S9S08QD4J2MSCR - 8-bit 16MHz 4KB Flash MCU | NXP
部品番号: S9S08QD4J2MSCR ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $2.85 | $2.85 |
| 10 | $2.55 | $25.50 |
| 100 | $2.1 | $210.00 |
| 500 | $1.78 | $890.00 |
| 1,000 | $1.55 | $1,550.00 |
S9S08QD4J2MSCR 概要
A microcontroller (MCU) is a small computer-on-a-chip that integrates a CPU core, non-volatile program memory (Flash), volatile working memory (RAM), and a set of on-chip peripherals (timers, ADC, communication ports, GPIOs). In the broader taxonomy it belongs to: 8-bit microcontroller -> S08 family -> HCS08 core -> NXP/Freescale automotive MCU -> embedded processor -> semiconductor IC. MCU selection typically begins with core architecture (8/16/32-bit), pin count, Flash/RAM budget, and required peripherals.
Key features of the S9S08QD4J2MSCR include 4 KB Flash program memory, an integrated 10-bit ADC with up to 4 channels (automatic compare, asynchronous clock source, internal bandgap/temperature sensor channels, hardware-triggerable via RTI), a TIM1 module that supports two channels of input capture, output compare, and buffered edge- or center-aligned PWM, and an on-chip background debugging system with two extra breakpoints during in-circuit debug. Supply voltage is 2.7 V to 5.5 V and the operating temperature range spans -40 C to +125 C.
The device uses a CISC instruction set, the 68 HC08 ISA with the added BGND instruction, single-breakpoint setting plus two additional breakpoints in on-chip debug logic, and an RTI-based hardware trigger to the ADC for time-synchronized conversions without CPU intervention.
Typical applications include automotive body electronics, sensor signal acquisition with on-chip ADC, brushed DC motor or LED PWM drive via TIM1 channels, low-cost appliance control, and small consumer products where 8-pin SOIC footprint and 4 KB Flash are sufficient.
When designing with this MCU, ensure the supply decoupling network (typically 100 nF + 4.7 uF) is placed within 5 mm of the VDD pin, route the RESET line away from PWM outputs to avoid injected noise, and confirm that the chosen programming/debug interface (BDM) is available on the production board.
This page consolidates distributor pricing, package-level compatibility notes, application notes and practical design notes not always present in a single supplier listing, complementing the manufacturer datasheet.
ドロップイン代替品: S9S08QD4J2MSCR — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: S9S08QD4J2MSCR （同一形状・フットプリント） — 相違点: Package, Debug Interface, ADC, Instruction Set, Operating Temperature.
クイック比較ツール — 並列比較する代替部品を選択:
S9S08QD4J2MSC
✅ ドロップイン✓ 在庫あり
$1.14 / 個
データシートを見る →MC9S08QD4CSC
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →MC9S08QD4J2MSCR
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MC9S08QD2MSCR
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MC9S08QD2CSC
✅ ドロップイン📋 参考代替品（カタログ未掲載）
S9S08QD4J2MSCR 最大定格＆電気的特性
| Core | HCS08 |
| Instruction Set Architecture | CISC (68 HC08 with added BGND) |
| Core Width | 8-bit |
| Maximum CPU Frequency | 16 MHz |
| Program Memory Type | Flash |
| Program Memory Size | 4 KB (4K x 8) |
| 電源電圧 | 2.7 V to 5.5 V |
| 動作温度 | -40 C to +125 C |
| パッケージ | 8-SOIC (0.154 inch, 3.90 mm width) |
| 実装タイプ | Surface Mount |
| Packaging | Tape & Reel (TR) |
| I/O Pins | 4 |
| ADC | 10-bit, 4-channel with internal bandgap/temperature sensor, hardware triggerable via RTI |
| Timers | TIM1 - 2-channel (input capture / output compare / buffered edge- or center-aligned PWM) |
| Debug | Background Debug Mode (BDM); single breakpoint + two additional on-chip breakpoints |
| RoHS ステータス | Compliant |
S9S08QD4J2MSCR ピン構成
| ピン 1 | PTB4/ADP5 — General I/O / ADC channel (per datasheet pin assignments table) |
| ピン 2 | PTA0/KBI0 — General I/O / Keyboard interrupt (per datasheet pin assignments table) |
| ピン 3 | PTA1/KBI1 — General I/O / Keyboard interrupt (per datasheet pin assignments table) |
| ピン 4 | VSS — Ground reference |
| ピン 5 | PTA2/KBI2/TCLK — General I/O / Keyboard interrupt / Timer clock input (per datasheet pin assignments table) |
| ピン 6 | PTA3/KBI3/BKGD — General I/O / Keyboard interrupt / Background Debug Mode pin (per datasheet pin assignments table) |
| ピン 7 | VDD — Supply voltage (2.7 V to 5.5 V) |
| ピン 8 | PTA4/RESET — General I/O / External reset input (per datasheet pin assignments table) |
主な用途
S9S08QD4J2MSCR の用途: 6 件s: Automotive Body Electronics, Sensor Signal Acquisition, Brushed DC Motor / LED PWM Drive, Low-Cost Appliance Control, Battery-Operated Consumer Devices, Industrial Sensor Nodes.
Automotive Body Electronics
The S9S08QD4J2MSCR suits automotive body modules such as lighting controllers, mirror adjusters, and seat switches that need a small, robust 8-bit MCU. Its AEC-Q100-style qualification flow (S9 prefix), -40 C to +125 C operating range, and 2.7 V to 5.5 V supply align with automotive 12 V battery rail tolerances. Pin headers (4 I/O) and TIM1 PWM channels drive small loads directly. Designers typically pair it with a CAN or LIN transceiver for body networks and benefit from the HCS08 core's predictable interrupt latency.
おすすめ
Sensor Signal Acquisition
The integrated 10-bit ADC with up to 4 channels and automatic compare function makes the S9S08QD4J2MSCR a natural fit for low-cost analog sensor front-ends. The ADC supports an asynchronous clock source and is hardware-triggerable via the RTI counter, enabling time-synchronized sampling without CPU load. Internal bandgap and temperature sensor channels simplify system health monitoring and ratiometric measurements. With 4 KB Flash and the HC08 instruction set, simple firmware filters run comfortably within code space.
おすすめ
Brushed DC Motor / LED PWM Drive
TIM1 provides two channels of input capture, output compare, buffered edge-aligned PWM, and buffered center-aligned PWM on the S9S08QD4J2MSCR, which is enough to drive a small brushed DC motor or a dual-string LED backlight. Center-aligned PWM reduces harmonic content and acoustic noise on motor windings. Combined with the 16 MHz HCS08 core and 4 KB Flash, designers can implement simple PID or trapezoidal commutation firmware. The 8-SOIC footprint saves board area compared with QFP MCUs.
おすすめ
Low-Cost Appliance Control
White goods, coffee machines, and HVAC peripheral controllers often need only modest compute in a tiny package. The S9S08QD4J2MSCR's 8-SOIC outline, 2.7 V to 5.5 V supply, and 4 KB Flash fit typical appliance UI boards with relay drives and keypads. The 10-bit ADC reads NTC temperature sensors, and TIM1 PWM dims indicator bars. NXP's mature S08 toolchain (CodeWarrior, CodeWarrior for S08 ColdFire, GCC) keeps firmware development cost low for cost-sensitive consumer appliances.
おすすめ
Battery-Operated Consumer Devices
Small battery-powered accessories such as remote controls, smart locks, and toys can leverage the S9S08QD4J2MSCR's 2.7 V minimum supply to run directly off two AA cells or a CR2032 with a boost converter. The 8-SOIC package is easy to hand-prototype and rework. Designers can use TIM1 PWM for IR carrier generation, ADC channels for battery monitoring, and the BDM interface for field firmware updates. The HCS08 core's low interrupt latency keeps user-perceived latency minimal.
おすすめ
Industrial Sensor Nodes
Industrial 4-bit / 8-bit nodes that need deterministic control in electrically noisy environments can use the S9S08QD4J2MSCR thanks to the -40 C to +125 C rating and 2.7 V to 5.5 V supply headroom. The ADC's automatic compare function can wake the CPU only when a threshold is crossed, lowering average consumption in polled loops. With 4 KB Flash, simple Modbus RTU firmware fits, and the 8-SOIC footprint survives conformal coating and standard wave-solder rework on industrial PCBs.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: S9S08QD4J2MSCR — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | S9S08QD4J2MSC | MC9S08QD4CSC | MC9S08QD4J2MSCR | MC9S08QD2MSCR | MC9S08QD2CSC |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 8-SOIC (3.90 mm) | 8-SOIC (3.90 mm) - same | 8-SOIC (3.90 mm) - same | 8-SOIC (3.90 mm) - same | 8-SOIC (3.90 mm) - same | 8-SOIC (3.90 mm) - same |
| Core | HCS08 (8-bit) | HCS08 (8-bit) | HCS08 (8-bit) | HCS08 (8-bit) | HCS08 (8-bit) | HCS08 (8-bit) |
| CPU Frequency | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz |
| Program Flash | 4 KB | 4 KB | 4 KB | 4 KB | 2 KB (-50%) | 2 KB (-50%) |
| Supply Voltage | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| ADC | 10-bit, 4-ch | 10-bit, 4-ch | 10-bit, 4-ch | 10-bit, 4-ch | 10-bit, 4-ch | 10-bit, 4-ch |
| Packaging | Tape & Reel (TR) | Tube | Tube | Tape & Reel | Tape & Reel | Tube |
主な差別化要因
- Lowest-pin-count qualified HCS08 family option （vs MC9S08QD2MSCR)
- Automotive S9 qualification prefix （vs MC9S08QD4CSC)
- Hardware-triggerable ADC with RTI （vs Generic 8-bit MCUs (PIC12F))
設計ノート
Place a 100 nF X7R ceramic bypass capacitor within 5 mm of the VDD pin and a 4.7 uF bulk capacitor on the same node to handle Flash write current spikes. The NXP S9S08QD4 datasheet shows the internal voltage domain will be hot during Flash programming, so a low-impedance supply is mandatory. Designers should also add a 10 kohm pull-up on RESET/PTA4 to avoid spurious resets on power-up ramps.
Route the BKGD/PTB3 pin to a dedicated test pad and keep it away from PWM output traces (PTA0/PTA1) to prevent capacitive coupling that can disrupt background debug. The 8-SOIC land pattern should follow the IPC-7351 SOIC-8 nominal recommendation with 0.6 mm pitch and at least 0.1 mm solder mask sliver between pads. Solid ground pour under the package reduces digital switching noise coupling into the ADC channels.
Watch for confusion between S9S08QD4 (4 KB Flash) and S9S08QD2 (2 KB Flash). The mask set differs and code compiled for 4 KB will overflow a 2 KB part. Also, the BGND opcode is documented as a privileged debug instruction - locking BGND via the FOPT register prevents accidental invocation in fielded firmware. The datasheet block diagram and FOPT/SOPT registers should be reviewed before locking the part.
At 16 MHz CPU and 5.5 V supply, the S9S08QD4J2MSCR typically dissipates well under 100 mW, so the 8-SOIC package is comfortable without forced cooling. Still, ambient temperatures above 85 C reduce Flash retention margin and may force a derate of the internal oscillator. Place the part away from board hot spots (power MOSFETs, transformers) and follow NXP layout guidelines for SOIC thermal relief.
コンプライアンス情報
Automotive-grade silicon indicated by the S9 prefix per NXP part-numbering convention. Confirm the specific AEC-Q100 grade and PPAP documentation with NXP for safety-critical automotive subsystems. Halogen-free status not explicitly stated in the verified web data; confirmed by datasheet only if explicitly required.
