XC6SLX75-2FGG484C - 74,637-Cell Spartan-6 FPGA | AMD
部品番号: XC6SLX75-2FGG484C ✓ 生産中XC6SLX75-2FGG484C 概要
A field-programmable gate array is a semiconductor whose digital functions are configured after manufacture. An FPGA belongs to the programmable-logic hierarchy, connecting lookup tables, flip-flops, routing fabric, block RAM, DSP resources, and I/O blocks. This configurability allows one hardware design to support multiple protocols, control algorithms, or product variants without changing the PCB layout. The Spartan-6 LX family was positioned for cost-sensitive applications requiring more integration than simple programmable logic devices.
The XC6SLX75-2FGG484C provides 74,637 logic cells and 5,831 CLBs, creating a practical balance between processing capacity, fixed resources, and package complexity. Its 280 I/O positions support interfaces to external memory, control peripherals, communications transceivers, and industrial equipment. The -2 speed designation identifies the device's performance grade, while the 484-pin FBGA package supports dense connection to multilayer PCBs and substantial external I/O requirements.
Spartan-6 devices integrate configurable logic with dedicated resources for memory and DSP processing. This architecture allows designers to implement parallel control, signal processing, protocol conversion, and data acquisition in a single programmable device. At 45 nm, the XC6SLX75 family combines a large logic fabric with a package suited to high-pin-count mixed-signal and embedded-control systems. The 667 MHz internal-frequency figure describes the device's stated performance class rather than the operating speed of every implemented design.
Typical applications include industrial automation, motor control, machine vision, real-time networking, telecommunications equipment, and embedded control systems. The large I/O count is particularly useful when a design must connect multiple sensors, converters, memory devices, and communications interfaces while retaining programmable timing and logic. The 484-pin package also helps when signal count, rather than raw logic capacity alone, determines the required footprint.
Board design must follow the AMD Spartan-6 package and pinout files for the 484-pin FBGA, including ball assignments, power planes, decoupling, and high-speed routing rules. The commercial-temperature suffix C corresponds to the stated 0 °C to 85 °C operating range. Configuration storage, clocking, power sequencing, and I/O standards should be verified in the manufacturer datasheet before schematic sign-off.
This product page combines the exact device identity, package data, temperature grade, logic resources, searchable alternatives, application guidance, and design-focused comparison information. That engineering context helps engineers identify board-level consequences beyond basic part-number matching while keeping the core specifications traceable to the AMD Spartan-6 LX documentation.
ドロップイン代替品: XC6SLX75-2FGG484C — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: XC6SLX75-2FGG484C （同一形状・フットプリント） — 相違点: Logic Cells, Mounting Type, Process Technology, Speed Grade, Package Type.
XC6SLX75-2FGG484I
✅ ドロップイン価格はお問い合わせください
データシートを見る →XC6SLX75-2FG484C
✅ ドロップイン価格はお問い合わせください
データシートを見る →XA6SLX75-3FGG484I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC6SLX75-2CSG484I
✅ ドロップイン価格はお問い合わせください
データシートを見る →XC6SLX45-2FGG484I
✅ ドロップイン価格はお問い合わせください
データシートを見る →XC6SLX75-2FGG484C 最大定格＆電気的特性
| Device Type | FPGA |
| FPGA Family | Spartan-6 LX |
| Logic Cells | 74,637 cells |
| Configurable Logic Blocks | 5,831 CLBs |
| I/O Count | 280 I/O |
| Internal Frequency | 667 MHz |
| Process Technology | 45 nm CMOS |
| Package Type | FBGA-484 |
| Package Dimensions | 23 mm x 23 mm |
| Package Pitch | 1 mm |
| ピン数 | 484 pins |
| 動作温度 | 0 °C to 85 °C |
| Speed Grade | -2 |
| Temperature Grade Code | C |
| 実装タイプ | Surface Mount |
| Programmable Logic Technology | 45 nm CMOS |
XC6SLX75-2FGG484C 1 mm ピン配置ガイド
XC6SLX75-2FGG484C (1 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: XC6SLX75-2FGG484C.
詳細は データシート をご参照ください。
主な用途
XC6SLX75-2FGG484C の用途: 6 件s: Industrial Automation and Motion Control, Machine Vision and Data Acquisition, Real-Time Networking Equipment, Telecommunications and Signal Conditioning, Digital Signal Processing, Embedded Control and Sensor Fusion.
Industrial Automation and Motion Control
The XC6SLX75-2FGG484C fits industrial motion-control and machine-sequencing systems that combine parallel control logic with many sensors and actuator interfaces. Its 74,637 logic cells and 5,831 CLBs provide substantial capacity for sequencing, state machines, safety interlocks, and real-time control algorithms, while 280 I/O support encoders, sensor inputs, and industrial transceivers. The 45 nm CMOS Spartan-6 LX device can consolidate functions that would otherwise require multiple programmable logic components. Use the AMD package pinout file to map the 484-pin FBGA accurately, and validate timing against the -2 speed class before finalizing each control path.
おすすめ
Machine Vision and Data Acquisition
The XC6SLX75-2FGG484C is suitable for machine-vision controllers that must capture parallel data, perform timing-sensitive processing, and coordinate camera, exposure, and transport functions. Its 280 I/O permit interfaces to image sensors and supporting logic, while 74,637 logic cells can implement acquisition pipelines, buffer management, feature extraction, and communication formatting. The 1 mm-pitch FBGA supports a dense PCB footprint but requires careful escape routing and controlled impedance for high-speed sensor links. Validate interface timing, pin placement, and clocking against the official 484-pin package documentation before releasing the board layout.
おすすめ
Real-Time Networking Equipment
The XC6SLX75-2FGG484C supports protocol conversion, packet handling, and interface bridging in cost-sensitive networking equipment. The large logic fabric allows parallel packet classification, CRC processing, buffering logic, and multiple protocol engines to coexist in one FPGA, while 280 I/O provide connections to transceivers and external memories. Its 667 MHz stated internal-frequency class is useful for timing-budget planning, although actual interfaces must be constrained to their individual data-sheet limits. Use the manufacturer package and device documentation to confirm differential I/O, clock, configuration, and power requirements for each network port.
おすすめ
Telecommunications and Signal Conditioning
The XC6SLX75-2FGG484C can implement programmable filters, line-interface logic, framing, and protocol adaptation in telecommunications equipment. Its 5,831 CLBs and 74,637 logic cells provide enough parallelism for multichannel processing, while 280 I/O support serial links, clocks, control signals, and external memory. The -2 speed grade provides a defined performance class for design planning, and the commercial 0 °C to 85 °C range suits controlled indoor equipment. Clock architecture, I/O standards, and pin assignments should be checked directly against AMD's Spartan-6 documentation because package ball assignments govern the physical implementation.
おすすめ
Digital Signal Processing
The XC6SLX75-2FGG484C is appropriate for fixed-function DSP modules combined with substantial control logic. Its configurable fabric can implement filters, fixed-point arithmetic, digital modulation, correlation, and custom accelerators, while the dedicated Spartan-6 resource mix reduces the amount of general-purpose logic needed. With 280 I/O, the device can connect parallel data converters, memory, clocks, and control peripherals in a compact 23 mm by 23 mm package. Designers should use the AMD datasheet to account for routing and clock-speed constraints and should evaluate fixed-point arithmetic rather than assuming every design path operates at the stated 667 MHz device frequency.
おすすめ
Embedded Control and Sensor Fusion
The XC6SLX75-2FGG484C works well in embedded controllers that must combine multiple sensor streams, actuator outputs, communication interfaces, and deterministic control logic. Its 280 I/O can accommodate digital sensors, counters, display controls, and external converters, while 74,637 logic cells support filtering, state estimation, and protocol handling. Consolidating these functions into one FPGA can simplify firmware partitioning and provide hardware-level timing determinism. The 484-pin FBGA requires multilayer PCB construction and exact land-pattern verification, so engineers should follow AMD's package pinout file and preserve the specified power and decoupling topology.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: XC6SLX75-2FGG484C — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | XC6SLX75-2FGG484I | XC6SLX75-2FG484C | XA6SLX75-3FGG484I | XC6SLX75-2CSG484I | XC6SLX45-2FGG484I |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | FBGA-484 | FBGA-484 | FBGA-484 | FBGA-484 | FBGA-484 | FBGA-484 |
| Speed Grade | -2 | -2 | -2 | -3 | -2 | -2 |
| Special Ordering Feature | Commercial temperature suffix C | I temperature suffix | FG package ordering suffix | XA family and -3 speed grade | CSG package ordering suffix | Lower-density LX and I temperature suffix |
主な差別化要因
- Full Spartan-6 LX resource complement （vs XC6SLX45-2FGG484I)
- Commercial-temperature ordering identity （vs XC6SLX75-2FGG484I)
- Established -2 speed class （vs XA6SLX75-3FGG484I)
- High-density mixed-signal connectivity （vs XC6SLX75-2CSG484I)
設計ノート
Use the official AMD Spartan-6 484-pin FBGA land pattern and ball-assignment file rather than a generic 484-ball symbol. The device body is 23 mm by 23 mm with a 1 mm pitch, so small placement or naming differences can create escaped routes that conflict with power, configuration, and high-speed I/O. Check every ball against the selected speed and temperature-grade ordering code before releasing the PCB library and schematic symbols.
Plan power delivery around the manufacturer's recommended decoupling and power-plane arrangement. A 1 mm-pitch FBGA limits escape routing, so place stable reference decoupling close to the associated supply balls and reserve clean routing for clock and high-speed interfaces. Separate noisy logic return paths from sensitive clock and data paths where the board stack-up permits, and verify the final layer transitions with the manufacturer's signal-integrity guidance.
Do not treat XC6SLX75-2FGG484C, XC6SLX75-2FGG484I, XC6SLX75-2FG484C, and XC6SLX75-2CSG484I as interchangeable solely because each uses a 484-pin orderable package. The suffix changes can identify package, temperature, or family differences, and XC6SLX45-2FGG484I has fewer resources. Validate the exact ordering code, ball map, speed grade, temperature range, and design utilization before approving a substitution.
The 45 nm CMOS Spartan-6 LX design should include thermal analysis across expected switching activity, temperature, and board construction. The 484-pin FBGA provides substantial electrical connectivity but concentrates heat beneath the device, making copper spreader area and board airflow important. Use the manufacturer's power and thermal characterization for final calculations, and verify that the selected -2 commercial-temperature device remains within its 0 °C to 85 °C rating in the assembled system.
コンプライアンス情報
The G ordering character is associated with lead-free package availability in the Spartan-6 documentation excerpt, but no explicit RoHS, REACH, halogen-free, conflict-minerals, or AEC-Q100 declaration is established for this exact MPN.
