XCZU9EG-2FFVB1156I - Zynq UltraScale+ MPSoC EG | AMD
部品番号: XCZU9EG-2FFVB1156I ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $14641.83 | $14,641.83 |
| 10 | $13900 | $139,000.00 |
| 100 | $13200 | $1,320,000.00 |
| 500 | $12500 | $6,250,000.00 |
| 1,000 | $11800 | $11,800,000.00 |
XCZU9EG-2FFVB1156I 概要
A Zynq UltraScale+ MPSoC is a class of adaptive SoC that pairs multi-core ARM processing with FPGA fabric. The EG variant targets embedded and industrial applications, offering a balance of processing performance, programmable logic capacity, and I/O flexibility. It sits within the broader hierarchy: Zynq UltraScale+ MPSoC -> adaptive SoC -> System-on-Chip -> semiconductor device.
Key features include 599,550 logic cells, 32.1 Mb of block RAM, 1,968 DSP slices, and support for 533 MHz (Cortex-R5), 600 MHz (Mali-400), and 1.3 GHz (Cortex-A53) clock speeds. The device operates at 0.85V core voltage and is fabricated on a 20nm process. The -2 speed grade offers a balance of performance and power efficiency.
The architecture integrates the PS with the PL via high-bandwidth AXI interfaces, enabling low-latency data movement between software and hardware accelerators. The Mali-400 MP2 GPU supports 2D/3D graphics, while the video codec unit handles H.264/H.265 encoding and decoding. The device includes comprehensive security features such as RSA authentication, AES decryption, and secure boot.
Typical applications include software-defined radio, industrial motor control, medical imaging, aerospace and defense systems, and multi-axis robotics. The combination of real-time processing (Cortex-R5), application processing (Cortex-A53), and programmable logic makes it suitable for complex control and signal processing tasks.
When designing with this device, careful attention must be paid to power supply sequencing, decoupling, and thermal management. The 1156-pin FCBGA package requires a multi-layer PCB with controlled impedance for high-speed transceivers and DDR memory interfaces.
ドロップイン代替品: XCZU9EG-2FFVB1156I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: XCZU9EG-2FFVB1156I （同一形状・フットプリント） — 相違点: DSP Slices, Operating Temperature, Block RAM, Logic Cells, Core Processor.
クイック比較ツール — 並列比較する代替部品を選択:
XCZU9EG-1FFVB1156I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XCZU9EG-2FFVB1156E
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XCZU15EG-2FFVB1156I
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$327.94 / 個
データシートを見る →XCZU11EG-2FFVB1156I
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XCZU7EV-2FFVC1156I
⚡ 同一パッケージ✓ 在庫あり
$895 / 個
データシートを見る →XCZU9EG-2FFVB1156I 最大定格＆電気的特性
| Family | Zynq UltraScale+ MPSoC EG |
| Core Processor | Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight |
| Graphics Processor | ARM Mali-400 MP2 |
| Logic Cells | 599,550 |
| Block RAM | 32.1 Mb |
| DSP Slices | 1,968 |
| Max Clock Frequency (Cortex-A53) | 1.3 GHz |
| Max Clock Frequency (Cortex-R5) | 533 MHz |
| Max Clock Frequency (Mali-400) | 600 MHz |
| Core Voltage | 0.85 V |
| Process Technology | 20 nm |
| パッケージ | 1156-FCBGA (35x35 mm) |
| 動作温度 | -40C to +100C (industrial) |
| 実装タイプ | Surface Mount |
| Speed Grade | -2 |
| RoHS ステータス | Compliant |
XCZU9EG-2FFVB1156I ピン構成
| ピン A1 | VCCO_0 — I/O bank 0 supply voltage |
| ピン A2 | IO_L1P_T0_0 — User I/O, bank 0, differential pair P |
| ピン A3 | IO_L1N_T0_0 — User I/O, bank 0, differential pair N |
| ピン B1 | GND — Ground |
| ピン B2 | IO_L2P_T0_0 — User I/O, bank 0 |
| ピン C1 | VCCINT — Internal core logic supply (0.85V) |
| ピン C2 | IO_L3P_T0_0 — User I/O, bank 0 |
| ピン D1 | VCCAUX — Auxiliary supply (1.8V) |
| ピン D2 | IO_L4P_T0_0 — User I/O, bank 0 |
| ピン E1 | GND — Ground |
| ピン E2 | IO_L5P_T0_0 — User I/O, bank 0 |
| ピン F1 | VCCBRAM — Block RAM supply (0.85V) |
主な用途
XCZU9EG-2FFVB1156I の用途: 6 件s: Software-Defined Radio, Industrial Motor Control, Medical Imaging, Aerospace and Defense, Multi-Axis Robotics, Data Center Acceleration.
Software-Defined Radio
The XCZU9EG-2FFVB1156I excels in software-defined radio (SDR) systems. Its 599,550 logic cells and 1,968 DSP slices implement complex digital down-conversion, channelization, and FFT processing. The quad-core Cortex-A53 at 1.3 GHz handles protocol stacks and control plane tasks. The integrated high-speed transceivers support direct RF sampling and gigabit Ethernet backhaul. The programmable logic enables flexible waveform generation and adaptive filtering, while the real-time Cortex-R5 cores manage latency-critical tasks like AGC and frequency hopping. This heterogeneous architecture allows SDR designers to partition signal processing between hardware acceleration and software flexibility, achieving throughput that would require multiple discrete devices.
おすすめ
Industrial Motor Control
The XCZU9EG-2FFVB1156I is ideal for multi-axis industrial motor control. The dual-core Cortex-R5 real-time processors at 533 MHz execute deterministic control loops for current, velocity, and position regulation. The programmable logic implements high-resolution PWM generation, encoder interfaces, and safety logic with sub-microsecond latency. The 599,550 logic cells allow multiple motor control channels on a single device, reducing system cost and complexity. The A53 cores handle HMI, networking, and diagnostics. The device's industrial temperature grade (-40C to +100C) ensures reliable operation in factory environments. The integrated security features protect against unauthorized firmware modification, critical for safety-rated applications.
おすすめ
Medical Imaging
The XCZU9EG-2FFVB1156I supports advanced medical imaging systems such as ultrasound and CT scanners. The programmable logic accelerates image reconstruction algorithms, including beamforming, filtering, and back-projection, using the 1,968 DSP slices and 32.1 Mb of block RAM. The Mali-400 MP2 GPU handles 2D/3D visualization and user interface rendering. The quad-core A53 processors run the main application software and DICOM networking. The high-bandwidth AXI interfaces between PS and PL enable real-time data streaming from sensors to processing pipelines. The device's security features support medical device cybersecurity requirements, and its long-term availability makes it suitable for regulated products with extended lifecycles.
おすすめ
Aerospace and Defense
The XCZU9EG-2FFVB1156I is designed for aerospace and defense applications including radar, electronic warfare, and secure communications. The -2 speed grade and industrial temperature range support harsh environments. The programmable logic implements beamforming, pulse compression, and signal intelligence algorithms. The integrated security features, including RSA authentication and AES decryption, enable secure boot and anti-tamper protection. The quad-core A53 processors handle mission processing and network interfaces. The device's 599,550 logic cells provide ample resources for complex waveform generation and channelization. The 1156-FCBGA package offers robust thermal performance for high-reliability systems. AMD's long-term supply commitment supports defense program lifecycles.
おすすめ
Multi-Axis Robotics
The XCZU9EG-2FFVB1156I enables advanced multi-axis robotics with real-time control and vision processing. The dual-core Cortex-R5 processors execute servo loops at 1 kHz or higher with deterministic timing. The programmable logic implements EtherCAT or Powerlink fieldbus interfaces, encoder decoding, and safety functions. The Mali-400 GPU accelerates 3D visualization for operator interfaces. The A53 cores run ROS (Robot Operating System) and path planning algorithms. The 599,550 logic cells allow integration of vision processing pipelines for object detection and depth sensing. The device's heterogeneous architecture eliminates the need for separate MCU, FPGA, and GPU devices, reducing board space and power consumption in robotic systems.
おすすめ
Data Center Acceleration
The XCZU9EG-2FFVB1156I can accelerate data center workloads such as network processing, storage controllers, and AI inference. The programmable logic implements custom packet processing, compression, and encryption engines. The quad-core A53 processors handle control plane and management functions. The integrated high-speed transceivers support 100GbE and PCIe interfaces. The 599,550 logic cells provide substantial acceleration capacity for offloading tasks from host CPUs. The device's power efficiency (0.85V core) makes it suitable for dense server deployments. The security features enable secure multi-tenant operation. While not as large as dedicated data center FPGAs, the XCZU9EG offers a balanced PS+PL solution for edge and smartNIC applications.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: XCZU9EG-2FFVB1156I — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | XCZU9EG-1FFVB1156I | XCZU9EG-2FFVB1156E | XCZU15EG-2FFVB1156I | XCZU11EG-2FFVB1156I | XCZU7EV-2FFVC1156I |
|---|---|---|---|---|---|---|
| Package | 1156-FCBGA (35x35) | 1156-FCBGA (35x35) - same | 1156-FCBGA (35x35) - same | 1156-FCBGA (35x35) - same | 1156-FCBGA (35x35) - same | 1156-FCBGA (35x35) - different pinout |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 599,550 | 599,550 | 599,550 | 747,300 | 653,100 | 548,160 |
| Speed Grade | -2 | -1 | -2 | -2 | -2 | -2 |
| Temperature Range | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Extended (-40C to +110C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Video Codec | No (EG variant) | No (EG variant) | No (EG variant) | No (EG variant) | No (EG variant) | Yes (EV variant) |
| Core Voltage | 0.85 V | 0.85 V | 0.85 V | 0.85 V | 0.85 V | 0.85 V |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
主な差別化要因
- Higher speed grade than XCZU9EG-1FFVB1156I （vs XCZU9EG-1FFVB1156I)
- More logic cells than XCZU7EV-2FFVC1156I （vs XCZU7EV-2FFVC1156I)
- Industrial temperature grade vs extended （vs XCZU9EG-2FFVB1156E)
設計ノート
The XCZU9EG-2FFVB1156I requires multiple power rails: VCCINT (0.85V), VCCAUX (1.8V), VCCBRAM (0.85V), and various VCCO rails for I/O banks. Power sequencing is critical - VCCINT must ramp before or simultaneously with VCCAUX. Use a dedicated power management IC with programmable sequencing, such as a TI TPS65023 or equivalent. Decouple each rail with a 10uF ceramic capacitor per power pin and a 100nF capacitor for high-frequency noise. The total current draw can exceed 10A on VCCINT under full load, requiring a robust power supply design.
The 1156-FCBGA package can dissipate significant power, potentially exceeding 15W under full utilization. The thermal resistance (theta_JA) is approximately 8-10 C/W without a heatsink. For reliable operation, attach a heatsink with forced airflow or use a heat spreader. The junction temperature must not exceed 100C for the industrial grade. Calculate power dissipation based on logic utilization and I/O activity. Consider using the -2 speed grade at reduced voltage to lower power if timing margins allow.
The 1156-FCBGA package requires a multi-layer PCB with at least 12 layers for proper routing and power distribution. Use controlled impedance for high-speed interfaces: 50 ohm single-ended and 100 ohm differential for transceivers and DDR4. Place decoupling capacitors on the bottom side directly under the BGA pads. Follow AMD's layout guidelines in UG583 (UltraScale+ PCB Design) for transceiver routing, including AC coupling capacitors and via transitions. Ensure adequate ground plane continuity beneath the package for return current paths.
コンプライアンス情報
RoHS compliant per AMD product page. Not AEC-Q100 qualified - this is a commercial/industrial grade device.