XC7VX330T-1FFG1157C - Virtex-7 XT FPGA 326K Logic Cells | AMD
部品番号: XC7VX330T-1FFG1157C ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $1895 | $1,895.00 |
| 10 | $1750 | $17,500.00 |
| 100 | $1620 | $162,000.00 |
| 500 | $1490 | $745,000.00 |
| 1,000 | $1380 | $1,380,000.00 |
XC7VX330T-1FFG1157C 概要
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain programmable logic blocks and interconnects that allow the hardware to be reprogrammed to implement arbitrary digital logic functions. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which are a subset of integrated circuits used extensively in prototyping, signal processing, and high-speed networking.
Key features of the XC7VX330T-1FFG1157C include 600 user I/Os, 27,648 Kb of block RAM, and support for multiple high-speed serial transceivers. The device operates from a 1V core supply and is available in a 1156-pin FCBGA package, offering excellent thermal and electrical performance for dense PCB designs. The Virtex-7 XT family is optimized for high-end applications requiring maximum logic capacity and I/O bandwidth.
Technically, the Virtex-7 XT architecture integrates advanced clock management tiles (CMTs) with MMCM and PLL, high-speed serial transceivers, and hardened memory controllers. The 28nm HPL (High-Performance, Low-Power) process enables high logic density with manageable power dissipation. The device supports configuration via JTAG, SelectMAP, and SPI flash, providing flexible design integration.
Typical applications include wired communications (100G/400G line cards), data center acceleration, aerospace and defense signal processing, and high-performance computing. The 600 I/Os and large block RAM make it suitable for wide parallel data paths and deep buffering.
When designing with this FPGA, careful attention to power supply decoupling and thermal management is essential. The 1V core rail requires a robust power delivery network with multiple decoupling capacitors, and the FCBGA package needs adequate thermal vias and airflow for high-utilization designs.
ドロップイン代替品: XC7VX330T-1FFG1157C — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
XC7VX330T-1FFG1157I
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XC7VX330T-2FFG1157C
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XC7VX330T-1FFG1157I
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XC7VX330T-2FFG1157C
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XC7VX330T-1FFG1157I
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XC7VX330T-2FFG1157C
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XC7VX330T-1FFG1157C 最大定格＆電気的特性
| Family | Virtex-7 XT |
| Logic Cells | 326400 |
| Block RAM | 27648000 bits (27,648 Kb) |
| Number of I/Os | 600 |
| パッケージ | 1156-BBGA, FCBGA (FFG1157) |
| Core Voltage | 1V |
| Process Technology | 28nm |
| 動作温度 | 0C to +85C (commercial) |
| 実装タイプ | Surface Mount |
| ピン数 | 1156 |
| RoHS ステータス | Compliant |
| REACH Status | Compliant |
XC7VX330T-1FFG1157C ピン構成
| ピン A1 | IO_L1P_T0 — User I/O bank 0, differential pair P |
| ピン A2 | IO_L1N_T0 — User I/O bank 0, differential pair N |
| ピン B1 | VCCINT — Internal core voltage 1V |
| ピン B2 | GND — Ground |
| ピン C1 | IO_L2P_T0 — User I/O bank 0, differential pair P |
| ピン C2 | IO_L2N_T0 — User I/O bank 0, differential pair N |
| ピン D1 | VCCAUX — Auxiliary voltage 1.8V |
| ピン D2 | GND — Ground |
| ピン E1 | IO_L3P_T0 — User I/O bank 0, differential pair P |
| ピン E2 | IO_L3N_T0 — User I/O bank 0, differential pair N |
| ピン F1 | VCCINT — Internal core voltage 1V |
| ピン F2 | GND — Ground |
主な用途
XC7VX330T-1FFG1157C の用途: 6 件s: Wired Communications, Data Center Acceleration, Aerospace and Defense, High-Performance Computing, Medical Imaging, Test and Measurement.
Wired Communications
The XC7VX330T-1FFG1157C excels in wired communications, providing 600 I/Os and 326K logic cells for high-speed line cards. Its 28nm process and 1V core enable efficient processing of 100G/400G Ethernet frames. The large block RAM (27,648 Kb) supports deep packet buffering, while the high I/O count facilitates parallel data paths to PHYs and switches. This FPGA is ideal for implementing MAC, PCS, and packet processing logic in core and edge routers.
おすすめ
Data Center Acceleration
In data centers, the XC7VX330T-1FFG1157C accelerates compute-intensive workloads such as encryption, compression, and AI inference. Its 326K logic cells and 600 I/Os allow flexible implementation of custom accelerators. The 1V core voltage reduces power consumption, while the FCBGA package supports high-density boards. This FPGA can offload tasks from CPUs, improving throughput and reducing latency in cloud and enterprise environments.
おすすめ
Aerospace and Defense
The XC7VX330T-1FFG1157C is suited for aerospace and defense applications requiring high reliability and performance. Its 600 I/Os interface with sensors and actuators, while 326K logic cells handle complex signal processing. The 28nm process offers a balance of speed and power, critical for mission-critical systems. The FCBGA package provides robust thermal performance in harsh environments, and the device supports secure configuration for defense applications.
おすすめ
High-Performance Computing
For HPC, the XC7VX330T-1FFG1157C provides massive parallelism with 326K logic cells and 600 I/Os. It can implement custom arithmetic units, FFTs, and matrix operations, accelerating scientific simulations. The 27,648 Kb block RAM enables on-chip data storage, reducing memory latency. The 1V core and 28nm technology offer high performance per watt, making it suitable for compute nodes in supercomputers and research clusters.
おすすめ
Medical Imaging
In medical imaging, the XC7VX330T-1FFG1157C processes high-resolution image data from CT, MRI, and ultrasound systems. Its 326K logic cells handle real-time filtering and reconstruction algorithms, while 600 I/Os interface with high-speed ADCs and display controllers. The 28nm process ensures low power, critical for portable devices. The large block RAM supports frame buffering, and the FCBGA package enables compact, high-performance imaging boards.
おすすめ
Test and Measurement
The XC7VX330T-1FFG1157C is ideal for test and measurement equipment, offering 600 I/Os for high-speed data acquisition and 326K logic cells for signal analysis. Its 1V core and 28nm technology provide low jitter and high accuracy. The device can implement custom triggering, waveform generation, and real-time processing, making it suitable for oscilloscopes, logic analyzers, and spectrum analyzers. The FCBGA package supports high-density PCBs for compact instruments.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: XC7VX330T-1FFG1157C — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | XC7VX330T-1FFG1157I | XC7VX330T-2FFG1157C |
|---|---|---|---|
| Package | 1156-BBGA, FCBGA | 1156-BBGA, FCBGA - same | 1156-BBGA, FCBGA - same |
| Brand | AMD | AMD | AMD |
| Logic Cells | 326400 | 326400 | 326400 |
| Block RAM | 27648000 bits | 27648000 bits | 27648000 bits |
| Number of I/Os | 600 | 600 | 600 |
| Core Voltage | 1V | 1V | 1V |
| Speed Grade | -1 | -1 | -2 |
| Temperature Range | 0C to +85C | -40C to +100C | 0C to +85C |
主な差別化要因
- Higher speed grade option （vs XC7VX330T-1FFG1157I)
- Commercial temperature range （vs XC7VX330T-1FFG1157I)
- Smaller package footprint （vs XC7VX330T-2FF1761C)
設計ノート
The XC7VX330T-1FFG1157C requires a robust power delivery network. The 1V core rail must be regulated with low-ripple DC-DC converters and extensive decoupling. Use at least 10 x 100nF ceramic capacitors per power pin and bulk capacitors (10uF-100uF) distributed across the package. Follow AMD's power distribution guidelines in UG933 for optimal performance.
With 326K logic cells, power dissipation can exceed 20W under high utilization. The FCBGA package requires a heatsink and adequate airflow. Ensure thermal vias are placed under the package to conduct heat to the PCB ground plane. For high-ambient environments, consider the industrial temperature variant (XC7VX330T-1FFG1157I) to ensure reliability.
The 1156-pin FCBGA requires a multi-layer PCB (at least 12 layers) for signal routing and power integrity. Use controlled impedance traces for high-speed I/Os and differential pairs. Follow AMD's PCB design guidelines in UG933 for stack-up, via placement, and decoupling. Ensure all ground pins are connected to a solid ground plane.
コンプライアンス情報
RoHS and REACH compliance indicated by 'G' in package code (FFG1157). AEC-Q100 not applicable for FPGA.
