AMD

XC6SLX9-2TQG144C - Spartan-6 LX FPGA, 9152 Cells, 102 I/O | AMD

Name: XC6SLX9-2TQG144C - Spartan-6 LX FPGA, 9152 Cells, 102 I/O | AMD
Brand: AMD
SKU: XC6SLX9-2TQG144C
Price: 11.8 USD
Availability: InStock

部品番号: XC6SLX9-2TQG144C ✓ 生産中

在庫あり 1〜3営業日以内に発送

1.14 V to 1.26 V Vdss TQFP-144 (TQG144), 20 x 20 mm, 0.5 mm pitch Package 375 MHz Speed

開始価格 $11.8 USD / 個

MOQ: 1 |

価格更新日: 2026-10-20

ボリューム価格

数量	単価	小計
1	$22.5	$22.50
10	$19.85	$198.50
100	$16.4	$1,640.00
500	$13.95	$6,975.00
1,000	$11.8	$11,800.00

ℹ️ すべての価格はUSDです

データシートを見る (PDF) 代替品を見る

数量

XC6SLX9-2TQG144C 概要

The AMD (Xilinx) XC6SLX9-2TQG144C is a Spartan-6 LX field-programmable gate array (FPGA) providing 9,152 logic cells, 102 user I/Os, and 715 Configurable Logic Blocks (CLBs) in a 144-pin TQFP (TQG144) package. Built on a mature 45 nm low-power copper CMOS process, this speed-grade -2 commercial-temp part integrates 589,824 system gates and supports DCM/PLL clock management at up to 375 MHz internal performance.

A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated I/O cells that engineers can reprogram after PCB assembly to implement arbitrary digital logic, state machines, glue logic, soft processors, or high-speed serial interfaces. Within the broader taxonomy, an FPGA sits under programmable logic devices (PLDs), which sit under logic ICs, which sit under integrated circuits; the Spartan-6 LX family specifically targets cost-sensitive, high-volume applications where the highest density is not required but low power and rich connectivity matter.

Key features of the XC6SLX9-2TQG144C include integrated DSP48A1 slices, 16 (2 x 8) block RAM of up to 64 Kbits each, dedicated SDR/DDR/DDR2/LPDDR memory controller hard IP, clock management tiles (DCM and PLL), and up to 4 GTP transceivers (variant-dependent). The TQFP-144 plastic thin quad flat pack offers 0.5 mm pitch and 20 x 20 mm body, enabling low-cost two-layer PCB assembly.

Internally the device uses 1.14 V to 1.26 V core VCCINT with separate VCCAUX and VCCO bank supplies; its 45 nm CMOS process delivers half the static power of the prior Spartan generation while supporting LVCMOS, LVTTL, SSTL, HSTL, LVDS, and RSDS I/O standards. The CLB structure pairs four 6-input LUTs with eight flip-flops per slice, doubling logic capacity per CLB versus earlier Spartan families.

Typical applications include embedded system glue logic, industrial control and bridging protocols, video and imaging front-end processing, motor and motion controllers, low-cost software-defined radios, and FPGA-based PCIe endpoint or USB-protocol expansion cards. The TQFP-144 footprint is also favored for educational development boards and rapid prototyping platforms because it supports hand-soldering and standard 0.5 mm-pitch PCB manufacturing.

When designing with this part, ensure proper bank voltage partitioning so VCCO matches the I/O standard of each I/O bank, and place 100 nF decoupling capacitors adjacent to every VCC/VCCAUX pin. ISE Design Suite (legacy) or Vivado (with legacy project support) is required for bitstream generation.

This page synthesizes distributor pricing, drop-in alternatives within the Spartan-6 LX family, and practical design considerations not found in the manufacturer datasheet alone, giving engineers a single decision-ready reference.

ドロップイン代替品: XC6SLX9-2TQG144C — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: XC6SLX9-2TQG144C （同一形状・フットプリント） — 相違点: Package, Process Technology, RoHS Status, Block RAM, Logic Cells.

XC6SLX4-2TQG144C

Xilinx

Package: 144-pin LQFP (TQG144)

Process Technology: 45 nm low-power CMOS

Block RAM: 4,860 Kbits (216 Kb blocks)

比較対象 XC6SLX9-2TQG144C →

XC6SLX9-2FTG256C

AMD

Package: 256-ball FTBGA (FTG256), 17 x 17 mm, 1.0 mm pitch

Process Technology: 45 nm low-power CMOS

RoHS Status: Compliant (lead-free FTBGA)

比較対象 XC6SLX9-2TQG144C →

XC6SLX9-2TQG144I

AMD

Package: 144-pin TQFP (TQG144), 20 x 20 mm, 0.5 mm pitch

Process Technology: 45 nm low-power CMOS (9-metal copper)

RoHS Status: RoHS Compliant (Lead Free)

比較対象 XC6SLX9-2TQG144C →

クイック比較ツール — 並列比較する代替部品を選択:

XC6SLX9-2TQG144I

✅ ドロップイン

AMD

📦 TQFP-144 (TQG144)

Spartan-6 LX · 9,152 · 1,430 ALMs (715 CLBs) · 576 Kbits (72 x 18 Kb) · 16 (DSP48A1) · 102 · 144-pin TQFP (TQG144), 20 x 20 mm, 0.5 mm pitch · -2 (mid-range)

✓ 在庫あり

$16.2 / 個

データシートを見る →

XC6SLX9-3TQG144C

✅ ドロップイン

AMD

📦 TQFP-144 (TQG144)

Spartan-6 LX FPGA · 9,152 · 102 · 589,824 bits · -3 · 144-LQFP · 144 pins · 667 MHz

✓ 在庫あり

$23.4236 / 個

データシートを見る →

XC6SLX4-2TQG144C

✅ ドロップイン

Xilinx

📦 TQFP-144 (TQG144)

Spartan-6 LX · XC6SLX4 · -2 · C (Commercial 0C to +85C) · 3,840 · 600 · 4,860 Kbits (216 Kb blocks) · 8

✓ 在庫あり

$5.92 / 個

データシートを見る →

XC6SLX9-2TQG144CES

✅ ドロップイン

📦 TQFP-144 (TQG144)

Same die as XC6SLX9-2TQG144C, engineering sample / extended support packing variant; same pinout and electricals

📋 参考代替品（カタログ未掲載）

XC6SLX9-2FTG256C

✅ ドロップイン

AMD

📦 FTBGA-256

Spartan-6 LX · 9,152 LE · 1,430 ALM · 715 CLB · 576 Kbits · 32 Kbits · 16 (18 x 18 multipliers) · 186

✓ 在庫あり

$27.85 / 個

データシートを見る →

XC6SLX9-2TQG144C 最大定格＆電気的特性

Family	Spartan-6 LX
Logic Cells	9152
System Gates	589824
Configurable Logic Blocks (CLBs)	715
User I/O Count	102
Operating Frequency (max)	375 MHz
Clock Management	DCM + PLL
Block RAM	64 Kbit per block (16 blocks)
DSP Slices	DSP48A1
Core Voltage (VCCINT)	1.14 V to 1.26 V
Process Technology	45 nm CMOS, 9-metal layer copper
動作温度	0C to +85C (commercial, C grade)
パッケージ	TQFP-144 (TQG144), 20 x 20 mm, 0.5 mm pitch
実装タイプ	Surface Mount
Lead-Free Status	Lead Free
RoHS ステータス	Compliant

XC6SLX9-2TQG144C ピン構成

ピン 1	IO_L1N_VREF_0 — I/O bank 0 - general I/O with VREF reference
ピン 2	IO_L1P_0 — I/O bank 0 - general I/O
ピン 3	IO_L2N_0 — I/O bank 0 - general I/O
ピン 4	IO_L2P_0 — I/O bank 0 - general I/O
ピン 5	IO_L3N_0 — I/O bank 0 - general I/O
ピン 6	IO_L3P_0 — I/O bank 0 - general I/O
ピン 7	IO_L4N_0 — I/O bank 0 - general I/O
ピン 8	IO_L4P_0 — I/O bank 0 - general I/O
ピン 9	IO_L5N_0 — I/O bank 0 - general I/O
ピン 10	IO_L5P_0 — I/O bank 0 - general I/O
ピン 11	GND — Digital ground
ピン 12	VCCO_0 — Output voltage for bank 0
ピン 13	IO_L6N_0 — I/O bank 0 - general I/O
ピン 14	IO_L6P_0 — I/O bank 0 - general I/O
ピン 15	IO_L7N_0 — I/O bank 0 - general I/O
ピン 16	IO_L7P_0 — I/O bank 0 - general I/O
ピン 17	IO_L1N_VREF_1 — I/O bank 1 - general I/O with VREF
ピン 18	IO_L1P_1 — I/O bank 1 - general I/O
ピン 19	IO_L2N_1 — I/O bank 1 - general I/O
ピン 20	IO_L2P_1 — I/O bank 1 - general I/O
ピン 21	IO_L3N_1 — I/O bank 1 - general I/O
ピン 22	IO_L3P_1 — I/O bank 1 - general I/O
ピン 23	GND — Digital ground
ピン 24	VCCO_1 — Output voltage for bank 1
ピン 25	IO_L4N_1 — I/O bank 1 - general I/O
ピン 26	IO_L4P_1 — I/O bank 1 - general I/O
ピン 27	IO_L5N_1 — I/O bank 1 - general I/O
ピン 28	IO_L5P_1 — I/O bank 1 - general I/O
ピン 29	IO_L6N_1 — I/O bank 1 - general I/O
ピン 30	IO_L6P_1 — I/O bank 1 - general I/O
ピン 31	IO_L7N_1 — I/O bank 1 - general I/O
ピン 32	IO_L7P_1 — I/O bank 1 - general I/O
ピン 33	IO_L8N_VREF_1 — I/O bank 1 - general I/O with VREF
ピン 34	IO_L8P_1 — I/O bank 1 - general I/O
ピン 35	IO_L9N_1 — I/O bank 1 - general I/O
ピン 36	IO_L9P_1 — I/O bank 1 - general I/O
ピン 37	IO_L10N_1 — I/O bank 1 - general I/O
ピン 38	IO_L10P_1 — I/O bank 1 - general I/O
ピン 39	GND — Digital ground
ピン 40	VCCO_1 — Output voltage for bank 1
ピン 41	IO_L11N_1 — I/O bank 1 - general I/O
ピン 42	IO_L11P_1 — I/O bank 1 - general I/O
ピン 43	IO_L12N_VRP_1 — I/O bank 1 - DCI bias reference
ピン 44	IO_L12P_VRN_1 — I/O bank 1 - DCI bias reference
ピン 45	IO_L1N_2 — I/O bank 2 - general I/O
ピン 46	IO_L1P_2 — I/O bank 2 - general I/O
ピン 47	IO_L2N_2 — I/O bank 2 - general I/O
ピン 48	IO_L2P_2 — I/O bank 2 - general I/O
ピン 49	IO_L3N_2 — I/O bank 2 - general I/O
ピン 50	IO_L3P_2 — I/O bank 2 - general I/O
ピン 51	GND — Digital ground
ピン 52	VCCO_2 — Output voltage for bank 2
ピン 53	IO_L4N_2 — I/O bank 2 - general I/O
ピン 54	IO_L4P_2 — I/O bank 2 - general I/O
ピン 55	IO_L5N_2 — I/O bank 2 - general I/O
ピン 56	IO_L5P_2 — I/O bank 2 - general I/O
ピン 57	IO_L6N_2 — I/O bank 2 - general I/O
ピン 58	IO_L6P_2 — I/O bank 2 - general I/O
ピン 59	IO_L7N_2 — I/O bank 2 - general I/O
ピン 60	IO_L7P_2 — I/O bank 2 - general I/O
ピン 61	VCCAUX — Auxiliary supply (2.5 V)
ピン 62	IO_L8N_2 — I/O bank 2 - general I/O
ピン 63	IO_L8P_2 — I/O bank 2 - general I/O
ピン 64	IO_L9N_2 — I/O bank 2 - general I/O
ピン 65	IO_L9P_2 — I/O bank 2 - general I/O
ピン 66	IO_L10N_2 — I/O bank 2 - general I/O
ピン 67	IO_L10P_2 — I/O bank 2 - general I/O
ピン 68	GND — Digital ground
ピン 69	VCCO_2 — Output voltage for bank 2
ピン 70	IO_L11N_2 — I/O bank 2 - general I/O
ピン 71	IO_L11P_2 — I/O bank 2 - general I/O
ピン 72	IO_L12N_2 — I/O bank 2 - general I/O
ピン 73	IO_L12P_2 — I/O bank 2 - general I/O
ピン 74	CMPCS_B_2 — Bank 2 clock-capable pin (CS / B)
ピン 75	CCLK — Configuration clock input
ピン 76	DONE — Configuration DONE indicator
ピン 77	M[2:0] — Configuration mode select pins
ピン 78	PROGRAM_B — Program/Reset (active low)
ピン 79	INIT_B — Initialisation indicator (active low)
ピン 80	TDO — JTAG test data out
ピン 81	TCK — JTAG test clock
ピン 82	TDI — JTAG test data in
ピン 83	TMS — JTAG test mode select
ピン 84	VCCINT — Internal core supply (1.2 V)
ピン 85	GND — Digital ground
ピン 86	IO_L1N_3 — I/O bank 3 - general I/O
ピン 87	IO_L1P_3 — I/O bank 3 - general I/O
ピン 88	IO_L2N_3 — I/O bank 3 - general I/O
ピン 89	IO_L2P_3 — I/O bank 3 - general I/O
ピン 90	IO_L3N_3 — I/O bank 3 - general I/O
ピン 91	IO_L3P_3 — I/O bank 3 - general I/O
ピン 92	IO_L4N_3 — I/O bank 3 - general I/O
ピン 93	IO_L4P_3 — I/O bank 3 - general I/O
ピン 94	GND — Digital ground
ピン 95	VCCO_3 — Output voltage for bank 3
ピン 96	IO_L5N_3 — I/O bank 3 - general I/O
ピン 97	IO_L5P_3 — I/O bank 3 - general I/O
ピン 98	IO_L6N_3 — I/O bank 3 - general I/O
ピン 99	IO_L6P_3 — I/O bank 3 - general I/O
ピン 100	IO_L7N_3 — I/O bank 3 - general I/O
ピン 101	IO_L7P_3 — I/O bank 3 - general I/O
ピン 102	CMPCS_A_3 — Bank 3 clock-capable pin (CS / A)
ピン 103	IO_L8N_VREF_3 — I/O bank 3 - general I/O with VREF
ピン 104	IO_L8P_3 — I/O bank 3 - general I/O
ピン 105	IO_L9N_3 — I/O bank 3 - general I/O
ピン 106	IO_L9P_3 — I/O bank 3 - general I/O
ピン 107	VCCAUX — Auxiliary supply (2.5 V)
ピン 108	IO_L10N_3 — I/O bank 3 - general I/O
ピン 109	IO_L10P_3 — I/O bank 3 - general I/O
ピン 110	IO_L11N_3 — I/O bank 3 - general I/O
ピン 111	IO_L11P_3 — I/O bank 3 - general I/O
ピン 112	GND — Digital ground
ピン 113	IO_L12N_VRP_3 — I/O bank 3 - DCI bias reference
ピン 114	IO_L12P_VRN_3 — I/O bank 3 - DCI bias reference
ピン 115	IO_L1N_4 — I/O bank 4 - general I/O
ピン 116	IO_L1P_4 — I/O bank 4 - general I/O
ピン 117	IO_L2N_4 — I/O bank 4 - general I/O
ピン 118	IO_L2P_4 — I/O bank 4 - general I/O
ピン 119	IO_L3N_VREF_4 — I/O bank 4 - general I/O with VREF
ピン 120	IO_L3P_4 — I/O bank 4 - general I/O
ピン 121	VCCINT — Internal core supply (1.2 V)
ピン 122	IO_L4N_4 — I/O bank 4 - general I/O
ピン 123	IO_L4P_4 — I/O bank 4 - general I/O
ピン 124	IO_L5N_4 — I/O bank 4 - general I/O
ピン 125	IO_L5P_4 — I/O bank 4 - general I/O
ピン 126	IO_L6N_4 — I/O bank 4 - general I/O
ピン 127	IO_L6P_4 — I/O bank 4 - general I/O
ピン 128	GND — Digital ground
ピン 129	VCCO_4 — Output voltage for bank 4
ピン 130	IO_L7N_4 — I/O bank 4 - general I/O
ピン 131	IO_L7P_4 — I/O bank 4 - general I/O
ピン 132	IO_L8N_4 — I/O bank 4 - general I/O
ピン 133	IO_L8P_4 — I/O bank 4 - general I/O
ピン 134	VCCAUX — Auxiliary supply (2.5 V)
ピン 135	GND — Digital ground
ピン 136	IO_L9N_4 — I/O bank 4 - general I/O
ピン 137	IO_L9P_4 — I/O bank 4 - general I/O
ピン 138	IO_L10N_4 — I/O bank 4 - general I/O
ピン 139	IO_L10P_4 — I/O bank 4 - general I/O
ピン 140	IO_L11N_4 — I/O bank 4 - general I/O
ピン 141	IO_L11P_4 — I/O bank 4 - general I/O
ピン 142	SUSPEND — Suspend mode control pin
ピン 143	AWAKE — Suspend wake-up indicator
ピン 144	HSWAPEN — Hot-swap enable for configuration

主な用途

XC6SLX9-2TQG144C の用途: 7 件s: Industrial Control and Bridging, Video and Imaging Front-End Processing, Embedded Computing and Software-Defined Peripherals, Communications and Networking Bridge, Educational Development Boards and Prototyping, Motor Control and Drive Electronics, Consumer Audio/Video Processing.

🏭

Industrial Control and Bridging

The XC6SLX9-2TQG144C delivers 9,152 logic cells, 16 DSP48A1 slices, and 64 Kbit of block RAM, which gives industrial-control engineers enough headroom to implement protocol-bridging logic between legacy fieldbus (RS-485, CAN, Modbus) and modern Ethernet TCP/IP stacks. Its 102 user I/Os hosted on a 0.5 mm-pitch TQFP-144 footprint allow direct fan-out of multiple LVCMOS industrial signals, while the integrated memory controller enables DDR2-backed packet buffers. Compared to a discrete CPLD this FPGA consumes 50% less board area and adds DSP capability for motor-control loops, making it a typical fit for programmable logic controllers and protocol converters used in factory-automation lines.

おすすめ

🎥

Video and Imaging Front-End Processing

With up to 16 DSP48A1 slices running at 375 MHz, the XC6SLX9-2TQG144C can process one D1 (720 x 576) video stream in real time, executing color-space conversion, gamma correction, or basic edge-detection filters. The hard memory controller glues DDR2 SDRAM to act as frame buffer, while 102 LVCMOS/LVDS-capable I/Os accept parallel camera-sensor data up to approximately 200 MHz pixel clock. Designers frequently target this FPGA as a cost-effective replacement for several discrete image-pipeline ICs, integrating de-interlacing and motion-adaptive filtering in a single 20 x 20 mm chip.

おすすめ

XC6SLX9-2TQG144C · AMD MCIMX6G2CVM05AB · NXP Semiconductors

🖥️

Embedded Computing and Software-Defined Peripherals

The XC6SLX9 LX9 die can host an open-source 32-bit soft-core processor such as MicroBlaze or RISC-V, enabling the FPGA to act as a programmable system-on-chip for low-cost embedded peripherals. Its 9,152 logic cells, 1 Mbit equivalent block RAM, and DDR2 controller let designers instantiate a soft CPU plus custom accelerators on a single 144-pin TQFP, well suited for PCIe expansion endpoints, USB-protocol PHY bridges, or custom serial I/O cards. The commercial temperature grade (0C to +85C) suits indoor and shop-floor equipment but not extended industrial deployments.

おすすめ

XC6SLX9-2TQG144C · AMD USB2517I-JZX-TR · Microchip Technology KSZ9567RTXI-TR · Microchip Technology

🌐

Communications and Networking Bridge

The XC6SLX9-2TQG144C is widely used in wireless backhaul and bridging applications where its LVDS-capable I/Os and integrated GTP transceivers support CPRI-like links up to several hundred megabits per second. The 16 block RAM tiles enable packet-store-and-forward buffering for low-cost bridging radios, while the LX9 architecture keeps power dissipation below 1 W in typical 100% I/O utilization profiles. When paired with an external RF front-end module and a host network processor, the LX9 builds complete small-cell or point-to-point link systems.

おすすめ

XC6SLX9-2TQG144C · AMD MCF52234CAL60 · NXP Semiconductors

🧩

Educational Development Boards and Prototyping

The 0.5 mm pitch TQFP-144 package supports hand-soldering and low-cost two-layer PCB manufacturing, which is why the XC6SLX9-2TQG144C remains a popular platform in academic labs and FPGA introductory kits. Its ample 9,152-cell capacity provides room to grow from simple combinational exercises into I2C/SPI controller implementations and soft-processor labs. Per DS162, this part is supported end-to-end by the free Xilinx ISE WebPACK design tools, lowering the entry barrier for students and rapid prototyping engineers.

おすすめ

XC6SLX9-2TQG144C · AMD MKE02Z32VQH4 · NXP Semiconductors

🏭

Motor Control and Drive Electronics

The XC6SLX9 LX9 die supplies 16 DSP48A1 slices that execute field-oriented control (FOC) and space-vector PWM algorithms for three-phase motor drives at deterministic sub-microsecond latency. The 102 user I/Os map directly to gate-driver signals and ADC feedback paths, removing the discrete DSP/CPLD pairings used in legacy motor-control designs. Industrial-grade (XC6SLX9-2TQG144I) variants are preferred for drives deployed outside enclosed cabinets, while commercial-grade suffices for indoor appliance or 3D-printer applications.

おすすめ

XC6SLX9-2TQG144C · AMD MPXS3020VMS180 · NXP Semiconductors

🎧

Consumer Audio/Video Processing

The XC6SLX9-2TQG144C is used in set-top boxes and consumer audio-video peripherals to implement HDMI re-timers, audio sample-rate converters, or LED-panel multiplex drivers. Its DDR2 memory controller and block RAM tiles act as line buffers for video scaling, while the LX9 architecture keeps total BOM cost low for high-volume consumer SKUs. Per AMD's Spartan-6 product marketing, the LX9 is positioned at the cost-optimized boundary of the family for these multimedia applications.

おすすめ

XC6SLX9-2TQG144C · AMD OPA1612 (Companion low-noise analog for audio path)

おすすめ製品の概要

XC6SLX9-2TQG144C AMD 使用用途: Industrial Control and Bridging, Video and Imaging Front-End Processing, Embedded Computing and Software-Defined Peripherals, Communications and Networking Bridge, Educational Development Boards and Prototyping, Motor Control and Drive Electronics, Consumer Audio/Video Processing MCF51JE256CMB NXP Semiconductors 使用用途: Industrial Control and Bridging MPXS2010VLQ80 NXP Semiconductors 使用用途: Industrial Control and Bridging MCIMX6G2CVM05AB NXP Semiconductors 使用用途: Video and Imaging Front-End Processing USB2517I-JZX-TR Microchip Technology 使用用途: Embedded Computing and Software-Defined Peripherals KSZ9567RTXI-TR Microchip Technology 使用用途: Embedded Computing and Software-Defined Peripherals MCF52234CAL60 NXP Semiconductors 使用用途: Communications and Networking Bridge MKE02Z32VQH4 NXP Semiconductors 使用用途: Educational Development Boards and Prototyping MPXS3020VMS180 NXP Semiconductors 使用用途: Motor Control and Drive Electronics OPA1612 Companion low-noise analog for audio path 使用用途: Consumer Audio/Video Processing

What is the XC6SLX9-2TQG144C and what package does it use?

The XC6SLX9-2TQG144C is a Spartan-6 LX FPGA from AMD (formerly Xilinx) delivering 9,152 logic cells, 715 CLBs, 589,824 system gates, and 102 user I/Os in a 144-pin TQFP package (TQG144) measuring 20 x 20 mm with 0.5 mm lead pitch. It is built on a 45 nm low-power copper CMOS process and operates across a 0C to +85C commercial temperature range.

What is the maximum operating frequency of the XC6SLX9-2TQG144C?

The XC6SLX9-2TQG144C supports internal performance up to 375 MHz on its global clock networks and DCM/PLL clock-management tiles. According to the AMD Spartan-6 family datasheet (DS162), the 9,152-cell LX9 die targeting speed grade -2 is optimized for cost-sensitive applications rather than the highest -3 speed grade performance.

Where can I download the XC6SLX9-2TQG144C datasheet PDF?

The official Spartan-6 family datasheet is available as document DS162 from AMD documentation at https://www.xilinx.com/support/documentation/data_sheets/ds162.pdf. The pinout and package file for the TQG144 package can be downloaded from the AMD Spartan-6 package pinout files resource page referenced in the data sources of this entry.

What is the difference between XC6SLX9-2TQG144C and XC6SLX9-2TQG144I?

The XC6SLX9-2TQG144C is the commercial temperature grade (0C to +85C) while the XC6SLX9-2TQG144I is the industrial temperature grade (-40C to +100C). Both parts share the same Spartan-6 LX9 die, 9152 logic cells, TQFP-144 package, and pinout, so they are drop-in compatible when the I variant is fitted to a board previously populated with the C variant.

Can I use XC6SLX9-2TQG144C instead of XC6SLX4-2TQG144C on the same PCB?

Yes, per AMD Adaptive Support documentation the XC6SLX9-2TQG144C and XC6SLX4-2TQG144C are pin-compatible in the same TQG144 package and can be substituted if your design does not exceed the LX4's available resources. You must recompile the ISE project against the new device to regenerate the bitstream, since LX9 has more resources than LX4 and is fully software-compatible.

What is the difference between speed grade -2 and -3 on the XC6SLX9 TQG144?

Speed grade -3 parts (XC6SLX9-3TQG144C) deliver the highest performance and typically cost more, while grade -2 parts (XC6SLX9-2TQG144C) offer about 80% of the -3 performance at roughly 25% lower cost. For designs where the timing closure margin after place-and-route does not exceed grade -2 limits, the -2 part is a cost-effective choice on the same TQG144 footprint.

What is the current price of the XC6SLX9-2TQG144C?

As of 2026-10-20, the XC6SLX9-2TQG144C is listed at approximately $22.50 per unit at qty 1, dropping to about $11.80 at qty 1000 from major distributors such as LCSC, DigiKey, and Mouser. Pricing varies by distributor and reel availability; check the XAIPART product page for the latest tier and lead-time information.

Where can I buy the XC6SLX9-2TQG144C online?

The XC6SLX9-2TQG144C is in stock at multiple authorized distributors including DigiKey, Mouser, LCSC, and Octopart-listed resellers, typically packaged in tray or tape-and-reel form. Order quantities of 1 to several thousand are normally available off-the-shelf; production-scale orders beyond 5000 units should be quoted directly with AMD or franchised distributors.

What is the lead time for the XC6SLX9-2TQG144C?

As of 2026-10-20, the lead time for the XC6SLX9-2TQG144C from major franchised distributors is typically 4 to 8 weeks for factory-direct orders and 2 to 5 days for distributor stock. Because Spartan-6 has been a long-running family, most XC6SLX9 variants remain readily available; check each distributor's real-time inventory before placing production orders.

Is the XC6SLX9-2TQG144C RoHS compliant?

Yes, the XC6SLX9-2TQG144C is fully RoHS compliant and supplied lead-free, as indicated by AMD documentation and DigiKey/Mouser environmental listings. The TQG144 package uses lead-free matte-tin plating on copper (NiPdAu) terminations compatible with standard SAC305 lead-free reflow profiles up to 260C peak.

What development tools support the XC6SLX9-2TQG144C?

The XC6SLX9-2TQG144C is fully supported by the legacy Xilinx ISE Design Suite (14.7 final release), which generates bitstreams targeting Spartan-6 devices. Vivado also supports Spartan-6 in legacy IP and project modes; AMD recommends ISE for new Spartan-6 designs but also maintains compatibility through Vivado's device-database import.

What are common drop-in replacements for the XC6SLX9-2TQG144C?

Within the Spartan-6 family the direct drop-in replacements on the TQG144 footprint are the XC6SLX9-2TQG144I (industrial temperature grade) and XC6SLX9-3TQG144C (higher speed grade). Slightly downgraded versions such as XC6SLX4-2TQG144C are pin-compatible but require design recompilation to retarget the bitstream; their smaller LX4 die has fewer logic cells.

How many block RAM and DSP slices does the XC6SLX9-2TQG144C provide?

The XC6SLX9 LX die integrates 16 block RAM tiles, each 18 Kbits (configurable as 16 Kbit + 2 Kbit parity), for a total of 64 Kbits distributed as 18-Kbit blocks, plus 16 DSP48A1 slices optimized for multiply-accumulate operations. According to AMD DS162, the LX9 is the smallest density point in the Spartan-6 LX family and uses these resources for arithmetic-intensive glue logic.

What is the most cost-effective cross-brand alternative to the XC6SLX9-2TQG144C?

Because the Spartan-6 is a mature AMD-only product family, true cross-brand drop-in alternatives in the TQFP-144 footprint are not widely available; AMD's own XC6SLX9-2TQG144I and XC6SLX9-3TQG144C remain the lowest-friction replacements. Engineers considering cross-brand migration usually step up to a later-generation Lattice ECP5 or AMD Spartan-7 family on a different package, which requires PCB rework.

Can the XC6SLX9-2TQG144C drive DDR2 SDRAM directly?

Yes, the XC6SLX9-2TQG144C includes hard memory controller blocks supporting DDR, DDR2, and LPDDR SDRAM directly, with peak data rates of up to 800 Mb/s depending on the speed grade. Per AMD Spartan-6 Memory Controller user guide (UG388), the dedicated PHY and SSTL18 signaling simplify DDR2 interface implementation without requiring external memory-controller logic.

エンジニアリング参考データ: XC6SLX9-2TQG144C — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose XC6SLX9-2TQG144C when your design needs up to 9,152 logic cells, 16 DSP slices, and 102 user I/Os on a hand-solderable 0.5 mm pitch TQFP-144 footprint in a commercial-temperature environment. Step up to XC6SLX9-2TQG144I for industrial -40C to +100C operation at about 15% higher cost, or choose XC6SLX9-3TQG144C for higher performance at the same LX9 logic capacity. Downgrade to XC6SLX4-2TQG144C only when 3,840 logic cells suffice, keeping in mind that this requires ISE project retargeting. For cross-brand migration, plan for PCB rework because no Lattice or Intel (Altera) Cyclone IV directly drop-in to the LX9 TQG144 footprint.

代替品との比較

パラメータ	この製品	XC6SLX9-2TQG144I	XC6SLX9-3TQG144C	XC6SLX4-2TQG144C
Brand	AMD (Xilinx)	AMD (Xilinx)	AMD (Xilinx)	AMD (Xilinx)
Package	TQFP-144 (TQG144)	TQFP-144 (TQG144) - same	TQFP-144 (TQG144) - same	TQFP-144 (TQG144) - same
Logic Cells	9152	9152	9152	3840 (-58%)
Speed Grade	-2	-2	-3 (higher performance)	-2
Operating Temperature	0C to +85C (Commercial)	-40C to +100C (Industrial)	0C to +85C (Commercial)	0C to +85C (Commercial)
User I/O Count	102	102	102	102
Process / Family	Spartan-6 LX, 45nm	Spartan-6 LX, 45nm	Spartan-6 LX, 45nm	Spartan-6 LX, 45nm
Approx. Unit Price (qty 1)	~$22.50	~$26.00	~$28.50	~$17.00
Pin-Compatible Drop-In	-	Yes	Yes	Yes (requires ISE retarget)

主な差別化要因

TQFP-144 hand-solderable package （vs XC6SLX9-2FTG256C)
Largest LX9 logic density in TQG144 （vs XC6SLX4-2TQG144C)
Commercial temperature grade at lower cost （vs XC6SLX9-2TQG144I)
Mature ISE/Vivado tool support with abundant design examples （vs XC6SLX25/LX45 in larger packages)

設計ノート

Estimated: at typical 100% I/O switching utilization on a 1.2 V core at 25C, the XC6SLX9-2TQG144C draws approximately 80 mA quiescent and roughly 100 to 400 mA dynamic current. Design a multi-rail supply with 0.5% accuracy on VCCINT (1.2 V ± 5%) using a low-noise LDO such as a TPS7A4701 (as cited in industry references) downstream of a switching regulator to remove switching-ripple noise. Decouple each VCCINT, VCCAUX, and VCCO pin with a 100 nF 0402 ceramic as close to the pin as the layout allows.

In TQFP-144 the die dissipates heat through the package body and bond wires; estimated theta_JA is roughly 30 C/W without airflow, so a 1 W dissipation at 25C ambient yields a 30C junction temperature rise, still within the 0C to +85C commercial grade. For designs above 1.5 W or operating with limited airflow, attach a small thermal-pad-heatsink or add 100 cm^2 of internal copper area below the part on the PCB, per AMD Spartan-6 hardware design guide UG393.

Route matched-pair LVDS or DDR2 signals on the TQG144 0.5 mm pitch package using length-matching within ±10 ps and skew-matched within ±50 mil; keep differential-pair spacing no greater than 2 times the trace-to-ground reference. Pin 1 orientation follows the standard TQFP counter-clockwise numbering; verify against the official AMD Spartan-6 TQG144 package pinout file (PKG_TQG144) when laying out the footprint to prevent reverse-assembly errors.

Do not leave any VCCO bank supply floating - un-powered VCCO pins on the LX9 produce I/O behavior that can damage the I/O buffers and disrupt JTAG configuration. Per AMD Xilinx forum guidance, also avoid tying PROGRAM_B high without a 4.7 kohm pull-up to VCCAUX, since PROG-B glitches can interrupt configuration. Place pull-ups on TMS, TDI, and TCK as well to avoid floating JTAG state during power-up.

When using GTP transceivers or 200 MHz+ LVDS signals, isolate the TQG144 from adjacent noisy signals by surrounding the LX9 IO banks with a ground ring or guard trace tied to the lower-layer ground plane. Keep DCM/PLL clock feedback traces routed within 12 mm and stub-free to the CCLK feedback pins if used in DLL feedback mode.

コンプライアンス情報

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

鉛フリー

Yes

ハロゲンフリー

Yes

紛争鉱物

Compliant

RoHS compliant and lead-free per AMD product environmental specifications on DigiKey/Mouser. Spartan-6 family parts are not AEC-Q100 qualified by default; automotive projects must request AEC-grade Spartan-6 variants separately. Halogen-free and conflict-minerals compliance per AMD corporate policy.

データ検証日: 2026-10-20 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

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