R5F211B3NP#U0 - 16-Bit 3/5V 12KB Flash MCU | Renesas | 28-HWQFN
部品番号: R5F211B3NP#U0 ✓ 生産中R5F211B3NP#U0 概要
The R8C core is designed for efficient CISC-style instruction execution in compact embedded systems. The R5F211B3NP#U0 combines a 16-bit CPU core with 12 KB of on-chip flash memory in a 28-HWQFN package. The product family is associated with a 3/5 V operating environment, making it suitable for systems that use either a 3.3 V or 5 V supply. The package reduces board area compared with larger leaded microcontroller packages while supporting a high-density pin arrangement.
Key product characteristics include the 16-bit R8C CPU core, 12 KB flash memory, 3/5 V supply capability, and 28-HWQFN package construction. These specifications make the R5F211B3NP#U0 appropriate for compact embedded controllers that require more computational width than an 8-bit MCU while using a small surface-mount footprint. The integrated flash memory allows firmware to be stored directly on the controller, simplifying the hardware arrangement compared with external program-memory designs.
The device is intended for applications that need reliable embedded control, local logic, peripheral interaction, and embedded firmware execution. Typical uses include industrial control modules, instrumentation, appliance controllers, small motor-control boards, sensor-interface equipment, and compact embedded consumer products. The 28-HWQFN package is particularly useful when board area is constrained but a multilayer PCB and appropriate manufacturing processes are available.
When designing around the R5F211B3NP#U0, use the manufacturer datasheet for the exact pin descriptions, electrical limits, clock configuration, peripheral assignments, and programming procedure. Decoupling, exposed-pad thermal management, programming access, and unused-pin handling should follow the package-specific recommendations. Verify the selected memory variant, supply requirements, and timing characteristics against the final system operating conditions before releasing the PCB.
ドロップイン代替品: R5F211B3NP#U0 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
この製品に利用可能なドロップイン代替品はありません。
代替品をリクエストR5F211B3NP#U0 最大定格＆電気的特性
| CPU Core | R8C 16-bit CISC core |
| Product Type | 16-bit microcontroller |
| 電源電圧 | 3 V or 5 V |
| Flash Memory | 12 KB |
| Program Memory Organization | 12K x 8 |
| パッケージ | 28-HWQFN |
| ピン数 | 28 pins |
| 実装タイプ | Surface mount |
| Architecture | 16-bit |
| Core Family | R8C |
| Manufacturer Product Series | 16-bit Microcontrollers with R8C CPU Core (Non Promotion) |
| Tube Packaging | Tube |
| Lead-Free Status | Pb-free |
R5F211B3NP#U0 28-hwqfn ピン配置ガイド
R5F211B3NP#U0 (28-hwqfn パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: R5F211B3NP#U0.
詳細は データシート をご参照ください。
主な用途
R5F211B3NP#U0 の用途: 6 件s: Compact Industrial Control Module, Appliance and Equipment Controller, Sensor Interface and Data Acquisition, Small Motor and Actuator Control, Instrumentation and Measurement Front End, Battery-Powered Embedded Device.
Compact Industrial Control Module
The R5F211B3NP#U0 fits compact industrial control modules that need more instruction width than an 8-bit MCU while retaining a simple embedded-programming model. Its 16-bit R8C core and 12 KB of flash provide room for local control firmware, while the 3/5 V supply capability supports common industrial and embedded supply rails. The 28-HWQFN package also helps reduce board area in densely populated controller assemblies. Before finalizing the design, verify operating-temperature limits, watchdog behavior, communication peripherals, EMC requirements, and isolation needs against the manufacturer documentation.
おすすめ
Appliance and Equipment Controller
The R5F211B3NP#U0 is appropriate for appliance controllers, small equipment modules, and user-interface subsystems requiring deterministic embedded control. Its 12 KB flash provides integrated firmware storage, and the 16-bit R8C architecture can handle control logic, state machines, and interface handling in a compact 28-HWQFN footprint. A 3.3 V or 5 V system architecture can use the device without a separate external program-memory component. Exact GPIO assignment, timers, serial interfaces, and analog functions must be checked for each pin variant before the PCB is released.
おすすめ
Sensor Interface and Data Acquisition
The R5F211B3NP#U0 can serve as the local controller in a sensor-interface board that converts measurements into system data and manages actuator commands. Its 16-bit processing width and integrated 12 KB flash support embedded algorithms, calibration handling, and protocol logic. The compact HWQFN package is useful when the interface electronics must fit beside a sensor or connector. Confirm the device's ADC characteristics, timer resolution, serial interfaces, and input count in the datasheet because those specifications determine whether it can replace a discrete analog front end.
おすすめ
Small Motor and Actuator Control
The R5F211B3NP#U0 is suitable for small motor, valve, relay, or actuator-control modules where a compact controller must combine firmware with discrete power-driver circuitry. The 16-bit R8C core can execute sequencing and fault-handling logic, while 12 KB flash is suitable for modest embedded control programs. The MCU should operate alongside a dedicated driver rather than directly driving high-current loads. Confirm timer outputs, PWM capability, fault inputs, and pin multiplexing in the manufacturer documentation before assigning the motor-control functions.
おすすめ
Instrumentation and Measurement Front End
The R5F211B3NP#U0 can support compact instrumentation front ends that coordinate sensors, calibration logic, status indicators, and communication functions. Its 16-bit R8C CPU core provides an efficient platform for measurement sequencing and local processing, while the 12 KB flash stores embedded control code. The 3/5 V compatibility is useful in laboratory and industrial modules with either supply convention. For precision measurement, verify ADC performance, oscillator accuracy, reference-voltage options, and analog-pin availability rather than assuming suitability from the core architecture alone.
おすすめ
Battery-Powered Embedded Device
The R5F211B3NP#U0 may be evaluated for compact battery-powered sensors, access controls, and portable embedded modules that require a small controller and 3/5 V operation. Its 28-HWQFN footprint minimizes board area, while the R8C core can handle low-duty-cycle acquisition and local state management. However, battery-life design depends on the exact regulator, sleep modes, active current, and wake-up behavior, which are not stated in the product listing. Review the datasheet's electrical and low-power characteristics before selecting it for energy-limited operation.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: R5F211B3NP#U0 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 |
|---|---|
| Brand | Renesas Electronics |
| Package | 28-HWQFN |
| CPU Core | R8C |
| CPU Width | 16-bit |
| Flash Memory | 12 KB |
| Program Memory Organization | 12K x 8 |
| Supply Voltage | 3 V or 5 V |
| Pin Count | 28 pins |
| Packaging | Tube |
主な差別化要因
- 16-bit R8C processing core （vs ATXMEGA8E5-MNR)
- Integrated 12 KB program memory （vs PIC16F76-I/SP)
- Compact 28-HWQFN footprint （vs LPC1830FBD144Q)
設計ノート
Design the PCB footprint from the manufacturer 28-HWQFN package drawing rather than treating it as a generic 28-pin QFN. Confirm pad dimensions, exposed-pad geometry, solder-mask opening, paste pattern, and copper tolerances. Place the decoupling network close to the supply pins and route ground returns directly beneath the device to minimize loop area.
Use the R5F211B3NP#U0 with a stable 3 V or 5 V supply within the limits defined by the manufacturer datasheet. Place the required bulk and local bypass capacitors according to the reference circuit and account for capacitor DC-bias derating. Validate startup, transient response, and supply ripple across the full load range rather than checking only nominal voltage.
Provide adequate copper beneath and around the 28-HWQFN package, with particular attention to any exposed thermal pad and the manufacturer land-pattern requirement. Use the datasheet thermal information to determine whether a thermal via array is appropriate. Avoid placing heat-generating regulators or power stages directly beneath the microcontroller on a compact multilayer board.
Assign programming, reset, clock, and debug-related pins only after reviewing the complete manufacturer pin table. Keep sensitive analog or timing-sensitive routes away from switching nodes and high-current return paths. Route decoupling connections before expanding to the rest of the board so transient current can return through the smallest possible loop.
コンプライアンス情報
The distributor listing identifies R5F211B3NP#U0 as Pb-free. RoHS, REACH, halogen-free, conflict-minerals, and automotive-qualification status are not established by the verified records.
