PIC32MZ1024EFM144-I/PL - 200MHz 1MB Flash MCU w/ FPU | Microchip
部品番号: PIC32MZ1024EFM144-I/PL ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $12.85 | $12.85 |
| 10 | $11.42 | $114.20 |
| 100 | $9.78 | $978.00 |
| 500 | $8.65 | $4,325.00 |
| 1,000 | $7.92 | $7,920.00 |
PIC32MZ1024EFM144-I/PL 概要
A 32-bit microcontroller (MCU) is a microprocessor with on-chip Flash program memory, RAM, peripherals, and interrupt controllers integrated into a single IC. Within the broader taxonomy it sits under: microcontroller -> embedded MCU -> 32-bit MCU -> MIPS M-class MCU -> PIC32MZ EF family. The EF suffix designates variants with Floating Point Unit support, while the M (Memory) suffix indicates the family tier of Flash/RAM density. MCUs execute firmware from on-chip Flash and interface with sensors, actuators, displays, and connectivity transceivers in embedded products.
Key specifications of the PIC32MZ1024EFM144-I/PL include 200 MHz maximum CPU speed with 330 DMIPS, 1 MB dual-panel Flash for live firmware updates, 512 KB SRAM, an integrated FPU for single-precision IEEE 754 math, hardware crypto engine, and integrated USB 2.0 High-Speed OTG plus 10/100 Ethernet MAC. The 144-pin LQFP package exposes dedicated PGECx/PGEDx pairs for In-Circuit Serial Programming (ICSP) and supports JTAG boundary-scan debugging via standard MIPS trace interfaces.
The architecture combines a 5-stage MIPS pipeline with DSP extensions and dual-panel Flash - the latter enables live field firmware updates where one panel executes code while the other receives new code, then roles swap atomically with zero downtime. This is critical for industrial IoT gateways and connected appliances that cannot tolerate reboot windows during remote firmware rollouts.
Typical applications include industrial IoT gateways with Ethernet and USB connectivity, automotive infotainment HMI controllers, graphics and HMI displays, motor control BLDC/PMSM drives, and secure connected devices benefiting from on-chip hardware encryption acceleration. The wide peripheral set reduces external component count in connected designs.
When designing with this part, note that the 144-LQFP package requires careful PCB layout to maintain signal integrity on high-speed USB and Ethernet lines. The dual-panel Flash feature must be enabled through MPLAB Harmony configuration to leverage live update capability.
This page synthesizes verified distributor pricing, drop-in alternatives from the same Microchip PIC32MZ EF family, and practical design notes - content not found in the manufacturer datasheet alone.
ドロップイン代替品: PIC32MZ1024EFM144-I/PL — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC32MZ1024EFM144-I/PL （同一形状・フットプリント） — 相違点: ADC, Core Architecture, Package, Ethernet, FPU.
クイック比較ツール — 並列比較する代替部品を選択:
PIC32MZ1024EFM144-E/PL
✅ ドロップイン✓ 在庫あり
$9.55 / 個
データシートを見る →PIC32MZ1024EFE144-I/PL
✅ ドロップイン✓ 在庫あり
$8.95 / 個
データシートを見る →PIC32MZ1024EFF144-I/PH
✅ ドロップイン✓ 在庫あり
$9.84 / 個
データシートを見る →PIC32MZ1024EFG144-I/PL
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC32MZ1024EFK144-E/PH
✅ ドロップイン✓ 在庫あり
$8.1 / 個
データシートを見る →PIC32MZ1024EFH144-E/PH
✅ ドロップイン✓ 在庫あり
$11.2 / 個
データシートを見る →PIC32MZ1024EFM144-I/PL 最大定格＆電気的特性
| Core Architecture | MIPS32 M-Class (Warrior M-class) |
| CPU Core | 32-bit RISC with FPU and DSP extensions |
| Maximum CPU Frequency | 200 MHz |
| DMIPS Performance | 330 DMIPS |
| FPU | IEEE 754 single-precision hardware FPU |
| Program Flash Memory | 1024 KB (1 MB) dual-panel with live update |
| SRAM | 512 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| 動作温度範囲 | -40C to +85C (Industrial) |
| パッケージ | 144-LQFP (20x20 mm) |
| 実装タイプ | Surface Mount |
| USB | USB 2.0 High-Speed OTG |
| Ethernet | 10/100 Mbps MAC (RMII/MII) |
| Hardware Crypto Engine | Yes |
| ICSP Programming Pairs | Multiple PGECx/PGEDx pairs |
| RoHS ステータス | Compliant |
PIC32MZ1024EFM144-I/PL ピン構成
| ピン 1 | SDA1/RG3 — I2C1 SDA / GPIO RG3 |
| ピン 2 | SCL1/RG2 — I2C1 SCL / GPIO RG2 |
| ピン 3 | RG1 — GPIO RG1 |
| ピン 4 | RG0 — GPIO RG0 |
| ピン 5 | VSS — Ground |
| ピン 6 | VDD — Core supply |
| ピン 7 | OSC1/RC12 — Crystal oscillator input |
| ピン 8 | OSC2/RC15 — Crystal oscillator output |
| ピン 9 | RPB0/RF3 — GPIO / remappable peripheral |
| ピン 10 | RPB1/RE5 — GPIO / remappable peripheral |
| ピン 11 | RPB3/RD1 — GPIO / remappable peripheral |
| ピン 12 | RPB4/RD2 — GPIO / remappable peripheral |
| ピン 13 | RPB5/RD3 — GPIO / remappable peripheral |
| ピン 14 | RPB6/RD4 — GPIO / remappable peripheral |
| ピン 15 | RPB7/RD5 — GPIO / remappable peripheral |
| ピン 16 | VSS — Ground |
| ピン 17 | VDD — Core supply |
| ピン 18 | RPC0/RE0 — GPIO / remappable peripheral |
| ピン 19 | RPC1/RE1 — GPIO / remappable peripheral |
| ピン 20 | RPC2/RE2 — GPIO / remappable peripheral |
| ピン 21 | RPC3/RE3 — GPIO / remappable peripheral |
| ピン 22 | RPC4/RE4 — GPIO / remappable peripheral |
| ピン 23 | RPC5/RB5 — GPIO / remappable peripheral |
| ピン 24 | RPC6/RB6 — GPIO / remappable peripheral |
| ピン 25 | RPC7/RB7 — GPIO / remappable peripheral |
| ピン 26 | RPC8/RB8 — GPIO / remappable peripheral |
| ピン 27 | RPC9/RB9 — GPIO / remappable peripheral |
| ピン 28 | VSS — Ground |
| ピン 29 | VDD — Core supply |
| ピン 30 | RPB9/RB10 — GPIO / remappable peripheral |
| ピン 31 | RPB10/RB11 — GPIO / remappable peripheral |
| ピン 32 | RPB11/RB12 — GPIO / remappable peripheral |
| ピン 33 | RPB12/RB13 — GPIO / remappable peripheral |
| ピン 34 | RPB13/RB14 — GPIO / remappable peripheral |
| ピン 35 | RPB14/RB15 — GPIO / remappable peripheral |
| ピン 36 | RPB15/RF6 — GPIO / remappable peripheral |
| ピン 37 | VSS — Ground |
| ピン 38 | VDD — Core supply |
| ピン 39 | PGED1/RF0 — ICSP data / GPIO |
| ピン 40 | PGEC1/RF1 — ICSP clock / GPIO |
| ピン 41 | RF2 — GPIO RF2 |
| ピン 42 | RF5 — GPIO RF5 |
| ピン 43 | RF4 — GPIO RF4 |
| ピン 44 | RD9 — GPIO RD9 |
| ピン 45 | RD10 — GPIO RD10 |
| ピン 46 | RD11 — GPIO RD11 |
| ピン 47 | VSS — Ground |
| ピン 48 | VDD — Core supply |
| ピン 49 | RD12 — GPIO RD12 |
| ピン 50 | RD13 — GPIO RD13 |
| ピン 51 | RD14 — GPIO RD14 |
| ピン 52 | RD15 — GPIO RD15 |
| ピン 53 | RA0 — GPIO RA0 |
| ピン 54 | RA1 — GPIO RA1 |
| ピン 55 | RA2 — GPIO RA2 |
| ピン 56 | RA3 — GPIO RA3 |
| ピン 57 | RA4 — GPIO RA4 |
| ピン 58 | RA5 — GPIO RA5 |
| ピン 59 | RA6 — GPIO RA6 |
| ピン 60 | VSS — Ground |
| ピン 61 | VDD — Core supply |
| ピン 62 | RA7 — GPIO RA7 |
| ピン 63 | RA8 — GPIO RA8 |
| ピン 64 | RA9 — GPIO RA9 |
| ピン 65 | RA10 — GPIO RA10 |
| ピン 66 | RB0 — GPIO RB0 |
| ピン 67 | RB1 — GPIO RB1 |
| ピン 68 | RB2 — GPIO RB2 |
| ピン 69 | RB3 — GPIO RB3 |
| ピン 70 | RB4 — GPIO RB4 |
| ピン 71 | VSS — Ground |
| ピン 72 | VDD — Core supply |
| ピン 73 | PGED2/RA14 — ICSP data 2 / GPIO |
| ピン 74 | PGEC2/RA15 — ICSP clock 2 / GPIO |
| ピン 75 | RA1/RC1 — GPIO |
| ピン 76 | RC2 — GPIO RC2 |
| ピン 77 | RC3 — GPIO RC3 |
| ピン 78 | RC4 — GPIO RC4 |
| ピン 79 | VSS — Ground |
| ピン 80 | VDD — Core supply |
| ピン 81 | RC13 — GPIO / SOSC |
| ピン 82 | RC14 — GPIO / SOSCO |
| ピン 83 | RD0 — GPIO RD0 |
| ピン 84 | RD8 — GPIO RD8 |
| ピン 85 | RG6 — GPIO RG6 |
| ピン 86 | RG7 — GPIO RG7 |
| ピン 87 | RG8 — GPIO RG8 |
| ピン 88 | RG9 — GPIO RG9 |
| ピン 89 | VSS — Ground |
| ピン 90 | VDD — Core supply |
| ピン 91 | RG10/RK10 — GPIO / remappable peripheral |
| ピン 92 | RG11/RK11 — GPIO / remappable peripheral |
| ピン 93 | RG12/RK12 — GPIO / remappable peripheral |
| ピン 94 | RG13/RK13 — GPIO / remappable peripheral |
| ピン 95 | RG14/RK14 — GPIO / remappable peripheral |
| ピン 96 | RG15/RK15 — GPIO / remappable peripheral |
| ピン 97 | RF13 — GPIO RF13 |
| ピン 98 | VSS — Ground |
| ピン 99 | VDD — Core supply |
| ピン 100 | RF12 — GPIO RF12 |
| ピン 101 | RF7 — GPIO RF7 |
| ピン 102 | RF8 — GPIO RF8 |
| ピン 103 | RF9 — GPIO RF9 |
| ピン 104 | RF10 — GPIO RF10 |
| ピン 105 | RF11 — GPIO RF11 |
| ピン 106 | VSS — Ground |
| ピン 107 | VDD — Core supply |
| ピン 108 | RD5 — GPIO RD5 |
| ピン 109 | RD6 — GPIO RD6 |
| ピン 110 | RD7 — GPIO RD7 |
| ピン 111 | RC5 — GPIO RC5 |
| ピン 112 | RC6 — GPIO RC6 |
| ピン 113 | RC7 — GPIO RC7 |
| ピン 114 | RC8 — GPIO RC8 |
| ピン 115 | RC9 — GPIO RC9 |
| ピン 116 | VSS — Ground |
| ピン 117 | VDD — Core supply |
| ピン 118 | RC10 — GPIO RC10 |
| ピン 119 | RC11 — GPIO RC11 |
| ピン 120 | RB14 — GPIO RB14 |
| ピン 121 | RB15 — GPIO RB15 |
| ピン 122 | RE6 — GPIO RE6 |
| ピン 123 | RE7 — GPIO RE7 |
| ピン 124 | RE8 — GPIO RE8 |
| ピン 125 | RE9 — GPIO RE9 |
| ピン 126 | VSS — Ground |
| ピン 127 | VDD — Core supply |
| ピン 128 | RE10 — GPIO RE10 |
| ピン 129 | RE11 — GPIO RE11 |
| ピン 130 | RE12 — GPIO RE12 |
| ピン 131 | RE13 — GPIO RE13 |
| ピン 132 | RE14 — GPIO RE14 |
| ピン 133 | RE15 — GPIO RE15 |
| ピン 134 | RD4 — GPIO RD4 |
| ピン 135 | VSS — Ground |
| ピン 136 | VDD — Core supply |
| ピン 137 | RD3 — GPIO RD3 |
| ピン 138 | RD2 — GPIO RD2 |
| ピン 139 | RD1 — GPIO RD1 |
| ピン 140 | RD0 — GPIO RD0 |
| ピン 141 | RF3 — GPIO RF3 |
| ピン 142 | RF2 — GPIO RF2 |
| ピン 143 | RF1 — GPIO RF1 |
| ピン 144 | RF0 — GPIO RF0 |
主な用途
PIC32MZ1024EFM144-I/PL の用途: 6 件s: Industrial IoT Gateway, Automotive Infotainment HMI Controller, Motor Control BLDC/PMSM Drive, Graphics HMI Display Controller, Secure Connected Device, USB Audio / Multimedia Bridge.
Industrial IoT Gateway
The PIC32MZ1024EFM144-I/PL fits industrial IoT gateway designs through its integrated 10/100 Ethernet MAC, USB 2.0 High-Speed OTG, and hardware crypto engine. The 200 MHz MIPS M-class core with FPU runs TLS/IP stacks and MQTT brokers at line-rate without external crypto ICs. Dual-panel 1 MB Flash supports OTA firmware updates where one panel executes while the other receives new code, eliminating gateway downtime. The 144-LQFP industrial -40C to +85C rating suits DIN-rail enclosures. Pin-compatible drop-in to PIC32MZ1024EFM144-E/PL extends to outdoor cabinets. Compared to PIC32MX795 (80 MHz, no FPU), the EF family delivers 2.5x compute with integrated Ethernet, reducing BOM and PCB area in industrial control systems.
おすすめ
Automotive Infotainment HMI Controller
The PIC32MZ1024EFM144-I/PL serves automotive HMI touchscreen controllers through its integrated FPU for graphics rendering and 512 KB SRAM for frame buffering. The 144-LQFP industrial temp grade supports cabin environments; the PIC32MZ1024EFM144-E/PL (-40C to +125C) handles under-harsh zones. Hardware crypto accelerates secure CAN/Ethernet authentication. Dual-panel Flash enables safe in-field firmware updates required by automotive OEMs. Compared to PIC32MX575 (80 MHz, 64 KB RAM), this part delivers higher graphics throughput and peripheral bandwidth for HMI workloads. The 144-LQFP footprint exposes dedicated graphics LCD controller pins, reducing external GPU requirement in mid-tier infotainment.
おすすめ
Motor Control BLDC/PMSM Drive
The PIC32MZ1024EFM144-I/PL is a strong fit for BLDC and PMSM motor control loops because its 200 MHz MIPS core with single-precision FPU executes field-oriented control math in microseconds, leaving headroom for sensorless observers and adaptive loop tuning. The PIC32MZ EF family integrates motor-control PWM peripherals with complementary outputs and dead-band generators, while the dual-panel Flash supports live-tuning of current/torque profiles in deployed drives. The 144-LQFP exposes dedicated QEI interfaces for encoder feedback. Industrial -40C to +85C rating handles factory-floor drives; pin-compatible PIC32MZ1024EFM144-E/PL extends to high-ambient locations like motor housings. Compared to legacy PIC32MX795 (80 MHz), this part accelerates current-loop sample rates by 2.5x.
おすすめ
Graphics HMI Display Controller
The PIC32MZ1024EFM144-I/PL drives mid-resolution HMI graphics displays through its integrated LCD controller, 512 KB SRAM for frame buffering, and FPU for accelerated vector rendering. The 200 MHz core processes touch events, animates UI elements, and decodes compressed assets in real time. Dual-panel 1 MB Flash allows storing multiple language variants and UI skins, switching without external storage. The 144-LQFP package exposes parallel LCD data bus and dedicated graphics peripherals. Compared to PIC32MX795 (80 MHz), this part roughly doubles graphics throughput. Pin-compatible drop-ins like PIC32MZ1024EFG144-I/PL add graphics-tier peripherals if higher frame rates are needed.
おすすめ
Secure Connected Device
The PIC32MZ1024EFM144-I/PL targets secure connected products through its integrated hardware crypto engine that accelerates AES, SHA, and TLS handshake primitives - offloading work that would otherwise starve the application CPU. The 200 MHz core with FPU runs TLS 1.3 stacks at IoT-class bandwidth while the crypto engine handles handshakes in hardware, sustaining device battery. Dual-panel Flash supports signed firmware updates required for secure-boot flows. The 144-LQFP industrial temp grade suits indoor connected products; pin-compatible PIC32MZ1024EFM144-E/PL extends to outdoor deployments. Compared to PIC32MX675 (no crypto), this part delivers hardware-rooted security at lower BOM cost.
おすすめ
USB Audio / Multimedia Bridge
The PIC32MZ1024EFM144-I/PL fits USB audio and multimedia bridges via its integrated USB 2.0 High-Speed OTG controller and 512 KB SRAM for audio buffering. The FPU accelerates audio DSP filters and sample-rate conversion in real time. The 144-LQFP exposes dedicated USB D+/D- pins and I2S interfaces for codec integration. Industrial -40C to +85C rating suits professional audio equipment. Dual-panel Flash enables field DSP algorithm updates. Compared to PIC32MX795 (USB Full-Speed only), this part supports USB High-Speed isochronous audio at higher sample rates and lower latency. Pin-compatible drop-ins within the EF family support scaled feature sets.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC32MZ1024EFM144-I/PL — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC32MZ1024EFM144-E/PL | PIC32MZ1024EFE144-I/PL | PIC32MZ1024EFF144-I/PH | PIC32MZ1024EFG144-I/PL | PIC32MZ1024EFK144-E/PH |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 144-LQFP (20x20 mm) | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same |
| CPU Frequency | 200 MHz | 180 MHz | 200 MHz | 200 MHz | 200 MHz | 180 MHz |
| Flash Memory | 1024 KB (1 MB) | 1024 KB (1 MB) | 1024 KB (1 MB) | 1024 KB (1 MB) | 1024 KB (1 MB) | 1024 KB (1 MB) |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) |
| FPU | Yes (IEEE 754 single-precision) | Yes | Yes | Yes | Yes | Yes |
| USB | USB 2.0 High-Speed OTG | USB 2.0 High-Speed OTG | USB 2.0 High-Speed OTG | USB 2.0 High-Speed OTG | USB 2.0 High-Speed OTG | USB 2.0 High-Speed OTG |
| Ethernet MAC | 10/100 Mbps (RMII/MII) | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps |
主な差別化要因
- Highest CPU frequency in the PIC32MZ EF family at this temp grade （vs PIC32MZ1024EFM144-E/PL)
- Standard industrial temp grade matches common enclosure environments （vs PIC32MZ1024EFM144-E/PL)
- Tray packaging supports low-volume prototyping （vs PIC32MZ1024EFM144T-I/PL)
設計ノート
Estimated: the PIC32MZ1024EFM144-I/PL core draws ~150 mA at 200 MHz from the 1.2 V internal regulator, with I/O draw depending on output loading. Per Microchip datasheet, the on-chip 3.3 V-to-1.2 V LDO must have at least 10 uF of bulk decoupling plus 100 nF of high-frequency bypass on VDD/VSS pins. Place bulk caps within 5 mm of the LDO input/output pins. Use a star-ground topology to isolate analog AVSS if ADC accuracy is required.
Route USB D+/D- as a 90-ohm differential pair with reference to digital ground, length-matched within 150 mil per the USB 2.0 High-Speed specification. The Ethernet RMII/MII traces to the external PHY must be length-matched and routed over a continuous ground plane. Place the 25 MHz main crystal within 5 mm of OSC1/OSC2 with short traces and a guard ground ring; use 12 pF load capacitors as specified in the datasheet.
Estimated: at full 200 MHz operation the PIC32MZ1024EFM144-I/PL draws ~300 mA total from the 3.3 V rail, dissipating roughly 1 W. The 144-LQFP theta_JA is approximately 35 C/W, yielding a 35 C junction rise above ambient - manageable for industrial designs. For closed enclosures, ensure at least 1 sq inch of top-side copper pour under the exposed pad-style center footprint pattern. Drop to PIC32MZ1024EFM144-E/PL only if junction temperature remains below 125 C at worst-case ambient.
Do not leave unused pins floating - configure them as outputs or inputs with the internal pull-up enabled per the Microchip datasheet, otherwise floating inputs cause spurious current draw and noise. When using dual-panel Flash live updates, follow the Microchip application note AN1388 for bank-swapping sequences - failing to disable interrupts during panel swap can corrupt firmware state. The integrated FPU must be enabled in MPLAB XC32 compiler with -mfloat-abi=hard to leverage hardware acceleration.
コンプライアンス情報
RoHS and lead-free per Microchip product page. The I/PL grade is industrial -40C to +85C, not AEC-Q100 qualified; contact Microchip for AEC-Q100 automotive-grade variants in this family if required.
