XC7VX330T-1FFG1157C - Virtex-7 XT FPGA 326K Logic Cells | AMD
Teilenummer: XC7VX330T-1FFG1157C ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $1895 | $1.895,00 |
| 10 | $1750 | $17.500,00 |
| 100 | $1620 | $162.000,00 |
| 500 | $1490 | $745.000,00 |
| 1.000 | $1380 | $1.380.000,00 |
XC7VX330T-1FFG1157C Übersicht
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain programmable logic blocks and interconnects that allow the hardware to be reprogrammed to implement arbitrary digital logic functions. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which are a subset of integrated circuits used extensively in prototyping, signal processing, and high-speed networking.
Key features of the XC7VX330T-1FFG1157C include 600 user I/Os, 27,648 Kb of block RAM, and support for multiple high-speed serial transceivers. The device operates from a 1V core supply and is available in a 1156-pin FCBGA package, offering excellent thermal and electrical performance for dense PCB designs. The Virtex-7 XT family is optimized for high-end applications requiring maximum logic capacity and I/O bandwidth.
Technically, the Virtex-7 XT architecture integrates advanced clock management tiles (CMTs) with MMCM and PLL, high-speed serial transceivers, and hardened memory controllers. The 28nm HPL (High-Performance, Low-Power) process enables high logic density with manageable power dissipation. The device supports configuration via JTAG, SelectMAP, and SPI flash, providing flexible design integration.
Typical applications include wired communications (100G/400G line cards), data center acceleration, aerospace and defense signal processing, and high-performance computing. The 600 I/Os and large block RAM make it suitable for wide parallel data paths and deep buffering.
When designing with this FPGA, careful attention to power supply decoupling and thermal management is essential. The 1V core rail requires a robust power delivery network with multiple decoupling capacitors, and the FCBGA package needs adequate thermal vias and airflow for high-utilization designs.
Drop-in-Alternativen für XC7VX330T-1FFG1157C – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
XC7VX330T-1FFG1157I
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XC7VX330T-2FFG1157C
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XC7VX330T-1FFG1157I
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XC7VX330T-2FFG1157C
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XC7VX330T-1FFG1157I
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XC7VX330T-2FFG1157C
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XC7VX330T-1FFG1157C Grenzwerte & elektrische Eigenschaften
| Family | Virtex-7 XT |
| Logic Cells | 326400 |
| Block RAM | 27648000 bits (27,648 Kb) |
| Number of I/Os | 600 |
| Gehäuse | 1156-BBGA, FCBGA (FFG1157) |
| Core Voltage | 1V |
| Process Technology | 28nm |
| Betriebstemperatur | 0C to +85C (commercial) |
| Montageart | Surface Mount |
| Anzahl der Pins | 1156 |
| RoHS-Status | Compliant |
| REACH Status | Compliant |
XC7VX330T-1FFG1157C Pin-Konfiguration
| Pin A1 | IO_L1P_T0 — User I/O bank 0, differential pair P |
| Pin A2 | IO_L1N_T0 — User I/O bank 0, differential pair N |
| Pin B1 | VCCINT — Internal core voltage 1V |
| Pin B2 | GND — Ground |
| Pin C1 | IO_L2P_T0 — User I/O bank 0, differential pair P |
| Pin C2 | IO_L2N_T0 — User I/O bank 0, differential pair N |
| Pin D1 | VCCAUX — Auxiliary voltage 1.8V |
| Pin D2 | GND — Ground |
| Pin E1 | IO_L3P_T0 — User I/O bank 0, differential pair P |
| Pin E2 | IO_L3N_T0 — User I/O bank 0, differential pair N |
| Pin F1 | VCCINT — Internal core voltage 1V |
| Pin F2 | GND — Ground |
Typische Anwendungen
XC7VX330T-1FFG1157C ist geeignet für 6 Anwendungs: Wired Communications, Data Center Acceleration, Aerospace and Defense, High-Performance Computing, Medical Imaging, Test and Measurement.
Wired Communications
The XC7VX330T-1FFG1157C excels in wired communications, providing 600 I/Os and 326K logic cells for high-speed line cards. Its 28nm process and 1V core enable efficient processing of 100G/400G Ethernet frames. The large block RAM (27,648 Kb) supports deep packet buffering, while the high I/O count facilitates parallel data paths to PHYs and switches. This FPGA is ideal for implementing MAC, PCS, and packet processing logic in core and edge routers.
Empfohlen
Data Center Acceleration
In data centers, the XC7VX330T-1FFG1157C accelerates compute-intensive workloads such as encryption, compression, and AI inference. Its 326K logic cells and 600 I/Os allow flexible implementation of custom accelerators. The 1V core voltage reduces power consumption, while the FCBGA package supports high-density boards. This FPGA can offload tasks from CPUs, improving throughput and reducing latency in cloud and enterprise environments.
Empfohlen
Aerospace and Defense
The XC7VX330T-1FFG1157C is suited for aerospace and defense applications requiring high reliability and performance. Its 600 I/Os interface with sensors and actuators, while 326K logic cells handle complex signal processing. The 28nm process offers a balance of speed and power, critical for mission-critical systems. The FCBGA package provides robust thermal performance in harsh environments, and the device supports secure configuration for defense applications.
Empfohlen
High-Performance Computing
For HPC, the XC7VX330T-1FFG1157C provides massive parallelism with 326K logic cells and 600 I/Os. It can implement custom arithmetic units, FFTs, and matrix operations, accelerating scientific simulations. The 27,648 Kb block RAM enables on-chip data storage, reducing memory latency. The 1V core and 28nm technology offer high performance per watt, making it suitable for compute nodes in supercomputers and research clusters.
Empfohlen
Medical Imaging
In medical imaging, the XC7VX330T-1FFG1157C processes high-resolution image data from CT, MRI, and ultrasound systems. Its 326K logic cells handle real-time filtering and reconstruction algorithms, while 600 I/Os interface with high-speed ADCs and display controllers. The 28nm process ensures low power, critical for portable devices. The large block RAM supports frame buffering, and the FCBGA package enables compact, high-performance imaging boards.
Empfohlen
Test and Measurement
The XC7VX330T-1FFG1157C is ideal for test and measurement equipment, offering 600 I/Os for high-speed data acquisition and 326K logic cells for signal analysis. Its 1V core and 28nm technology provide low jitter and high accuracy. The device can implement custom triggering, waveform generation, and real-time processing, making it suitable for oscilloscopes, logic analyzers, and spectrum analyzers. The FCBGA package supports high-density PCBs for compact instruments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für XC7VX330T-1FFG1157C – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | XC7VX330T-1FFG1157I | XC7VX330T-2FFG1157C |
|---|---|---|---|
| Package | 1156-BBGA, FCBGA | 1156-BBGA, FCBGA - same | 1156-BBGA, FCBGA - same |
| Brand | AMD | AMD | AMD |
| Logic Cells | 326400 | 326400 | 326400 |
| Block RAM | 27648000 bits | 27648000 bits | 27648000 bits |
| Number of I/Os | 600 | 600 | 600 |
| Core Voltage | 1V | 1V | 1V |
| Speed Grade | -1 | -1 | -2 |
| Temperature Range | 0C to +85C | -40C to +100C | 0C to +85C |
Wichtigste Unterscheidungsmerkmale
- Higher speed grade option (vs. XC7VX330T-1FFG1157I)
- Commercial temperature range (vs. XC7VX330T-1FFG1157I)
- Smaller package footprint (vs. XC7VX330T-2FF1761C)
Designhinweise
The XC7VX330T-1FFG1157C requires a robust power delivery network. The 1V core rail must be regulated with low-ripple DC-DC converters and extensive decoupling. Use at least 10 x 100nF ceramic capacitors per power pin and bulk capacitors (10uF-100uF) distributed across the package. Follow AMD's power distribution guidelines in UG933 for optimal performance.
With 326K logic cells, power dissipation can exceed 20W under high utilization. The FCBGA package requires a heatsink and adequate airflow. Ensure thermal vias are placed under the package to conduct heat to the PCB ground plane. For high-ambient environments, consider the industrial temperature variant (XC7VX330T-1FFG1157I) to ensure reliability.
The 1156-pin FCBGA requires a multi-layer PCB (at least 12 layers) for signal routing and power integrity. Use controlled impedance traces for high-speed I/Os and differential pairs. Follow AMD's PCB design guidelines in UG933 for stack-up, via placement, and decoupling. Ensure all ground pins are connected to a solid ground plane.
Compliance-Informationen
RoHS and REACH compliance indicated by 'G' in package code (FFG1157). AEC-Q100 not applicable for FPGA.
