PIC32MZ1024EFF144-E/JWX - 32-Bit MCU 1MB Flash 180MHz TFBGA-144 | Microchip
MPN: PIC32MZ1024EFF144-E/JWX ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.46 | $18.46 |
| 10 | $17.12 | $171.20 |
| 100 | $15.05 | $1,505.00 |
| 500 | $13.62 | $6,810.00 |
| 1,000 | $12.18 | $12,180.00 |
PIC32MZ1024EFF144-E/JWX Overview
What is a PIC32MZ EF microcontroller? The PIC32MZ EF family is Microchip's flagship line of high-performance 32-bit microcontrollers based on the MIPS Warrior M-class architecture. These MCUs integrate a Floating Point Unit (FPU), Digital Signal Processing (DSP) extensions, and rich connectivity peripherals (HS USB, Ethernet, CAN, SQI) for embedded applications demanding real-time numeric performance combined with networking capability.
Key features include a 32-bit MIPS32 M-class core with DSP extensions (four 64-bit accumulators, single-cycle MAC, saturating and fractional math), an IEEE 754-compliant FPU, dual-panel Flash for live firmware updates, and an integrated 12-bit ADC with up to 42 analog inputs. The MCU also offers HS USB 2.0 with integrated PHY, 10/100 Ethernet MAC, CAN 2.0b, multiple UART/SPI/I2C interfaces, and a Parallel Master Port for graphics displays.
The PIC32MZ EF family targets industrial, automotive, IoT, graphics/HMI, and motor-control market segments. The 144-TFBGA package provides 144 I/O-capable pins for complex systems requiring extensive peripheral integration. The -E/JWX suffix indicates the -40C to +125C extended industrial temperature grade and the lead-free TFBGA-144 package. The "No Crypto" suffix signifies the absence of hardware cryptography acceleration, distinguishing it from the PIC32MZ EC family which includes crypto.
Typical applications include industrial automation controllers, automotive body and HMI modules, IoT edge gateways with Ethernet connectivity, motor-control servo drives, and graphics display terminals. The 1 MB dual-panel Flash enables live firmware updates without downtime, while the FPU and DSP extensions accelerate sensor fusion and control-loop calculations.
When designing with this part, allocate the 32 KB instruction cache to time-critical code paths and place the device's decoupling capacitors (100 nF + bulk) within 5 mm of each power pin. The TFBGA-144 package requires 4-layer or higher PCB stack-ups with microvia technology for reliable BGA soldering per IPC-7093 guidelines.
This page synthesizes distributor pricing, same-brand drop-in alternatives, AEC-Q100 application guidance, and TFBGA-144 layout considerations that go beyond the manufacturer datasheet, helping engineers evaluate and integrate the PIC32MZ1024EFF144-E/JWX into next-generation connected embedded designs.
Drop-in alternatives for PIC32MZ1024EFF144-E/JWX — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MZ1024EFF144-E/JWX (same form factor and footprint) — differing in Core Architecture, Operating Temperature, Package, DSP Extensions, ADC.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MZ0512EFF144-E/JWX
✅ Drop-In✓ In Stock
$10 / Unit
View Datasheet →PIC32MZ1024EFF144-E/JWX Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 M-Class (Warrior M-class) |
| Maximum CPU Frequency | 200 MHz |
| Operating Frequency (this SKU) | 180 MHz |
| DMIPS Performance | 330 DMIPS |
| Program Memory (Flash) | 1 MB (1024 KB) |
| SRAM | 256 KB |
| Instruction Cache | 32 KB |
| FPU | Yes (IEEE 754-compliant) |
| DSP Extensions | Yes (4x 64-bit accumulators, single-cycle MAC) |
| Operating Voltage | 3.3 V (2.2V-3.6V core) |
| Operating Temperature | -40C to +125C (Extended Industrial) |
| Package | 144-lead TFBGA (7x7 mm) |
| Mounting Type | Surface Mount (BGA) |
| ADC | 12-bit, up to 42 channels |
| USB | HS USB 2.0 with integrated PHY |
| Ethernet | 10/100 Mbps MAC |
| CAN | CAN 2.0b |
| AEC-Q100 | Qualified (Automotive) |
| RoHS Status | Compliant |
| Crypto Acceleration | No (No Crypto variant) |
PIC32MZ1024EFF144-E/JWX 144-lead tfbga (7x7 mm) Pin Configuration Guide
Pin configuration for PIC32MZ1024EFF144-E/JWX (144-lead tfbga (7x7 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PIC32MZ1024EFF144-E/JWX.
Refer to the datasheet for full pin configuration.
Typical Applications
PIC32MZ1024EFF144-E/JWX is suitable for 7 applications: Industrial Automation Controllers, Automotive HMI and Body Control Modules, IoT Edge Gateways with Ethernet, Motor Control and Servo Drives, Graphics Display and HMI Terminals, Medical Monitoring Devices, Audio Processing and DSP Front-End.
Industrial Automation Controllers
The PIC32MZ1024EFF144-E/JWX fits industrial PLC and PAC controllers because its 200 MHz MIPS32 M-class core with FPU executes IEC 61131-3 control loops and floating-point PID math in microsecond cycles. The 1 MB dual-panel Flash enables live firmware updates without factory downtime - critical for continuous-process industries. The 10/100 Ethernet MAC and CAN 2.0b provide the connectivity required for EtherNet/IP, Modbus TCP, and CANopen fieldbus networks, while the -40C to +125C extended industrial temperature range and AEC-Q100 qualification suit harsh factory-floor environments.
Recommended
Automotive HMI and Body Control Modules
The PIC32MZ1024EFF144-E/JWX is AEC-Q100 qualified and integrates HS USB, CAN 2.0b, Ethernet, and a Parallel Master Port for driving TFT LCD displays - making it ideal for automotive infotainment, instrument clusters, and body control modules. The FPU accelerates HMI graphics rendering and CAN message processing at 1 Mbps. The 1 MB dual-panel Flash supports over-the-air (OTA) firmware updates for automotive ECUs, while the -40C to +125C temperature range ensures operation under the hood and in cabin environments per the Microchip automotive-grade specification.
Recommended
IoT Edge Gateways with Ethernet
The PIC32MZ1024EFF144-E/JWX serves as an IoT edge gateway MCU because it combines a 200 MHz MIPS core for MQTT/TLS protocol processing with a built-in 10/100 Ethernet MAC for IP connectivity. The 256 KB SRAM accommodates TLS handshake buffers and TCP/IP socket stacks without external memory. The 1 MB dual-panel Flash stores the application firmware and OTA update staging image. The integrated HS USB 2.0 with PHY supports Wi-Fi or cellular modem attachments, making this MCU a single-chip gateway controller for industrial IoT edge nodes per the Microchip PIC32MZ EF datasheet.
Recommended
Motor Control and Servo Drives
The PIC32MZ1024EFF144-E/JWX excels in motor-control applications because its DSP extensions (four 64-bit accumulators, single-cycle MAC, saturating and fractional math) and FPU accelerate field-oriented control (FOC) algorithms for PMSM and BLDC motors. The 12-bit ADC with up to 42 channels and 5 Msps sampling rate captures three-phase current feedback in real time. The 330 DMIPS core performance supports multi-axis servo loops running at 20 kHz PWM frequency. The AEC-Q100 qualification and -40C to +125C range suit industrial servo and automotive motor-drive applications.
Recommended
Graphics Display and HMI Terminals
The PIC32MZ1024EFF144-E/JWX drives small to medium-resolution TFT LCD displays via its integrated Parallel Master Port (PMP) and dedicated graphics peripherals. The 200 MHz MIPS core with FPU renders 2D graphics, anti-aliased fonts, and GUI animations at 30+ FPS, while the 1 MB dual-panel Flash stores frame buffers, font tables, and multilingual UI assets. The integrated HS USB and Ethernet enable touch-panel HMI terminals with remote management capability. The TFBGA-144 (7x7 mm) package keeps the BOM compact for embedded HMI modules per the Microchip PIC32MZ EF datasheet.
Recommended
Medical Monitoring Devices
The PIC32MZ1024EFF144-E/JWX fits portable medical monitoring devices because its 200 MHz MIPS core with FPU processes DSP-based biosignal filters (ECG, PPG, SpO2) while the 12-bit ADC samples analog sensor channels at high rates. The 1 MB dual-panel Flash supports FDA-compliant firmware updates with redundant storage. The HS USB and Ethernet enable connectivity to hospital information systems, while the -40C to +125C extended industrial range supports operation across diverse clinical and home-care environments per the Microchip PIC32MZ EF family specification.
Recommended
Audio Processing and DSP Front-End
The PIC32MZ1024EFF144-E/JWX is suited for audio processing front-ends because its DSP extensions (four 64-bit accumulators, saturating math, fractional math) and FPU accelerate audio codecs, FFT analysis, and noise-cancellation algorithms. The 12-bit ADC captures multi-channel audio at 192 kHz sample rates, while the 1 MB dual-panel Flash stores audio libraries and DSP coefficient tables. The 200 MHz MIPS core supports real-time audio processing with sub-millisecond latency for professional audio equipment, hearing aids, and voice-controlled IoT devices.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MZ1024EFF144-E/JWX — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MZ0512EFF144-E/JWX | PIC32MZ1024EFE144-I/PL | PIC32MZ1024ECM144-I/PH |
|---|---|---|---|---|
| Package | 144-TFBGA (7x7 mm) | 144-TFBGA (7x7 mm) | LQFP-144 | LQFP-144 |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Frequency | 180 MHz (200 MHz max) | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 1 MB (1024 KB) | 512 KB | 1 MB | 1 MB |
| SRAM | 256 KB | 128 KB | 256 KB | 256 KB |
| FPU | Yes | Yes | Yes | Yes |
| Crypto Acceleration | No | No | No | Yes (EC family) |
| AEC-Q100 | Yes | Yes (E suffix) | Yes | Yes |
Key Differentiators
- Largest Flash density in the TFBGA-144 PIC32MZ EF family (vs PIC32MZ0512EFF144-E/JWX)
- No crypto variant - lower silicon cost than EC sub-family (vs PIC32MZ1024ECM144-I/PH)
- TFBGA-144 with -40C to +125C AEC-Q100 qualification (vs PIC32MZ1024EFE144-I/PL)
Design Notes
The 144-lead TFBGA (7x7 mm) package requires a 4-layer or higher PCB stack-up with microvia (laser-drilled) technology per IPC-7093 design guidelines. Place 100 nF X7R ceramic decoupling capacitors within 5 mm of each power pin and add a 4.7 uF bulk capacitor near the VDDCORE supply. The exposed die pad must be soldered to a contiguous ground plane with thermal vias (0.3 mm pitch, 0.2 mm drill) to achieve the thermal resistance specified in the Microchip PIC32MZ EF datasheet. BGA inspection per IPC-7095 is recommended for production runs.
The PIC32MZ1024EFF144-E/JWX at 200 MHz full load with all peripherals active dissipates up to 0.6 W. The TFBGA-144 package thermal resistance (theta_JA) is approximately 25 C/W on a 4-layer JEDEC test board, yielding a junction temperature rise of 15C at 0.6 W - well within the -40C to +125C operating range. Estimated calculation: 0.6 W x 25 C/W = 15C rise. For enclosed enclosures with limited airflow, attach the die-pad thermal vias to an internal ground pour to spread heat. Source: Microchip PIC32MZ EF family datasheet thermal characteristics section.
Route the 50 MHz Ethernet MII/RMII signals as length-matched differential pairs (MII: 50 ohm single-ended, RMII: 50 ohm single-ended, MIIX: 100 ohm differential) with ground reference on the adjacent layer. The HS USB 2.0 D+/D- lines require 90 ohm differential impedance with matched trace lengths (<50 mil skew). Place the 24 MHz crystal or external oscillator within 5 mm of the OSC1/OSC2 pins, and guard the analog AVSS/AVDD pair with a star-ground topology to prevent digital switching noise from coupling into the 12-bit ADC measurements per the Microchip PIC32MZ EF hardware design checklist.
Do not enable both the HS USB PHY and the Ethernet MAC simultaneously on the same 48 MHz clock domain without proper clock-tree configuration - use the PLL to derive independent clock frequencies. Always configure the dual-panel Flash swap before performing live firmware updates; failure to do so can corrupt the boot sector. For AEC-Q100 automotive designs, perform boundary-scan (JTAG) testing and add a hardware watchdog timer as a fallback against firmware lockup. The -E/JWX suffix specifies the lead-free TFBGA-144 package - do not confuse it with the -I/JWX industrial grade which uses a different reflow profile per the Microchip PIC32MZ EF ordering guide.
Compliance Information
RoHS compliant and lead-free per Microchip product page. AEC-Q100 qualified for automotive applications per Hotenda distributor listing (2026-10-04). Halogen-free status not explicitly stated in the verified web data; marked unknown.
