RTAX2000SL-1CGS624V - 2M-Gate Rad-Tolerant FPGA | Actel/Microchip
MPN: RTAX2000SL-1CGS624V ✓ Active| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for RTAX2000SL-1CGS624V — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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RTAX2000SL-CGS624E
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View Datasheet →RTAX2000SL-1LG624V
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View Datasheet →RTAX2000S-1CG624PROTO
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View Datasheet →RTAX2000S-1CG624PROTO
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View Datasheet →RTAX250S-LG624V
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View Datasheet →RTAX250SL-CG624B
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$3950 / Unit
View Datasheet →RTAX250S-1LG624B
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View Datasheet →RTAX2000SL-1CGS624V Maximum Ratings & Electrical Characteristics
| Equivalent System Gates | 2000000 |
| Logic Cells (CLBs) | 21504 |
| User I/Os (max, package dependent) | Up to 684 |
| Embedded Memory | Up to 540 kbits with optional EDAC |
| Total Ionizing Dose (TID) | 300 krad (functional), 200 krad (parametric) |
| SEU Rate | Less than 1E-10 errors per bit-day |
| Technology | Digital CMOS, antifuse nonvolatile |
| Package | 624-ball ceramic CGA (CGS624) |
| Speed Grade | -1 |
| Quality / Screening Suffix | S (space flow), V suffix qualification level |
| Configuration | One-time programmable (OTP), live at power-up, single chip |
| Embedded SRAM Features | Built-in FIFO control logic |
| Clocking | Segmentable clocks, chip-wide highway routing |
| Mounting Type | Surface Mount |
RTAX2000SL-1CGS624V 624-ball ceramic cga (cgs624) Pin Configuration Guide
Complete pinout information for RTAX2000SL-1CGS624V (624-ball ceramic cga (cgs624) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX2000SL-1CGS624V.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX2000SL-1CGS624V is suitable for 6 applications: Satellite Payload Data Processing, Spacecraft Command and Telemetry Control, Remote Sensing and Imaging Instrumentation, Launch Vehicle Avionics, Deep-Space Probe Digital Logic, Space Communication and Signal Chains.
Satellite Payload Data Processing
The RTAX2000SL-1CGS624V fits payload data processing because its 2,000,000 system gates and 540 kbits of embedded SRAM with optional EDAC absorb DSP pipelines, packetizers, and compression engines that commercial FPGAs could perform only without radiation immunity. Its SEU rate below 1E-10 errors per bit-day means configuration and flip-flop corruption is effectively eliminated without heavy triple-module redundancy on the SL fabric, freeing gate capacity for useful logic. In a typical payload chain the device sits between sensor front ends and the telemetry downlink, implementing DDR-style data capture, framing, and EDAC-protected buffering in one chip, cutting board area and interfaces. Because the antifuse fabric is live at power-up, payload bring-up begins immediately after switch-on with no configuration delay, which matters during eclipse-powered operations.
Recommended
Spacecraft Command and Telemetry Control
Spacecraft onboard control benefits directly from the RTAX2000SL-1CGS624V's live-at-power-up antifuse operation: housekeeping and safety logic begins executing the instant power is applied, with no boot sequence that could be interrupted by a single-event functional interrupt. With up to 684 user I/Os in the CGS624 ceramic package, one device consolidates UART/MIL-STD-style telemetry links, discrete command interfaces, and watchdog functions that would otherwise need multiple rad-tolerant ASSPs. The 300 krad functional TID tolerance covers multi-year LEO control-node missions, and the -1 speed grade easily meets tens-of-MHz command loops. Designers should implement EDAC on the embedded SRAM blocks used for telemetry buffering and use segmentable clock regions to isolate safety-critical domains from payload clocking, improving fault containment in the control path.
Recommended
Remote Sensing and Imaging Instrumentation
Earth-observation and scientific instruments require deterministic, radiation-tolerant digital back ends, and the RTAX2000SL-1CGS624V addresses this with 2M gates of CMOS fabric and 540 kbits of EDAC-capable embedded memory suitable for line buffers and FIFO stages feeding image compression or lossless packetization. The built-in FIFO control logic in the embedded SRAM reduces glue logic and simplifies timing closure for high-rate pixel streams. The chip-wide highway routing and segmentable clocks let designers dedicate a clean clock region to the sensor readout path while image processing runs in adjacent regions, easing signal-integrity and jitter management. The 624-ball ceramic CGA provides the mechanical robustness and thermal path needed for launch vibration and on-orbit thermal cycling that would challenge plastic-packaged commercial FPGAs.
Recommended
Launch Vehicle Avionics
Launch environments combine intense vibration, high dose-rate events during ascent through radiation belts, and short but unforgiving mission timelines. The RTAX2000SL-1CGS624V's ceramic column grid array package withstands launch mechanical stress, while antifuse configuration cannot lose its bitstream under shock, and SEU rates below 1E-10 errors per bit-day protect guidance, sequencing, and flight-termination interface logic. The 200 krad parametric and 300 krad functional TID tolerance provides margin for brief but intense exposure profiles typical of ascent trajectories. Designers typically use the device for redundant-comparator voting, telemetry encoding, and safety interlocks where determinism is mandatory. A key consideration is one-time programmability: the flight unit must be fully verified in simulation and on prototyping hardware, such as the Aldec/Microchip adaptor flow, before programming.
Recommended
Deep-Space Probe Digital Logic
Deep-space missions encounter cumulative TID levels and galactic cosmic ray flux far beyond LEO conditions, making the RTAX2000SL-1CGS624V's combination of 300 krad functional TID tolerance and sub-1E-10 SEU-per-bit-day antifuse configuration appropriate for probe subsystems such as instrument controllers, autonomy engines, and communication framing logic. Because solar-powered reconfiguration is impossible at interplanetary distances, the inability of antifuse configuration to corrupt is a decisive advantage over SRAM-based space FPGAs that rely on external configuration scrubbing. The 2M-gate capacity supports science-data preprocessing that reduces downlink bandwidth requirements, directly saving mission communications power. Thermal design should account for the ceramic package's junction-to-case path, bonding the CGA to a radiative thermal chassis for reliable heat removal across the mission.
Recommended
Space Communication and Signal Chains
Transmitter and receiver baseband processing is a natural fit for the RTAX2000SL-1CGS624V: the 2M-gate fabric implements modulators, scramblers, Viterbi or LDPC-adjacent framing functions, and CCSDS-compliant packet assembly, while the up-to-684 I/Os interface ADC/DAC converters and the RF control chain at 2.5V/3.3V bank levels. Segmentable clock regions allow the modulation clock domain to be isolated from housekeeping logic, simplifying jitter budgets on the DAC interface. The 540 kbit embedded SRAM with FIFO control supports elastic buffering between the baseband and formatter clocks without external memory, improving reliability in vacuum environments where commercial DDR memories are impractical. Designers should budget for the -1 speed grade timing when planning symbol rates, and use the EDAC option on any SRAM storing link-state tables.
Recommended
Recommended Products Summary
Engineering reference data for RTAX2000SL-1CGS624V — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX2000SL-CGS624E | RTAX2000SL-1LG624V | RTAX250SL-CG624B |
|---|---|---|---|---|
| Package | 624-ball ceramic CGA (CGS624) | CG624 - same | LG624 - same 624-ball footprint | CG624 - same |
| Brand | Actel (Microchip Technology) | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent Gates | 2,000,000 | 2,000,000 | 2,000,000 | [DATA_NEEDED] |
| Speed Grade | -1 | [DATA_NEEDED] | -1 | [DATA_NEEDED] |
| Screening / Qualification | S / V (space flow) | E flow | V flow | B flow |
| SEU-Hardened Fabric | Yes (SL) | Yes (SL) | Yes (SL) | Yes (SL, RTAX250 family) |
| User I/Os (max) | Up to 684 | Up to 684 | Up to 684 | [DATA_NEEDED] |
| TID Tolerance | 300 krad functional / 200 krad parametric | 300 krad functional / 200 krad parametric | 300 krad functional / 200 krad parametric | [DATA_NEEDED] |
| Unit Price | Quote-based (as of 2026-09-02) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- 2M-gate SL fabric with SEU-hardened flip-flops (vs RTAX2000S-1CG624PROTO)
- Higher flight screening flow (vs RTAX2000SL-CGS624E)
- Double the logic capacity of RTAX250SL in the same footprint (vs RTAX250SL-CG624B)
Design Notes
RTAX-S/SL devices are one-time programmable: the antifuse fabric cannot be reconfigured after programming. Use the Microchip/Aldec prototyping flow (ProASIC3E-based adaptor board with EDIF netlist and pinout converter, per the RTAX-S/SL datasheet prototyping application note) to validate the complete design before committing a flight unit. Reserve 20-30% I/O and logic margin in the 2M-gate device because late payload changes cannot be absorbed after the flight part is programmed.
RTAX2000SL uses a 1.5V-class core supply with separate I/O bank rails; verify exact rail values and sequencing against the RTAX-S/SL datasheet power tables for the CG624 package before designing the power tree. Since the device is live at power-up, ensure input decoupling and inrush control allow clean rail ramp so the always-on configuration and I/O logic initializes correctly at the moment of battery or solar-array switch-on.
The 624-ball ceramic column grid array requires precise land pattern per the datasheet CG624 package drawing and controlled reflow due to the solder-column construction. Provide a solid ground plane under the device, dedicate thermal vias or a heatslug interface to the ceramic body per Microchip's space hardware guidelines, and assign I/O banks in Libero so that 2.5V/3.3V bank voltages match your interface standards before routing.
Compliance Information
Compliance data not stated in retrieved distributor snippets for this space-grade ceramic-package part; obtain Microchip environmental certificates for the exact MPN. Space-grade ceramic CGA parts often carry RoHS exemptions for high-lead solder columns.
