XC6SLX25-3FG484C - Spartan-6 LX FPGA | AMD Xilinx
Référence : XC6SLX25-3FG484C ✓ ActifXC6SLX25-3FG484C Présentation
A field-programmable gate array, or FPGA, is a programmable logic device that combines configurable logic, programmable I/O, and dedicated processing resources on one semiconductor die. FPGAs occupy the programmable-logic hierarchy between fixed-function logic ICs and higher-end adaptive computing devices. They allow hardware functions to be revised through configuration bitstreams rather than redesigning a custom ASIC, reducing prototype cycles and supporting field upgrades.
The XC6SLX25-3FG484C provides 24,051 logic cells and 1,879 configurable logic blocks, according to the indexed Spartan-6 comparison data. Its 500 MHz internal-frequency listing makes it suitable for parallel logic, state-machine, control, interface, and signal-processing designs that require deterministic hardware operation. The 484-BBGA package also exposes substantially more connection options than a small quad-flat package.
The device combines configurable logic with DSP48 processing resources and dedicated block RAM for filtering, transforms, communications encoding, and other data-intensive functions. Its 45 nm CMOS implementation and 1.2 V core voltage place it in the Spartan-6 generation designed to balance programmable logic capacity, I/O connectivity, power efficiency, and cost for cost-sensitive, high-volume equipment.
Typical uses include industrial automation and control, video-processing pipelines, communications infrastructure, instrumentation, embedded systems, and interface consolidation. The 24,051-cell Spartan-6 LX device is particularly appropriate when parallel datapath logic, moderate DSP requirements, and extensive package I/O are needed without moving immediately to a larger FPGA or developing a custom ASIC.
Design planning must account for the BGA escape routing, decoupling, clock integrity, configuration memory, and thermal performance of a 484-ball package. Although the indexed operating-temperature range is 0 to 85 °C, thermal design should be evaluated for the actual board, enclosure, airflow, and activity level rather than relying only on the commercial temperature designation.
This product record combines verified distributor availability, exact package and device identifiers, Spartan-6 family specifications, drop-in same-package comparisons, and procurement-oriented guidance. It distinguishes confirmed data from unavailable numeric pricing, pin-by-pin mapping, and detailed power characteristics so engineers can make sourcing and design decisions without relying on inferred values.
Alternatives de remplacement direct pour XC6SLX25-3FG484C — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC6SLX25-3FG484C (même facteur de forme et même empreinte) — différant par Logic Cells, Package, Process Technology, Speed Grade.
XC6SLX25-N3FG484C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX25-3FGG484C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX25-3FGG484I
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →XC6SLX25-2FGG484C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX25-2FG484C
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Voir la fiche technique →XC6SLX25-3FG484C Valeurs maximales et caractéristiques électriques
| Device Type | FPGA |
| FPGA Family | Spartan-6 LX |
| Logic Cells | 24,051 cells |
| Configurable Logic Blocks | 1,879 CLBs |
| Internal Frequency | 500 MHz |
| Process Technology | 45 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Speed Grade | -3 |
| Température de fonctionnement | 0 °C to 85 °C |
| Boîtier | 484-BBGA, 15 x 15 mm, 0.80 mm pitch |
| Package Classification | Lead-free CSBGA-324 |
| Metal Balls | 266 balls |
| Package Reference | MO-275 |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Guide de configuration des broches du XC6SLX25-3FG484C mo-275
Configuration des broches du XC6SLX25-3FG484C (boîtier mo-275). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC6SLX25-3FG484C.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC6SLX25-3FG484C convient pour 6 applications: Industrial Automation and Control, Video and Image Processing, Communications and Interface Consolidation, Embedded Instrumentation, Signal Processing and Filtering, Power-Supply Control and Monitoring.
Industrial Automation and Control
XC6SLX25-3FG484C fits factory-control, sequencing, and machine-interlock systems that benefit from 24,051 logic cells and parallel hardware execution. Its indexed 500 MHz internal frequency supports demanding control pipelines without using a microcontroller for every timing-critical decision. The 484-BBGA package also provides extensive I/O connectivity for sensors, actuators, counters, and communications. According to the AMD Spartan-6 family information, the device provides DSP48 and block-RAM resources that can implement filtering or protocol acceleration alongside control logic. Designers should validate the -3 timing margin and the device's indexed 0 °C to 85 °C operating range against the enclosure temperature.
Recommandé
Video and Image Processing
XC6SLX25-3FG484C is appropriate for parallel video pipelines, pixel transformations, test-pattern generation, and embedded image-processing functions. The 24,051-cell Spartan-6 LX resource pool allows multiple pipeline stages to operate concurrently, while the dedicated DSP and block-RAM resources can accelerate filtering and buffering. Its 500 MHz listed internal frequency provides a useful basis for high-speed datapath design. According to the indexed AMD family information, the -3 grade is the highest-performance Spartan-6 LX option. The engineering trade-off is routing complexity: a 15 x 15 mm, 0.80 mm-pitch BGA requires careful escape routing, layer transitions, and high-speed signal-integrity validation.
Recommandé
Communications and Interface Consolidation
XC6SLX25-3FG484C can consolidate serial interfaces, packet formatting, buffers, and protocol state machines into one programmable Spartan-6 LX device. Its 24,051 logic cells and 1,879 configurable logic blocks allow multiple channels to be processed in parallel, while block RAM supports buffering and frame organization. The listed 500 MHz internal frequency is useful for high-throughput datapaths, and the 484-BBGA package offers more I/O than smaller devices. According to AMD's indexed family materials, DSP48 resources can also support filtering or modulation functions. Designers must verify every high-speed interface's timing, I/O standard, impedance, and pin assignment using the official package files before release.
Recommandé
Embedded Instrumentation
XC6SLX25-3FG484C suits configurable measurement, timing, waveform, and signal-conditioning logic in laboratory or embedded instrumentation. The 24,051 logic cells permit acquisition pipelines, control sequencing, calibration tables, and communications to coexist in one device. Its indexed 500 MHz internal frequency supports parallel sampling and filtering arrangements, while dedicated DSP and RAM resources improve implementation efficiency. According to the supplied AMD family information, the -3 speed grade provides the highest available Spartan-6 LX performance. For a 484-BBGA implementation, engineers should plan stable references, low-noise power distribution, thermal monitoring, and carefully controlled clock routing to preserve measurement quality.
Recommandé
Signal Processing and Filtering
XC6SLX25-3FG484C is well matched to FIR filters, moving averages, waveform conditioning, and fixed-function signal-processing accelerators. The 24,051 logic cells provide parallel multiplier-add and control resources, while the Spartan-6 LX DSP48 blocks and block RAM improve throughput without relying entirely on general-purpose LUT logic. According to the indexed AMD documentation, the device's listed 500 MHz internal frequency and -3 speed grade support demanding sequential processing. A practical design must still map the required multipliers, memories, and I/O into the available resources and check timing after placement and routing. Differential clocks and high-speed data interfaces require controlled impedance, return paths, and BGA escape geometry.
Recommandé
Power-Supply Control and Monitoring
XC6SLX25-3FG484C can implement supervisory sequencing, fault detection, load sharing, telemetry, and power-good logic for embedded power systems. Its 24,051-cell capacity provides more parallelism than required for simple sequencing, leaving room for communication, data logging, and redundant checks. The 500 MHz listed internal frequency permits fast control-loop processing, and the 484-BBGA package offers enough connections for multiple rails and status signals. According to the AMD Spartan-6 family information indexed in the supplied data, the device also supports DSP and RAM resources for monitoring algorithms. Designers must separate sensitive analog measurement paths from switching nodes and confirm all timing against the -3 speed-grade constraints.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC6SLX25-3FG484C — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC6SLX25-N3FG484C | XC6SLX25-3FGG484C | XC6SLX25-3FGG484I | XC6SLX25-2FGG484C | XC6SLX25-2FG484C |
|---|---|---|---|---|---|---|
| Package | 484-BBGA, 15 x 15 mm | 484-BBGA, 15 x 15 mm - same package | 484-BBGA, 15 x 15 mm - same package | 484-BBGA, 15 x 15 mm - same package | 484-BBGA, 15 x 15 mm - same package | 484-BBGA, 15 x 15 mm - same package |
| Brand | Advanced Micro Devices, Inc. | Advanced Micro Devices, Inc. | Advanced Micro Devices, Inc. | Advanced Micro Devices, Inc. | Advanced Micro Devices, Inc. | Advanced Micro Devices, Inc. |
| Logic Cells | 24,051 cells | 24,051 cells | 24,051 cells | 24,051 cells | 24,051 cells | 24,051 cells |
| Speed Grade | -3 | -3N | -3 | -3 | -2 | -2 |
Principaux différenciateurs
- Highest-performance speed grade among the indexed same-package alternatives (vs XC6SLX25-2FG484C)
- Full 24,051-cell density retained in a direct same-package family comparison (vs XC6SLX25-3CSG324C)
- Commercial -3 grade with a 500 MHz listed internal frequency (vs XC6SLX25-2FGG484C)
- Same-family logic density and ball count in the closest indexed cross-reference (vs XC6SLX25-N3FG484C)
Notes de conception
Plan the 484-BBGA layout around the verified 15 x 15 mm body and 0.80 mm ball pitch. Use the official AMD package file to establish every ball location, and route high-speed signals through short, referenced escape paths where possible. The package data identifies both a 484-BBGA ordering designation and 266 metal balls, so the approved device and package drawings must be checked before defining pads or starting a PCB revision.
Do not assume that the listed 1.2 V core voltage is the complete board power requirement. The supplied data does not include auxiliary rail voltages, quiescent current, or current per I/O bank. Obtain those values from the manufacturer documentation, then create a power budget covering the FPGA core, configuration circuitry, external memories, I/O loads, and regulators. Add local bulk and high-frequency decoupling only after confirming the official values and layout guidance.
Treat clocks, configuration interfaces, and high-speed I/O as separate signal-integrity problems. The verified data confirms a 500 MHz internal-frequency listing but does not specify every external interface timing limit. Use length matching where required, preserve continuous reference planes, avoid split planes under escape routes, and validate edge rates with actual models. Post-layout timing analysis should include placement, routing, and realistic I/O loading rather than relying on the nominal internal frequency alone.
Begin thermal analysis with the verified commercial operating range of 0 °C to 85 °C, then calculate actual junction temperature from the selected FPGA activity, board construction, airflow, and surrounding components. The supplied data does not contain theta-JA, theta-JC, maximum power, or derating curves, so no numerical junction-temperature claim is made here. Use the official power and thermal tables and preserve thermal paths from the BGA through the PCB stack-up.
Informations de conformité
RoHS and REACH compliance are referenced by the indexed AMD certification information, and the package is described as lead-free. No verified AEC-Q100 qualification, halogen-free declaration, or conflict-minerals report was supplied for this exact orderable MPN.
