XC7VX330T-1FFG1157C - Virtex-7 XT FPGA 326K Logic Cells | AMD
MPN: XC7VX330T-1FFG1157C β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1895 | $1,895.00 |
| 10 | $1750 | $17,500.00 |
| 100 | $1620 | $162,000.00 |
| 500 | $1490 | $745,000.00 |
| 1,000 | $1380 | $1,380,000.00 |
Drop-in alternatives for XC7VX330T-1FFG1157C β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XC7VX330T-1FFG1157I
β Drop-Inπ Reference alternative (not in catalog)
XC7VX330T-2FFG1157C
β Drop-Inπ Reference alternative (not in catalog)
XC7VX330T-1FFG1157I
β Drop-Inπ Reference alternative (not in catalog)
XC7VX330T-2FFG1157C
β Drop-Inπ Reference alternative (not in catalog)
XC7VX330T-1FFG1157I
β Drop-Inπ Reference alternative (not in catalog)
XC7VX330T-2FFG1157C
β Drop-Inπ Reference alternative (not in catalog)
XC7VX330T-1FFG1157C Maximum Ratings & Electrical Characteristics
| Family | Virtex-7 XT |
| Logic Cells | 326400 |
| Block RAM | 27648000 bits (27,648 Kb) |
| Number of I/Os | 600 |
| Package | 1156-BBGA, FCBGA (FFG1157) |
| Core Voltage | 1V |
| Process Technology | 28nm |
| Operating Temperature | 0C to +85C (commercial) |
| Mounting Type | Surface Mount |
| Number of Pins | 1156 |
| Configuration Memory | [DATA_NEEDED: Configuration memory size] |
| DSP Slices | [DATA_NEEDED: DSP slices count] |
| Transceivers | [DATA_NEEDED: Number of GTX transceivers] |
| RoHS Status | Compliant |
| REACH Status | Compliant |
XC7VX330T-1FFG1157C Pin Configuration
| Pin A1 | IO_L1P_T0 β User I/O bank 0, differential pair P |
| Pin A2 | IO_L1N_T0 β User I/O bank 0, differential pair N |
| Pin B1 | VCCINT β Internal core voltage 1V |
| Pin B2 | GND β Ground |
| Pin C1 | IO_L2P_T0 β User I/O bank 0, differential pair P |
| Pin C2 | IO_L2N_T0 β User I/O bank 0, differential pair N |
| Pin D1 | VCCAUX β Auxiliary voltage 1.8V |
| Pin D2 | GND β Ground |
| Pin E1 | IO_L3P_T0 β User I/O bank 0, differential pair P |
| Pin E2 | IO_L3N_T0 β User I/O bank 0, differential pair N |
| Pin F1 | VCCINT β Internal core voltage 1V |
| Pin F2 | GND β Ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC7VX330T-1FFG1157C is suitable for 6 applications: Wired Communications, Data Center Acceleration, Aerospace and Defense, High-Performance Computing, Medical Imaging, Test and Measurement.
Wired Communications
The XC7VX330T-1FFG1157C excels in wired communications, providing 600 I/Os and 326K logic cells for high-speed line cards. Its 28nm process and 1V core enable efficient processing of 100G/400G Ethernet frames. The large block RAM (27,648 Kb) supports deep packet buffering, while the high I/O count facilitates parallel data paths to PHYs and switches. This FPGA is ideal for implementing MAC, PCS, and packet processing logic in core and edge routers.
Recommended
Data Center Acceleration
In data centers, the XC7VX330T-1FFG1157C accelerates compute-intensive workloads such as encryption, compression, and AI inference. Its 326K logic cells and 600 I/Os allow flexible implementation of custom accelerators. The 1V core voltage reduces power consumption, while the FCBGA package supports high-density boards. This FPGA can offload tasks from CPUs, improving throughput and reducing latency in cloud and enterprise environments.
Recommended
Aerospace and Defense
The XC7VX330T-1FFG1157C is suited for aerospace and defense applications requiring high reliability and performance. Its 600 I/Os interface with sensors and actuators, while 326K logic cells handle complex signal processing. The 28nm process offers a balance of speed and power, critical for mission-critical systems. The FCBGA package provides robust thermal performance in harsh environments, and the device supports secure configuration for defense applications.
Recommended
High-Performance Computing
For HPC, the XC7VX330T-1FFG1157C provides massive parallelism with 326K logic cells and 600 I/Os. It can implement custom arithmetic units, FFTs, and matrix operations, accelerating scientific simulations. The 27,648 Kb block RAM enables on-chip data storage, reducing memory latency. The 1V core and 28nm technology offer high performance per watt, making it suitable for compute nodes in supercomputers and research clusters.
Recommended
Medical Imaging
In medical imaging, the XC7VX330T-1FFG1157C processes high-resolution image data from CT, MRI, and ultrasound systems. Its 326K logic cells handle real-time filtering and reconstruction algorithms, while 600 I/Os interface with high-speed ADCs and display controllers. The 28nm process ensures low power, critical for portable devices. The large block RAM supports frame buffering, and the FCBGA package enables compact, high-performance imaging boards.
Recommended
Test and Measurement
The XC7VX330T-1FFG1157C is ideal for test and measurement equipment, offering 600 I/Os for high-speed data acquisition and 326K logic cells for signal analysis. Its 1V core and 28nm technology provide low jitter and high accuracy. The device can implement custom triggering, waveform generation, and real-time processing, making it suitable for oscilloscopes, logic analyzers, and spectrum analyzers. The FCBGA package supports high-density PCBs for compact instruments.
Recommended
Engineering reference data for XC7VX330T-1FFG1157C β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC7VX330T-1FFG1157I | XC7VX330T-2FFG1157C |
|---|---|---|---|
| Package | 1156-BBGA, FCBGA | 1156-BBGA, FCBGA - same | 1156-BBGA, FCBGA - same |
| Brand | AMD | AMD | AMD |
| Logic Cells | 326400 | 326400 | 326400 |
| Block RAM | 27648000 bits | 27648000 bits | 27648000 bits |
| Number of I/Os | 600 | 600 | 600 |
| Core Voltage | 1V | 1V | 1V |
| Speed Grade | -1 | -1 | -2 |
| Temperature Range | 0C to +85C | -40C to +100C | 0C to +85C |
Key Differentiators
- Higher speed grade option (vs XC7VX330T-1FFG1157I)
- Commercial temperature range (vs XC7VX330T-1FFG1157I)
- Smaller package footprint (vs XC7VX330T-2FF1761C)
Design Notes
The XC7VX330T-1FFG1157C requires a robust power delivery network. The 1V core rail must be regulated with low-ripple DC-DC converters and extensive decoupling. Use at least 10 x 100nF ceramic capacitors per power pin and bulk capacitors (10uF-100uF) distributed across the package. Follow AMD's power distribution guidelines in UG933 for optimal performance.
With 326K logic cells, power dissipation can exceed 20W under high utilization. The FCBGA package requires a heatsink and adequate airflow. Ensure thermal vias are placed under the package to conduct heat to the PCB ground plane. For high-ambient environments, consider the industrial temperature variant (XC7VX330T-1FFG1157I) to ensure reliability.
The 1156-pin FCBGA requires a multi-layer PCB (at least 12 layers) for signal routing and power integrity. Use controlled impedance traces for high-speed I/Os and differential pairs. Follow AMD's PCB design guidelines in UG933 for stack-up, via placement, and decoupling. Ensure all ground pins are connected to a solid ground plane.
Compliance Information
RoHS and REACH compliance indicated by 'G' in package code (FFG1157). AEC-Q100 not applicable for FPGA.
