PIC32MZ2064DAG169T-I/6J - 200MHz MCU 2MB Flash LFBGA-169 | Microchip
部品番号: PIC32MZ2064DAG169T-I/6J ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $26.77 | $26.77 |
| 10 | $24.09 | $240.90 |
| 100 | $21.42 | $2,142.00 |
| 500 | $19.27 | $9,635.00 |
| 1,000 | $17.65 | $17,650.00 |
| 46,000 | $0 | $0.00 |
PIC32MZ2064DAG169T-I/6J 概要
A 32-bit microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, and programmable peripherals on one die; the PIC32MZ DA family occupies the upper end of the MCU spectrum, often competing with entry-level MPUs for graphics workloads. Within the broader hierarchy it sits as: PIC32MZU -> 32-bit MCU -> microcontroller -> embedded processor -> semiconductor IC, and it is one of Microchip's premier choices for human-machine-interface applications.
Key features include dual-panel Flash for live firmware update support, a 12-bit 18 MSPS 45-channel ADC, a dedicated Memory Management Unit for embedded OS execution, a 2-D channel for display pipeline acceleration, and a crypto engine (RNG/AES/SHA) on selected variants. The device supports parallel RGB/memory interfaces for direct LCD connection and includes Hi-Speed USB, Ethernet, CAN-FD, and multiple SPI/I2C/UART instances for system connectivity.
The architecture pairs the MIPS32 microAptiv core with a tightly-coupled LCD DMA path, allowing full-screen GUI rendering at WXGA resolution without CPU bottleneck. Internal stacked DDR2 eliminates the need for an external SDRAM chip on the PCB, reducing BOM cost and EMI.
Typical applications include industrial HMI panels, automotive dashboards, home appliance color touch interfaces, medical patient monitors, point-of-sale terminals, and any GUI-rich embedded product where the BOM stack must remain compact.
When designing with this part, allocate PCB ground return paths under the BGA, follow Microchip's DDR2 layout checklist, and confirm thermal budget using the package's junction-to-ambient resistance.
This page synthesizes distributor pricing, drop-in alternatives, application notes, and design trade-offs not found in the manufacturer datasheet alone, giving engineers and procurement teams a faster path from spec to order.
ドロップイン代替品: PIC32MZ2064DAG169T-I/6J — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC32MZ2064DAG169T-I/6J （同一形状・フットプリント） — 相違点: Package, Operating Temperature, ADC, Core Architecture, CAN.
クイック比較ツール — 並列比較する代替部品を選択:
PIC32MZ2064DAR169-I/6J
✅ ドロップイン✓ 在庫あり
$9.3 / 個
データシートを見る →PIC32MZ2064DAB169-I/HF
✅ ドロップイン✓ 在庫あり
$19.95 / 個
データシートを見る →PIC32MZ2064DAB169T-I/HF
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC32MZ1064DAB169T-I/HF
✅ ドロップイン✓ 在庫あり
$4.52 / 個
データシートを見る →PIC32MZ1064DAB169-I/HF
✅ ドロップイン✓ 在庫あり
$12.4 / 個
データシートを見る →PIC32MZ1025DAB169T-I/HF
✅ ドロップイン✓ 在庫あり
$12.65 / 個
データシートを見る →PIC32MZ2064DAG169T-I/6J 最大定格＆電気的特性
| Core Architecture | MIPS32 microAptiv |
| Core Width | 32-bit |
| Maximum CPU Clock | 200 MHz |
| DMIPS | 330 DMIPS |
| Program Flash | 2 MB (2M x 8) |
| SRAM | 640 KB |
| Stacked DRAM | On-chip externally addressable DDR2 (32 MB or 128 MB options) |
| Graphics Accelerator | 2-D DMA engine for GUI acceleration |
| ADC | 12-bit, 18 MSPS, 45 channels |
| Memory Management Unit | Yes (for embedded OS) |
| Live Update Flash | Dual-panel Flash |
| 動作温度 | -40C to +85C (Industrial grade) |
| パッケージ | 169-ball LFBGA 11x11 mm |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant |
PIC32MZ2064DAG169T-I/6J 169-ball lfbga 11x11 mm ピン配置ガイド
PIC32MZ2064DAG169T-I/6J (169-ball lfbga 11x11 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: PIC32MZ2064DAG169T-I/6J.
詳細は データシート をご参照ください。
主な用途
PIC32MZ2064DAG169T-I/6J の用途: 6 件s: Industrial HMI Touch Panels, Automotive Dashboard Displays, Home Appliance Touch Interfaces, Medical Patient Monitors, Point-of-Sale Terminals, Industrial IoT Edge Gateways.
Industrial HMI Touch Panels
The PIC32MZ2064DAG169T-I/6J fits industrial HMI panels because its 200 MHz MIPS32 microAptiv core, 2 MB dual-panel Flash, 640 KB SRAM, and integrated stacked 32/128 MB DDR2 remove the need for an external SDRAM chip while still driving WXGA-resolution displays via the integrated parallel RGB interface. The 2-D DMA engine offloads GUI rendering from the CPU so the operator sees instantaneous touch response even with high-frame animations. It supports industrial temperature grade (-40C to +85C) and Hi-Speed USB plus Ethernet for plant-floor connectivity, including CAN-FD for motor drive side-channels. Placed as the main MCU on a single 4-layer PCB, it eliminates the external memory footprint and EMI that discrete SDRAM would otherwise introduce in noisy factory environments.
おすすめ
Automotive Dashboard Displays
The PIC32MZ2064DAG169T-I/6J suits automotive dashboards because its MIPS32 microAptiv core runs instrument-cluster graphics at 200 MHz with 330 DMIPS, while the on-chip 2-D DMA engine composes gauges, map overlays, and warning indicators at frame rates exceeding 60 fps without CPU intervention. The integrated stacked DDR2 (32 MB or 128 MB) holds map tiles and live image assets, and the parallel RGB output drives TFT-LCD panels directly. The industrial temperature grade covers typical cabin environments, and CAN-FD interfaces to the vehicle body controller. For AEC-Q100 grade 2/3 requirements, the user must select a Q-grade variant; the standard G-variant serves development and non-safety cockpit displays where compliance targets are lower.
おすすめ
Home Appliance Touch Interfaces
The PIC32MZ2064DAG169T-I/6J enables color touch UIs on washing machines, ovens, and refrigerators because its 2 MB Flash holds the full LVGL or Microchip MPLAB Harmony GUI plus Wi-Fi/BLE stack, while the 640 KB SRAM and stacked DDR2 hold image caches and rendered frame buffers. The 200 MHz core animates knob rotations, temperature sliders, and progress arcs smoothly, and the parallel RGB interface connects directly to mid-size TFT-LCDs to keep BOM cost low. Industrial-grade temperature operation tolerates kitchen-cabinet thermal load, and the dual-panel Flash supports OTA firmware updates so appliances can receive new cycles and security patches during their service life.
おすすめ
Medical Patient Monitors
The PIC32MZ2064DAG169T-I/6J fits patient-side monitors because its MIPS32 microAptiv core processes waveforms at 200 MHz, the 12-bit 18 MSPS 45-channel ADC captures multi-lead ECG and SpO2 signals simultaneously, and the integrated stacked DDR2 holds rolling waveform history at full sample rate. The 2-D graphics engine plots real-time traces, numerics, and alarms on a color LCD via the parallel RGB interface, while the dual-panel Flash enables safe firmware updates without interrupting the monitoring function. Industrial-grade temperature operation covers bedside thermal environments. Designers should validate IEC 60601-1 isolation requirements externally; the MCU itself provides the deterministic processing and graphics horsepower required for clinical display interfaces.
おすすめ
Point-of-Sale Terminals
The PIC32MZ2064DAG169T-I/6J powers point-of-sale terminals because its 2 MB Flash stores the secure payment UI and crypto libraries, the 640 KB SRAM and stacked DDR2 buffer signature images and receipt graphics, and the MIPS32 microAptiv core at 200 MHz drives smooth animated menus on color touch displays. The integrated 12-bit ADC monitors battery and printer-supply rails, and the Hi-Speed USB with on-the-go supports PIN-pad and printer peripherals. CAN-FD or Ethernet connects to back-office terminals, and the dual-panel Flash supports field-provisioning during terminal activation. Industrial temperature operation covers checkout-counter thermal exposure.
おすすめ
Industrial IoT Edge Gateways
The PIC32MZ2064DAG169T-I/6J works as an industrial IoT edge node because the MIPS32 core at 200 MHz runs TLS stacks and Modbus/OPC-UA protocol conversion with 640 KB SRAM plus 32/128 MB stacked DDR2 holding large datapoint buffers. Hi-Speed USB, multiple UARTs, I2C, and SPI instances connect to sensors and actuators, and Ethernet or CAN-FD uplinks to plant networks. The 2-D DMA engine drives a local diagnostic display on-site, while the dual-panel Flash supports secure OTA updates for long-life industrial deployments. Industrial-grade temperature operation tolerates cabinet thermal environments.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC32MZ2064DAG169T-I/6J — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC32MZ2064DAR169-I/6J | PIC32MZ2064DAB169-I/HF | PIC32MZ2064DAB169T-I/HF | PIC32MZ1064DAB169T-I/HF | PIC32MZ1064DAB169-I/HF | PIC32MZ1025DAB169T-I/HF |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 169-ball LFBGA 11x11 mm | 169-ball LFBGA 11x11 mm - same | 169-ball LFBGA 11x11 mm - same | 169-ball LFBGA 11x11 mm - same | 169-ball LFBGA 11x11 mm - same | 169-ball LFBGA 11x11 mm - same | 169-ball LFBGA 11x11 mm - same |
| Core | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz |
| Program Flash | 2 MB (dual-panel) | 2 MB (dual-panel) | 2 MB (dual-panel) | 2 MB (dual-panel) | 1 MB (-50%) | 1 MB (-50%) | 1 MB (-50%) |
| SRAM | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB |
| Stacked DDR2 | Yes (32 or 128 MB) | Yes (32 or 128 MB) | Yes (lower-density option) | Yes (lower-density option) | Yes (lower-density option) | Yes (lower-density option) | Yes (lower-density option) |
| 2-D Graphics DMA | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Live-Update Flash | Yes (dual-panel) | Yes (dual-panel) | Yes (dual-panel) | Yes (dual-panel) | Yes (dual-panel) | Yes (dual-panel) | Yes (dual-panel) |
| Recommended Status | Existing (recommended successor is DAR) | Microchip-recommended for new designs | Active | Active | Active | Active | Active |
主な差別化要因
- On-chip stacked DDR2 memory eliminates a separate SDRAM chip （vs PIC32MZ EF family (PIC32MZ2048EFM144-I/PH))
- Microchip-recommended successor is pin-compatible in same package （vs PIC32MZ2064DAR169-I/6J)
- Lower-Flash variants share footprint for cost-down programs （vs PIC32MZ1064DAB169T-I/HF)
設計ノート
Estimated: at maximum sustained core activity (200 MHz) and internal DDR2 self-refresh, the 169-ball LFBGA 11x11 mm package on a 4-layer PCB with 1 oz copper pours dissipates approximately 0.6 W to 1.2 W. The junction-to-ambient thermal resistance of this BGA is around 25 C/W on a typical 4-layer JEDEC test board, implying a temperature rise of 15 C to 30 C above ambient. For closed-enclosure designs with limited airflow, add thermal vias under the BGA and copper pours on inner layers to keep the junction below 125 C.
The integrated stacked DDR2 die is sensitive to trace impedance and crosstalk on the parallel RGB and memory interface. Follow Microchip's PCB layout checklist in the PIC32MZ Graphics (DA) Family datasheet: route DDR2 signals on inner layers with continuous ground return, decouple VDDDDR2 with 100μF bulk + 100nF ceramic per pin group, and keep analog/digital grounds separated until a single point near the MCU. Use a 4-layer stackup minimum, with the second inner layer as solid ground, to keep the parallel display bus noise below the ADC quantization floor when capturing analog sensor signals simultaneously.
Do not confuse the I/6J temperature grade (industrial -40C to +85C) with the V/6J extended grade when ordering for harsh environments. Do not assume PIC32MZ2064DAG169 is the recommended new-design part - Microchip's product page explicitly recommends PIC32MZ2064DAR169 for new designs. Also note that dual-panel Flash uses one panel as active and one as shadow; during firmware updates the shadow panel is written while active continues, so power loss during write does not brick the device, but the image must still be verified by application code before bonding to mass production.
Ball A1 of the 169-LFBGA is identified by the marker dot on top, with row/column numbering following JEDEC MO-275 conventions. Keepout zones for BGA fanout require 0.4 mm ball pitch and 0.5 mm via pad to avoid solder bridging; use laser-drilled microvias or via-in-pad with filled plating for high-density escape routing. Place the boot-mode pull-ups on the BOOT pins as documented in the pinout table, otherwise the device can fail to enumerate over ICSP during initial programming.
コンプライアンス情報
RoHS compliant per Microchip product page. Industrial temperature grade (-40C to +85C). Not AEC-Q100 qualified; the user must choose an AEC-Q100 grade variant if automotive safety certification is required.
