PIC32MZ1024EFF144T-E/JWX - 32-bit MIPS MCU 180MHz 1MB Flash 144-TFBGA
部品番号: PIC32MZ1024EFF144T-E/JWX ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $13.42 | $13.42 |
| 10 | $12.08 | $120.80 |
| 100 | $10.74 | $1,074.00 |
| 500 | $9.86 | $4,930.00 |
| 1,000 | $9.12 | $9,120.00 |
PIC32MZ1024EFF144T-E/JWX 概要
A 32-bit MIPS microcontroller (MCU) is a programmable embedded processor based on the MIPS instruction set architecture that executes 32-bit operations per clock cycle, enabling deterministic real-time control with significantly higher throughput than 8/16-bit MCUs. The PIC32MZ EF family sits in the high-performance tier of Microchip's MCU portfolio, positioned between the PIC32MX mainstream family and the PIC32MZ EF/WFI graphics-tier devices. Within the broader taxonomy: 32-bit MCU -> microcontroller -> embedded processor -> semiconductor -> integrated circuit.
Key features include up to 180 MHz core speed (200 MHz on the industrial-grade -I variant), 1 MB Flash program memory, 256 KB SRAM, 8 DMA channels, 120 general-purpose I/O lines, and an integrated Floating Point Unit and DSP. The -E temperature grade extends operation from -40C to +125C, suitable for automotive and harsh industrial environments. Security features include Flash OTP and a unique 128-bit device ID for anti-counterfeit provisioning. The 144-ball TFBGA package provides high pin density (0.5 mm pitch) for space-constrained designs while maintaining robust thermal and electrical performance.
The architecture combines the MIPS M-Class core with tightly-coupled peripherals mapped to a multi-channel DMA engine, enabling deterministic interrupt response and offloading data movement from the CPU. On-chip peripherals include HS USB 2.0 (host/device/OTG), 10/100 Ethernet MAC with MII/RMII interfaces, two CAN 2.0b controllers, multiple UART/SPI/I2C, and an SQI interface for Quad-SPI Flash expansion. The advanced analog block delivers up to 48 MSPS 12-bit ADC, 2 analog comparators, and multiple DAC outputs.
Typical applications include industrial automation controllers, automotive infotainment and cluster-I/O, IoT gateways, graphical HMI touch panels, BLDC and PMSM motor control, and connected medical devices. The wide temperature range and CAN interfaces make it particularly well-suited for in-vehicle networks and factory-floor PLC modules. Engineers pair it with companion parts such as external Ethernet PHYs, CAN transceivers, and TFT LCD drivers.
Design considerations include proper decoupling of the four separate supply rails (VDD, AVDD, VBAT, and VDDIO), trace-length matching on the Ethernet MII/RMII bus, and careful PCB layout to manage BGA fanout on a 4-layer or higher stackup. The JTAG/SWD interface supports boundary-scan and in-field firmware updates via bootloader or OTA mechanisms.
This page synthesizes real-time distributor pricing, drop-in alternative cross-references, and practical design notes not consolidated on the manufacturer product page, giving procurement and design engineers a single, decision-ready reference for the PIC32MZ1024EFF144T-E/JWX.
ドロップイン代替品: PIC32MZ1024EFF144T-E/JWX — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC32MZ1024EFF144T-E/JWX （同一形状・フットプリント） — 相違点: Package, ADC, Operating Temperature, Core Architecture, CAN.
クイック比較ツール — 並列比較する代替部品を選択:
PIC32MZ1024EFF144T-I/JWX
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC32MZ1024EFF144-E/JWX
✅ ドロップイン✓ 在庫あり
$12.18 / 個
データシートを見る →PIC32MZ1024EFF144T-250E/JWX
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC32MZ0512EFF144T-I/JWX
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$6.45 / 個
データシートを見る →PIC32MZ1024EFE144T-I/JWX
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$8.95 / 個
データシートを見る →PIC32MZ1024EFF144T-E/JWX
✅ ドロップイン✓ 在庫あり
$9.12 / 個
データシートを見る →PIC32MZ1024EFF144T-E/JWX 最大定格＆電気的特性
| Core Architecture | MIPS32 M-Class (PIC32) |
| Core Frequency | 180 MHz (200 MHz on -I variant) |
| Program Flash | 1 MB (1M x 8) |
| SRAM | 256 KB |
| Floating Point Unit | Yes (single/double precision) |
| DSP Engine | Yes (DSP-enhanced ASE) |
| DMA Channels | 8 |
| GPIO | 120 |
| ADC | 12-bit, up to 48 MSPS |
| 動作温度 | -40C to +125C (E grade) |
| Operating Voltage | 2.3 V to 3.6 V |
| USB | Hi-Speed USB 2.0 (Host/Device/OTG) |
| Ethernet | 10/100 MAC (MII/RMII) |
| CAN | 2x CAN 2.0b |
| パッケージ | 144-ball TFBGA (JWX) 7x7 mm, 0.5 mm pitch |
| 実装タイプ | Surface Mount (BGA) |
| Temperature Grade | Automotive (E: -40C to +125C) |
| RoHS ステータス | Compliant |
| MSLレベル | 3 (per JEDEC J-STD-020, reflow 260C) |
| Cryptography | No (No Crypto variant) |
PIC32MZ1024EFF144T-E/JWX ピン構成
| ピン A1 | GPIO/PMP/EMUC — General-purpose I/O / Parallel Master Port data / EMDC debug clock |
| ピン A12 | VDD — Core logic supply voltage (1.8 V typical) |
| ピン B1 | GPIO/PMP/EMUD — General-purpose I/O / PMP data / EMDC debug data |
| ピン B12 | VSS — Core ground reference |
| ピン C1 | GPIO — General-purpose I/O |
| ピン D1 | ANxx — Analog input channel |
| ピン E1 | ANxx — Analog input channel |
| ピン F1 | ANxx — Analog input channel |
| ピン G1 | ANxx — Analog input channel |
| ピン H1 | ANxx — Analog input channel |
| ピン J1 | ANxx — Analog input channel |
| ピン K1 | AVDD — Analog supply voltage (3.3 V) |
| ピン L1 | AVSS — Analog ground reference |
| ピン A6 | USB_DP — USB HS D+ data line |
| ピン B6 | USB_DM — USB HS D- data line |
| ピン C6 | VBUS — USB VBUS detect |
| ピン D6 | ETH_TXEN — Ethernet MAC TX enable (MII/RMII) |
| ピン E6 | ETH_TXD0 — Ethernet MAC transmit data 0 |
| ピン F6 | ETH_TXD1 — Ethernet MAC transmit data 1 |
| ピン G6 | ETH_REFCLK — Ethernet MAC reference clock |
| ピン H6 | ETH_CRS_DV — Ethernet MAC carrier sense/data valid |
| ピン J6 | ETH_RXD0 — Ethernet MAC receive data 0 |
| ピン K6 | ETH_RXD1 — Ethernet MAC receive data 1 |
| ピン L6 | ETH_MDC — Ethernet PHY management clock |
| ピン C7 | CAN1_TX — CAN 1 transmit |
| ピン D7 | CAN1_RX — CAN 1 receive |
| ピン E7 | CAN2_TX — CAN 2 transmit |
| ピン F7 | CAN2_RX — CAN 2 receive |
| ピン G7 | TMS/SWDIO — JTAG TMS / SWD data |
| ピン H7 | TCK/SWCLK — JTAG TCK / SWD clock |
| ピン J7 | TDO — JTAG test data out |
| ピン K7 | TDI — JTAG test data in |
| ピン L7 | VBAT — Battery backup supply for SRAM |
| ピン A9 | VDDIO — I/O supply voltage (2.3-3.6 V) |
| ピン L12 | OSC1 — Primary crystal oscillator input |
| ピン K12 | OSC2 — Primary crystal oscillator output |
| ピン J12 | SOSC1 — Secondary 32 kHz crystal input |
| ピン H12 | SOSC2 — Secondary 32 kHz crystal output |
| ピン G12 | MCLR — Master clear / reset input (active-low) |
| ピン F12 | SQI_CLK — Quad-SPI clock output |
| ピン E12 | SQI_CS — Quad-SPI chip select |
| ピン D12 | SQI_D0 — Quad-SPI data 0 (MOSI) |
| ピン C12 | SQI_D1 — Quad-SPI data 1 (MISO) |
| ピン B12 | SQI_D2 — Quad-SPI data 2 (WP#) |
| ピン A12 | SQI_D3 — Quad-SPI data 3 (HOLD#) |
| ピン L1 | NC — Not connected (reserved ball per datasheet) |
主な用途
PIC32MZ1024EFF144T-E/JWX の用途: 6 件s: Industrial IoT Gateways and Edge Controllers, Automotive Infotainment and Cluster HMI, BLDC and PMSM Motor Control, Graphics HMI Touch Panels, Connected Medical Devices, Building Automation and HVAC Controllers.
Industrial IoT Gateways and Edge Controllers
The PIC32MZ1024EFF144T-E/JWX's 180 MHz MIPS core with 1 MB Flash and 256 KB SRAM makes it ideal for industrial IoT gateway applications running Modbus/TCP, MQTT, and OPC UA protocol stacks on top of RTOS or bare-metal firmware. The integrated HS USB 2.0 and 10/100 Ethernet MAC with MII/RMII interface allows direct connection to industrial sensors and controllers without external PHY cost overhead at low volumes. The 120 GPIO lines provide ample headroom for parallel sensor arrays, LCDs, and discrete I/O expansion. With the -E automotive temperature grade (-40C to +125C), it operates reliably inside factory-floor enclosures subject to wide thermal swings.
おすすめ
Automotive Infotainment and Cluster HMI
The PIC32MZ1024EFF144T-E/JWX's MIPS32 M-class core with FPU and DSP extensions is well suited for automotive cluster and infotainment HMI applications, including TFT LCD driving, touch input processing, and audio codec control. Its 12-bit ADC at up to 48 MSPS captures analog gauge signals, while the SQI interface supports external Quad-SPI Flash for high-speed graphics assets. The two CAN 2.0b controllers enable gateway functionality between CAN-FD body networks, and the -40C to +125C automotive temperature rating supports under-dash installation. The 144-TFBGA package provides high pin density for the multiple bus interfaces typical of in-vehicle systems.
おすすめ
BLDC and PMSM Motor Control
The PIC32MZ1024EFF144T-E/JWX's DSP-enhanced ASE and single-precision FPU deliver the floating-point performance needed for field-oriented control (FOC) of BLDC and PMSM motors in industrial drives and e-mobility applications. Its 8 DMA channels offload current-sensing sample transfer from the CPU, enabling deterministic 20 kHz PWM control loops. The integrated 12-bit ADC at 48 MSPS captures three-phase shunt currents with sub-microsecond latency, while multiple PWM outputs drive the three-phase inverter directly. The 144-TFBGA package's high pin count accommodates both the encoder interface and auxiliary sensor I/O typical of servo drives.
おすすめ
Graphics HMI Touch Panels
The PIC32MZ1024EFF144T-E/JWX supports graphics HMI touch panel designs by combining its 180 MHz MIPS core with 1 MB Flash and 256 KB SRAM to drive TFT LCDs up to WXGA resolution via the PMP/parallel interface. The integrated FPU accelerates 2D graphics primitives, while 8 DMA channels manage frame buffer transfer without CPU intervention. External Quad-SPI Flash via the SQI interface stores graphics assets and fonts, and the capacitive touch I/F interfaces with common projected-capacitive controllers. Designers pair it with companion ICs for backlight boost converters, isolated CAN/RS-485, and audio DAC for human-machine interface stations.
おすすめ
Connected Medical Devices
The PIC32MZ1024EFF144T-E/JWX is well suited for connected medical devices such as patient monitors, infusion pumps, and diagnostic instrumentation that require deterministic real-time response, USB connectivity, and high-resolution analog front-ends. Its 12-bit ADC at 48 MSPS captures biosignals (ECG, SpO2) with adequate resolution for diagnostic-grade measurements, while the HS USB 2.0 interface supports tethered data transfer to host PCs. The 1 MB Flash stores both application firmware and patient-data logs, and the cryptographic accelerator (on non-No-Crypto variants) secures wireless transmissions to EMR systems. The 144-TFBGA footprint enables compact board designs for portable monitors.
おすすめ
Building Automation and HVAC Controllers
The PIC32MZ1024EFF144T-E/JWX handles building automation controller applications including BACnet/IP gateways, KNX bridges, and HVAC control panels that combine multiple fieldbuses, Ethernet connectivity, and local HMI. The 10/100 Ethernet MAC supports BACnet/IP and MQTT cloud uplinks, while the dual CAN 2.0b controllers bridge to BACnet MS-TP or Modbus RTU networks. The -40C to +125C operating range covers unconditioned rooftop and basement installations. The 120 GPIO lines accommodate multiple relay drivers, sensor inputs, and local display/keypad interfaces typical of building controllers.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC32MZ1024EFF144T-E/JWX — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC32MZ1024EFF144T-I/JWX | PIC32MZ1024EFF144-E/JWX | PIC32MZ1024EFF144T-250E/JWX | PIC32MZ0512EFF144T-I/JWX | PIC32MZ1024EFE144T-I/JWX |
|---|---|---|---|---|---|---|
| Package | 144-TFBGA (JWX) 7x7 mm | 144-TFBGA (JWX) 7x7 mm - same | 144-TFBGA (JWX) 7x7 mm - same | 144-TFBGA (JWX) 7x7 mm - same | 144-TFBGA (JWX) 7x7 mm - same | 144-TFBGA (JWX) 7x7 mm - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Frequency | 180 MHz | 200 MHz | 180 MHz | 200/252 MHz | 200 MHz | 200 MHz |
| Flash | 1 MB | 1 MB | 1 MB | 1 MB | 512 KB | 1 MB |
| SRAM | 256 KB | 256 KB | 256 KB | 256 KB | 128 KB | 256 KB |
| Temperature Grade | Automotive (E: -40C to +125C) | Industrial (I: -40C to +85C) | Automotive (E: -40C to +125C) | Automotive (E: -40C to +125C) | Industrial (I: -40C to +85C) | Industrial (I: -40C to +85C) |
| FPU | Yes (single + double precision) | Yes | Yes | Yes | Yes | No (EFE sub-family) |
| DSP Extensions | Yes (DSP ASE) | Yes | Yes | Yes | Yes | No (EFE sub-family) |
| Cryptography | No (No Crypto variant) | No | No | No | No | No |
| Approx. 1k price (USD) | 9.12 | 8.40 | 9.05 | 10.50 | 7.20 | 7.85 |
主な差別化要因
- Highest temperature grade in the EFF family （vs PIC32MZ1024EFF144T-I/JWX)
- Maximum Flash density at this pin count （vs PIC32MZ0512EFF144T-I/JWX)
- FPU and DSP ASE retained （vs PIC32MZ1024EFE144T-I/JWX)
- Faster speed grade option available （vs PIC32MZ1024EFF144T-250E/JWX)
設計ノート
The 144-TFBGA package at 0.5 mm pitch requires a 4-layer or higher PCB stackup with microvia or via-in-pad fanout to maintain solder joint reliability. Per IPC-7351 nominal land pattern guidelines, use NSMD pads with a diameter 0.3 mm smaller than the ball. Place 100 nF X7R decoupling capacitors within 2 mm of every Vdd/Vss pair, and add four 4.7 uF bulk capacitors distributed around the package perimeter to control simultaneous switching noise on the GPIO banks.
The PIC32MZ EF family operates on four separate supply rails (VDD core, AVDD analog, VDDIO I/O, VBAT battery-backed SRAM). Power-up sequencing requires VDD first, then VDDIO and AVDD, per the manufacturer datasheet. AVDD must be filtered through a ferrite bead and 10 uF + 100 nF network to isolate analog noise. VBAT may remain floating for non-battery applications but must not exceed VDD + 0.3 V during transient events. Estimated: total worst-case active current is 95 mA at 180 MHz with all peripherals enabled, rising to 110 mA during Ethernet transmit bursts.
Three common pitfalls on PIC32MZ EF designs: (1) omitting the 32.768 kHz secondary crystal on SOSC1/SOSC2 disables the RTCC and prevents proper sleep-mode wake-up - the device will not enter Deep Sleep without a valid SOSC. (2) Using internal FRC without calibration drifts up to 2% across temperature, which is unacceptable for CAN 2.0b timing at 1 Mbps - always specify an external crystal or TXCO. (3) Programming the JTAGEN bit in DEVCFG1 inadvertently disables JTAG access; the device must be recovered via SWD-only programming on PICkit 4.
The TFBGA-144 package has a theta_JA of approximately 28 C/W on a JEDEC 4-layer test board. At maximum active power of approximately 1 W (worst case 95 mA x 3.6 V), the junction temperature rises 28 C above ambient. For automotive under-hood applications at 85 C ambient, the die will operate near 113 C, leaving thermal headroom for the +125 C E-grade limit. Designers should add thermal vias under the central ground balls and avoid placing the device near heat sources.
コンプライアンス情報
RoHS and REACH compliant per Microchip product declaration. The -E temperature grade supports automotive environments but the part is not AEC-Q100 qualified; for AEC-Q100 certified variants consult Microchip automotive catalog.
