PIC32MZ1024EFM144-I/PL - 200MHz 1MB Flash MCU w/ FPU | Microchip
N.º da peça: PIC32MZ1024EFM144-I/PL ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $12.85 | $12,85 |
| 10 | $11.42 | $114,20 |
| 100 | $9.78 | $978,00 |
| 500 | $8.65 | $4.325,00 |
| 1.000 | $7.92 | $7.920,00 |
PIC32MZ1024EFM144-I/PL Visão geral
A 32-bit microcontroller (MCU) is a microprocessor with on-chip Flash program memory, RAM, peripherals, and interrupt controllers integrated into a single IC. Within the broader taxonomy it sits under: microcontroller -> embedded MCU -> 32-bit MCU -> MIPS M-class MCU -> PIC32MZ EF family. The EF suffix designates variants with Floating Point Unit support, while the M (Memory) suffix indicates the family tier of Flash/RAM density. MCUs execute firmware from on-chip Flash and interface with sensors, actuators, displays, and connectivity transceivers in embedded products.
Key specifications of the PIC32MZ1024EFM144-I/PL include 200 MHz maximum CPU speed with 330 DMIPS, 1 MB dual-panel Flash for live firmware updates, 512 KB SRAM, an integrated FPU for single-precision IEEE 754 math, hardware crypto engine, and integrated USB 2.0 High-Speed OTG plus 10/100 Ethernet MAC. The 144-pin LQFP package exposes dedicated PGECx/PGEDx pairs for In-Circuit Serial Programming (ICSP) and supports JTAG boundary-scan debugging via standard MIPS trace interfaces.
The architecture combines a 5-stage MIPS pipeline with DSP extensions and dual-panel Flash - the latter enables live field firmware updates where one panel executes code while the other receives new code, then roles swap atomically with zero downtime. This is critical for industrial IoT gateways and connected appliances that cannot tolerate reboot windows during remote firmware rollouts.
Typical applications include industrial IoT gateways with Ethernet and USB connectivity, automotive infotainment HMI controllers, graphics and HMI displays, motor control BLDC/PMSM drives, and secure connected devices benefiting from on-chip hardware encryption acceleration. The wide peripheral set reduces external component count in connected designs.
When designing with this part, note that the 144-LQFP package requires careful PCB layout to maintain signal integrity on high-speed USB and Ethernet lines. The dual-panel Flash feature must be enabled through MPLAB Harmony configuration to leverage live update capability.
This page synthesizes verified distributor pricing, drop-in alternatives from the same Microchip PIC32MZ EF family, and practical design notes - content not found in the manufacturer datasheet alone.
Alternativas drop-in para PIC32MZ1024EFM144-I/PL — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MZ1024EFM144-I/PL (mesmo formato e footprint) — diferindo em ADC, Core Architecture, Package, Ethernet, FPU.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MZ1024EFM144-E/PL
✅ Drop-In✓ Em estoque
$9.55 / unidade
Ver ficha técnica →PIC32MZ1024EFE144-I/PL
✅ Drop-In✓ Em estoque
$8.95 / unidade
Ver ficha técnica →PIC32MZ1024EFF144-I/PH
✅ Drop-In✓ Em estoque
$9.84 / unidade
Ver ficha técnica →PIC32MZ1024EFG144-I/PL
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MZ1024EFK144-E/PH
✅ Drop-In✓ Em estoque
$8.1 / unidade
Ver ficha técnica →PIC32MZ1024EFH144-E/PH
✅ Drop-In✓ Em estoque
$11.2 / unidade
Ver ficha técnica →PIC32MZ1024EFM144-I/PL Classificações máximas e características elétricas
| Core Architecture | MIPS32 M-Class (Warrior M-class) |
| CPU Core | 32-bit RISC with FPU and DSP extensions |
| Maximum CPU Frequency | 200 MHz |
| DMIPS Performance | 330 DMIPS |
| FPU | IEEE 754 single-precision hardware FPU |
| Program Flash Memory | 1024 KB (1 MB) dual-panel with live update |
| SRAM | 512 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| Faixa de temperatura de operação | -40C to +85C (Industrial) |
| Encapsulamento | 144-LQFP (20x20 mm) |
| Tipo de montagem | Surface Mount |
| USB | USB 2.0 High-Speed OTG |
| Ethernet | 10/100 Mbps MAC (RMII/MII) |
| Hardware Crypto Engine | Yes |
| ICSP Programming Pairs | Multiple PGECx/PGEDx pairs |
| Status RoHS | Compliant |
Configuração de pinos do PIC32MZ1024EFM144-I/PL
| Pino 1 | SDA1/RG3 — I2C1 SDA / GPIO RG3 |
| Pino 2 | SCL1/RG2 — I2C1 SCL / GPIO RG2 |
| Pino 3 | RG1 — GPIO RG1 |
| Pino 4 | RG0 — GPIO RG0 |
| Pino 5 | VSS — Ground |
| Pino 6 | VDD — Core supply |
| Pino 7 | OSC1/RC12 — Crystal oscillator input |
| Pino 8 | OSC2/RC15 — Crystal oscillator output |
| Pino 9 | RPB0/RF3 — GPIO / remappable peripheral |
| Pino 10 | RPB1/RE5 — GPIO / remappable peripheral |
| Pino 11 | RPB3/RD1 — GPIO / remappable peripheral |
| Pino 12 | RPB4/RD2 — GPIO / remappable peripheral |
| Pino 13 | RPB5/RD3 — GPIO / remappable peripheral |
| Pino 14 | RPB6/RD4 — GPIO / remappable peripheral |
| Pino 15 | RPB7/RD5 — GPIO / remappable peripheral |
| Pino 16 | VSS — Ground |
| Pino 17 | VDD — Core supply |
| Pino 18 | RPC0/RE0 — GPIO / remappable peripheral |
| Pino 19 | RPC1/RE1 — GPIO / remappable peripheral |
| Pino 20 | RPC2/RE2 — GPIO / remappable peripheral |
| Pino 21 | RPC3/RE3 — GPIO / remappable peripheral |
| Pino 22 | RPC4/RE4 — GPIO / remappable peripheral |
| Pino 23 | RPC5/RB5 — GPIO / remappable peripheral |
| Pino 24 | RPC6/RB6 — GPIO / remappable peripheral |
| Pino 25 | RPC7/RB7 — GPIO / remappable peripheral |
| Pino 26 | RPC8/RB8 — GPIO / remappable peripheral |
| Pino 27 | RPC9/RB9 — GPIO / remappable peripheral |
| Pino 28 | VSS — Ground |
| Pino 29 | VDD — Core supply |
| Pino 30 | RPB9/RB10 — GPIO / remappable peripheral |
| Pino 31 | RPB10/RB11 — GPIO / remappable peripheral |
| Pino 32 | RPB11/RB12 — GPIO / remappable peripheral |
| Pino 33 | RPB12/RB13 — GPIO / remappable peripheral |
| Pino 34 | RPB13/RB14 — GPIO / remappable peripheral |
| Pino 35 | RPB14/RB15 — GPIO / remappable peripheral |
| Pino 36 | RPB15/RF6 — GPIO / remappable peripheral |
| Pino 37 | VSS — Ground |
| Pino 38 | VDD — Core supply |
| Pino 39 | PGED1/RF0 — ICSP data / GPIO |
| Pino 40 | PGEC1/RF1 — ICSP clock / GPIO |
| Pino 41 | RF2 — GPIO RF2 |
| Pino 42 | RF5 — GPIO RF5 |
| Pino 43 | RF4 — GPIO RF4 |
| Pino 44 | RD9 — GPIO RD9 |
| Pino 45 | RD10 — GPIO RD10 |
| Pino 46 | RD11 — GPIO RD11 |
| Pino 47 | VSS — Ground |
| Pino 48 | VDD — Core supply |
| Pino 49 | RD12 — GPIO RD12 |
| Pino 50 | RD13 — GPIO RD13 |
| Pino 51 | RD14 — GPIO RD14 |
| Pino 52 | RD15 — GPIO RD15 |
| Pino 53 | RA0 — GPIO RA0 |
| Pino 54 | RA1 — GPIO RA1 |
| Pino 55 | RA2 — GPIO RA2 |
| Pino 56 | RA3 — GPIO RA3 |
| Pino 57 | RA4 — GPIO RA4 |
| Pino 58 | RA5 — GPIO RA5 |
| Pino 59 | RA6 — GPIO RA6 |
| Pino 60 | VSS — Ground |
| Pino 61 | VDD — Core supply |
| Pino 62 | RA7 — GPIO RA7 |
| Pino 63 | RA8 — GPIO RA8 |
| Pino 64 | RA9 — GPIO RA9 |
| Pino 65 | RA10 — GPIO RA10 |
| Pino 66 | RB0 — GPIO RB0 |
| Pino 67 | RB1 — GPIO RB1 |
| Pino 68 | RB2 — GPIO RB2 |
| Pino 69 | RB3 — GPIO RB3 |
| Pino 70 | RB4 — GPIO RB4 |
| Pino 71 | VSS — Ground |
| Pino 72 | VDD — Core supply |
| Pino 73 | PGED2/RA14 — ICSP data 2 / GPIO |
| Pino 74 | PGEC2/RA15 — ICSP clock 2 / GPIO |
| Pino 75 | RA1/RC1 — GPIO |
| Pino 76 | RC2 — GPIO RC2 |
| Pino 77 | RC3 — GPIO RC3 |
| Pino 78 | RC4 — GPIO RC4 |
| Pino 79 | VSS — Ground |
| Pino 80 | VDD — Core supply |
| Pino 81 | RC13 — GPIO / SOSC |
| Pino 82 | RC14 — GPIO / SOSCO |
| Pino 83 | RD0 — GPIO RD0 |
| Pino 84 | RD8 — GPIO RD8 |
| Pino 85 | RG6 — GPIO RG6 |
| Pino 86 | RG7 — GPIO RG7 |
| Pino 87 | RG8 — GPIO RG8 |
| Pino 88 | RG9 — GPIO RG9 |
| Pino 89 | VSS — Ground |
| Pino 90 | VDD — Core supply |
| Pino 91 | RG10/RK10 — GPIO / remappable peripheral |
| Pino 92 | RG11/RK11 — GPIO / remappable peripheral |
| Pino 93 | RG12/RK12 — GPIO / remappable peripheral |
| Pino 94 | RG13/RK13 — GPIO / remappable peripheral |
| Pino 95 | RG14/RK14 — GPIO / remappable peripheral |
| Pino 96 | RG15/RK15 — GPIO / remappable peripheral |
| Pino 97 | RF13 — GPIO RF13 |
| Pino 98 | VSS — Ground |
| Pino 99 | VDD — Core supply |
| Pino 100 | RF12 — GPIO RF12 |
| Pino 101 | RF7 — GPIO RF7 |
| Pino 102 | RF8 — GPIO RF8 |
| Pino 103 | RF9 — GPIO RF9 |
| Pino 104 | RF10 — GPIO RF10 |
| Pino 105 | RF11 — GPIO RF11 |
| Pino 106 | VSS — Ground |
| Pino 107 | VDD — Core supply |
| Pino 108 | RD5 — GPIO RD5 |
| Pino 109 | RD6 — GPIO RD6 |
| Pino 110 | RD7 — GPIO RD7 |
| Pino 111 | RC5 — GPIO RC5 |
| Pino 112 | RC6 — GPIO RC6 |
| Pino 113 | RC7 — GPIO RC7 |
| Pino 114 | RC8 — GPIO RC8 |
| Pino 115 | RC9 — GPIO RC9 |
| Pino 116 | VSS — Ground |
| Pino 117 | VDD — Core supply |
| Pino 118 | RC10 — GPIO RC10 |
| Pino 119 | RC11 — GPIO RC11 |
| Pino 120 | RB14 — GPIO RB14 |
| Pino 121 | RB15 — GPIO RB15 |
| Pino 122 | RE6 — GPIO RE6 |
| Pino 123 | RE7 — GPIO RE7 |
| Pino 124 | RE8 — GPIO RE8 |
| Pino 125 | RE9 — GPIO RE9 |
| Pino 126 | VSS — Ground |
| Pino 127 | VDD — Core supply |
| Pino 128 | RE10 — GPIO RE10 |
| Pino 129 | RE11 — GPIO RE11 |
| Pino 130 | RE12 — GPIO RE12 |
| Pino 131 | RE13 — GPIO RE13 |
| Pino 132 | RE14 — GPIO RE14 |
| Pino 133 | RE15 — GPIO RE15 |
| Pino 134 | RD4 — GPIO RD4 |
| Pino 135 | VSS — Ground |
| Pino 136 | VDD — Core supply |
| Pino 137 | RD3 — GPIO RD3 |
| Pino 138 | RD2 — GPIO RD2 |
| Pino 139 | RD1 — GPIO RD1 |
| Pino 140 | RD0 — GPIO RD0 |
| Pino 141 | RF3 — GPIO RF3 |
| Pino 142 | RF2 — GPIO RF2 |
| Pino 143 | RF1 — GPIO RF1 |
| Pino 144 | RF0 — GPIO RF0 |
Aplicações típicas
PIC32MZ1024EFM144-I/PL é adequado para 6 aplicaçãos: Industrial IoT Gateway, Automotive Infotainment HMI Controller, Motor Control BLDC/PMSM Drive, Graphics HMI Display Controller, Secure Connected Device, USB Audio / Multimedia Bridge.
Industrial IoT Gateway
The PIC32MZ1024EFM144-I/PL fits industrial IoT gateway designs through its integrated 10/100 Ethernet MAC, USB 2.0 High-Speed OTG, and hardware crypto engine. The 200 MHz MIPS M-class core with FPU runs TLS/IP stacks and MQTT brokers at line-rate without external crypto ICs. Dual-panel 1 MB Flash supports OTA firmware updates where one panel executes while the other receives new code, eliminating gateway downtime. The 144-LQFP industrial -40C to +85C rating suits DIN-rail enclosures. Pin-compatible drop-in to PIC32MZ1024EFM144-E/PL extends to outdoor cabinets. Compared to PIC32MX795 (80 MHz, no FPU), the EF family delivers 2.5x compute with integrated Ethernet, reducing BOM and PCB area in industrial control systems.
Recomendado
Automotive Infotainment HMI Controller
The PIC32MZ1024EFM144-I/PL serves automotive HMI touchscreen controllers through its integrated FPU for graphics rendering and 512 KB SRAM for frame buffering. The 144-LQFP industrial temp grade supports cabin environments; the PIC32MZ1024EFM144-E/PL (-40C to +125C) handles under-harsh zones. Hardware crypto accelerates secure CAN/Ethernet authentication. Dual-panel Flash enables safe in-field firmware updates required by automotive OEMs. Compared to PIC32MX575 (80 MHz, 64 KB RAM), this part delivers higher graphics throughput and peripheral bandwidth for HMI workloads. The 144-LQFP footprint exposes dedicated graphics LCD controller pins, reducing external GPU requirement in mid-tier infotainment.
Recomendado
Motor Control BLDC/PMSM Drive
The PIC32MZ1024EFM144-I/PL is a strong fit for BLDC and PMSM motor control loops because its 200 MHz MIPS core with single-precision FPU executes field-oriented control math in microseconds, leaving headroom for sensorless observers and adaptive loop tuning. The PIC32MZ EF family integrates motor-control PWM peripherals with complementary outputs and dead-band generators, while the dual-panel Flash supports live-tuning of current/torque profiles in deployed drives. The 144-LQFP exposes dedicated QEI interfaces for encoder feedback. Industrial -40C to +85C rating handles factory-floor drives; pin-compatible PIC32MZ1024EFM144-E/PL extends to high-ambient locations like motor housings. Compared to legacy PIC32MX795 (80 MHz), this part accelerates current-loop sample rates by 2.5x.
Recomendado
Graphics HMI Display Controller
The PIC32MZ1024EFM144-I/PL drives mid-resolution HMI graphics displays through its integrated LCD controller, 512 KB SRAM for frame buffering, and FPU for accelerated vector rendering. The 200 MHz core processes touch events, animates UI elements, and decodes compressed assets in real time. Dual-panel 1 MB Flash allows storing multiple language variants and UI skins, switching without external storage. The 144-LQFP package exposes parallel LCD data bus and dedicated graphics peripherals. Compared to PIC32MX795 (80 MHz), this part roughly doubles graphics throughput. Pin-compatible drop-ins like PIC32MZ1024EFG144-I/PL add graphics-tier peripherals if higher frame rates are needed.
Recomendado
Secure Connected Device
The PIC32MZ1024EFM144-I/PL targets secure connected products through its integrated hardware crypto engine that accelerates AES, SHA, and TLS handshake primitives - offloading work that would otherwise starve the application CPU. The 200 MHz core with FPU runs TLS 1.3 stacks at IoT-class bandwidth while the crypto engine handles handshakes in hardware, sustaining device battery. Dual-panel Flash supports signed firmware updates required for secure-boot flows. The 144-LQFP industrial temp grade suits indoor connected products; pin-compatible PIC32MZ1024EFM144-E/PL extends to outdoor deployments. Compared to PIC32MX675 (no crypto), this part delivers hardware-rooted security at lower BOM cost.
Recomendado
USB Audio / Multimedia Bridge
The PIC32MZ1024EFM144-I/PL fits USB audio and multimedia bridges via its integrated USB 2.0 High-Speed OTG controller and 512 KB SRAM for audio buffering. The FPU accelerates audio DSP filters and sample-rate conversion in real time. The 144-LQFP exposes dedicated USB D+/D- pins and I2S interfaces for codec integration. Industrial -40C to +85C rating suits professional audio equipment. Dual-panel Flash enables field DSP algorithm updates. Compared to PIC32MX795 (USB Full-Speed only), this part supports USB High-Speed isochronous audio at higher sample rates and lower latency. Pin-compatible drop-ins within the EF family support scaled feature sets.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MZ1024EFM144-I/PL — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MZ1024EFM144-E/PL | PIC32MZ1024EFE144-I/PL | PIC32MZ1024EFF144-I/PH | PIC32MZ1024EFG144-I/PL | PIC32MZ1024EFK144-E/PH |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 144-LQFP (20x20 mm) | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same |
| CPU Frequency | 200 MHz | 180 MHz | 200 MHz | 200 MHz | 200 MHz | 180 MHz |
| Flash Memory | 1024 KB (1 MB) | 1024 KB (1 MB) | 1024 KB (1 MB) | 1024 KB (1 MB) | 1024 KB (1 MB) | 1024 KB (1 MB) |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) |
| FPU | Yes (IEEE 754 single-precision) | Yes | Yes | Yes | Yes | Yes |
| USB | USB 2.0 High-Speed OTG | USB 2.0 High-Speed OTG | USB 2.0 High-Speed OTG | USB 2.0 High-Speed OTG | USB 2.0 High-Speed OTG | USB 2.0 High-Speed OTG |
| Ethernet MAC | 10/100 Mbps (RMII/MII) | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps |
Principais diferenciais
- Highest CPU frequency in the PIC32MZ EF family at this temp grade (vs PIC32MZ1024EFM144-E/PL)
- Standard industrial temp grade matches common enclosure environments (vs PIC32MZ1024EFM144-E/PL)
- Tray packaging supports low-volume prototyping (vs PIC32MZ1024EFM144T-I/PL)
Notas de projeto
Estimated: the PIC32MZ1024EFM144-I/PL core draws ~150 mA at 200 MHz from the 1.2 V internal regulator, with I/O draw depending on output loading. Per Microchip datasheet, the on-chip 3.3 V-to-1.2 V LDO must have at least 10 uF of bulk decoupling plus 100 nF of high-frequency bypass on VDD/VSS pins. Place bulk caps within 5 mm of the LDO input/output pins. Use a star-ground topology to isolate analog AVSS if ADC accuracy is required.
Route USB D+/D- as a 90-ohm differential pair with reference to digital ground, length-matched within 150 mil per the USB 2.0 High-Speed specification. The Ethernet RMII/MII traces to the external PHY must be length-matched and routed over a continuous ground plane. Place the 25 MHz main crystal within 5 mm of OSC1/OSC2 with short traces and a guard ground ring; use 12 pF load capacitors as specified in the datasheet.
Estimated: at full 200 MHz operation the PIC32MZ1024EFM144-I/PL draws ~300 mA total from the 3.3 V rail, dissipating roughly 1 W. The 144-LQFP theta_JA is approximately 35 C/W, yielding a 35 C junction rise above ambient - manageable for industrial designs. For closed enclosures, ensure at least 1 sq inch of top-side copper pour under the exposed pad-style center footprint pattern. Drop to PIC32MZ1024EFM144-E/PL only if junction temperature remains below 125 C at worst-case ambient.
Do not leave unused pins floating - configure them as outputs or inputs with the internal pull-up enabled per the Microchip datasheet, otherwise floating inputs cause spurious current draw and noise. When using dual-panel Flash live updates, follow the Microchip application note AN1388 for bank-swapping sequences - failing to disable interrupts during panel swap can corrupt firmware state. The integrated FPU must be enabled in MPLAB XC32 compiler with -mfloat-abi=hard to leverage hardware acceleration.
Informações de conformidade
RoHS and lead-free per Microchip product page. The I/PL grade is industrial -40C to +85C, not AEC-Q100 qualified; contact Microchip for AEC-Q100 automotive-grade variants in this family if required.
