PIC32MZ1064DAG169-I/6J - 200MHz 32-bit MCU, 1MB Flash | Microchip
部品番号: PIC32MZ1064DAG169-I/6J ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $9.62 | $9.62 |
| 10 | $8.95 | $89.50 |
| 100 | $7.84 | $784.00 |
| 500 | $6.92 | $3,460.00 |
| 1,000 | $6.05 | $6,050.00 |
PIC32MZ1064DAG169-I/6J 概要
A 32-bit microcontroller (MCU) is an integrated processor that combines a CPU core, program and data memory, and a rich set of on-chip peripherals in a single silicon die, forming the highest level of the embedded computing hierarchy: microcontroller -> embedded processor -> semiconductor. The PIC32MZ DA family extends this concept into the application-processor tier by integrating dedicated graphics hardware, high-throughput analog front ends, and external DDR2 DRAM addressing capability (32 MB on-chip window / 128 MB externally addressable), giving designers MPU-class performance with MCU-class ease of use for graphical human-machine interfaces.
Key differentiating features include the integrated 2D Graphics Controller with a dedicated GPU, the 12-bit 18 MSPS ADC capable of up to 45 analog input channels, and the on-chip 32 MB / off-chip 128 MB DDR2 DRAM controller. The 169-LFBGA package is required to expose the 120 GPIO pins and the parallel display interface, and the 0.80 mm ball pitch suits 4-layer or higher mainboards with microvia breakout. The device also exposes dedicated crypto/hash and random-number peripherals for secure boot and IP protection flows.
Architecturally, the PIC32MZ1064DAG169-I/6J uses the MIPS32 microAptiv core with a 5-stage pipeline, FPU, MMU, and dual-bank Flash with live-update support. The peripheral set is interconnected through a multi-layer AHB/APB bus matrix that allows concurrent USB, graphics, and ADC operation without arbitration stalls. Internal PLLs multiply the external reference to the 200 MHz system clock, and an on-chip 32 kHz oscillator supports low-power modes.
Typical applications include 2D GUI / HMI appliances, automotive cluster displays, medical patient monitors, point-of-sale terminals, industrial machine-control touchscreens, and any embedded product requiring a colorful TFT-LCD panel driven by the on-chip GPU. The HS USB and CAN peripherals also make it suitable for connected industrial nodes that bridge a TFT to a CAN-FD or USB host bus.
When designing with this MCU, ensure the PCB has matched-length routing for the DDR2 interface and a 6-layer stack-up to keep impedance under control; the 0.80 mm pitch LFBGA demands microvia or laser-drilled vias at the breakout, and the ADC's 18 MSPS rate requires an anti-aliasing front-end RC network for accurate conversions above 5 MHz analog bandwidth. Decoupling follows the standard 100 nF per power pin plus 4.7 uF bulk arrangement recommended in the device family reference manual.
This page synthesizes distributor pricing (DigiKey, LCSC, Hotenda), drop-in alternatives inside the same 169-LFBGA footprint, and practical design notes that go beyond the manufacturer datasheet, including selection guidance against other PIC32MZ DA and PIC32MX parts.
ドロップイン代替品: PIC32MZ1064DAG169-I/6J — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC32MZ1064DAG169-I/6J （同一形状・フットプリント） — 相違点: USB, CAN, Package, Core Architecture, ADC.
クイック比較ツール — 並列比較する代替部品を選択:
PIC32MZ1064DAA169-I/HF
✅ ドロップイン✓ 在庫あり
$12.1 / 個
データシートを見る →PIC32MZ1064DAB169-I/HF
✅ ドロップイン✓ 在庫あり
$12.4 / 個
データシートを見る →PIC32MZ2064DAG169-I/HF
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC32MZ1064DAB169T-I/HF
✅ ドロップイン✓ 在庫あり
$4.52 / 個
データシートを見る →PIC32MZ1064DAA169-I/HF
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$12.1 / 個
データシートを見る →PIC32MZ1064DAG169-I/6J 最大定格＆電気的特性
| Core | MIPS32 microAptiv (PIC32MZ DA) |
| CPU Architecture | 32-bit, single-core, 5-stage pipeline |
| Max CPU Clock | 200 MHz |
| Program Flash | 1 MB (1M x 8) |
| SRAM | 640 KB |
| External Memory Bus | 32 MB on-chip / 128 MB external DDR2 DRAM addressable |
| Graphics Hardware | Integrated 2D Graphics Controller + dedicated Graphics Processor (GPU) |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| 電源電圧 | 1.7 V to 3.6 V |
| I/O Voltage | 1.8 V / 3.3 V (peripheral-dependent) |
| GPIO Count | 120 |
| USB | USB 2.0 High-Speed |
| CAN | 1x CAN 2.0B |
| 動作温度 | -40C to +85C (industrial) |
| パッケージ | 169-ball LFBGA, 11x11 mm, 0.80 mm pitch |
| 実装タイプ | Surface Mount (BGA) |
| MSLレベル | 3 (per JEDEC J-STD-020) |
| RoHS ステータス | Compliant |
PIC32MZ1064DAG169-I/6J 169-ball lfbga, 11x11 mm, 0.80 mm pitch ピン配置ガイド
PIC32MZ1064DAG169-I/6J (169-ball lfbga, 11x11 mm, 0.80 mm pitch パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: PIC32MZ1064DAG169-I/6J.
詳細は データシート をご参照ください。
主な用途
PIC32MZ1064DAG169-I/6J の用途: 6 件s: TFT-LCD HMI / GUI Appliances, Industrial Machine-Control Touchscreen, Medical Patient Monitor, Automotive Cluster Display, Point-of-Sale Terminal, Connected Industrial IoT Gateway.
TFT-LCD HMI / GUI Appliances
The PIC32MZ1064DAG169-I/6J drives 4.3-inch to 7-inch 800x480 RGB565 TFT panels with its integrated 2D Graphics Controller and dedicated GPU, offloading line-draw, blit, alpha-blend, and color-conversion from the 200 MHz MIPS32 core. The 640 KB on-chip SRAM holds a full framebuffer plus GUI stack, leaving the CPU free for touch and CAN/USB protocol tasks. Designers get a true drop-in graphics solution on a 169-LFBGA footprint with 120 GPIO for buttons, LEDs, and a capacitive touch I2C controller.
おすすめ
Industrial Machine-Control Touchscreen
On a factory-floor touchscreen, the PIC32MZ1064DAG169-I/6J provides 200 MHz MIPS performance to refresh a 480x272 TFT, scan a 4-wire resistive touch, and drive CAN-FD communication with a PLC simultaneously. Its 12-bit 18 MSPS ADC with up to 45 channels accepts analog feedback from temperature, pressure, and position sensors without an external analog front end. Industrial -40C to +85C operation and 120 GPIO for switchgear wiring make it a strong choice for cabinet-mounted operator interfaces.
おすすめ
Medical Patient Monitor
Patient monitors need a clean, low-noise analog front end plus a responsive TFT GUI, both of which the PIC32MZ1064DAG169-I/6J delivers via its 12-bit 18 MSPS ADC and integrated 2D Graphics Controller. The 640 KB SRAM fits waveform trace buffers, and the MIPS32 FPU handles real-time SpO2 and ECG DSP at full 200 MHz. The 169-LFBGA package is small enough for handheld form factors while exposing the DDR2 interface for additional trace memory.
おすすめ
Automotive Cluster Display
The PIC32MZ1064DAG169-I/6J's GPU, CAN 2.0B interface, and 200 MHz MIPS core make it suitable for entry-level instrument clusters that combine a speedometer TFT with CAN-driven vehicle data. Although the industrial -I grade targets +85C, designers moving to the AEC-Q100 qualified 'F' variant can reuse the same 169-LFBGA PCB. The 120 GPIO drives segment overlays and warning indicators alongside the TFT panel.
おすすめ
Point-of-Sale Terminal
POS terminals integrate a color TFT for the cashier, a USB host for receipt printers and barcode scanners, and a keypad interface, and the PIC32MZ1064DAG169-I/6J handles all three with its GPU-accelerated graphics, USB 2.0 High-Speed, and 120 GPIO. The 1 MB Flash stores multilingual firmware, and the 32 MB on-chip / 128 MB external DDR2 window holds transaction logs and menu artwork.
おすすめ
Connected Industrial IoT Gateway
For an IIoT gateway, the PIC32MZ1064DAG169-I/6J combines a 200 MHz core for protocol translation, a USB 2.0 High-Speed link for cellular or Wi-Fi dongles, a CAN 2.0B port for fieldbus, and a 169-LFBGA footprint exposing Ethernet RMII pins via the EBI. Its 1 MB Flash and 640 KB SRAM let it run TCP/IP and TLS stacks locally, while the integrated GPU drives a status display for diagnostics and configuration.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC32MZ1064DAG169-I/6J — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC32MZ1064DAA169-I/HF | PIC32MZ1064DAB169-I/HF | PIC32MZ2064DAG169-I/HF | PIC32MZ1064DAB169T-I/HF |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 169-LFBGA (11x11 mm, 0.80 mm pitch) | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same |
| Max CPU Clock | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash | 1 MB | 1 MB | 1 MB | 2 MB (+100%) | 1 MB |
| SRAM | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB |
| Integrated GPU / Graphics Controller | Yes | No (A-suffix) | No (B-suffix) | Yes | No (B-suffix) |
| ADC | 12-bit, 18 MSPS, up to 45 inputs | 12-bit, 18 MSPS, up to 45 inputs | 12-bit, 18 MSPS, up to 45 inputs | 12-bit, 18 MSPS, up to 45 inputs | 12-bit, 18 MSPS, up to 45 inputs |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) |
主な差別化要因
- Integrated 2D Graphics Controller + dedicated GPU at 200 MHz （vs PIC32MZ1064DAA169-I/HF (A-suffix, no GPU))
- Doubles Flash headroom while keeping GPU and 169-LFBGA footprint （vs PIC32MZ2064DAG169-I/HF)
- 12-bit 18 MSPS ADC with up to 45 analog inputs on-chip （vs PIC32MZ1064DAB169-I/HF (B-suffix connectivity variant))
設計ノート
The 169-LFBGA uses a 0.80 mm ball pitch on an 11x11 mm substrate, which mandates a 4-layer (or higher) PCB stack-up with microvia-in-pad or laser-drilled blind vias at the breakout. Use a 1.2 mm via-in-pad design rule with a 0.25 mm drill and 0.5 mm pad to fan out the inner rows without violating clearances. Keep the DDR2 traces at 50 ohm single-ended / 100 ohm differential and route them on the layer directly beneath the BGA with reference ground.
The PIC32MZ DA family draws peaks up to ~300 mA on the 1.8 V core rail during GPU bursts; pair a low-dropout regulator such as the MCP1727 or MIC28510 with a 10 uF X7R bulk and 100 nF per VDD/VSS pin. Decouple each analog supply pair (AVDD/AVSS) with a 10 uH ferrite plus 4.7 uF + 100 nF network to keep the 12-bit ADC noise below 1 LSB at 18 MSPS. Estimated: a fully loaded application refresh on a 7-inch TFT and active USB link typically consumes 0.6-0.9 W at 3.3 V.
Do not boot the PIC32MZ1064DAG169-I/6J without a valid DDR2 initialization sequence in the start-up code; the GPU relies on the external DRAM for framebuffer storage and will hang the LCD controller if the EBI is misconfigured. Also, ensure the JTAG/SWD trace length does not exceed 50 mm and is impedance-matched to 50 ohm, otherwise MPLAB X ICE debugging will fail intermittently. Finally, configure the PLLB output before enabling peripherals that depend on the 200 MHz domain, or peripherals will operate at the wrong baud/clock rate.
At 200 MHz with the GPU + USB + ADC all active, the silicon dissipates approximately 0.7-1.0 W, raising the die temperature 30-40C above ambient on a 4-layer PCB without thermal vias. Estimated: with a 4x4 thermal via array (0.3 mm drills, 1.2 mm pitch) connecting the BGA die pad to an inner copper pour, theta_JA improves from ~35 C/W to ~22 C/W, keeping Tj well below the +125C Tjmax even in sealed +85C enclosures.
Route the parallel RGB display bus on the top layer underneath the BGA escape, keep each TFT signal length-matched within 1 mm of the data group, and series-terminate each line with 22 ohm resistors close to the MCU pads to suppress reflections on the high-speed GPU burst writes. Keep the parallel RGB away from the USB 2.0 differential pair to avoid 480 MHz coupling; place a continuous ground guard strip between the two regions.
コンプライアンス情報
Industrial -I grade only (-40C to +85C). AEC-Q100 qualified variants available on different temperature suffixes. RoHS and lead-free status per Microchip product page.
