XC6SLX45-2FG676I - 45K Logic Cell Spartan-6 LX FPGA | AMD
部品番号: XC6SLX45-2FG676I ✓ 生産中XC6SLX45-2FG676I 概要
A field-programmable gate array is a semiconductor device whose digital logic, memory, signal processing, and input/output functions are configured after manufacture. In the product hierarchy, an FPGA is a programmable-logic device, a configurable semiconductor, and an application-specific integrated circuit. This architecture allows one physical design to implement multiple control, interface, signal-processing, or communication functions without changing the PCB.
The verified listing identifies the XC6SLX45-2FG676I as a 45 nm CMOS Spartan-6 LX FPGA with 43,661 cells, 358 I/O, and a 676-BGA package. The -2 ordering code denotes the specified device speed grade, while the I suffix identifies the industrial temperature grade. The 676-ball package provides a large, high-density connection interface for designs requiring extensive external connectivity.
Spartan-6 LX devices are suitable when designers need deterministic programmable logic and parallel I/O rather than the compute density of a processor. The 358 I/O listed for this device can support external memories, data buses, control signals, high-speed interfaces, and general-purpose digital peripherals. The exact clock, I/O-standard, and performance ratings for this ordering code must be confirmed in the AMD Spartan-6 documentation before final sign-off.
Typical applications include industrial automation, video and image processing, communications infrastructure, instrumentation, embedded control, data acquisition, and interface bridging. The large 676-ball BGA also makes the device appropriate for dense boards where minimizing package count and supporting many parallel connections are priorities.
A critical design consideration is that a BGA package requires careful PCB escape routing, layer-stackup control, via strategy, and assembly-process planning. Designers must also verify pin compatibility, supported I/O standards, configuration requirements, power sequencing, and operating-temperature limits before treating any substitute as a true drop-in replacement.
This page combines verified distributor data, order-code details, a same-footprint comparison, and practical implementation guidance to help engineers evaluate the XC6SLX45-2FG676I for both new designs and controlled replacement programs.
ドロップイン代替品: XC6SLX45-2FG676I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: XC6SLX45-2FG676I （同一形状・フットプリント） — 相違点: Package, Logic Cells, Process Technology, Speed Grade, Block RAM.
XC6SLX45-2FGG676I
✅ ドロップイン価格はお問い合わせください
データシートを見る →XC6SLX45-2FGG676C
✅ ドロップイン価格はお問い合わせください
データシートを見る →XC6SLX45-3FGG676I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC6SLX45-3FGG676C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC6SLX45-2FG676C
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XC6SLX45-2FG676I 最大定格＆電気的特性
| Device Type | Spartan-6 LX Field Programmable Gate Array (FPGA) |
| Logic Cells | 43,661 cells |
| I/O Count | 358 I/O |
| Technology | 45 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Speed Grade | -2 |
| Temperature Grade | Industrial |
| パッケージ | 676-BGA |
| Package Type | BGA |
| Number of Terminals | 676 |
| Package Shape | Square |
| Terminal Form | Ball |
| Programmable Logic Type | FPGA |
| Manufacturer | AMD / Xilinx |
XC6SLX45-2FG676I square ピン配置ガイド
XC6SLX45-2FG676I (square パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: XC6SLX45-2FG676I.
詳細は データシート をご参照ください。
主な用途
XC6SLX45-2FG676I の用途: 6 件s: Industrial Automation and Control, Data Acquisition and Signal Conditioning, Communications and Interface Bridging, Video and Image Processing, Test and Measurement Instrumentation, Embedded Control and Sensor Fusion.
Industrial Automation and Control
The AMD XC6SLX45-2FG676I fits industrial automation systems that require extensive parallel control, acquisition, and communication logic on a single FPGA. Its 43,661 logic cells provide substantial programmable capacity, while the 358 I/O allow the design to connect sensors, actuator drivers, interlocks, status indicators, and industrial communication transceivers without relying on several smaller programmable devices. The industrial-temperature I suffix supports designs intended for extended-temperature equipment, although the exact rated limits must be confirmed in AMD documentation. Engineers should partition sensitive interface and clock paths, verify the supported I/O standards for each bank, and complete timing analysis for the -2 speed grade. Compared with a processor-based controller, the FPGA can execute multiple deterministic control tasks concurrently while reducing software scheduling overhead.
おすすめ
Data Acquisition and Signal Conditioning
XC6SLX45-2FG676I is suitable for parallel data-acquisition front ends where multiple channels must be sampled, filtered, buffered, and transferred under deterministic timing. The 358 I/O provide a high pin count for converter outputs, capture-control signals, clock distribution, and interface logic, while the 43,661-cell Spartan-6 LX fabric can implement parallel pipelines, digital filters, calibration tables, and data-formatting logic. Using the FPGA in parallel with an ADC allows samples to be captured and processed without moving every operation through a serial processor interface. Design work should account for input timing uncertainty, clock skew, I/O supply requirements, and board-level channel-to-channel skew. The -2 grade should be validated against the target acquisition clock, and unused inputs need defined termination behavior in the FPGA constraints.
おすすめ
Communications and Interface Bridging
The AMD XC6SLX45-2FG676I can be used in communications equipment for protocol conversion, packet handling, test instrumentation, and legacy-to-modern interface bridging. Its high logic-cell count supports parallel datapaths and multiple protocol engines, while 358 I/O can expose buses, clocks, resets, and status signals needed around a communications module. The Spartan-6 LX architecture is especially useful where a fixed hardware pipeline offers more predictable latency than software handling. Implementation should establish independent clock domains for serial and parallel sides, constrain each interface explicitly, and reserve sufficient I/O supply flexibility for the selected standards. Because the verified data does not provide transceiver rates or supported protocol inventory, engineers must consult the family datasheet and design-guide set before committing to a particular line rate.
おすすめ
Video and Image Processing
XC6SLX45-2FG676I can support parallel video, image-capture, and pixel-processing designs because 43,661 logic cells are available for frame buffers, timing generators, color conversion, filtering, and interface control. The 358 I/O are particularly relevant for parallel sensors and displays, where wide data buses can be implemented without a serial-to-parallel converter at every stage. A practical design can use internal block resources for buffering where supported, but the exact RAM and DSP quantities were not supplied in the verified records and must be checked before architecture selection. Engineers should budget resources for line and frame timing, constrain video clocks carefully, and plan PCB escape routing for the dense 676-ball package. The -2 grade should be checked against pixel-clock timing, while industrial-temperature requirements determine whether the I suffix is necessary.
おすすめ
Test and Measurement Instrumentation
The AMD XC6SLX45-2FG676I is appropriate for programmable test equipment, logic analyzers, pattern generators, and automated measurement systems that need deterministic timing and flexible I/O. Its 43,661-cell capacity can hold acquisition engines, sequence control, timing generators, and data-processing pipelines, while 358 I/O provide high parallelism for fixture and DUT connections. In a measurement instrument, the FPGA can execute repeated tests without processor scheduling delays and combine results into real-time displays or protocol analyzers. Design teams should separate sensitive analog-adjacent input circuitry from digital switching activity, control clock jitter, and validate every input timing constraint. Since the verified material does not state supported I/O-voltage combinations or maximum operating frequencies for this exact grade, those values must be obtained from the manufacturer family documentation.
おすすめ
Embedded Control and Sensor Fusion
XC6SLX45-2FG676I can serve as the programmable control core in a sensor-rich embedded system where numerous inputs, timing-sensitive sampling, and parallel outputs must be coordinated. The 43,661-cell fabric can host motor or actuator sequencing, sensor fusion, watchdog logic, and communication adaptation, while the 358 I/O support multiple device buses and discrete control lines. The industrial-temperature designation is useful for equipment exposed to temperature variation, but engineers must verify the complete temperature range and any required environmental qualifications. A robust implementation should use independent clocking for sensor, communication, and service interfaces, isolate asynchronous inputs, and establish fail-safe states for external outputs. The FPGA should also be checked against functional-safety requirements where applicable because no AEC-Q100 or industrial certification status was provided.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: XC6SLX45-2FG676I — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | XC6SLX45-2FGG676I | XC6SLX45-2FGG676C | XC6SLX45-3FGG676I | XC6SLX45-3FGG676C | XC6SLX45-2FG676C |
|---|---|---|---|---|---|---|
| Package | 676-BGA | 676-BGA | 676-BGA | 676-BGA | 676-BGA | 676-BGA |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Device Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX |
| Speed Grade | -2 | -2 | -2 | -3 | -3 | -2 |
| Temperature Grade | Industrial (I) | Industrial (I) | Commercial (C) | Industrial (I) | Commercial (C) | Commercial (C) |
主な差別化要因
- Industrial-temperature ordering option （vs XC6SLX45-2FGG676C)
- Lower documented speed grade than the -3 family variants （vs XC6SLX45-3FGG676I)
- Matches the verified 43,661-cell and 358-I/O device class （vs XC6SLX45-2FGG676I)
設計ノート
Treat the 676-ball BGA as a high-density routing problem rather than an ordinary two-row package. Establish the complete ball map from the exact AMD package drawing before assigning power, ground, configuration, clock, and user I/O. Plan the layer stackup, via-in-pad or via-geometry rules, solder-mask and paste design, assembly profile, and X-ray inspection requirements with the PCB and assembly suppliers. Do not infer ball locations from the package suffix.
Separate core and I/O supply planning. The verified core voltage is 1.2 V, but external I/O banks may require other supplies, and the available family data does not enumerate all permitted voltage combinations. Use the manufacturer power-decoupling recommendations, provide low-impedance power and ground planes, isolate noisy switching loads, and verify sequencing. An estimated thermal calculation cannot be completed from the supplied data because the exact power dissipation and junction-temperature limits are unavailable.
Constrain every external clock and data interface explicitly in the FPGA design. Use dedicated clock-capable pins where required, keep clock distribution symmetrical, and bound loads on high-fanout nets to reduce skew. Because the verified records do not provide the complete pin table or maximum operating frequencies, engineers must consult the official Spartan-6 package and design documentation before releasing constraints. Any grade substitution should be checked for timing closure and power impact.
Do not treat a shared family or package as sufficient proof of drop-in compatibility. For each candidate, verify the exact order code, ball map, voltage table, configuration pins, power sequence, supported I/O standards, speed grade, and temperature rating against the original design. The -2 and -3 speed grades are not performance-identical, and C versus I temperature grades are not equivalent for extended-temperature operation. Record the manufacturer package drawing revision used for approval.
コンプライアンス情報
The supplied records identify the device as industrial-temperature, but they do not provide verified RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations. No compliance status has been inferred.