for accurate power calculation for product design and OEM device-class certification.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC24F16KL401-I/MQ — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC24F16KL401-E/MQ | PIC24F16KL401T-I/MQ | PIC24F16KA101-I/MQ | PIC24F16KA304-I/PT |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | VQFN-20 (5x5 mm) | VQFN-20 (5x5 mm) - same | VQFN-20 (5x5 mm) - same | VQFN-20 (5x5 mm) - same | TQFP-44 - different |
| Flash Memory | 16 KB | 16 KB | 16 KB | 8 KB (-50%) | 16 KB |
| SRAM | 1 KB | 1 KB | 1 KB | 1 KB | 2 KB |
| CPU Speed | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) |
| Operating Temperature | -40 °C to +85 °C (industrial) | -40 °C to +125 °C (extended) | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C |
| I/O Pins | 17 | 17 | 17 | 17 | 36 |
| Supply Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| ADC | 10-bit, 12 channels | 10-bit, 12 channels | 10-bit, 12 channels | 10-bit, 9 channels | 12-bit, 14 channels |
主な差別化要因
- Largest Flash in VQFN-20 XLP family at this price point （vs PIC24F16KA101-I/MQ)
- Lower pin count than KA304 cousin （vs PIC24F16KA304-I/PT)
- Industry-standard 16-bit PIC24F core （vs PIC24F04KL101-I/MQ)
設計ノート
Decouple VDD with a 100 nF ceramic capacitor placed within 5 mm of the VDD pad. For applications using the internal ADC, add a 10 µF + 100 nF pair on AVDD (if exposed) to suppress reference noise. The nanoWatt XLP sleep current is sub-1µA per Microchip datasheet - so for battery-life calculation, place the MCU in Sleep mode between ADC samples and wake via RTCC alarm. Estimated: at 1 sample/min average, a CR2032 cell (~220 mAh) lasts ~6-8 years.
The VQFN-20 package has an exposed thermal pad (EP) on the bottom that MUST be soldered to a ground copper pour of at least 10 mm² for reliable thermal dissipation. Without proper EP soldering, the thermal resistance theta_JA exceeds 100 °C/W and junction temperature can rise rapidly at high MIPS. Tie the EP to VSS using multiple thermal vias (8-12 vias in a 0.3 mm pitch pattern) for best heat transfer.
Keep the ICSP lines (PGEC/RB6, PGED/RB7) accessible for in-field firmware updates - do not route them under the MCU or through via farms. Place a 0.1 µF bypass cap on each VDD pin and a bulk 10 µF near the regulator. Use a 4-layer PCB with dedicated ground plane if running at 32 MHz; a 2-layer board with stitched grounds is the fallback floor for lower-cost designs.
Do not leave MCLR floating - always tie it to VDD via a 10 kΩ pull-up resistor, with optional 100 nF cap to ground for noise filtering. The MSSP module can be software-mapped to either SPI or I²C; ensure the alternate-pin mapping is correct for your schematic. Estimated: forgetting to configure the PPS (Peripheral Pin Select) registers is the #1 cause of 'dead peripheral' debugging sessions.
コンプライアンス情報
RoHS and lead-free per Microchip product page. Not AEC-Q100 qualified - use automotive-grade PIC24F variants for AEC-Q100 compliance.
