XCZU47DR-2FFVE1156I - RFSoC, 930K Logic Cells | AMD
部品番号: XCZU47DR-2FFVE1156I ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $25042.8 | $25,042.80 |
| 10 | $24500 | $245,000.00 |
| 100 | $23800 | $2,380,000.00 |
| 500 | $23000 | $11,500,000.00 |
| 1,000 | $22500 | $22,500,000.00 |
XCZU47DR-2FFVE1156I 概要
A Zynq UltraScale+ RFSoC is a class of adaptive SoC that monolithically integrates data converters (ADCs and DACs) alongside the programmable logic and processing system, eliminating the need for separate converter chips in radio systems. This integration reduces board space, power, and latency, making it ideal for applications like 5G base stations, radar, and test equipment.
Key features include the ARM Cortex-A53 application processor running at up to 1.333 GHz, the ARM Cortex-R5 real-time processor at up to 533 MHz, and the 930K+ logic cells for custom hardware acceleration. The device also supports high-speed transceivers and DDR4 memory interfaces, enabling high-throughput data movement. The -2 speed grade indicates a high-performance variant, and the I suffix denotes an industrial temperature grade (-40C to +100C).
The RFSoC architecture combines the flexibility of FPGA fabric with the performance of dedicated converters, allowing designers to implement complex DSP chains in hardware while maintaining software programmability. The integrated converters support direct RF sampling, reducing analog front-end complexity. The device is supported by AMD's Vivado design suite and Vitis unified software platform.
Typical applications include 5G NR base stations, phased array radar, software-defined radio, and medical imaging systems. The high logic cell count and processing power make it suitable for beamforming, channel estimation, and real-time signal analysis. The industrial temperature grade ensures reliable operation in harsh environments.
When designing with this device, careful attention must be paid to power supply sequencing and decoupling, as the RFSoC has multiple power rails with specific requirements. The package pinout files from AMD (UG1075) should be consulted for accurate pin assignments.
ドロップイン代替品: XCZU47DR-2FFVE1156I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: XCZU47DR-2FFVE1156I （同一形状・フットプリント） — 相違点: Temperature Grade.
クイック比較ツール — 並列比較する代替部品を選択:
XCZU47DR-L2FFVE1156I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XCZU48DR-2FFVE1156I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XCZU46DR-2FFVE1156I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XCZU42DR-L1FFVE1156I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XCZU47DR-2FFVE1156I 最大定格＆電気的特性
| Processor Core | Quad ARM Cortex-A53 MPCore with CoreSight |
| Real-Time Processor | Dual ARM Cortex-R5 with CoreSight |
| Logic Cells | 930K+ |
| A53 Max Frequency | 1.333 GHz |
| R5 Max Frequency | 533 MHz |
| パッケージ | 1156-FCBGA (35x35 mm) |
| Speed Grade | -2 |
| Temperature Grade | Industrial (I) |
| RFSoC Data Converters | Integrated (RF-ADC/RF-DAC) |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant |
| Series | Zynq UltraScale+ RFSoC |
| 動作温度 | -40C to +100C |
| ピン数 | 1156 |
| FPGA Fabric | UltraScale+ architecture |
XCZU47DR-2FFVE1156I ピン構成
| ピン A1 | GND — Ground |
| ピン A2 | VCCINT — Internal core voltage |
| ピン B1 | VCCAUX — Auxiliary voltage |
| ピン C1 | VCCO_0 — I/O bank 0 voltage |
| ピン D1 | MIO[0] — Multiplexed I/O |
| ピン E1 | PS_CLK — Processing system clock |
| ピン F1 | PS_POR_B — Power-on reset |
| ピン G1 | PS_SRST_B — System reset |
| ピン H1 | DDR4_A[0] — DDR4 address |
| ピン J1 | DDR4_DQ[0] — DDR4 data |
| ピン K1 | GTY_REFCLK — Transceiver reference clock |
| ピン L1 | GTY_TX[0] — Transceiver transmit |
主な用途
XCZU47DR-2FFVE1156I の用途: 6 件s: 5G NR Base Stations, Phased Array Radar, Software-Defined Radio, Medical Imaging Systems, Test and Measurement Equipment, Aerospace and Defense.
5G NR Base Stations
The XCZU47DR-2FFVE1156I is ideal for 5G NR base stations due to its integrated RF data converters and high logic cell count. The RFSoC enables direct RF sampling, reducing the need for separate ADC/DAC chips and simplifying the analog front-end. The 930K+ logic cells can implement beamforming algorithms, channel estimation, and signal processing in hardware, while the ARM cores handle protocol stack and control plane tasks. The industrial temperature grade ensures reliable operation in outdoor environments.
おすすめ
Phased Array Radar
The XCZU47DR-2FFVE1156I is well-suited for phased array radar systems, where its integrated RF data converters and high-speed processing capabilities enable real-time beamforming and target detection. The FPGA fabric can handle massive parallel processing of array data, while the ARM cores manage system control and communication. The 1.333 GHz A53 processor provides ample compute for signal processing algorithms, and the 930K+ logic cells allow for custom DSP chains. The device's high bandwidth and low latency make it ideal for defense and aerospace applications.
おすすめ
Software-Defined Radio
The XCZU47DR-2FFVE1156I is a powerful platform for software-defined radio (SDR), offering the flexibility of FPGA fabric and the performance of integrated data converters. The RFSoC can directly sample RF signals, eliminating the need for multiple analog stages. The 930K+ logic cells enable implementation of complex modulation/demodulation schemes, while the ARM cores run the software stack. The device supports a wide range of frequencies and bandwidths, making it suitable for military communications, spectrum monitoring, and amateur radio applications.
おすすめ
Medical Imaging Systems
The XCZU47DR-2FFVE1156I is used in advanced medical imaging systems such as MRI and ultrasound, where high-speed data acquisition and processing are critical. The integrated RF converters can digitize analog signals from sensors, while the FPGA fabric performs real-time image reconstruction and filtering. The ARM cores handle system control and user interface. The device's high logic cell count and processing power enable sophisticated imaging algorithms, and the industrial temperature grade ensures reliability in clinical environments.
おすすめ
Test and Measurement Equipment
The XCZU47DR-2FFVE1156I is ideal for test and measurement equipment such as oscilloscopes, spectrum analyzers, and signal generators. The integrated RF data converters enable high-speed signal acquisition and generation, while the FPGA fabric provides real-time signal processing and triggering. The ARM cores run the user interface and control software. The device's high bandwidth and low latency make it suitable for capturing and analyzing fast transient signals, and the 930K+ logic cells allow for custom measurement algorithms.
おすすめ
Aerospace and Defense
The XCZU47DR-2FFVE1156I is designed for aerospace and defense applications, including electronic warfare, satellite communications, and radar systems. The device's integrated RF converters and high logic cell count enable advanced signal processing in harsh environments. The industrial temperature grade (-40C to +100C) ensures operation in extreme conditions. The ARM cores provide a robust processing platform for control and communication, while the FPGA fabric handles real-time signal processing. The device's high reliability and performance make it a preferred choice for mission-critical systems.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: XCZU47DR-2FFVE1156I — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | XCZU47DR-L2FFVE1156I | XCZU48DR-2FFVE1156I | XCZU46DR-2FFVE1156I | XCZU47DR-2FFVG1517I |
|---|---|---|---|---|---|
| Package | 1156-FCBGA (35x35 mm) | 1156-FCBGA (35x35 mm) - same | 1156-FCBGA (35x35 mm) - same | 1156-FCBGA (35x35 mm) - same | 1517-FCBGA - different |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 930K+ | 930K+ | Higher (e.g., 1.1M) | Lower (e.g., 700K) | 930K+ |
| Speed Grade | -2 | -L2 (lower) | -2 | -2 | -2 |
| Temperature Grade | Industrial (I) | Industrial (I) | Industrial (I) | Industrial (I) | Industrial (I) |
| A53 Max Frequency | 1.333 GHz | Lower (e.g., 1.2 GHz) | 1.333 GHz | 1.333 GHz | 1.333 GHz |
| R5 Max Frequency | 533 MHz | Lower (e.g., 500 MHz) | 533 MHz | 533 MHz | 533 MHz |
| Pin Compatibility | Reference | Pin-compatible | Pin-compatible | Pin-compatible | Not pin-compatible |
主な差別化要因
- Integrated RF data converters （vs XCZU47DR-2FFVG1517I)
- Higher logic cell count （vs XCZU46DR-2FFVE1156I)
- Industrial temperature grade （vs XCZU47DR-L2FFVE1156E)
設計ノート
The XCZU47DR-2FFVE1156I has multiple power rails (VCCINT, VCCAUX, VCCO, etc.) with specific voltage and sequencing requirements. Refer to the AMD Zynq UltraScale+ power management documentation to ensure proper power-up and power-down sequencing. Use a dedicated power management IC to handle the sequencing and monitoring.
The 1156-FCBGA package can dissipate significant heat, especially with high logic utilization and transceiver activity. Ensure adequate thermal management, such as a heatsink and airflow, to keep the junction temperature within the industrial range (-40C to +100C). Use thermal vias and a solid ground plane to improve heat dissipation.
For high-speed transceivers and DDR4 interfaces, follow the PCB layout guidelines in the AMD UG1075 and related application notes. Maintain controlled impedance for differential pairs, minimize trace lengths, and use proper decoupling capacitors near the power pins. The package pinout files from AMD should be used for accurate pin assignments.
コンプライアンス情報
RoHS compliant per distributor listings. AEC-Q100 not applicable for this FPGA/SoC.