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XC6SLX9-2TQG144I - Spartan-6 LX FPGA, 9,152 Cells, 144-LQFP | AMD

MPN: XC6SLX9-2TQG144I ✓ Active
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1.2 V Vdss 144-pin TQFP (TQG144), 20 x 20 mm, 0.5 mm pitch Package -2 (mid-range) Speed DDR, DDR2, DDR3, LPDDR (via Memory Controller Block) Memory
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Price updated: 2026-10-11
Volume Pricing
Qty Unit Price Extended
1 $33.5 $33.50
10 $28.9 $289.00
100 $22.4 $2,240.00
500 $18.75 $9,375.00
1,000 $16.2 $16,200.00
ℹ️ All prices are in USD

XC6SLX9-2TQG144I Overview

The AMD (Xilinx) XC6SLX9-2TQG144I is a logic-optimized Spartan-6 LX Field-Programmable Gate Array (FPGA) IC delivering 9,152 logic cells, 102 user I/O pins, and 576 Kbits of block RAM in a 144-pin TQFP (TQG144) package with 0.5 mm pitch. The "-2" speed grade targets a balance between performance and power efficiency, and the "I" suffix designates the industrial operating temperature range of -40C to +100C.

An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a matrix of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon blocks (BRAM, DSP, transceivers) that engineers can reconfigure post-manufacturing. FPGAs sit above microcontrollers and ASICs in the programmable logic hierarchy: microcontrollers execute software sequentially, ASICs are hard-wired for one function, while FPGAs deliver hardware-level parallelism with full design flexibility. The Spartan-6 family specifically targets cost-sensitive, high-volume logic, embedded, and DSP applications.

Key features of the XC6SLX9-2TQG144I include 9,152 logic cells (1,430 ALMs / 715 CLBs), 576 Kbits of block RAM, 16 DSP48A1 slices, 102 user I/O, and integrated configuration options supporting SPI, BPI, and JTAG modes. The device includes on-chip clock management (DCMs and PLLs) and supports DDR, DDR2, DDR3, and LPDDR external memory interfaces, enabling it to bridge to modern system memory.

Built on a mature 45 nm low-power copper CMOS process, the XC6SLX9-2TQG144I is engineered for low static and dynamic power dissipation. The 1.2V core voltage with separate I/O bank voltages (1.2V-3.3V) lets designers mix logic levels on a single chip. The TQG144 package is the high-volume cost-optimized footprint, suitable for cost-sensitive designs that don't need the transceivers of the LXT family.

Typical applications span industrial control and motor drive, automotive infotainment and driver assistance (non-safety), consumer video processing, software-defined radio, low-cost ASIC replacement, and bridge/IO expansion. Compared with a microcontroller, the FPGA delivers true parallel processing and deterministic latency, critical for video pipelines and DSP.

When designing, plan for a multi-rail power supply (1.2V VCCINT + per-bank VCCO) and respect the JTAG programming and configuration sequencing requirements documented in the Spartan-6 configuration user guide. For new designs, evaluate whether a Spartan-7 XC7S6/XC7S15 or Artix-7 XC7A15T would deliver better cost-per-logic and updated silicon.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

Drop-in alternatives for XC6SLX9-2TQG144I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with XC6SLX9-2TQG144I (same form factor and footprint) — differing in Block RAM, Clock Management, Core Voltage (VCCINT), DSP Slices, Logic Cells.

AMD
Block RAM: 64 Kbit per block (16 blocks)
Clock Management: DCM + PLL
Core Voltage (VCCINT): 1.14 V to 1.26 V
Compare with XC6SLX9-2TQG144I →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

XC6SLX9-3TQG144I

✅ Drop-In
AMD
📦 TQFP-144 (TQG144)
FPGA · Spartan-6 LX · 9,152 logic cells · 102 I/O · 144-LQFP · 144 pins · -3 · I

✓ In Stock

Contact for price

View Datasheet →

XC6SLX9-2TQG144C

✅ Drop-In
AMD
📦 TQFP-144 (TQG144)
Spartan-6 LX · 9152 · 589824 · 715 · 102 · 375 MHz · DCM + PLL · 64 Kbit per block (16 blocks)

✓ In Stock

$11.8 / Unit

View Datasheet →

XC6SLX4-2TQG144I

✅ Drop-In
AMD
📦 TQFP-144 (TQG144)
Spartan-6 LX field-programmable gate array (FPGA) · 3,840 cells · 221,184 bits · 102 pins · 375 MHz · 1.14 V to 1.26 V · -2 · 144-pin TQFP

✓ In Stock

$6.189 / Unit

View Datasheet →
ℹ️ 1 cross-package part(s) hidden — different package requires PCB rework and is not a true drop-in replacement. Contact us if you need cross-package suggestions.

XC6SLX9-2TQG144I Maximum Ratings & Electrical Characteristics

Family Spartan-6 LX
Logic Cells 9,152
Slices / ALMs 1,430 ALMs (715 CLBs)
Block RAM 576 Kbits (72 x 18 Kb)
DSP Slices 16 (DSP48A1)
Maximum User I/O 102
Package 144-pin TQFP (TQG144), 20 x 20 mm, 0.5 mm pitch
Speed Grade -2 (mid-range)
Operating Temperature -40C to +100C (Industrial)
Core Voltage (VCCINT) 1.2 V
I/O Bank Voltage (VCCO) 1.2 V to 3.3 V
Process Technology 45 nm low-power CMOS (9-metal copper)
Memory Interfaces DDR, DDR2, DDR3, LPDDR (via Memory Controller Block)
Clock Management DCM + PLL per tile
Mounting Type Surface Mount
MSL Level 3 (per JEDEC J-STD-020)
RoHS Status RoHS Compliant (Lead Free)

XC6SLX9-2TQG144I 144-pin tqfp (tqg144), 20 x 20 mm, 0.5 mm pitch Pin Configuration Guide

Pin configuration for XC6SLX9-2TQG144I (144-pin tqfp (tqg144), 20 x 20 mm, 0.5 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

144-pin tqfp (tqg144), 20 x 20 mm, 0.5 mm pitch package pinout diagram for XC6SLX9-2TQG144I

No detailed pinout data available for XC6SLX9-2TQG144I.

Refer to the datasheet for full pin configuration.

Typical Applications

XC6SLX9-2TQG144I is suitable for 6 applications: Industrial Motor Control, Automotive Infotainment / Video Bridging, Software-Defined Radio / Signal Processing, ASIC Replacement / Glue Logic Consolidation, Consumer Video / Display Processing, Embedded IoT Bridge / IO Expansion.

🏭

Industrial Motor Control

The XC6SLX9-2TQG144I is well suited to industrial motor control and drive applications, where its 16 DSP48A1 slices handle field-oriented control (FOC) math at PWM frequencies up to 50 kHz with single-cycle MAC operations. The 102 user I/O accommodate multiple encoder interfaces, Hall sensors, and gate-driver PWM channels, while the integrated Memory Controller Block streams feedback samples into DDR2 or DDR3 external memory. The TQG144 package exposes enough I/O to drive multi-axis systems with a single chip, and the industrial -40C to +100C temperature range supports factory-floor and outdoor enclosures. Designers benefit from Spartan-6 mature IP libraries (PWM, SVPWM, PID) and a deterministic hardware pipeline that delivers sub-microsecond loop latency.

🚗

Automotive Infotainment / Video Bridging

In automotive cabin infotainment systems, the XC6SLX9-2TQG144I bridges LVDS/TTL camera inputs to the head-unit SoC, performing deinterlacing, color-space conversion, and overlay composition in hardware. The 16 DSP slices handle scaling and chroma upsampling at 60 fps 1080p, while 576 Kbits of block RAM line-buffer intermediate scan lines without external SDRAM. The 1.2V to 3.3V per-bank VCCO rails let designers mix LVDS inputs (2.5V) and 3.3V output to a head-unit processor from one chip. Note this is for cabin systems (no AEC-Q100); safety-critical ADAS functions require ASIL-rated SoCs. The TQG144 package is hand-solder-friendly for prototype builds.

🌐

Software-Defined Radio / Signal Processing

For software-defined radio receivers and digital signal processing, the XC6SLX9-2TQG144I delivers 16 DSP48A1 slices capable of running 18 x 25-bit MAC operations at speeds suitable for baseband demodulation, FFT preprocessing, and channel filtering below 50 MSPS. Designers block datacommuinte the on-chip block RAM as FFT working memory, reducing external memory access latency. The TQG144 package provides enough I/O for parallel ADC interfaces (e.g., 12-14 bit ADCs at 65-100 MSPS) plus SPI control and JTAG debug. Compared with a microcontroller, the FPGA achieves deterministic sub-microsecond latency on sample streams, critical for low-jitter phase-sensitive demodulation.

🔧

ASIC Replacement / Glue Logic Consolidation

The XC6SLX9-2TQG144I is widely deployed as a low-cost ASIC replacement, replacing multiple discrete CPLDs, bus bridges, and custom logic chips on legacy boards with one reconfigurable part. With 9,152 logic cells, designers typically migrate 5-10 legacy TTL/CMOS chips onto one LX9, cutting board area and BOM cost. The 102 user I/O cover most legacy bus widths (16-bit address + 16-bit data + control), while the integrated clock management removes external PLL chips. For low-volume industrial and aerospace programs, this FPGA cuts NRE to zero while still delivering production volumes at the LX9 price point.

📺

Consumer Video / Display Processing

In consumer video peripherals (HDMI splitters, scalers, capture cards), the XC6SLX9-2TQG144I handles color-space conversion, frame-rate conversion, and overlay composition in hardware at resolutions up to 1080p60. The integrated Memory Controller Block supports DDR3, enabling frame-buffer use for scaling and deinterlacing. The 1.2V to 3.3V per-bank VCCO support mixed-voltage TMDS and LVCMOS interfaces from a single chip, reducing external level shifters. The TQG144 package is hand-solderable for low-volume and DIY/prosumer products.

🧩

Embedded IoT Bridge / IO Expansion

As an embedded IoT gateway or industrial sensor hub, the XC6SLX9-2TQG144I interfaces multiple sensor buses (SPI, I2C, UART, GPIO) and performs local pre-processing before forwarding data to a host processor. With 102 user I/O, designers expose many sensor interfaces concurrently, while 16 DSP slices handle sensor-fusion math (e.g., Kalman filters for IMU). The industrial -40C to +100C temperature rating suits outdoor enclosures and factory cabinets. Compared with a microcontroller, the FPGA executes deterministic sensor-fusion pipelines in parallel, freeing the host CPU for higher-level decision logic.

What is the XC6SLX9-2TQG144I?
The XC6SLX9-2TQG144I is an AMD/Xilinx Spartan-6 LX Field-Programmable Gate Array (FPGA) with 9,152 logic cells, 576 Kbits of block RAM, 16 DSP48A1 slices, and 102 user I/O pins, housed in a 144-pin TQFP (TQG144) package at industrial temperature grade. According to AMD/Xilinx documentation, it is fabricated on a 45 nm low-power CMOS process and supports DDR/DDR2/DDR3 external memory interfaces through on-chip memory controller blocks.
How many logic cells does the XC6SLX9 have?
The XC6SLX9 contains 9,152 logic cells organized as 1,430 Adaptive Logic Modules (ALMs) / 715 Configurable Logic Blocks (CLBs). This is the smallest Spartan-6 LX device in terms of logic density, optimized for cost-sensitive applications where the Spartan-6 platform benefits (low power, integrated memory controllers, mature toolchain) outweigh the need for maximum density.
What is the difference between XC6SLX9-2TQG144I and XC6SLX9-2TQG144C?
The XC6SLX9-2TQG144I is rated for -40C to +100C (Industrial temperature grade), while the XC6SLX9-2TQG144C is rated for 0C to +85C (Commercial temperature grade). Both share the identical TQG144 package, 9,152 logic cells, and -2 speed grade; they differ only in operating temperature range. Choose 'I' for industrial/automotive cabin applications and 'C' for commercial environments.
What is the difference between XC6SLX9-2TQG144I and XC6SLX9-3TQG144I?
The XC6SLX9-3TQG144I is the -3 (highest performance) speed grade while the XC6SLX9-2TQG144I is the -2 (mid-range) speed grade. Both share the same TQG144 package, 9,152 logic cells, and industrial temperature range. The -3 grade delivers approximately 15% higher Fmax on internal logic and DSP paths at the cost of higher dynamic power consumption. Choose -3 for timing-critical designs and -2 for power-sensitive applications.
Where can I buy the XC6SLX9-2TQG144I online?
The XC6SLX9-2TQG144I is available from authorized distributors including DigiKey (stock check via product detail page 2339920), Mouser, TrustedParts, Avaq, and Octopart-aggregated sellers. According to the Xilinx family overview datasheet, the part ships today from major franchised distributors. As of 2026-10-11, distributor pricing is approximately $33.50 at qty 1, dropping to $16.20 at qty 1000.
What is the price of the XC6SLX9-2TQG144I?
The XC6SLX9-2TQG144I is priced at approximately $33.50 per unit at qty 1, $22.40 at qty 100, $18.75 at qty 500, and $16.20 at qty 1000 as of 2026-10-11. Spartan-6 LX devices in TQFP packages typically have stronger price elasticity than BGA packages because the TQFP footprint can be assembled on low-cost 4-layer PCBs. Check Octopart for live distributor comparison.
What is the lead time for the XC6SLX9-2TQG144I?
Lead time for the XC6SLX9-2TQG144I is typically 8-12 weeks factory-direct from Xilinx (now AMD) and 2-4 weeks from major distributors when in stock. Spartan-6 production is mature and stable, but lead times can extend during industrial demand cycles. As of 2026-10-11, DigiKey and Mouser typically show stock or short lead times. Check TrustedParts or Octopart for cross-distributor inventory.
Is the XC6SLX9-2TQG144I in stock?
Stock status varies by distributor and time. As of 2026-10-11, DigiKey lists the XC6SLX9-2TQG144I at product detail page 2339920 with current stock/lead-time, and Mouser lists the AMD/Xilinx part on its catalog page. For real-time stock comparison across 5+ distributors, Octopart's XC6SLX9-2TQG144I page aggregates availability data including TrustedParts and Avaq listings.
XC6SLX9-2TQG144I vs XC6SLX4-2TQG144I - which is better?
The XC6SLX9 and XC6SLX4 both come in the TQG144 package, but the XC6SLX9 has 9,152 logic cells versus 3,840 for the XC6SLX4 - a 138% increase in capacity. Both share the same Spartan-6 LX architecture, -2 speed grade, and 1.2V core. Choose XC6SLX4 for cost-optimized glue-logic applications; choose XC6SLX9 for moderate DSP, video, or bridge designs that need more headroom.
XC6SLX9-2TQG144I vs XC6SLX16 - which should I choose?
The XC6SLX16 has 14,579 logic cells (about 59% more than the XC6SLX9's 9,152) and 32 DSP48A1 slices (double the XC6SLX9's 16). The XC6SLX9 in TQG144 is preferable for low-cost logic-only designs with simple memory controller needs, while the XC6SLX16 in FBG256/FTG256 packages suits applications needing more DSP and parallel processing. For TQG144 footprint constraint, XC6SLX9 is the highest-density option.
When should I choose XC6SLX9-2TQG144I over a Spartan-7 XC7S6?
Choose XC6SLX9-2TQG144I when you need a TQFP-144 footprint (XC7S6 is only available in smaller QFN/CPGA packages), require mature Spartan-6 toolchain reuse, or have long-life industrial designs already validated on Spartan-6. Choose the XC7S6 when you are starting a new design - Spartan-7 delivers ~30% lower power, a faster Vivado-only toolchain, and modern security features. Spartan-6 remains fully active per AMD product roadmap.
What is the best drop-in replacement for XC6SLX9-2TQG144I?
The closest drop-in replacements for the XC6SLX9-2TQG144I are same-package variants of the XC6SLX9 itself: the -3 speed grade XC6SLX9-3TQG144I (higher performance, same footprint) and the commercial-temperature XC6SLX9-2TQG144C (lower cost, same footprint). Both share identical TQG144 pinout and can be soldered onto the same PCB land pattern. For non-TQG144 footprints, the XC6SLX9 also exists in FTG256, CSG225, and CPG196 packages from the same family.
Can a Spartan-7 replace the Spartan-6 XC6SLX9?
A Spartan-7 device cannot be a drop-in replacement for the Spartan-6 XC6SLX9-2TQG144I because the TQG144 footprint does not exist in the Spartan-7 family. Spartan-7 FPGAs ship in FTGB196, CPGA196, QFG144 (different pinout), and BGA packages with different pin assignments. A migration requires PCB redesign plus full HDL re-implementation in Vivado, although IP cores can often be carried over with verification.
Where do I download the XC6SLX9-2TQG144I datasheet PDF?
The XC6SLX9-2TQG144I datasheet can be downloaded from AMD/Xilinx at docs.xilinx.com (Spartan-6 Family Overview DS160 and DC Switching Characteristics DS162) and from third-party archives at xilinxsemi.com, alldatasheet.com, findic.us, and digchip.com. The Spartan-6 Family Overview is 11 pages and covers LX/LXT device features; the full DC/AC Switching Characteristics document contains TQG144 package pinout tables.
What are the key specifications engineers should know about XC6SLX9-2TQG144I?
The XC6SLX9-2TQG144I has 9,152 logic cells, 1,430 ALMs, 576 Kbits block RAM, 16 DSP48A1 slices, 102 user I/O, and supports DDR/DDR3 memory interfaces, all in a 144-pin TQFP package with -40C to +100C industrial temperature range and -2 speed grade on a 45 nm low-power CMOS process. These headline specs position it as a low-cost, low-power, mid-density FPGA for industrial, consumer, and embedded logic designs where cost-per-logic matters more than raw performance.

Engineering reference data for XC6SLX9-2TQG144I — comparison, design guidance, and compliance information.

Selection Guide

Choose the XC6SLX9-2TQG144I when you need a TQFP-144-footprint Spartan-6 LX FPGA with industrial temperature range (-40C to +100C), mid-range -2 speed grade, and the largest density (9,152 cells / 576 Kbits BRAM / 16 DSP slices) available in that exact footprint. Choose XC6SLX9-3TQG144I when timing margin is critical and you can tolerate ~15% higher dynamic power. Choose XC6SLX9-2TQG144C for cost-sensitive commercial-temperature products. Choose XC6SLX4-2TQG144I for simpler glue-logic designs where the XC6SLX9 density is overkill. For new designs without legacy Spartan-6 IP, evaluate Spartan-7 XC7S15 in CPGA196 for lower power, but note the XC7S family does NOT offer TQFP-144, so the PCB must be redesigned.

Comparison with Alternatives

Parameter This Product XC6SLX9-3TQG144I XC6SLX9-2TQG144C XC6SLX4-2TQG144I
Brand AMD (Xilinx) AMD (Xilinx) AMD (Xilinx) AMD (Xilinx)
Package TQFP-144 (TQG144), 20x20 mm, 0.5 mm pitch TQFP-144 (TQG144) - same TQFP-144 (TQG144) - same TQFP-144 (TQG144) - same
Logic Cells 9,152 9,152 (same die) 9,152 (same die) 3,840 (-58%)
Block RAM 576 Kbits 576 Kbits 576 Kbits 216 Kbits
DSP Slices 16 (DSP48A1) 16 16 8 (-50%)
Maximum User I/O 102 102 102 102
Speed Grade -2 (mid-range) -3 (highest performance) -2 (mid-range) -2 (mid-range)
Operating Temperature -40C to +100C (Industrial) -40C to +100C (Industrial) 0C to +85C (Commercial) -40C to +100C (Industrial)

Key Differentiators

  • Industrial temperature range (vs XC6SLX9-2TQG144C)
  • Mid-range speed/power trade-off (vs XC6SLX9-3TQG144I)
  • Highest logic density in TQG144 footprint (vs XC6SLX4-2TQG144I)

Design Notes

The XC6SLX9-2TQG144I requires three rails: VCCINT = 1.2V (core logic), VCCAUX = 2.5V or 3.3V (auxiliary), and per-bank VCCO = 1.2V to 3.3V (I/O banks). According to the Spartan-6 Family Overview, VCCINT must ramp monotonically in 0.2-50 ms; failure to meet the ramp spec can cause inrush on the POR circuit. Decouple VCCINT with 100 uF bulk + 0.1 uF + 10 uF ceramic per supply pin. Estimated: a fully utilized LX9 with all 16 DSP slices running at 200 MHz draws approximately 300-500 mA from VCCINT.

The TQG144 package is a 20 x 20 mm TQFP with 0.5 mm pitch and exposed pad-free bottom (no thermal pad). Per AMD package guidelines, use a 4-layer PCB with continuous power planes under the device. For a mid-density LX9 design, 4 layers with 1 oz copper are sufficient; high-speed DDR3 interfaces require impedance-controlled 100 ohm differential and 50 ohm single-ended traces routed on inner stripline layers.

Do not confuse TQG144 (this part) with FBG484 (the same LX9 silicon in a 484-ball BGA package) - the pinout is incompatible. Verify that the Spartan-6 configuration mode pins (M0, M1, M2) are strapped to the correct logic levels for SPI/BPI/JTAG boot mode per UG380. Failure to set configuration mode results in a non-booting device that appears dead. Use the JTAG header pattern from Xilinx HW-USB or compatible programmer.

Spartan-6 LX uses 1.2V internal LVCMOS signalling; output drive strength (2/4/6/8/12/16 mA) is programmable per pin via the IOSTANDARD attribute. For high-speed DDR3 interfaces up to 800 Mbps, use SSTL15_18 (1.5V) VCCO and the Memory Controller Block (MCB). Estimated: traces longer than 50 mm at DDR rates require matched-length routing within 25 mil tolerance and a 100 ohm differential termination near the FPGA pins.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliant and lead-free per DigiKey listing and Xilinx family overview. The 'I' temperature grade (Industrial -40C to +100C) is NOT equivalent to AEC-Q100 automotive qualification; for cabin electronics this is acceptable, but safety-critical ADAS functions require AEC-Q100-qualified SoCs. Halogen-free status not explicitly listed in Verified Web Data; set to unknown.

Data verified on: 2026-10-11 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

AMD Xilinx XC6SLX9 XC6SLX9-2TQG144I XC6SLX9-3TQG144I XC6SLX9-2TQG144C XC6SLX4-2TQG144I Spartan-6 LX Field-Programmable Gate Array FPGA configurable logic block CLB Adaptive Logic Module ALM DSP48A1 block RAM BRAM TQFP-144 TQG144 Surface Mount 45 nm CMOS JEDEC J-STD-020 RoHS DDR3 memory controller JTAG industrial temperature grade
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