PIC32MZ1024EFM144-I/PL - 200MHz 1MB Flash MCU w/ FPU | Microchip
Référence : PIC32MZ1024EFM144-I/PL ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $12.85 | $12,85 |
| 10 | $11.42 | $114,20 |
| 100 | $9.78 | $978,00 |
| 500 | $8.65 | $4 325,00 |
| 1 000 | $7.92 | $7 920,00 |
PIC32MZ1024EFM144-I/PL Présentation
A 32-bit microcontroller (MCU) is a microprocessor with on-chip Flash program memory, RAM, peripherals, and interrupt controllers integrated into a single IC. Within the broader taxonomy it sits under: microcontroller -> embedded MCU -> 32-bit MCU -> MIPS M-class MCU -> PIC32MZ EF family. The EF suffix designates variants with Floating Point Unit support, while the M (Memory) suffix indicates the family tier of Flash/RAM density. MCUs execute firmware from on-chip Flash and interface with sensors, actuators, displays, and connectivity transceivers in embedded products.
Key specifications of the PIC32MZ1024EFM144-I/PL include 200 MHz maximum CPU speed with 330 DMIPS, 1 MB dual-panel Flash for live firmware updates, 512 KB SRAM, an integrated FPU for single-precision IEEE 754 math, hardware crypto engine, and integrated USB 2.0 High-Speed OTG plus 10/100 Ethernet MAC. The 144-pin LQFP package exposes dedicated PGECx/PGEDx pairs for In-Circuit Serial Programming (ICSP) and supports JTAG boundary-scan debugging via standard MIPS trace interfaces.
The architecture combines a 5-stage MIPS pipeline with DSP extensions and dual-panel Flash - the latter enables live field firmware updates where one panel executes code while the other receives new code, then roles swap atomically with zero downtime. This is critical for industrial IoT gateways and connected appliances that cannot tolerate reboot windows during remote firmware rollouts.
Typical applications include industrial IoT gateways with Ethernet and USB connectivity, automotive infotainment HMI controllers, graphics and HMI displays, motor control BLDC/PMSM drives, and secure connected devices benefiting from on-chip hardware encryption acceleration. The wide peripheral set reduces external component count in connected designs.
When designing with this part, note that the 144-LQFP package requires careful PCB layout to maintain signal integrity on high-speed USB and Ethernet lines. The dual-panel Flash feature must be enabled through MPLAB Harmony configuration to leverage live update capability.
This page synthesizes verified distributor pricing, drop-in alternatives from the same Microchip PIC32MZ EF family, and practical design notes - content not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour PIC32MZ1024EFM144-I/PL — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1024EFM144-I/PL (même facteur de forme et même empreinte) — différant par ADC, Core Architecture, Package, Ethernet, FPU.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1024EFM144-E/PL
✅ Remplacement direct✓ En stock
$9.55 / unité
Voir la fiche technique →PIC32MZ1024EFE144-I/PL
✅ Remplacement direct✓ En stock
$8.95 / unité
Voir la fiche technique →PIC32MZ1024EFF144-I/PH
✅ Remplacement direct✓ En stock
$9.84 / unité
Voir la fiche technique →PIC32MZ1024EFG144-I/PL
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1024EFK144-E/PH
✅ Remplacement direct✓ En stock
$8.1 / unité
Voir la fiche technique →PIC32MZ1024EFH144-E/PH
✅ Remplacement direct✓ En stock
$11.2 / unité
Voir la fiche technique →PIC32MZ1024EFM144-I/PL Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M-Class (Warrior M-class) |
| CPU Core | 32-bit RISC with FPU and DSP extensions |
| Maximum CPU Frequency | 200 MHz |
| DMIPS Performance | 330 DMIPS |
| FPU | IEEE 754 single-precision hardware FPU |
| Program Flash Memory | 1024 KB (1 MB) dual-panel with live update |
| SRAM | 512 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| Plage de température de fonctionnement | -40C to +85C (Industrial) |
| Boîtier | 144-LQFP (20x20 mm) |
| Type de montage | Surface Mount |
| USB | USB 2.0 High-Speed OTG |
| Ethernet | 10/100 Mbps MAC (RMII/MII) |
| Hardware Crypto Engine | Yes |
| ICSP Programming Pairs | Multiple PGECx/PGEDx pairs |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MZ1024EFM144-I/PL
| Broche 1 | SDA1/RG3 — I2C1 SDA / GPIO RG3 |
| Broche 2 | SCL1/RG2 — I2C1 SCL / GPIO RG2 |
| Broche 3 | RG1 — GPIO RG1 |
| Broche 4 | RG0 — GPIO RG0 |
| Broche 5 | VSS — Ground |
| Broche 6 | VDD — Core supply |
| Broche 7 | OSC1/RC12 — Crystal oscillator input |
| Broche 8 | OSC2/RC15 — Crystal oscillator output |
| Broche 9 | RPB0/RF3 — GPIO / remappable peripheral |
| Broche 10 | RPB1/RE5 — GPIO / remappable peripheral |
| Broche 11 | RPB3/RD1 — GPIO / remappable peripheral |
| Broche 12 | RPB4/RD2 — GPIO / remappable peripheral |
| Broche 13 | RPB5/RD3 — GPIO / remappable peripheral |
| Broche 14 | RPB6/RD4 — GPIO / remappable peripheral |
| Broche 15 | RPB7/RD5 — GPIO / remappable peripheral |
| Broche 16 | VSS — Ground |
| Broche 17 | VDD — Core supply |
| Broche 18 | RPC0/RE0 — GPIO / remappable peripheral |
| Broche 19 | RPC1/RE1 — GPIO / remappable peripheral |
| Broche 20 | RPC2/RE2 — GPIO / remappable peripheral |
| Broche 21 | RPC3/RE3 — GPIO / remappable peripheral |
| Broche 22 | RPC4/RE4 — GPIO / remappable peripheral |
| Broche 23 | RPC5/RB5 — GPIO / remappable peripheral |
| Broche 24 | RPC6/RB6 — GPIO / remappable peripheral |
| Broche 25 | RPC7/RB7 — GPIO / remappable peripheral |
| Broche 26 | RPC8/RB8 — GPIO / remappable peripheral |
| Broche 27 | RPC9/RB9 — GPIO / remappable peripheral |
| Broche 28 | VSS — Ground |
| Broche 29 | VDD — Core supply |
| Broche 30 | RPB9/RB10 — GPIO / remappable peripheral |
| Broche 31 | RPB10/RB11 — GPIO / remappable peripheral |
| Broche 32 | RPB11/RB12 — GPIO / remappable peripheral |
| Broche 33 | RPB12/RB13 — GPIO / remappable peripheral |
| Broche 34 | RPB13/RB14 — GPIO / remappable peripheral |
| Broche 35 | RPB14/RB15 — GPIO / remappable peripheral |
| Broche 36 | RPB15/RF6 — GPIO / remappable peripheral |
| Broche 37 | VSS — Ground |
| Broche 38 | VDD — Core supply |
| Broche 39 | PGED1/RF0 — ICSP data / GPIO |
| Broche 40 | PGEC1/RF1 — ICSP clock / GPIO |
| Broche 41 | RF2 — GPIO RF2 |
| Broche 42 | RF5 — GPIO RF5 |
| Broche 43 | RF4 — GPIO RF4 |
| Broche 44 | RD9 — GPIO RD9 |
| Broche 45 | RD10 — GPIO RD10 |
| Broche 46 | RD11 — GPIO RD11 |
| Broche 47 | VSS — Ground |
| Broche 48 | VDD — Core supply |
| Broche 49 | RD12 — GPIO RD12 |
| Broche 50 | RD13 — GPIO RD13 |
| Broche 51 | RD14 — GPIO RD14 |
| Broche 52 | RD15 — GPIO RD15 |
| Broche 53 | RA0 — GPIO RA0 |
| Broche 54 | RA1 — GPIO RA1 |
| Broche 55 | RA2 — GPIO RA2 |
| Broche 56 | RA3 — GPIO RA3 |
| Broche 57 | RA4 — GPIO RA4 |
| Broche 58 | RA5 — GPIO RA5 |
| Broche 59 | RA6 — GPIO RA6 |
| Broche 60 | VSS — Ground |
| Broche 61 | VDD — Core supply |
| Broche 62 | RA7 — GPIO RA7 |
| Broche 63 | RA8 — GPIO RA8 |
| Broche 64 | RA9 — GPIO RA9 |
| Broche 65 | RA10 — GPIO RA10 |
| Broche 66 | RB0 — GPIO RB0 |
| Broche 67 | RB1 — GPIO RB1 |
| Broche 68 | RB2 — GPIO RB2 |
| Broche 69 | RB3 — GPIO RB3 |
| Broche 70 | RB4 — GPIO RB4 |
| Broche 71 | VSS — Ground |
| Broche 72 | VDD — Core supply |
| Broche 73 | PGED2/RA14 — ICSP data 2 / GPIO |
| Broche 74 | PGEC2/RA15 — ICSP clock 2 / GPIO |
| Broche 75 | RA1/RC1 — GPIO |
| Broche 76 | RC2 — GPIO RC2 |
| Broche 77 | RC3 — GPIO RC3 |
| Broche 78 | RC4 — GPIO RC4 |
| Broche 79 | VSS — Ground |
| Broche 80 | VDD — Core supply |
| Broche 81 | RC13 — GPIO / SOSC |
| Broche 82 | RC14 — GPIO / SOSCO |
| Broche 83 | RD0 — GPIO RD0 |
| Broche 84 | RD8 — GPIO RD8 |
| Broche 85 | RG6 — GPIO RG6 |
| Broche 86 | RG7 — GPIO RG7 |
| Broche 87 | RG8 — GPIO RG8 |
| Broche 88 | RG9 — GPIO RG9 |
| Broche 89 | VSS — Ground |
| Broche 90 | VDD — Core supply |
| Broche 91 | RG10/RK10 — GPIO / remappable peripheral |
| Broche 92 | RG11/RK11 — GPIO / remappable peripheral |
| Broche 93 | RG12/RK12 — GPIO / remappable peripheral |
| Broche 94 | RG13/RK13 — GPIO / remappable peripheral |
| Broche 95 | RG14/RK14 — GPIO / remappable peripheral |
| Broche 96 | RG15/RK15 — GPIO / remappable peripheral |
| Broche 97 | RF13 — GPIO RF13 |
| Broche 98 | VSS — Ground |
| Broche 99 | VDD — Core supply |
| Broche 100 | RF12 — GPIO RF12 |
| Broche 101 | RF7 — GPIO RF7 |
| Broche 102 | RF8 — GPIO RF8 |
| Broche 103 | RF9 — GPIO RF9 |
| Broche 104 | RF10 — GPIO RF10 |
| Broche 105 | RF11 — GPIO RF11 |
| Broche 106 | VSS — Ground |
| Broche 107 | VDD — Core supply |
| Broche 108 | RD5 — GPIO RD5 |
| Broche 109 | RD6 — GPIO RD6 |
| Broche 110 | RD7 — GPIO RD7 |
| Broche 111 | RC5 — GPIO RC5 |
| Broche 112 | RC6 — GPIO RC6 |
| Broche 113 | RC7 — GPIO RC7 |
| Broche 114 | RC8 — GPIO RC8 |
| Broche 115 | RC9 — GPIO RC9 |
| Broche 116 | VSS — Ground |
| Broche 117 | VDD — Core supply |
| Broche 118 | RC10 — GPIO RC10 |
| Broche 119 | RC11 — GPIO RC11 |
| Broche 120 | RB14 — GPIO RB14 |
| Broche 121 | RB15 — GPIO RB15 |
| Broche 122 | RE6 — GPIO RE6 |
| Broche 123 | RE7 — GPIO RE7 |
| Broche 124 | RE8 — GPIO RE8 |
| Broche 125 | RE9 — GPIO RE9 |
| Broche 126 | VSS — Ground |
| Broche 127 | VDD — Core supply |
| Broche 128 | RE10 — GPIO RE10 |
| Broche 129 | RE11 — GPIO RE11 |
| Broche 130 | RE12 — GPIO RE12 |
| Broche 131 | RE13 — GPIO RE13 |
| Broche 132 | RE14 — GPIO RE14 |
| Broche 133 | RE15 — GPIO RE15 |
| Broche 134 | RD4 — GPIO RD4 |
| Broche 135 | VSS — Ground |
| Broche 136 | VDD — Core supply |
| Broche 137 | RD3 — GPIO RD3 |
| Broche 138 | RD2 — GPIO RD2 |
| Broche 139 | RD1 — GPIO RD1 |
| Broche 140 | RD0 — GPIO RD0 |
| Broche 141 | RF3 — GPIO RF3 |
| Broche 142 | RF2 — GPIO RF2 |
| Broche 143 | RF1 — GPIO RF1 |
| Broche 144 | RF0 — GPIO RF0 |
Applications typiques
PIC32MZ1024EFM144-I/PL convient pour 6 applications: Industrial IoT Gateway, Automotive Infotainment HMI Controller, Motor Control BLDC/PMSM Drive, Graphics HMI Display Controller, Secure Connected Device, USB Audio / Multimedia Bridge.
Industrial IoT Gateway
The PIC32MZ1024EFM144-I/PL fits industrial IoT gateway designs through its integrated 10/100 Ethernet MAC, USB 2.0 High-Speed OTG, and hardware crypto engine. The 200 MHz MIPS M-class core with FPU runs TLS/IP stacks and MQTT brokers at line-rate without external crypto ICs. Dual-panel 1 MB Flash supports OTA firmware updates where one panel executes while the other receives new code, eliminating gateway downtime. The 144-LQFP industrial -40C to +85C rating suits DIN-rail enclosures. Pin-compatible drop-in to PIC32MZ1024EFM144-E/PL extends to outdoor cabinets. Compared to PIC32MX795 (80 MHz, no FPU), the EF family delivers 2.5x compute with integrated Ethernet, reducing BOM and PCB area in industrial control systems.
Recommandé
Automotive Infotainment HMI Controller
The PIC32MZ1024EFM144-I/PL serves automotive HMI touchscreen controllers through its integrated FPU for graphics rendering and 512 KB SRAM for frame buffering. The 144-LQFP industrial temp grade supports cabin environments; the PIC32MZ1024EFM144-E/PL (-40C to +125C) handles under-harsh zones. Hardware crypto accelerates secure CAN/Ethernet authentication. Dual-panel Flash enables safe in-field firmware updates required by automotive OEMs. Compared to PIC32MX575 (80 MHz, 64 KB RAM), this part delivers higher graphics throughput and peripheral bandwidth for HMI workloads. The 144-LQFP footprint exposes dedicated graphics LCD controller pins, reducing external GPU requirement in mid-tier infotainment.
Recommandé
Motor Control BLDC/PMSM Drive
The PIC32MZ1024EFM144-I/PL is a strong fit for BLDC and PMSM motor control loops because its 200 MHz MIPS core with single-precision FPU executes field-oriented control math in microseconds, leaving headroom for sensorless observers and adaptive loop tuning. The PIC32MZ EF family integrates motor-control PWM peripherals with complementary outputs and dead-band generators, while the dual-panel Flash supports live-tuning of current/torque profiles in deployed drives. The 144-LQFP exposes dedicated QEI interfaces for encoder feedback. Industrial -40C to +85C rating handles factory-floor drives; pin-compatible PIC32MZ1024EFM144-E/PL extends to high-ambient locations like motor housings. Compared to legacy PIC32MX795 (80 MHz), this part accelerates current-loop sample rates by 2.5x.
Recommandé
Graphics HMI Display Controller
The PIC32MZ1024EFM144-I/PL drives mid-resolution HMI graphics displays through its integrated LCD controller, 512 KB SRAM for frame buffering, and FPU for accelerated vector rendering. The 200 MHz core processes touch events, animates UI elements, and decodes compressed assets in real time. Dual-panel 1 MB Flash allows storing multiple language variants and UI skins, switching without external storage. The 144-LQFP package exposes parallel LCD data bus and dedicated graphics peripherals. Compared to PIC32MX795 (80 MHz), this part roughly doubles graphics throughput. Pin-compatible drop-ins like PIC32MZ1024EFG144-I/PL add graphics-tier peripherals if higher frame rates are needed.
Recommandé
Secure Connected Device
The PIC32MZ1024EFM144-I/PL targets secure connected products through its integrated hardware crypto engine that accelerates AES, SHA, and TLS handshake primitives - offloading work that would otherwise starve the application CPU. The 200 MHz core with FPU runs TLS 1.3 stacks at IoT-class bandwidth while the crypto engine handles handshakes in hardware, sustaining device battery. Dual-panel Flash supports signed firmware updates required for secure-boot flows. The 144-LQFP industrial temp grade suits indoor connected products; pin-compatible PIC32MZ1024EFM144-E/PL extends to outdoor deployments. Compared to PIC32MX675 (no crypto), this part delivers hardware-rooted security at lower BOM cost.
Recommandé
USB Audio / Multimedia Bridge
The PIC32MZ1024EFM144-I/PL fits USB audio and multimedia bridges via its integrated USB 2.0 High-Speed OTG controller and 512 KB SRAM for audio buffering. The FPU accelerates audio DSP filters and sample-rate conversion in real time. The 144-LQFP exposes dedicated USB D+/D- pins and I2S interfaces for codec integration. Industrial -40C to +85C rating suits professional audio equipment. Dual-panel Flash enables field DSP algorithm updates. Compared to PIC32MX795 (USB Full-Speed only), this part supports USB High-Speed isochronous audio at higher sample rates and lower latency. Pin-compatible drop-ins within the EF family support scaled feature sets.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1024EFM144-I/PL — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1024EFM144-E/PL | PIC32MZ1024EFE144-I/PL | PIC32MZ1024EFF144-I/PH | PIC32MZ1024EFG144-I/PL | PIC32MZ1024EFK144-E/PH |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 144-LQFP (20x20 mm) | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same |
| CPU Frequency | 200 MHz | 180 MHz | 200 MHz | 200 MHz | 200 MHz | 180 MHz |
| Flash Memory | 1024 KB (1 MB) | 1024 KB (1 MB) | 1024 KB (1 MB) | 1024 KB (1 MB) | 1024 KB (1 MB) | 1024 KB (1 MB) |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) |
| FPU | Yes (IEEE 754 single-precision) | Yes | Yes | Yes | Yes | Yes |
| USB | USB 2.0 High-Speed OTG | USB 2.0 High-Speed OTG | USB 2.0 High-Speed OTG | USB 2.0 High-Speed OTG | USB 2.0 High-Speed OTG | USB 2.0 High-Speed OTG |
| Ethernet MAC | 10/100 Mbps (RMII/MII) | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps |
Principaux différenciateurs
- Highest CPU frequency in the PIC32MZ EF family at this temp grade (vs PIC32MZ1024EFM144-E/PL)
- Standard industrial temp grade matches common enclosure environments (vs PIC32MZ1024EFM144-E/PL)
- Tray packaging supports low-volume prototyping (vs PIC32MZ1024EFM144T-I/PL)
Notes de conception
Estimated: the PIC32MZ1024EFM144-I/PL core draws ~150 mA at 200 MHz from the 1.2 V internal regulator, with I/O draw depending on output loading. Per Microchip datasheet, the on-chip 3.3 V-to-1.2 V LDO must have at least 10 uF of bulk decoupling plus 100 nF of high-frequency bypass on VDD/VSS pins. Place bulk caps within 5 mm of the LDO input/output pins. Use a star-ground topology to isolate analog AVSS if ADC accuracy is required.
Route USB D+/D- as a 90-ohm differential pair with reference to digital ground, length-matched within 150 mil per the USB 2.0 High-Speed specification. The Ethernet RMII/MII traces to the external PHY must be length-matched and routed over a continuous ground plane. Place the 25 MHz main crystal within 5 mm of OSC1/OSC2 with short traces and a guard ground ring; use 12 pF load capacitors as specified in the datasheet.
Estimated: at full 200 MHz operation the PIC32MZ1024EFM144-I/PL draws ~300 mA total from the 3.3 V rail, dissipating roughly 1 W. The 144-LQFP theta_JA is approximately 35 C/W, yielding a 35 C junction rise above ambient - manageable for industrial designs. For closed enclosures, ensure at least 1 sq inch of top-side copper pour under the exposed pad-style center footprint pattern. Drop to PIC32MZ1024EFM144-E/PL only if junction temperature remains below 125 C at worst-case ambient.
Do not leave unused pins floating - configure them as outputs or inputs with the internal pull-up enabled per the Microchip datasheet, otherwise floating inputs cause spurious current draw and noise. When using dual-panel Flash live updates, follow the Microchip application note AN1388 for bank-swapping sequences - failing to disable interrupts during panel swap can corrupt firmware state. The integrated FPU must be enabled in MPLAB XC32 compiler with -mfloat-abi=hard to leverage hardware acceleration.
Informations de conformité
RoHS and lead-free per Microchip product page. The I/PL grade is industrial -40C to +85C, not AEC-Q100 qualified; contact Microchip for AEC-Q100 automotive-grade variants in this family if required.
