XC6SLX45-3FG484I - 316 I/O Spartan-6 LX FPGA | AMD
部品番号: XC6SLX45-3FG484I ✓ 生産中XC6SLX45-3FG484I 概要
A field-programmable gate array is a programmable logic device in which digital functions are implemented through configurable logic blocks and programmable interconnect. Within the semiconductor hierarchy, an FPGA sits above fixed-function logic and below programmable SoC implementations. The Spartan-6 LX family combines programmable logic, block RAM, DSP resources, clocking, and general-purpose I/O in a single device for applications requiring adaptable hardware functionality.
The verified key specifications for XC6SLX45-3FG484I include 316 I/O, a 500 MHz internal frequency, and 484-BBGA packaging. The package is specified as a 15 x 15 mm lead-free MO-275 arrangement with a 0.80 mm pitch and 324 balls according to the available detailed listing. These figures position the device as a high-pin-count Spartan-6 option for designs requiring extensive board-level connectivity while retaining a relatively compact package.
The -3 designation identifies the highest-performance Spartan-6 speed option listed in the verified data. This distinction is important in clocked digital systems because speed-grade differences affect achievable timing performance and should be checked against the selected clocking, I/O, and memory interfaces. The I suffix identifies the industrial-temperature version, while related C-suffix parts provide a distinct commercial-temperature choice.
Typical uses include industrial control, communications equipment, embedded processing, test and measurement, and signal-processing systems that benefit from parallel programmable logic. Its 316 available I/O can support external memory, data converters, communication transceivers, control signals, and parallel buses, subject to the exact bank voltage, pin, and timing constraints defined by the manufacturer documentation.
Designers should obtain the AMD Spartan-6 package pinout file and the device-specific datasheet before assigning power, clock, configuration, and I/O pins. The available sources identify the package and pin count, but they do not provide a complete verified ball-by-ball signal list or a manufacturer PDF URL for this exact ordering code. Those details should therefore be checked against the official device documentation rather than inferred from similar MPN suffixes.
This page consolidates verified distributor availability, exact package and timing identifiers, drop-in family comparisons, procurement facts, and practical design cautions. It also distinguishes confirmed data from attributes that still require verification in the manufacturer datasheet, reducing the risk of treating a speed-, temperature-, or package-suffix change as an unqualified functional equivalent.
ドロップイン代替品: XC6SLX45-3FG484I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: XC6SLX45-3FG484I （同一形状・フットプリント） — 相違点: Operating Temperature, Device Type, Package, Temperature Grade, Speed Grade.
XC6SLX45-2FG484I
✅ ドロップイン価格はお問い合わせください
データシートを見る →XC6SLX45-3FG484C
✅ ドロップイン価格はお問い合わせください
データシートを見る →XC6SLX45-2FG484C
✅ ドロップイン価格はお問い合わせください
データシートを見る →XC6SLX45-2FGG484C
✅ ドロップイン価格はお問い合わせください
データシートを見る →XC6SLX45-3FGG484I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC6SLX45-3FG484I 最大定格＆電気的特性
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-6 LX |
| Number of I/O | 316 I/O |
| Internal Frequency | 500 MHz |
| Speed Grade | -3 |
| Temperature Grade | Industrial |
| 動作温度 | 0 C to 85 C |
| Package Type | 484-BBGA |
| Package Dimensions | 15 x 15 mm |
| Ball Pitch | 0.80 mm |
| Package Ball Count | 324 balls |
| Package Outline | MO-275 |
| 実装タイプ | Surface Mount |
| Lead-Free Status | Lead Free |
XC6SLX45-3FG484I mo-275 ピン配置ガイド
XC6SLX45-3FG484I (mo-275 パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: XC6SLX45-3FG484I.
詳細は データシート をご参照ください。
主な用途
XC6SLX45-3FG484I の用途: 6 件s: Industrial Control and Automation, Communications and Network Interface Equipment, Embedded Instrumentation and Test Equipment, Parallel Data Acquisition and Signal Processing, Embedded Processor and Real-Time Control, Programmable Interface Aggregation.
Industrial Control and Automation
The XC6SLX45-3FG484I fits industrial controllers that need extensive digital connectivity and programmable control logic in an industrial-temperature package. Its confirmed 316 I/O can accommodate encoder interfaces, discrete I/O, communications links, and control signals, while the listed 500 MHz internal frequency supports demanding state machines and parallel data processing. The -3 designation provides the highest-performance speed grade identified in the verified Spartan-6 data. Designers should assign I/O banks and power rails only after checking the official bank constraints, because the search excerpts do not provide verified supply-voltage or differential-I/O details.
おすすめ
Communications and Network Interface Equipment
The XC6SLX45-3FG484I is suitable for programmable communications equipment where parallel buses, status signals, and timing-sensitive logic must coexist in one FPGA. The 316 I/O provide substantial connectivity for data buses, framing logic, transceiver control, and monitoring signals, and the -3 speed grade is the highest-performance option listed in the verified data. This makes it useful for protocol conversion, packet pre-processing, and custom interface bridging. The exact supported I/O standards and voltage ranges must be verified from the manufacturer documentation before selecting pins for high-speed links.
おすすめ
Embedded Instrumentation and Test Equipment
The high I/O count of the XC6SLX45-3FG484I supports instrument-style architectures that combine acquisition control, trigger logic, data formatting, and display or communications interfaces. The listed 500 MHz internal frequency is useful for parallel sampling pipelines and digital signal conditioning, while the -3 speed grade provides additional timing margin relative to the lower -2 alternative. The industrial 0 C to 85 C range also suits laboratory and process equipment with controlled ambient conditions. Designers should use the exact package and I/O tables to avoid conflicts between high-speed banks, supply rails, and adjacent slower interfaces.
おすすめ
Parallel Data Acquisition and Signal Processing
The XC6SLX45-3FG484I can implement parallel data acquisition, filtering, correlation, or format-conversion pipelines when a design benefits from dedicated programmable logic and numerous external connections. Its 316 I/O allow multiple converters, memories, counters, and digital interfaces to be coordinated within one device, and the listed 500 MHz internal frequency supports timing-sensitive datapaths. The -3 grade is the highest-performance choice identified in the verified material and may help close setup-and-hold or pipeline timing constraints. Exact converter interfaces, memory modes, and supported I/O standards remain device-documentation items and should not be inferred from the MPN alone.
おすすめ
Embedded Processor and Real-Time Control
The XC6SLX45-3FG484I is appropriate for soft-processor systems, real-time controllers, and hardware-assisted algorithms requiring both programmable logic and extensive peripheral connectivity. Its 316 I/O can connect memory, external peripherals, communication logic, and deterministic control signals, while the -3 speed grade supports demanding processor and datapath timing. The verified operating range of 0 C to 85 C makes it appropriate for industrial environments, but the system designer must confirm configuration, memory-interface, clock, and power requirements from the official device documentation before committing the FPGA to a schematic.
おすすめ
Programmable Interface Aggregation
The XC6SLX45-3FG484I can consolidate several legacy parallel interfaces onto a modern programmable platform, reducing the number of dedicated bridge devices. Its 316 I/O provide the fanout required for multiple buses, chip selects, interrupts, and control signals, and the listed 500 MHz internal frequency supports protocol conversion and timing normalization. The highest-performance -3 grade may be valuable where legacy interfaces have limited timing margin or where multiple conversion pipelines operate concurrently. A successful implementation still requires verified bank allocation, voltage compatibility, clocking, and pin-transition information from the manufacturer package documentation.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: XC6SLX45-3FG484I — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | XC6SLX45-2FG484I | XC6SLX45-3FG484C | XC6SLX45-2FG484C | XC6SLX45-2FGG484C | XC6SLX45-3FGG484I |
|---|---|---|---|---|---|---|
| Package | 484-BBGA, 15 x 15 mm, 0.80 mm pitch | 484-BBGA, 15 x 15 mm, 0.80 mm pitch | 484-BBGA, 15 x 15 mm, 0.80 mm pitch | 484-BBGA, 15 x 15 mm, 0.80 mm pitch | 484-BBGA, 15 x 15 mm, 0.80 mm pitch | 484-BBGA, 15 x 15 mm, 0.80 mm pitch |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| FPGA Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX |
| Speed Grade | -3, highest-performance listed grade | -2 | -3 | -2 | -2 | -3 |
| Temperature Suffix | I, industrial | I, industrial | C, commercial | C, commercial | C, commercial | I, industrial |
| Number of I/O | 316 I/O | 316 I/O | 316 I/O | 316 I/O | 316 I/O | 316 I/O |
| Special Feature | Industrial temperature and highest-performance -3 speed grade | Industrial temperature with -2 speed grade | Commercial temperature with -3 speed grade | Commercial temperature with -2 speed grade | Commercial temperature with -2 speed grade | Industrial temperature with -3 speed grade |
主な差別化要因
- Highest-performance listed Spartan-6 speed grade （vs XC6SLX45-2FG484I)
- Industrial-temperature ordering option （vs XC6SLX45-3FG484C)
- High connectivity in the 484-BBGA format （vs XC6SLX45-2FGG484C)
- High-performance industrial family option （vs XC6SLX45-2FG484I)
設計ノート
Do not treat an F, G, or FG suffix change as automatically interchangeable merely because several listings use a 484-BBGA description. The verified cross-reference results support package-family comparison, but final approval must compare the exact AMD ordering code, speed grade, temperature suffix, device variant, and official package drawing. In particular, changing -3 to -2 can alter timing closure, while changing I to C narrows the environmental operating requirement.
Use the official Spartan-6 package pinout file before assigning the 484-BBGA balls. The verified data confirms a 15 x 15 mm body, 0.80 mm pitch, 324 balls, and MO-275 outline, but it does not include the ball-by-ball power, clock, configuration, or I/O assignments. Route configuration and clock resources according to the manufacturer guidance, preserve the required ball map for the selected suffix, and do not derive the footprint from a visually similar family member.
Calculate the complete system power budget from the exact device configuration because utilization, speed grade, I/O activity, and voltage determine consumption. The supplied excerpts confirm the device identity, I/O count, frequency, and package but do not provide supply voltages or power coefficients, so no estimated dissipation value is fabricated here. Verify the required rails, sequencing, decoupling, and current limits in the manufacturer datasheet, and include worst-case utilization and temperature when sizing supplies.
Confirm bank voltage compatibility, supported I/O standards, clock-capable pins, and simultaneous-switching-noise limits from the exact device documentation before PCB layout. The 316 I/O count indicates high connectivity, not unrestricted simultaneous use at one voltage. Separate clocks from noisy inputs, observe device-specific routing constraints, and validate timing with the intended -3 grade rather than relying on a generic or lower-grade timing report.
コンプライアンス情報
The detailed listing identifies the package as lead free. No explicit RoHS, REACH, halogen-free, conflict-minerals, or AEC-Q100 statement was present in the supplied verified excerpts, so those fields remain unknown or not applicable.