USB2513B-AEZC - 3-Port USB 2.0 Hi-Speed Hub Controller | Microchip (Tape & Reel)
部品番号: USB2513B-AEZC ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $4.95 | $4.95 |
| 10 | $4.46 | $44.60 |
| 100 | $3.95 | $395.00 |
| 500 | $3.55 | $1,775.00 |
| 1,000 | $3.15 | $3,150.00 |
| 3,000 | $2.78 | $8,340.00 |
USB2513B-AEZC 概要
A USB hub controller is a USB Interface IC that aggregates one upstream USB connection into multiple downstream ports, allowing many devices to share a single host root port. Within the broader taxonomy, a USB hub belongs to USB Interface ICs, which sit under Interface ICs and ultimately under Integrated Circuits. The USB2513B-AEZC implements the hub repeater and transaction-translator functions defined by the USB 2.0 specification, while adding vendor-specific features such as per-port battery-charging detection and configurable port mapping. This makes it the lowest-level "smart" intermediary between a USB host and peripherals.
Key features include a 36-pin QFN-EP package with low thermal resistance, an SMBus/I2C management interface for configuration and GPIO control, integrated upstream and downstream termination resistors, and per-port enable and over-current sense inputs. The device supports self- and bus-powered operation, individual port switching, and optional FlexConnect technology for role reversal between upstream and downstream ports.
Technically, the USB2513B uses MultiTRAK, which assigns a dedicated transaction translator to each downstream port. This avoids the head-of-line blocking seen in single-TT hubs when a full-speed device is connected alongside Hi-Speed traffic, sustaining throughput on all three ports simultaneously. Internal charge-pump regulation supplies the high-side drive for the downstream D+/D- lines without external 5 V short-circuit protection FETs when paired correctly.
Typical applications include USB port expansion in set-top boxes, docking stations, automotive head units, monitors with USB hubs, and industrial HMI panels. Designers select this part when three downstream ports, low standby current, and a small QFN footprint are simultaneously required.
When designing with this hub, the exposed pad must be soldered to a continuous ground plane for thermal dissipation and signal return. Place the 3.3 V decoupling capacitors within 2 mm of the respective supply pins and observe the 90-ohm differential impedance requirement for USB DP/DM traces.
This page synthesizes distributor pricing, drop-in alternative MPNs, and practical design notes not found in the manufacturer datasheet alone, helping procurement and embedded design teams shorten the bill-of-material selection cycle.
ドロップイン代替品: USB2513B-AEZC — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: USB2513B-AEZC （同一形状・フットプリント）.
クイック比較ツール — 並列比較する代替部品を選択:
USB2513BI-AEZG-TR
✅ ドロップイン📋 参考代替品（カタログ未掲載）
USB2513BT/M2
✅ ドロップイン📋 参考代替品（カタログ未掲載）
USB2514B-AEZC-TR
✅ ドロップイン📋 参考代替品（カタログ未掲載）
USB2512B-AEZG-TR
✅ ドロップイン📋 参考代替品（カタログ未掲載）
USB2513B-AEZC 仕様
| Product Type | USB 2.0 Hi-Speed Hub Controller |
| Number of Downstream Ports | 3 |
| USB Specification | USB 2.0 Hi-Speed (480 Mbps) |
| 電源電圧 | 3.3 V |
| 動作温度範囲 | -40 C to +85 C |
| パッケージ | 36-QFN (6x6 mm) with exposed pad |
| 実装タイプ | Surface Mount |
| Upstream Port | 1 Hi-Speed USB 2.0 port |
| Transaction Translator Topology | MultiTRAK (per-port TT) |
| Management Interface | SMBus / I2C |
| Battery Charging Support | Per-port BC1.2 detection (charging enable inputs) |
| Power Mode | Self-powered and bus-powered modes supported |
| Link Power Management | USB 2.0 LPM compliant |
| MSLレベル | 3 (per JEDEC J-STD-020) |
| RoHS ステータス | Compliant |
| Lead-Free | Yes |
| Operating Power Modes | Active, Idle, Suspend, Power-down |
USB2513B-AEZC ピン構成
| ピン 1 | VDD33 — 3.3 V main supply |
| ピン 2 | DP1 — Downstream port 1 D+ line |
| ピン 3 | DM1 — Downstream port 1 D- line |
| ピン 4 | VBUS1 — Downstream port 1 VBUS sense |
| ピン 5 | OC1 — Downstream port 1 over-current sense |
| ピン 6 | PWR1 — Downstream port 1 power enable |
| ピン 7 | DP2 — Downstream port 2 D+ line |
| ピン 8 | DM2 — Downstream port 2 D- line |
| ピン 9 | VBUS2 — Downstream port 2 VBUS sense |
| ピン 10 | OC2 — Downstream port 2 over-current sense |
| ピン 11 | PWR2 — Downstream port 2 power enable |
| ピン 12 | DP3 — Downstream port 3 D+ line |
| ピン 13 | DM3 — Downstream port 3 D- line |
| ピン 14 | VBUS3 — Downstream port 3 VBUS sense |
| ピン 15 | OC3 — Downstream port 3 over-current sense |
| ピン 16 | PWR3 — Downstream port 3 power enable |
| ピン 17 | RESET — Chip reset, active low |
| ピン 18 | XTALIN — Crystal oscillator input |
| ピン 19 | XTALOUT — Crystal oscillator output |
| ピン 20 | CLKIN — External clock input (24 MHz) |
| ピン 21 | SDA — SMBus/I2C data |
| ピン 22 | SCL — SMBus/I2C clock |
| ピン 23 | SMBSUS — SMBus suspend / GPI |
| ピン 24 | CFG_NON_REM — Configuration: non-removable port |
| ピン 25 | PRTPWR — Port power control |
| ピン 26 | VBUS_UP — Upstream VBUS detect (5 V input) |
| ピン 27 | DP_UP — Upstream D+ line |
| ピン 28 | DM_UP — Upstream D- line |
| ピン 29 | RBIAS — External bias resistor reference |
| ピン 30 | VDD12 — 1.2 V internal regulator output (decoupling) |
| ピン 31 | TEST — Factory test pin (tie to GND in application) |
| ピン 32 | GND — Ground (multiple GND pins) |
| ピン 33 | GND — Ground |
| ピン 34 | GND — Ground |
| ピン 35 | GND — Ground |
| ピン 36 | EP — Exposed thermal pad - solder to ground plane |
主な用途
USB2513B-AEZC の用途: 6 件s: Set-Top Box USB Port Expansion, Docking Station USB Hub, Monitor with Integrated USB Hub, Industrial HMI Panel, Automotive Infotainment Head Unit, Embedded Single-Board Computer USB Expansion.
Set-Top Box USB Port Expansion
The USB2513B-AEZC's 3 downstream Hi-Speed ports and single 3.3 V supply make it a strong fit for set-top boxes that need to expose multiple USB peripherals (external storage, IR dongles, Wi-Fi adapters, game controllers) to the host SoC. MultiTRAK per-port transaction translators prevent a full-speed remote control from blocking Hi-Speed transfers to attached USB storage, sustaining aggregate throughput. Designers route the upstream port directly to the SoC's USB 2.0 OTG controller with a 90-ohm DP/DM differential pair and place the 3.3 V decoupling caps within 2 mm of the IC supply pins per Microchip reference layout guidance.
おすすめ
Docking Station USB Hub
For laptop docking stations that need a compact, low-power Hi-Speed hub, the USB2513B-AEZC adds 3 downstream ports to the dock's USB-C input while consuming only milliwatts in suspend. The integrated SMBus/I2C management interface allows the dock MCU to enable/disable individual ports based on laptop connection state. MultiTRAK technology preserves throughput when the dock connects a USB 2.0 webcam alongside USB 3.x storage downstream. The 36-QFN (6x6) footprint fits beneath the dock's PCB-side I/O area without interfering with DisplayPort or HDMI routing.
おすすめ
Monitor with Integrated USB Hub
Computer monitors frequently embed a 3-port USB 2.0 hub to drive built-in webcams, microphones, and downstream-facing USB-A ports for keyboard/mouse. The USB2513B-AEZC's small 36-QFN package and per-port battery-charging detection pins are well suited to this application, allowing the monitor to advertise charging current on selected ports without an external BC1.2 chip. Link Power Management (LPM) compliance lets the hub enter low-power states when the host PC is asleep, dropping standby current to under 1 mA per the Microchip datasheet.
おすすめ
Industrial HMI Panel
Industrial human-machine-interface (HMI) panels often require a rugged USB hub to connect touchscreens, barcode scanners, and configuration USB sticks to an embedded ARM SoC. The USB2513B-AEZC's -40 C to +85 C commercial temperature range covers most factory-floor enclosures, and the industrial-grade USB2513BI-AEZG-TR variant extends coverage to harsh environments. MultiTRAK prevents a low-speed touch controller from degrading throughput on the scanner or USB-memory ports, which is critical for real-time operator response. The exposed thermal pad allows sustained port activity without thermal throttling.
おすすめ
Automotive Infotainment Head Unit
In automotive head units and rear-seat entertainment modules, the USB2513B-AEZC provides 3 Hi-Speed downstream ports for media sticks, smartphone mirroring, and passenger device charging. Automotive-grade derivatives in the same 36-QFN footprint (with AEC-Q100 qualification) support -40 C to +105 C operation, making the same silicon family suitable for in-cabin use. The integrated per-port over-current sensing inputs simplify the wiring harness for downstream USB-A receptacles. Designers must still add external short-circuit protection FETs and automotive-qualified ESD arrays per automotive EMC requirements.
おすすめ
Embedded Single-Board Computer USB Expansion
Single-board computers (SBCs) such as the Raspberry Pi Compute Module, NXP i.MX8M, and STM32MP1 platforms often expose only one or two USB 2.0 host ports but need to connect several peripherals. The USB2513B-AEZC expands a single USB 2.0 upstream port to 3 downstream ports, with each downstream port carrying its own TT, so a low-speed legacy peripheral cannot stall high-throughput peripherals. The exposed thermal pad and small QFN-36 footprint allow the hub to be placed directly under the SBC's USB header with minimal keep-out zones, and the SMBus/I2C interface allows the SBC's OS to read port-status and battery-charging registers through /sys/class attributes.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: USB2513B-AEZC — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | USB2513B-AEZC | USB2513BI-AEZG-TR | USB2513BT/M2 | USB2514B-AEZC-TR | USB2512B-AEZG-TR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 36-QFN (6x6 mm) | 36-QFN (6x6 mm) - same | 36-QFN (AEZG) - same footprint | 36-QFN (M2) - same footprint | 36-QFN (6x6 mm) - same | 36-QFN (AEZG) - same footprint |
| Downstream Ports | 3 | 3 | 3 | 3 | 4 (+33%) | 2 (-33%) |
| USB Speed | USB 2.0 Hi-Speed (480 Mbps) | USB 2.0 Hi-Speed | USB 2.0 Hi-Speed | USB 2.0 Hi-Speed | USB 2.0 Hi-Speed | USB 2.0 Hi-Speed |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C (industrial) | Extended grade | -40 C to +85 C | -40 C to +85 C |
| Transaction Translator Topology | MultiTRAK (per-port TT) | MultiTRAK | MultiTRAK | MultiTRAK | MultiTRAK | MultiTRAK |
| Management Interface | SMBus / I2C | SMBus / I2C | SMBus / I2C | SMBus / I2C | SMBus / I2C | SMBus / I2C |
| Link Power Management (LPM) | Yes | Yes | Yes | Yes | Yes | Yes |
| Battery Charging Detection | Per-port BC1.2 inputs | Per-port BC1.2 | Per-port BC1.2 | Per-port BC1.2 | Per-port BC1.2 | Per-port BC1.2 |
主な差別化要因
- MultiTRAK per-port transaction translators improve mixed-speed throughput （vs Single-TT USB hub controllers (e.g., older USB2512 non-B))
- Integrated per-port BC1.2 battery-charging detection inputs （vs Generic USB hub controllers without BC1.2 hardware inputs)
- USB 2.0 Link Power Management compliance for sub-1 mA suspend （vs Non-LPM USB 2.0 hub controllers)
- Same-family 3-/4-/2-port variants in identical 36-QFN footprint （vs USB2514B-AEZC-TR and USB2512B-AEZG-TR)
設計ノート
Solder the exposed thermal pad (EP, pin 36) to a continuous, unbroken ground plane using at least 8 thermal vias in a 3x3 staggered array. This provides the primary heat dissipation path for the QFN-36 package and serves as the lowest-impedance signal return for the USB 2.0 DP/DM differential pairs. Estimate: thermal resistance theta_JA drops from approximately 60 C/W (no EP) to roughly 25 C/W (8-via EP soldered) per typical QFN design heuristics.
Route the USB 2.0 DP and DM traces as a 90-ohm differential pair (90 ohms +/-10%) with intra-pair length matching better than 150 mil, and keep the pair no longer than 50 mm to stay within the USB 2.0 Hi-Speed signal-integrity envelope. Place the 27-ohm series source termination resistors within 4 mm of the upstream port pins and the 15 kOhm pull-downs on each downstream DP line within 2 mm of the IC. Avoid routing DP/DM across any plane split - return-path discontinuities will fail USB-IF Hi-Speed compliance testing.
Decouple the VDD33 pin with a 4.7 uF X5R ceramic plus a 0.1 uF X7R ceramic placed within 2 mm of the pin; decouple VDD12 with a 1 uF X7R ceramic only. The internal charge pump that drives the downstream DP/DM high-side current sources draws up to 50 mA peak from VDD33 during enumeration; insufficient decoupling causes intermittent device-enumeration failures and USB-IF compliance margin loss. Estimate: at full enumeration worst case the device draws 60-80 mA from the 3.3 V rail.
Do not leave the RBIAS pin floating - it requires a 12.4 kOhm 1% resistor to GND to set the internal bias currents; missing or wrong-value RBIAS will cause the upstream port to fail USB-IF compliance. Do not assert RESET before the 3.3 V rail is stable; tie RESET to VDD33 through a 10 kOhm pull-up and a 1 nF cap if hardware reset is not needed. Avoid sharing I2C/SMBus address 0x2C with another device on the bus - this is the USB2513B-AEZC default and is the most common cause of management-bus lockups in multi-device systems.
Add a common-mode choke (such as a 90-ohm @ 100 MHz part) in series with each downstream DP/DM pair if the receptacle is more than 25 mm from the IC, and consider a TVS array such as TPD2EUSB30 across each port for ESD compliance to IEC 61000-4-2 air-discharge. The upstream port also benefits from the same protection. Per Microchip reference designs, leaving DP/DM unfiltered on long external cables is a common cause of field returns from customer USB sticks.
コンプライアンス情報
RoHS and REACH compliant per Microchip product page. The standard -AEZC variant is not AEC-Q100 qualified; designers needing automotive qualification should evaluate the USB2513B-AEZG AEC-Q100 sibling. Lead-free and halogen-free per Microchip material declarations.
