FPGA & CPLD
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EP2AGX260FF35C4 - Arria II GX FPGA 244K LE, 1152-FCBGA | Intel
The Intel (formerly Altera) EP2AGX260FF35C4 is a high-density Arria II GX field-programmable gate array (FPGA) from the 40 nm Arria II GX family, integrating 244,188 logic elements, 612 user I/O, 12,038,144 bits of embedded memory, and 612 embedded 18x18 multipliers in a 1152-ball FC-FBGA package. It is specified at the C4 commercial speed grade with a 0.9 V core supply and supports transceiver-rich designs requiring both high logic capacity and high-speed serial I/O. According to the Arria II GX Device Data Sheet referenced on Altera/Intel documentation portals, the FF35 package denotes the 35 mm FC-BGA footprint used for the highest-density Arria II GX members. The Arria II GX family occupies the mid-to-high tier of Altera/Intel FPGAs and is positioned between the lower-power Cyclone families and the high-end Stratix families. FPGAs in this class are typically used in applications that demand hundreds of thousands of logic elements together with multi-gigabit transceivers, on-chip memory blocks, and DSP multipliers, all without migrating to a Stratix-class device. The Arria II GX line introduced integrated transceivers operating up to 6.375 Gbps and hard PCIe Gen2 IP blocks, making it attractive for cost-sensitive yet transceiver-rich designs. Key features of the EP2AGX260FF35C4 include 244,188 logic elements organized into 10,260 logic array blocks (LABs), 612 maximum user I/O pins routed through 12 I/O banks supporting multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL), and 612 18x18 hardware multipliers for DSP. The FF35 speed/package combination delivers the highest logic density and pin count in the family while maintaining the commercial junction temperature range. Typical applications include high-definition video broadcast equipment, wireless baseband processing, PCIe Gen2 endpoint/root-port designs, ASIC prototyping, and high-speed serial interface aggregation (e.g., multi-channel SATA, SAS, or CPRI). The FF35 package is also widely used in defense and test-and-measurement platforms where dense, transceiver-capable FPGAs are required. Designers should consult the Arria II GX handbook and AN551 guidance for transceiver channel placement and PCB stack-up recommendations when targeting multi-gigabit links. When designing with this device, pay close attention to transceiver reference clock architecture, PLL configuration, and decoupling strategies; the FF35 package's 1152-ball count requires careful escape routing. Quartus II software (with Arria II GX device support) is the required toolchain for synthesis, place-and-route, and configuration bitstream generation.
EP2AGX260FF35C4G - Arria II GX FPGA 244K LE, 6.375Gbps, FC-FBGA-1152 | Intel
The Intel (formerly Altera) EP2AGX260FF35C4G is a high-density Arria II GX Field-Programmable Gate Array with 244,188 logic elements, 12,038,144 embedded memory bits, and integrated transceivers capable of up to 6.375 Gbps, housed in a 1152-pin FC-FBGA package. Built on a 40nm low-power process with a 0.9V core voltage, the device targets mid-range applications requiring a balance of logic density, on-chip memory bandwidth, and multi-gigabit serial I/O. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O elements that the designer can reconfigure after manufacturing. Within the broader taxonomy, the EP2AGX260FF35C4G belongs to the Arria II GX mid-range transceiver family, which sits between Cyclone (low-cost) and Stratix (high-performance) in Intel/Altera's portfolio. Arria II GX parts integrate transceivers and PCML-capable I/O on-chip, replacing what would otherwise require a discrete PHY plus an FPGA. Key features include 244,188 logic elements, 612 user I/O, 12 Mbits of embedded memory, 4 PCI Express hard IP blocks, and 8 transceivers supporting protocols such as PCI Express Gen1/Gen2, Serial RapidIO, and CPRI. The device supports up to 1,152 pins in a wire-bond-compatible FC-FBGA with high-speed serial channels, allowing a single-chip implementation for high-bandwidth serial links. Additional silicon features include dedicated DSP blocks, variable-precision multipliers, and embedded memory blocks configurable as RAM, ROM, or FIFO. The Arria II GX architecture combines hard intellectual property (PCIe Gen2, 10-Gbps-capable transceivers, and external memory controllers) with a fabric of 8-input adaptive logic modules (ALMs) that optimize register and LUT packing. This yields high logic efficiency and lets the device hit DSP throughput targets (up to ~300 GMACs at 500 MHz) without consuming excessive fabric resources. The transceiver blocks incorporate adaptive equalization and clock-data-recovery to handle backplane losses at multi-Gbps rates. Typical applications include wireless baseband processing (LTE, WiMAX, CPRI front-haul), industrial video and broadcast interfaces, PCI Express Gen1/Gen2 endpoint and root-port designs, and high-speed serial backplane bridges in telecom and defense equipment. The combination of integrated transceivers and hard PCIe cores eliminates companion chips in many systems, reducing both BOM and board complexity. When designing with this device, ensure the PCB supports the FC-FBGA-1152 ball grid with controlled-impedance routing for the transceiver channels. Reference design guidance for transceiver channel layout, decoupling, and JTAG is provided in the device handbook, and designers should plan power sequencing around the 0.9V core rail with the supported 1.1V / 2.5V / 3.0V auxiliary rails. This page synthesizes distributor pricing, drop-in same-package alternatives (Arria II GX speed-grade variants), and practical design notes that go beyond what is summarized in the manufacturer datasheet, helping engineers shortlist a part number without having to compare datasheets line-by-line.
EP2AGX260FF35C4N - Arria II GX 244K LE FPGA, 612 I/O, FCBGA-1152
The Altera (Intel) EP2AGX260FF35C4N is a high-density Arria II GX Field-Programmable Gate Array (FPGA) built on a 40 nm process, integrating 244,188 logic elements and 12,038,144 bits of embedded memory in a 1152-ball FineLine BGA (FC-FBGA) package. It supports up to 612 user I/O, 8 transceiver channels at up to 5 Gbps, and a core voltage of 0.9 V with a -4 speed grade suitable for commercial-temperature designs. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device containing an array of configurable logic blocks, dedicated DSP blocks, on-chip memory, and high-speed transceivers, all interconnected by a programmable routing fabric. FPGAs belong to the broader hierarchy of programmable logic devices (PLDs) within the integrated circuit / semiconductor taxonomy, and are widely used for parallel processing, custom digital logic, and high-speed serial interface implementation where ASICs would be uneconomical or too slow to design. Key features include 8 transceivers at up to 5 Gbps for PCI Express Gen2, Serial RapidIO, and CPRI links, integrated PCI Express hard IP blocks, and up to 612 user I/O supporting LVDS, LVTTL, LVCMOS, HSTL, and SSTL standards. The device also provides dedicated 18x18 multipliers and variable-precision DSP blocks for high-performance DSP pipelines. The 1152-ball FC-FBGA package enables high I/O density while supporting both single-ended and differential signaling at multi-gigabit data rates. Arria II GX FPGAs target mid-range applications where Stratix-class performance is not required but transceiver integration and DSP throughput remain essential. The 40 nm process node balances static and dynamic power, and the architecture supports hard IP for PCIe Gen2 x1/x4 and external memory interfaces including DDR3, DDR2, and QDRII+. The combination of high logic density, embedded transceivers, and dedicated DSP silicon makes the EP2AGX260 well-suited for communications infrastructure, broadcast video, and test-and-measurement platforms. Typical applications include wireless baseband processing, software-defined radio (SDR) prototyping, video broadcast and encoding platforms, 4G/LTE protocol stacks, radar and beamforming front-ends, industrial PCIe cards, and high-performance DSP co-processing. The integrated transceivers also suit SATA, CPRI/OBSAI, and Serial RapidIO interconnect fabrics in telecom infrastructure. When designing with the EP2AGX260FF35C4N, ensure the PCB has matched-impedance routing for all transceiver lanes, sufficient decoupling (typically 0402/0201 ceramics) at every power pin, and a thermal solution sized for the application power envelope. Confirm Quartus II support for the FF35C4N variant and that your transceiver reference clock meets the jitter requirements of the targeted serial protocol. This page synthesizes drop-in alternative MPNs, application-specific design notes, and a parameter-by-parameter comparison that complement - but do not replace - the manufacturer datasheet.
EP2AGX260FF35C5 - Arria II GX FPGA 260K LE, 612 I/O FCBGA-1152 | Intel / Altera
The Intel / Altera EP2AGX260FF35C5 is a high-density Arria II GX Field-Programmable Gate Array (FPGA) built on a 40 nm low-power process, delivering up to 244,188 logic elements (244K LE), 12,038,144 bits of embedded memory (about 1.5 MBytes), and 612 user I/O pins housed in a 1152-ball Fine-pitch Chip-Scale BGA (FCBGA-1152 / FBGA-1152) package. Arria II GX FPGAs are mid-range programmable logic devices (PLDs) that combine high-performance digital signal processing (DSP) blocks with multi-gigabit transceivers (MGTs) for serial connectivity. In the broader component taxonomy they sit under programmable logic -> FPGA -> PLD -> semiconductor, and they are complemented by fixed-function ASICs in cost-down high-volume applications and by microcontrollers in software-driven control tasks. The Arria II family specifically bridges the gap between Cyclone (low-cost) and Stratix (high-performance) families by targeting designs that need transceiver-based serial I/O plus sufficient logic density for parallel DSP and memory-intensive algorithms. Key features of the EP2AGX260FF35C5 include eight 6.375 Gbps multi-gigabit transceivers (C5 speed grade), embedded transceivers supporting PCIe Gen1/Gen2 and multiple SRIO / Serial RapidIO / 10G Ethernet protocols, hard PCI Express hard IP blocks, dedicated DSP blocks for high-speed arithmetic, programmable logic fabric supporting up to 244,188 equivalent logic elements, 12 Mbit of on-chip block RAM, and the FCBGA-1152 package with exposed thermal lid for efficient thermal dissipation. Operating supply voltages are typically 0.9 V core and 1.1 V / 2.5 V / 3.3 V I/O rails with the C5 commercial temperature grade (0 C to +85 C). Architecturally, the EP2AGX260FF35C5 uses an SRAM-based lookup-table (LUT) logic fabric with column- and row-based routing, dedicated memory block RAM (M20K) tiles, and variable-precision DSP blocks. Each transceiver channel includes clock-data recovery (CDR), serializer / deserializer (SERDES) hardware, and protocol-aware PCS logic to support industry-standard serial interfaces. The device is configured via JTAG or active/passive serial flash, and design entry uses Quartus II / Quartus Prime software. Typical applications include high-speed serial interface prototyping cards, PCIe Gen2 endpoint adapters, 10G Ethernet line cards, broadcast video processing, military / aerospace signal processing, and ASIC / ASSP prototyping. The wide transceivers and DSP capability make the device a frequent choice for DSP-heavy FPGA-based mezzanine cards (FMC / VITA-57). When selecting the EP2AGX260FF35C5, designers should plan for a multi-layer PCB with controlled-impedance transceiver lanes, a robust power distribution network with multiple decoupling caps per rail, and thermal relief through via arrays under the package lid. Quartus Prime design software (with device support for Arria II) is required for synthesis, place-and-route, and bitstream generation. This page consolidates distributor pricing, same-package drop-in alternatives, and practical design considerations - a synthesis not found in any single manufacturer datasheet, distributor product page, or parametric database.
EP2AGX260FF35C5G - Arria II GX FPGA 244K LE, 612 I/O | Intel
The Intel EP2AGX260FF35C5G is a high-density Arria II GX Field-Programmable Gate Array (FPGA) delivering 244,188 logic elements, 12,038,144 bits of embedded memory, and 612 user I/O in a 1152-ball FineLine BGA (FCBGA) package. As a member of Intel's (formerly Altera) mid-range Arria II GX family, this device targets cost-sensitive, transceiver-rich applications with up to 16 high-speed transceivers and embedded transceivers operating at data rates from 600 Mbps to 6.375 Gbps. The "C5" speed grade and commercial temperature rating position this part for mainstream design cycles where engineering-grade thermal envelopes are acceptable. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be reconfigured by the customer after manufacturing to implement virtually any digital logic function. FPGAs sit in the programmable logic taxonomy: FPGA -> programmable logic -> logic IC -> digital IC -> integrated circuit -> semiconductor. Arria II GX FPGAs occupy the mid-density tier between Cyclone (low-cost) and Stratix (high-performance) families, integrating transceivers, DSP blocks, and on-chip memory for signal-processing and protocol-bridging designs. Key features of the EP2AGX260FF35C5G include 8-input adaptive logic modules (ALMs), 312 hardware DSP blocks with up to 18x18-bit multipliers and accumulators, 244K logic elements, and 9.4 Mbits of internal RAM distributed across M20K blocks. Peripherals include PCI Express hard IP, external memory interfaces supporting DDR2/DDR3/QDRII/RLDRAM, and up to 16 embedded transceivers. The 1152-ball FCBGA package provides high pin density for high-bandwidth I/O. The Arria II GX architecture pairs a logic fabric with 6.375 Gbps transceivers, 8-bit SERDES, and hard PCIe Gen1/Gen2 IP, allowing engineers to consolidate protocol bridging, video processing, and DSP functions on a single chip. The C5 speed grade delivers a balance of Fmax and timing margin for cost-driven commercial systems. Typical applications include video broadcast infrastructure, wireless baseband processing, telecom backhaul, industrial imaging, and PCI Express adapter cards. This combination of high logic density, on-chip transceivers, and embedded DSP makes the EP2AGX260FF35C5G particularly suited for systems that previously required a discrete ASSP plus an FPGA. When designing with this part, ensure your PCB accommodates 1 mm pitch BGA routing with proper microvia stack-ups, and validate thermal envelopes against the FCBGA junction-to-ambient resistance. Plan power-rail sequencing around the Arria II GX POR (power-on-reset) requirements and verify transceiver reference-clock jitter budgets before tape-out. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical PCB/timing design notes not found in the manufacturer datasheet alone.
EP2AGX260FF35C5N - 244K LE Arria II GX FPGA | Intel | 1152-FBGA
The Intel EP2AGX260FF35C5N is a high-density Arria II GX Field Programmable Gate Array (FPGA) delivering 244,188 logic elements, 12,038,144 bits of embedded memory, and 736 (18x18) hardware multipliers in a 1152-ball flip-chip BGA package. It integrates 612 user I/Os, 48 SERDES channels, and 8 phase-locked loops (PLLs) supporting transceiver rates up to 3.75 Gbps, enabling high-throughput serial connectivity for digital signal processing, video bridging, and high-speed data aggregation systems. The C5 speed grade and -40C to +85C operating temperature range target industrial-grade applications requiring deterministic timing closure. What is an FPGA? A Field Programmable Gate Array is a semiconductor device containing programmable logic blocks, interconnect fabric, and I/O elements that engineers can configure after manufacture to implement custom digital circuits. FPGAs occupy a unique position in the silicon hierarchy: more flexible than Application-Specific Integrated Circuits (ASICs), lower-latency than microprocessors for parallel workloads, and increasingly competitive with Graphics Processing Units (GPUs) for streaming compute tasks. The Arria II GX family specifically adds hardened multi-gigabit transceivers, positioning it for protocols such as PCIe Gen1, Serial RapidIO, Gbps Ethernet, and CPRI/OBSAI in wireless backhaul. Key features include 10260 Logic Array Blocks (LABs), 4 fractional PLLs plus 4 general-purpose PLLs, dedicated DDR2/DDR3 memory controllers with hard PHY, and on-chip tri-speed Ethernet MACs. The 1152-pin FCBGA package uses Intel's flip-chip interconnect technology to deliver superior electrical performance and thermal dissipation for high-utilization designs. The EP2AGX260FF35C5N uses a 40nm process node, balancing static power consumption with 8-input adaptive logic modules (ALMs) that deliver up to 1.7x the performance of previous-generation 6-input LUT architectures. The integrated transceiver block achieves jitter performance below 2 ps RMS, making the device suitable for synchronous Ethernet and SONET/SDH interfaces. Typical applications include wireless baseband processing, military radar signal processing, medical imaging systems, high-definition video broadcast equipment, and ASIC prototyping platforms. The 48 transceiver channels support multiple CPRI links to remote radio heads in 4G LTE base stations, while the embedded memory bandwidth suits FFT engines for OFDM modulation/demodulation. When designing with the EP2AGX260FF35C5N, designers must use Intel Quartus II (or the newer Quartus Prime) design software for synthesis, place-and-route, and timing analysis. The 1152-ball FCBGA package requires high-density PCB fabrication (typically 8-12 layers with microvia stack-ups) and assembly with BGA-grade SMT processes. Power estimation should account for the dynamic power of 48 high-speed transceivers running at full rate.
EP2AGX260FF35C6 - Arria II GX 244K LE FPGA, 612 I/O, FC-FBGA-1152 | Intel (Altera)
The Intel (Altera) EP2AGX260FF35C6 is a high-density, transceiver-equipped Field Programmable Gate Array (FPGA) from the Arria II GX family, housed in a 1152-ball FC-FBGA (Flip-Chip Fine-pitch Ball Grid Array) package with 612 user I/O pins. Built on a 40 nm low-power process, it integrates approximately 244,188 logic elements and 12,038,144 memory bits, delivering mid-range density combined with multi-gigabit transceivers and an 18x18 multiplier count that makes it well-suited for DSP-intensive designs. According to distributor data, this device is part of the Arria II GX family of mid-range FPGAs targeting serial connectivity, video processing, and wireless baseband. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing to implement arbitrary digital logic. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs), themselves a sub-category of digital integrated circuits. Within Intel's product portfolio, Arria II GX occupies the mid-range tier between low-power Cyclone series and high-performance Stratix series, balancing cost, performance, and transceiver capability. The 40 nm process node enables lower static and dynamic power than the previous 65 nm generation while preserving up to 612 user I/O for high-bandwidth parallel interfaces. Key features of the EP2AGX260FF35C6 include 244,188 logic elements organized into 10,260 Logic Array Blocks (LABs), 12,038,144 bits of embedded memory for buffers and FIFO implementations, dedicated 18x18 hardware multipliers for DSP pipelines, integrated multi-gigabit transceivers operating up to 6.375 Gbps for protocols such as PCIe Gen2, Serial RapidIO, and Gigabit Ethernet, a hard PCI Express Gen2 controller block, and rich clock management with PLLs. The -C6 speed grade and 0.9 V core supply place this part in the commercial-grade mid-speed tier of the family. With 1152 balls in a 35 mm FC-FBGA package, the device requires multilayer PCB design with controlled-impedance routing and BGA assembly capability. From an architectural perspective, the Arria II GX series employs an island-style logic fabric with dedicated carry chains, distributed M9K memory blocks, MLAB logic-mode blocks, and variable-precision DSP blocks. Transceivers integrate hard PCS (Physical Coding Sublayer) and PMA (Physical Medium Attachment) layers, allowing soft logic to focus on user data-plane processing rather than low-level serialization. Hard memory controllers and the PCIe Gen2 controller further reduce soft-logic overhead, shortening time-to-market for designers. Typical applications include wireless baseband and digital pre-distortion (DPD) for radio units, broadcast video processing and switching, PCIe Gen2 endpoint cards, high-speed serial backplane aggregation, and industrial imaging pipelines. The combination of mid-density logic, embedded transceivers, and PCI-SIG-certified hard IP explains why Arria II GX remains attractive for cost-sensitive serial-connectivity designs even after the family was transitioned to legacy status. Designers should note that the FF35 FC-FBGA-1152 package requires a substantial PCB escape area and a stackup capable of routing 1.0 mm pitch BGA fanout. Multi-gigabit transceiver channels demand strict impedance control, length matching, and AC-coupling capacitor selection per Intel's Arria II GX Transceiver Layout Guidelines. Power-rail sequencing (1.0 V core, 2.5 V/3.3 V I/O banks, PLL analog supplies) must follow the datasheet Power-On Reset (POR) requirements to avoid latch-up during ramp. This page synthesizes distributor pricing, drop-in pin-compatible speed-grade alternatives, and practical high-speed BGA layout notes that go beyond the manufacturer datasheet alone.
EP2AGX260FF35C6G - Arria II GX FPGA 244K LE | Intel | 1152-FCBGA
The Intel EP2AGX260FF35C6G is a high-performance, low-power Arria II GX Field-Programmable Gate Array (FPGA) housed in a 1152-ball FineLine BGA (FCBGA) package. It integrates 244,188 logic elements, 12,038,144 bits of embedded memory, 612 embedded 18x18 multipliers, and 16 transceivers supporting data rates up to 6.375 Gbps. The device targets mid-range applications that need both logic density and multi-gigabit serial I/O without sacrificing power efficiency. An FPGA is a reconfigurable integrated circuit whose logic, memory, and I/O blocks are defined by a configuration bitstream rather than fixed masks. The Arria II GX family sits within Intel's (formerly Altera) mid-range product hierarchy: FPGA -> programmable logic -> PLD -> semiconductor. Compared with CPLDs, FPGAs offer far higher logic density and block-RAM; compared with ASICs, FPGAs provide rapid prototyping and post-silicon field upgrades through partial reconfiguration. Key features include 8 PLLs for clock management, support for DDR2/DDR3/QDRII+ external memory interfaces, integrated PCI Express hard IP blocks, and transceivers compliant with PCIe Gen1/Gen2, GIGE, XAUI, and Serial RapidIO protocols. Hard DSP blocks accelerate fixed- and floating-point operations, while the Quartus II design suite provides synthesis, place-and-route, and timing closure for the device. The C6 speed grade denotes a mid-tier performance bin optimized for industrial and commercial designs. The Arria II GX architecture uses a 40 nm process node, delivering sub-watt static power and dynamic power gated through the Quartus PowerPlay tool. Distributed and column-based M20K memory blocks deliver up to 612 embedded multipliers for high-throughput DSP pipelines, while 24 global clock networks support complex multi-clock-domain SoC designs. Typical applications include wireless baseband processing, high-speed serial bridge and protocol conversion, broadcast video processing, industrial machine vision, and PCI Express endpoint cards. The transceiver count and protocol support also make the part suitable for telecom backhaul aggregation and test-and-measurement instrumentation front ends. When designing with the EP2AGX260FF35C6G, allocate adequate PCB area for the FCBGA escape routing and a minimum 8-layer stack-up for transceiver signal integrity. Use the Quartus II transceiver toolkit for pre-emphasis and equalization tuning, and verify the JTAG chain against the BSDL file before bringing up prototype boards. This page synthesizes current distributor pricing, package-matched drop-in alternatives from the same Arria II GX family, and design notes that complement the official datasheet.
EP2AGX260FF35C6N - Arria II GX 244K LE FPGA, 1152-FBGA | Intel
The Intel (Altera) EP2AGX260FF35C6N is a high-density Arria II GX Field Programmable Gate Array (FPGA) delivering 244,188 logic elements, 612 user I/O, and 10,260 Logic Array Blocks (LABs) in a 1152-ball FineLine Ball-Grid Array (FBGA) package. Built on a 40 nm CMOS process with 0.9 V core supply, it operates at up to 400 MHz and integrates up to 12,038,144 bits of embedded memory plus dedicated transceivers for high-speed serial I/O. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit built from an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect. FPGAs occupy a distinct tier in the programmable logic hierarchy (FPGA -> programmable logic -> ASIC prototyping -> digital IC -> semiconductor), enabling parallel hardware execution, deterministic latency, and post-fabrication reprogrammability. Compared with general-purpose microcontrollers, FPGAs deliver substantially higher I/O throughput and per-clock computation for data-path intensive workloads. Key differentiating features of the EP2AGX260FF35C6N include its 244K logic-element capacity, integrated PCI Express hard IP, multi-gigabit transceivers (MGTs) supporting protocols such as PCIe Gen2, Serial RapidIO, XAUI, and CPRI, and on-chip memory blocks with hardware FIFO controllers. The 1152-FCBGA package exposes 612 user I/O pins to support wide parallel buses, external memory interfaces (DDR2/DDR3/QDRII+/RLDRAM II), and multiple high-speed serial links simultaneously. Architecturally, the device uses a heterogeneous fabric that combines 4-input ALMs (Adaptive Logic Modules), M9K and M144K memory blocks, MLABs, and DSP blocks operating at 400 MHz fabric speed. The transceiver block delivers up to 6.375 Gbps data rate, while the hard PCIe Gen2 controller supports x1/x4 lane configurations, eliminating soft-logic timing closure on the most demanding serial interfaces. Typical applications include high-speed serial interface bridging, digital video broadcasting, wireless baseband processing, defense and aerospace signal processing, and ASIC prototyping. The combination of high logic density, embedded transceivers, and large on-chip memory makes it well suited to throughput-bound designs that would otherwise require multiple discrete components. When designing with this part, plan power-rail decoupling carefully - the 0.9 V core, 1.1 V PLL, and 2.5 V/3.3 V I/O supplies each require bulk and high-frequency ceramic capacitors near the balls. Use Intel Quartus II or Quartus Prime for place-and-route, and respect simultaneous-switching-output (SSO) guidelines for the 612 I/O to maintain signal-integrity margins. This page synthesizes distributor pricing, drop-in alternatives, and practical design considerations not consolidated on any single distributor page, providing engineers with an actionable decision-support reference.
EP2AGX260FF35I3G - Arria II GX FPGA, 244K LE, 1152-FBGA | Intel
The Intel (formerly Altera) EP2AGX260FF35I3G is a high-density Arria II GX Field-Programmable Gate Array (FPGA) built on a 40 nm process, integrating 244,188 logic elements, 12,038,144 bits of embedded memory, and 612 user I/O pins in a 1152-ball FineLine Ball-Grid Array (FC-FBGA) package. The Arria II GX family is engineered for high-throughput serial connectivity, providing up to 16 transceivers at data rates suitable for PCI Express Gen2, Serial RapidIO, and multi-gigabit serial interfaces in a single programmable device. The device operates from a 0.9 V core supply with separate transceiver and auxiliary rails, and the speed grade 3 (I3) variant balances timing margin and maximum frequency for industrial temperature operation. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks, programmable interconnect, and dedicated hard IP such as transceivers and memory blocks. FPGAs occupy the top of the programmable-logic taxonomy: PLA -> CPLD -> FPGA -> SoC FPGA, and are widely used when time-to-market and design flexibility outweigh the per-unit cost advantage of an ASIC. The Arria II GX family specifically targets the mid-range transceiver-integrated segment between Cyclone (low cost) and Stratix (highest performance). Key features include embedded transceivers, hard PCI Express Gen2 IP cores, embedded memory blocks with byte-enable parity, dedicated DSP blocks for high-throughput signal processing, and configuration support via JTAG, Active Serial, Passive Serial, and Fast Passive Parallel modes. The device supports hot-socketing and in-system programming for production-line flexibility. Industrial temperature grade (I3 suffix) supports -40 C to +100 C operation, while the trailing G indicates lead-free / RoHS-compliant lead finish on the BGA balls. Typical applications include wireless baseband processing, high-speed serial bridging between ASICs, military radar signal processing, broadcast video engines, and PCI Express endpoint / root-port prototyping. For new designs, designers should consider migrating to Intel Cyclone V GT, Arria V GX, or Arria 10 GX families, as Arria II GX is in its end-of-life window and is increasingly sourced through distributors rather than direct Intel channels. A practical design tip: Arria II GX transceivers require careful attention to reference-clock jitter and PCB stack-up for the channel. Use the Quartus II transceiver toolkit to characterize link margin, and de-rate the line rate by at least 10-15% during board bring-up to absorb manufacturing tolerance. This page synthesizes distributor stock and pricing, parametric alternatives, and design notes not found in the Altera Arria II GX Device Handbook, providing an at-a-glance procurement reference for engineers and NPI buyers evaluating this legacy high-density FPGA.
EP2AGX260FF35I3N - 244K LE Arria II GX FPGA | Intel (Altera)
The Intel (formerly Altera) EP2AGX260FF35I3N is a high-density Arria II GX field-programmable gate array (FPGA) integrating 244,188 logic elements, 12,038,144 bits of embedded memory, and 612 user I/Os in a 1152-ball flip-chip BGA (FCBGA, 35 x 35 mm) package. The Arria II GX family targets mid-range applications requiring integrated transceivers for high-speed serial connectivity, combining a hardened 6.375 Gbps transceiver PHY with a low-power adaptive logic module (ALM) fabric to deliver a balanced power/performance profile for protocol bridging, video processing, and DSP-intensive designs. An FPGA (field-programmable gate array) is a reconfigurable semiconductor device whose logic functionality is defined after manufacture by the user. Architecturally the FPGA sits within the broader category of programmable logic devices (PLDs) and competes with CPLDs on the low end and ASICs on the high end. FPGAs consist of an array of configurable logic blocks (ALMs/LEs), programmable interconnect, embedded memory (block RAM), DSP blocks, clock management PLLs, and high-speed transceiver/IO tiles. They are widely used to prototype logic, accelerate parallel algorithms, and provide reconfigurable interfaces in telecom, broadcast, defense, and industrial systems. Key features of the EP2AGX260FF35I3N include 10260 LABs/CLBs, 612 I/O pins, embedded 6.375 Gbps multi-gigabit transceivers for protocols such as PCIe Gen1/Gen2, Serial RapidIO, XAUI, CPRI, and Gbps Ethernet, hard PCIe Gen1/Gen2 IP blocks, up to 16 global clock networks, and dynamic on-chip termination (OCT). The device operates from a 1.0 V core supply, supports configuration via fast passive parallel (FPP), active serial (AS), passive serial (PS), and JTAG modes, and is rated for the industrial temperature range (-40 C to +100 C case). The Arria II GX architecture uses an adaptive logic module (ALM) building block that combines 8-input fracturable look-up tables with dedicated arithmetic and register chains, increasing effective logic density by approximately 25 % over previous-generation 4-input LUT architectures. Multi-track routing and optimized pipeline registers enable sustained DSP throughput above 300 MHz, which is essential for wireless baseband and video codec pipelines. Hard memory controllers and variable-precision DSP blocks coexist with user-configurable fabric, allowing designers to instantiate high-bandwidth packet buffers and FFT engines without consuming programmable logic. Typical applications include wireless baseband processing (LTE, WiMAX), video infrastructure (broadcast encoders, transcoders, display controllers), high-speed serial protocol bridging (PCIe, Serial RapidIO, Gbps Ethernet), test and measurement instrumentation, and radar signal processing. Designers typically pair the FPGA with DDR2/DDR3 SDRAM, external flash for configuration storage, and an FPGA power supply such as the Intel Enpirion EN63A0QI or Linear Technology (Analog Devices) LTM4620/LTM4644 multi-rail controller to meet the 1.0 V core and 2.5 V/3.3 V aux rail requirements. When designing with this device, ensure 0.1 uF + 10 uF decoupling is placed adjacent to every power pin, follow the FCBGA escape and via-in-pad recommendations in the Arria II device handbook, and use Quartus II (or the later Quartus Prime) for synthesis, place-and-route, and timing closure. Estimating: total power at full transceiver utilization approaches 15-20 W and requires a multi-layer PCB with at least 2 oz copper and a thermal management plan (heat spreader or heatsink with controlled airflow) to keep the junction temperature within limits. This page synthesizes distributor pricing, same-package drop-in alternatives drawn from the Site MPN list, and practical FPGA design notes not found in a single datasheet reference, giving design engineers a one-stop engineering summary for the EP2AGX260FF35I3N.
EP2AGX260FF35I3NAA - Arria II GX FPGA 260K LE | Altera | BGA
The Altera (Intel) EP2AGX260FF35I3NAA is a high-density Arria II GX Field-Programmable Gate Array (FPGA) integrating 244,188 logic elements, 12,038,144 embedded memory bits, and 612 hardware multipliers in a 1152-ball FineLine BGA (FBGA-1152) package. Built on a 40 nm process, the device delivers up to 8.5 Gbps transceiver operation across 12 transceivers for high-bandwidth serial I/O, making it a system-on-chip solution for performance-critical embedded designs. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks, programmable interconnect, and dedicated hardware resources such as block RAM, DSP slices, and (in modern families) high-speed transceivers. FPGAs sit at the same level in the broader taxonomy as ASICs and microcontrollers, but unlike ASICs they can be re-programmed in the field to implement custom digital logic, glue logic, parallel processing pipelines, or even entire soft-core processor systems. The Arria II GX family targets mid-range applications that require a balance of logic density, on-chip memory, and integrated multi-gigabit transceivers without the power and cost of a Stratix-class device. Key features of the EP2AGX260FF35I3NAA include 8 user I/O banks supporting a wide range of single-ended and differential I/O standards (LVDS, LVPECL, HSTL, SSTL), dedicated DDR2/DDR3 memory controller hard IP, and 6 PLLs for clock management. The device operates across an industrial temperature range of -40C to +100C and supports the FF35 speed grade with I3 (-40C to +100C industrial) designation. The integrated transceivers support protocols including PCI Express Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, XAUI, and CPRI, eliminating the need for external PHY chips in many designs. Typical applications include telecom baseband processing, software-defined radio (SDR), military radar signal processing, video broadcast infrastructure, and high-speed serial protocol bridging. The combination of 244K logic elements with 12 Mbit embedded RAM makes the EP2AGX260 particularly well suited for data path intensive functions such as FFT processing, packet classification, and digital up/down conversion. When designing with this 1152-ball FBGA device, careful PCB layout with microvia stack-up, matched-length high-speed traces, and a robust power distribution network with multiple decoupling capacitors are mandatory. Thermal management should account for the industrial temperature grade and possible high transceiver utilization. This page synthesizes distributor pricing, drop-in alternative cross-references within the Arria II GX family, and practical design notes not consolidated in the manufacturer datasheet alone.
EP2AGX260FF35I5 - Arria II GX FPGA, 244K LE, 612 IO | Intel
The Intel (formerly Altera) EP2AGX260FF35I5 is a high-density Arria II GX Field Programmable Gate Array (FPGA) with 244,188 logic elements, 612 user I/Os, 12,038,144 memory bits, and integrated transceivers, housed in a 1152-ball Flip-Chip BGA (FCBGA) package. Built on a 40nm process, it operates from a 0.9V core supply and is specified for the industrial temperature range (-40C to +100C, I5 grade). The FF35 device code indicates the 35mm package footprint with the industrial speed/temperature grade. What is a FPGA? A Field-Programmable Gate Array is a semiconductor device containing programmable logic blocks (logic elements, LABs, DSP blocks, and memory blocks) interconnected by a configurable routing matrix. FPGAs sit at the top of the programmable logic hierarchy (PLD -> CPLD -> FPGA) and deliver hardware-level parallelism that microcontrollers cannot match. The Arria II GX family specifically targets mid-range applications that require embedded transceivers, making them part of the transceiver-equipped FPGA category alongside Stratix and Cyclone families. Key specifications include up to 16 transceivers with rates from 600 Mbps to 6.375 Gbps, dedicated DSP blocks for high-performance fixed/floating-point math, embedded hard IP for PCIe Gen2 and external memory interfaces (DDR3, QDRII+, RLDRAM2), and 12.5 Gbps LVDS support. The 35x35mm FCBGA package uses flip-chip technology for high pin density and superior thermal performance, enabling sustained operation in industrial environments. The Arria II GX architecture combines a logic fabric with hard IP for transceivers, PCI Express, and memory controllers, balancing flexibility with deterministic performance. Its 40nm low-power process reduces static and dynamic power relative to the prior Stratix IV generation, while the GX variant's integrated transceivers eliminate the need for external PHY chips in serial-protocol designs. Typical applications include high-speed serial-protocol bridging (PCIe, SATA, CPRI, XAUI), wireless baseband processing, broadcast video processing, military/aerospace signal processing, and industrial imaging. The combination of 244K logic elements and embedded transceivers suits mid-volume designs where ASIC NRE cost is prohibitive but microcontrollers or DSPs lack required throughput. Design consideration: the 0.9V core and multiple auxiliary rails require careful power-sequence design; failure to follow Intel's recommended ramp ordering may cause latch-up. The 1152-ball BGA also demands controlled-impedance PCB stackup and assembly via X-ray inspection. This page synthesizes distributor pricing, drop-in Arria II GX alternatives, and practical design considerations beyond the datasheet - giving engineers a fast procurement and selection reference for high-density FPGA designs.
EP2AGX260FF35I5G - Arria II GX FPGA, 244K LE, 1152-FCBGA | Intel
The Intel (formerly Altera) EP2AGX260FF35I5G is a high-density Arria II GX Field Programmable Gate Array (FPGA) built on a 40nm process, delivering 244,188 logic elements, 612 user I/O pins, and 12,038,144 bits of embedded memory in a 1152-ball FC-FBGA package. It integrates up to 12 transceiver channels supporting multi-gigabit serial connectivity, making it a mid-range, transceiver-rich platform for high-speed serial and parallel digital designs. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP blocks such as transceivers, memory controllers, and DSP slices. FPGAs belong to the broader family of programmable logic devices (PLDs) and are positioned in the system hierarchy as: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. Unlike ASICs, FPGAs are reprogrammable in-system, enabling rapid prototyping, hardware acceleration, and design iteration without NRE cost. The EP2AGX260FF35I5G core operates at 0.9V with up to 500 MHz internal performance. Key features include embedded 18x18 multipliers for DSP, dedicated high-speed transceivers (CPRI, PCIe, Gigabit Ethernet, Serial RapidIO), on-chip memory, and PLL-based clock management. The Arria II GX architecture balances logic density, transceiver bandwidth, and power efficiency, targeting mid-volume applications. Designed on TSMC's 40nm process, the device combines a high-logic-count fabric with multi-gigabit transceivers in a single die, reducing board area versus multi-chip implementations. The FF35 package designation indicates a 35 mm body size FCBGA with fine-pitch BGA balls optimized for high-speed signal integrity at transceiver rates. Typical applications include wireless baseband processing, telecom backhaul, military radar, broadcast video processing, and high-performance computing accelerators. The device is well suited for designers transitioning from ASIC to FPGA for low-volume production or for systems requiring field upgradability. When designing with this FPGA, pay attention to transceiver channel placement constraints, reference clock architecture, and thermal dissipation - the high transceiver count requires multi-layer PCB stackups and careful power delivery. Quartus II design software with Arria II GX device support is required for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, drop-in same-package alternatives drawn from the Arria II GX family, and practical design notes drawn from the manufacturer datasheet, providing engineering insight not duplicated on individual distributor product pages.
EP2AGX260FF35I5N - Arria II GX FPGA 244K LE, 612 IO | Intel
The Intel (formerly Altera) EP2AGX260FF35I5N is a high-density Arria II GX field-programmable gate array (FPGA) integrating 244,188 logic elements, 12,038,144 bits of embedded SRAM, and 8 transceivers capable of up to 6.375 Gbps operation, housed in a 1152-ball FC-FBGA package. The device targets mid-range serial connectivity, digital signal processing, and high-throughput data-pipeline applications that demand deterministic performance at industrial temperature grades. A field-programmable gate array (FPGA) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), programmable interconnect, embedded memory, and hardened IP such as transceivers, DSP blocks, and PLLs. FPGAs sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs) in the design hierarchy: unlike microcontrollers they execute logic in parallel hardware, and unlike ASICs they can be reconfigured after fabrication. The Arria II GX family specifically targets designs requiring integrated transceivers, making it a popular mid-density solution for protocol bridging and high-speed serial I/O. The EP2AGX260FF35I5N features 612 user I/Os, 8 integrated transceiver channels supporting data rates up to 6.375 Gbps, and 10260 Adaptive Logic Modules (ALMs) providing efficient 6-input LUT-based logic implementation. The 0.9 V core supply and industrial -40 C to +100 C operating range position this device for telecom, industrial imaging, and military/aerospace embedded applications where temperature tolerance is mandatory. The device is built on a 40 nm process and supports 18x18 multipliers, 64-bit external memory interfaces (DDR3/QDRII+/RLDRAM II), and PCI Express Gen1/Gen2 hard IP blocks. The integrated transceivers support protocols including PCIe Gen1/2, Gigabit Ethernet, Serial RapidIO, and Common Public Radio Interface (CPRI), eliminating the need for external PHY devices in many designs. Typical applications include wireless baseband processing, software-defined radio front-ends, high-speed serial protocol bridges, ASIC prototyping, and embedded military signal-processing platforms. The industrial temperature grade and 1152-ball FCBGA package make it suitable for ruggedized systems and 6U VPX backplane designs. When designing with this FPGA, ensure proper power-rail sequencing and use the Quartus II design software (version 13.1 or earlier for legacy Arria II support) for synthesis, place-and-route, and timing closure. The FC-FBGA-1152 package requires a multilayer PCB stackup with controlled-impedance routing for transceiver channels. This page synthesizes real-time distributor pricing, drop-in package-compatible alternatives drawn from the Arria II GX family, and design-in considerations not found in the standalone manufacturer datasheet.
EP2AGX45CU17C4G - Arria II GX FPGA, 42K LE, 156 I/O, 358-BGA | Intel
The Intel EP2AGX45CU17C4G is a 40nm Arria II GX Field-Programmable Gate Array (FPGA) integrating 42,959 logic elements, 3,517,440 bits of embedded memory, and transceivers in a 358-ball FCBGA/LFBGA package. Operating with a 0.9V core supply and a -4 speed grade, this Arria II GX device targets cost-sensitive mid-range applications that need high-speed serial I/O without migrating to a larger family. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), dedicated DSP blocks, embedded RAM, and programmable I/O elements interconnected by a programmable routing fabric. FPGAs sit at the top of the digital logic hierarchy between discrete gate arrays and full ASICs, providing hardware-timed parallelism that microcontrollers cannot match. Within the Altera/Intel portfolio, the Arria II GX family occupies the mid-range transceiver-capable tier above Cyclone and below Stratix, optimized for protocols such as PCI Express Gen1/Gen2, Gigabit Ethernet, Serial RapidIO, and CPRI/OBSAI common in wireless backhaul. Key features include 42,959 logic elements, 2,365 Kbits of dedicated RAM, embedded 18x18 multipliers, 156 user I/Os, and 3.5 Mbits of total embedded memory. The device integrates transceivers supporting data rates up to 3.75 Gbps, hardened PCI Express Gen1/Gen2 endpoints, and a DDR2/DDR3 memory controller interface. Configuration is supported through passive serial (PS), fast passive parallel (FPP), and JTAG modes with built-in decompression and encryption via the AES-128 bitstream security engine. Architecturally, the EP2AGX45CU17C4G uses a 40nm low-power process with adaptive logic modules (ALMs) that combine look-up tables and registers into 8-input fracturable structures. The transceiver tiles integrate the PHY, PCS, and bonding clocking for protocol portability, while the variable-precision DSP blocks accelerate fixed- and floating-point math for signal processing pipelines. Typical applications include wireless baseband processing, broadcast video encoders, medical imaging accelerators, industrial motor control, and high-speed serial interface bridging. Engineers select this Arria II GX device when designs need more logic density than Cyclone V but not the full transceiver bandwidth of Stratix IV. When designing with this FPGA, ensure 0.9V core and 2.5V/3.3V auxiliary rails use low-noise LDO regulators placed within 25mm of the package. A multi-layer PCB with continuous ground planes and matched-length transceiver traces is required for signal integrity above 1 Gbps. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP2AGX45CU17C5G - Arria II GX FPGA 45K LEs 3.5Mb | Intel
The Intel (formerly Altera) EP2AGX45CU17C5G is a mid-density Arria II GX Field-Programmable Gate Array (FPGA) from the 40nm Arria II family, integrating 42,959 logic elements and 3,517,440 bits of embedded memory in a 358-ball FineLine BGA (FCBGA, U358) package. According to the Arria II GX datasheet, this device ships with the -C5 speed grade and operates across the commercial 0C to 85C junction temperature range, while still exposing industrial-grade transceiver support through separately ordered variants. The part number encodes its identity: EP2A = Arria II, GX = GX transceiver family, 45 = ~45K logic elements, CU17 = U358 FCBGA package with 156 user I/O pins, C = commercial temperature, 5 = speed grade -5, and G = Pb-free / RoHS-compliant lead finish. A Field-Programmable Gate Array is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable routing channels, and dedicated hardware IP such as block RAM, DSP blocks, and high-speed transceivers, all controlled by SRAM-based configuration memory. FPGAs occupy a unique tier between general-purpose microcontrollers (which execute software sequentially) and fixed-function ASICs (which are silicon-permanent) — they reconfigure their hardware fabric in milliseconds, enabling hardware-level parallelism for compute-intensive workloads. The Arria II GX family sits in the mid-range, targeting applications that need integrated multi-gigabit transceivers without the cost of a Stratix-class device. Key features of the EP2AGX45CU17C5G include up to 156 general-purpose user I/O pins spread across 9 I/O banks, integrated 3.125 Gbps CPRI/OBSAI-compatible transceivers for backplane and chip-to-chip serial links, dedicated 18x18 multipliers and DSP blocks for signal-processing acceleration, programmable PLLs for clock synthesis, and hard PCI Express Gen1 hard IP blocks. The 358-pin FCBGA package provides high-density I/O escape routing for high-speed differential pairs and supplies the low-inductance power/ground distribution required by the transceiver analog supply rails. The Arria II GX architecture pairs a 40nm low-power process with adaptive logic modules (ALMs) that implement 8-input fracturable look-up tables, a tightly integrated hard memory controller subsystem, and a transceiver physical media attachment (PMA) layer supporting protocols such as PCIe Gen1 x1/x4, Gigabit Ethernet, Serial RapidIO, and CPRI. Hard IP blocks for memory interfaces and PCIe Gen1 free fabric logic for application code, while the transceiver PMA/PCS stack supports data rates commonly used in 3G/4G wireless baseband, broadcast video, and industrial backplane aggregation. Typical applications include wireless baseband processing (CPRI link aggregation for radio equipment controllers), high-resolution broadcast video routing and processing, military and industrial radar front-end preprocessing, machine-vision frame grabbers, test and measurement digitizers, and PCIe Gen1 endpoint cards in industrial PCs and embedded computing platforms. Engineers typically pair the EP2AGX45CU17C5G with external DDR2/DDR3 SDRAM and flash configuration memory. When designing with this part, pay particular attention to the four transceiver analog supply rails (VCCA_GXB, VCCL_GXB, VCCP, VCCR) — they require filtering and isolation from the digital core supply to meet jitter and bit-error-rate budgets. Configuration must use a supported scheme (fast passive parallel, fast passive serial, or JTAG) with a valid configuration bitstream. This page consolidates distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
EP2AGX45CU17C5N - Arria II GX FPGA, 45K LE, 156 I/O, 358-UBGA | Intel
The Intel (formerly Altera) EP2AGX45CU17C5N is a member of the Arria II GX family of field-programmable gate arrays (FPGAs) housed in a 358-ball UBGA (FCBGA) package. The device integrates approximately 45,000 logic elements, 156 user I/O pins, 1,805 logic array blocks, and 3,517,440 bits of embedded memory in a single fabric. Per the Intel Arria II GX Device Data Sheet, the EP2AGX45CU17C5N targets mid-range applications that require both programmable logic and multi-gigabit transceivers on a single die. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose digital logic fabric, interconnect, and I/O cells can be reconfigured after manufacture through a hardware description language bitstream. Within the wider semiconductor taxonomy, an FPGA belongs to programmable logic devices (PLDs) which also include CPLDs and structured ASICs. FPGAs sit between fixed-function ASICs and software-defined microcontrollers: like ASICs they deliver hardware parallelism at clock rates above 200 MHz, and like microcontrollers their function can be updated at any time. Arria II GX parts specifically add 3.75 Gbps transceivers, putting them in the mid-density transceiving tier below Cyclone but above the basic Cyclone IV GX. The key features of the EP2AGX45CU17C5N are 3.75 Gbps multi-gigabit transceivers with 8B/10B and PCIe hard IP, dedicated DSP blocks for 18x18 multipliers at up to 250 MHz, 156 general-purpose I/Os with support for LVDS, LVTTL, LVCMOS, SSTL and HSTL standards, and embedded memory arranged in M9K and M144K blocks totaling 3.5 Mbits. The die is fabricated on a 40 nm process and operates from a core voltage around 0.9 V with separate PLL, transceiver and I/O supply rails. Architecturally the EP2AGX45CU17C5N arranges logic in 1,805 LABs (Logic Array Blocks), each containing 10 adaptive logic modules. Multi-track interconnect routes signals between LABs, M9K memory, DSP blocks, and the transceiver PMA/PCS layers. Hard memory controllers and PCIe Gen1 hard IP blocks reduce soft-logic utilization for common protocols, leaving the user fabric free for application-specific state machines, DSP, and control planes. Typical applications include PCIe Gen1 endpoint cards, video broadcast and processing pipelines, industrial imaging and machine vision, military radar and signal-processing front ends, and telecom line cards requiring 3.125 Gbps CPRI or OBSAI links. The combination of mid-density logic and integrated transceivers is also well suited to test-and-measurement equipment and software-defined radio prototyping. Designers should plan power sequencing for the 0.9 V core, 2.5 V/3.3 V I/O and the transceiver analog supply rails, and provide sufficient decoupling on each rail. Bitstream configuration is via passive serial, fast passive parallel, JTAG, or the built-in Altera Enhanced Configuration Device interface. Engineers are advised to consult the Arria II GX Device Data Sheet Section I for absolute maximum ratings, recommended operating conditions and detailed transceiver electrical characteristics before board bring-up. This page synthesizes distributor pricing for the EP2AGX45CU17C5N, plus a comparison against same-package Arria II GX speed-grade and temperature-grade drop-in alternatives, and practical design notes that complement the manufacturer datasheet.
EP2AGX45CU17C6G - Arria II GX FPGA 42KLE, 156 I/O | Intel
The Intel EP2AGX45CU17C6G is a member of the Arria II GX family of mid-range FPGAs, delivering 42,959 logic elements and 3,517,440 RAM bits on a 40 nm process node, supplied at a 0.9 V core voltage. The device integrates up to 156 user I/O and supports transceiver speeds up to 3.75 Gbps through dedicated multi-gigabit transceivers, and is housed in a 358-pin FCBGA (LFBGA-358) package suitable for high-performance mid-range designs. An FPGA (Field Programmable Gate Array) is a reprogrammable digital logic device whose internal logic blocks, routing fabric, and I/O buffers are configured by loading a user-defined bitstream into on-chip SRAM configuration cells. Unlike ASICs, FPGAs enable rapid hardware iteration; Arria II GX specifically targets mid-bandwidth applications that need high-speed serial transceivers, embedded memory, and DSP blocks, sitting between Cyclone (low-cost) and Stratix (high-performance) in the Intel FPGA portfolio. Key features include 156 user I/O pins, dedicated multi-gigabit serial transceivers supporting protocols such as PCIe Gen1, XAUI, and Serial RapidIO, embedded transceivers with CDR support, on-chip memory bandwidth sufficient for high-throughput buffering, and integrated PLLs for clock management. The 0.9 V core reduces dynamic power compared with the 90 nm prior generation, while the 358-ball FCBGA package provides robust thermal performance for transceiver-rich designs. The architecture combines an FPGA fabric of adaptive logic modules, embedded RAM blocks, DSP blocks, and a high-speed serial interface subsystem, all built on the 40 nm process. Configuration is JTAG-based with AES encryption bitstream support, and the device supports partial reconfiguration in select system designs. Typical applications include telecom baseband processing, video broadcast and switching, radar signal preprocessing, high-speed serial protocol bridging, industrial imaging pipelines, and test-and-measurement front ends. The 3.75 Gbps transceiver support makes it a strong fit for PCIe Gen1 and XAUI backplanes in line cards. Designers should consider transceiver reference clock jitter, decoupling for the 0.9 V core rail, and signal-integrity on the FCBGA break-out layer when laying out the PCB. Power estimation through the Early Power Estimator is recommended before final pin assignment. This page synthesizes distributor stock data, drop-in FPGA alternatives, and transceiver-aware design notes not collected in the manufacturer handbook, providing engineers a one-stop reference for the EP2AGX45CU17C6G.
EP2AGX45CU17I3G - Arria II GX FPGA 42KLE 358-UBGA | Intel
The Intel (formerly Altera) EP2AGX45CU17I3G is a high-performance Arria II GX Field-Programmable Gate Array (FPGA) containing 42,959 logic elements, 3,517,440 bits of embedded RAM, and integrated transceivers, housed in a 358-ball FineLine BGA (UBGA, 17x17 mm) package. It is built on a 40 nm low-power process and supports 156 user I/O pins with up to 8 integrated 3.125 Gbps transceivers for serial connectivity. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic fabric, interconnect, and I/O can be reconfigured by the designer after manufacturing. FPGAs occupy a unique position between general-purpose CPUs and application-specific integrated circuits (ASICs): they offer hardware-level parallelism and deterministic latency, making them essential for high-throughput signal processing, high-speed serial interfacing, and ASIC prototyping. The Arria II GX family sits in the mid-range, providing transceivers and DSP blocks at lower power than equivalent high-end (Stratix) families while delivering far more logic than low-cost (Cyclone) families. Key features include 42,959 logic elements (LEs), 1,805 logic array blocks (LABs), 3,517,440 embedded RAM bits, 156 user I/Os, up to 8 transceivers operating up to 3.125 Gbps, dedicated DSP blocks for fixed- and floating-point math, and 4 PLLs for clock management. The device supports a 1.0 V core supply with 0.9 V internal operation and is rated for industrial temperature ranges (-40C to +100C case). Architecturally, EP2AGX45CU17I3G combines an LUT-based logic fabric, M9K memory blocks, MLAB distributed RAM, and hard IP for transceivers, PLLs, and PCI Express. This integration lets designers implement multi-gigabit serial links, parallel DSP pipelines, and memory interfaces on a single device without external PHY silicon, simplifying board design and BOM. Typical applications include wireless baseband processing, telecom backhaul, video broadcast equipment, military/aerospace signal processing, and high-speed serial protocol bridging. The integrated transceivers are especially useful where PCI Express, Serial RapidIO, or custom serial links are required alongside custom DSP or control logic. Designers should plan the PCB for a 17x17 mm BGA with 358 balls on a 1.0 mm pitch; this requires HDI stack-up with microvias and length-matched routing for transceiver channels. Power-rail sequencing (1.0 V core before I/O) and proper decoupling are essential to avoid latch-up at startup. This page synthesizes distributor pricing, 358-UBGA alternatives, and practical BGA layout notes not found in the manufacturer datasheet.
EP2AGX45CU17I3N - Arria II GX FPGA, 42K LEs, 156 I/O, 358-FCBGA | Intel
The Intel (formerly Altera) EP2AGX45CU17I3N is a member of the Arria II GX family of field-programmable gate arrays (FPGAs), built on a 40 nm process and offering 3,517,440 bits of embedded memory, 42,959 logic elements, and 156 user I/Os in a 358-pin LFBGA / FCBGA package. It integrates up to 8 high-speed transceivers capable of data rates up to 3.75 Gbps, making it suited for serial-protocol bridge, video, and wireless backhaul designs. An FPGA is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded multipliers, block RAM, and programmable I/O cells that can be rewired post-manufacturing to implement custom digital circuits. FPGAs occupy a position in the broader taxonomy of programmable logic devices (PLDs) and are widely used as glue logic, co-processors, and DSP accelerators between microcontrollers/DSPs and application-specific standard products (ASSPs). Within the programmable logic hierarchy, the Arria II family sits between the lower-cost Cyclone family and the high-performance Stratix family, targeting mid-range applications that need transceivers and DSP blocks. Key features of the EP2AGX45CU17I3N include 1,805 LABs, 8 transceiver channels, 4 PLLs, 312 (18x18) multipliers, support for DDR2/DDR3/LPDDR/LPDDR2 external memory interfaces, and 0.9 V core operation. The "I3" speed grade and "I" temperature grade designate industrial temperature operation (-40C to +100C) at a moderate performance bin. The Arria II GX architecture combines a logic fabric with embedded transceivers and DSP blocks, enabling designers to implement protocol bridging, video processing, and baseband DSP without external ASSPs. The 40 nm process node offers a balance of static power and dynamic performance, with dedicated hard IP for PCIe, Ethernet, and serial RapidIO protocols. Typical applications include wireless backhaul, serial protocol bridging, video processing, industrial imaging, and test & measurement instrumentation. The transceiver-rich architecture is especially useful where multi-gigabit serial links must coexist with custom DSP or control logic on a single device. When designing with this part, plan the power integrity network carefully: Arria II GX designs typically require multi-rail supplies (0.9 V core, 1.1 V transceiver PLLs, 2.5/3.3 V I/O) with bulk decoupling and high-frequency ceramic capacitors placed close to each bank. This page synthesizes distributor pricing, the curated Altera/Intel drop-in alternatives in the same 358-ball LFBGA footprint, and practical design notes that go beyond a single datasheet search.
EP2AGX45CU17I5G - 42,959 Logic Elements FPGA | Intel
Intel EP2AGX45CU17I5G is a field-programmable gate array in the Arria II GX family, providing 42,959 logic elements and 156 I/O in a 358-ball LFBGA/FCBGA package. The verified listing identifies industrial temperature grading and describes the device as a low-power, high-speed programmable IC based on 40 nm technology, with a 0.9 V core supply and a listed 500 MHz figure. These values make the component suitable for programmable digital logic, high-speed interfaces, and data-processing systems requiring configurable hardware resources. An FPGA, or field-programmable gate array, is a semiconductor device containing programmable logic elements, routing resources, memory blocks, and configurable I/O. After fabrication, engineers can configure these resources to implement digital circuits, interfaces, control logic, or data-processing pipelines. Within the system hierarchy, the FPGA sits between fixed-function application-specific integrated circuits and software-controlled processors: it provides hardware-level parallelism and deterministic timing while retaining post-manufacturing reconfigurability. The Arria II GX family is presented by distributors as a programmable-logic platform for high-speed applications. The principal verified features are 42,959 logic elements, 156 I/O, a 358-terminal LFBGA/FCBGA package, industrial temperature grading, and a 40 nm process technology. The listing also gives 0.9 V and 500 MHz values, although their precise electrical test conditions and meanings are not supplied in the provided excerpts. These characteristics support designs that need substantial programmable logic density and a broad external interface count, while the industrial grade indicates suitability for demanding environmental categories when the manufacturer's qualification documentation is reviewed. The device can be used to implement parallel datapaths, interface bridges, protocol handling, digital filters, and control functions. Its configurable architecture allows logic behavior to be changed through programming, which is valuable during prototyping, product updates, and field upgrades. The 156-I/O count is important for systems that connect multiple buses, converters, memory interfaces, or high-speed peripheral signals. The 358-ball package provides many physical connections, but package-ball verification is essential before design release because similar device suffixes can represent different speed grades, temperature grades, or package options. Typical applications include industrial automation, data-storage equipment, communications infrastructure, test and measurement, and high-speed digital signal processing. The listed industrial grade and programmable logic resources make the part appropriate for embedded control and interface aggregation, while the 500 MHz listing can help identify the intended performance class, but it should not be treated as a complete timing specification without the manufacturer datasheet. The 0.9 V value likewise requires confirmation in the detailed electrical characteristics before power-tree design is finalized. When designing with EP2AGX45CU17I5G, verify the complete ordering-code definition, I/O bank voltage limits, supported configuration methods, thermal requirements, signal-integrity rules, and exact ball map from the manufacturer documentation. The short distributor excerpts do not provide the pinout, logic-element architecture details, transceiver specifications, or environmental limits, so those values must remain marked as unavailable rather than inferred. This page combines the verified distributor specifications, commercial availability, package information, and same-family replacement candidates with clearly identified data gaps. It is intended to help engineers shortlist the FPGA while preserving the distinction between verified facts, such as 42,959 logic elements and 156 I/O, and parameters that require confirmation from the official manufacturer datasheet.
EP2AGX45DF25C4G - Arria II GX 45KLE FPGA 572-FCBGA | Intel
The Intel (formerly Altera) EP2AGX45DF25C4G is a member of the Arria II GX family of 40 nm low-power FPGAs, integrating 45,000 logic elements (LEs), 3,517,440 bits of embedded RAM, and 252 user I/O pins in a 572-ball FineLine Ball-Grid Array (FBGA) package. The device features up to 42959 adaptive logic modules, dedicated high-speed transceivers, and on-chip variable-precision DSP blocks, making it suitable for high-throughput serial connectivity and DSP-intensive applications. What is a Field Programmable Gate Array (FPGA)? An FPGA is a reconfigurable semiconductor device whose logic fabric, routing, and I/O can be programmed by the end user after manufacture. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and are typically classified alongside ASICs, CPLDs, and structured ASSPs in the programmable logic / semiconductor landscape. The Arria II GX family in particular targets mid-range applications requiring integrated transceivers (PCIe, Gigabit Ethernet, Serial RapidIO), signal processing, and embedded memory, while staying in the low-power envelope (sub-1.5 W typical at mid-utilization). Key features of the EP2AGX45DF25C4G include a logic-element density of approximately 45K, embedded 10-bit signal-processing blocks, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL), and the device is specified for industrial-grade temperatures. The package code DF25 indicates the 572-ball 1.0 mm-pitch FCBGA with Pb-free / lead-free compliance (suffix G), and the speed grade -4 balances performance and power for cost-sensitive mid-tier designs. Architecturally, the EP2AGX45DF25C4G uses a 40 nm process node with an adaptive logic module (ALM) fabric, embedded M9K/M144K RAM blocks, and dedicated Multipliers combined into DSP blocks. The integrated transceiver capability supports multiple protocols including PCIe Gen1/Gen2, XAUI, and Serial RapidIO, while the hard memory controller supports DDR2/DDR3 with on-chip termination. The high transceivers, programmable drive strength, and on-chip PLL/MMCM-equivalent blocks make the part well-suited to designs where transceiver count and DSP density matter more than raw logic capacity. Typical applications include wireless baseband processing, broadband aggregation routers with PCIe backplanes, broadcast video processing cards, defense and aerospace signal processing modules, and industrial machine-vision systems requiring deterministic latency. Designers choose the EP2AGX45 series when they need proven 40 nm transceiver availability, embedded memory bandwidth, and a long-lifecycle FPGA family supported by the Quartus II / Quartus Prime design toolchain. Design considerations for the EP2AGX45DF25C4G include proper transceiver analog supply filtering, controlled-impedance routing for the 572-ball FBGA breakout, thermal management under sustained DSP utilization, and careful power-decoupling of each 1.0 V core/1.5 V transceiver rail. Engineers should also reference Altera's Arria II GX device handbook for transceiver reference designs and the PCG (Pin Connection Guidelines) for correct ball-to-pad assignment. This page synthesizes distributor pricing, drop-in same-package alternatives from the Arria II GX family, and practical design notes not aggregated in a single location in the manufacturer datasheet.
EP2AGX45DF25C4N - Arria II GX FPGA, 42K LE, 252 I/O | Intel
The Intel EP2AGX45DF25C4N is a 42,959-logic-element Arria II GX mid-range FPGA with integrated transceivers, 3,517,440 bits of embedded RAM, and 252 user I/O, fabricated on a 40 nm process and supplied in a 572-ball FC-FBGA (DF25) package. The device belongs to the Arria II GX family, which targets cost-sensitive applications that need serial connectivity up to 3.75 Gbps alongside DSP and embedded memory resources. The "C4" speed grade and "N" lead-free suffix indicate a commercial-temperature-grade, Pb-free industrial offering suitable for prototyping and production deployment. An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnects, dedicated DSP slices, and block RAM into a single silicon die. FPGAs occupy the middle ground between fixed-function ASICs and software-driven microcontrollers, delivering hardware-level parallelism and reconfigurable I/O for compute-intensive, I/O-rich, or latency-sensitive workloads. The Arria II GX family extends this model with up to 16 integrated transceivers, hardening 6.375 Gbps backplane interfaces for protocols such as PCIe Gen1/Gen2, Gigabit Ethernet, Serial RapidIO, and CPRI. The Arria II GX device fits the broader taxonomy of programmable logic devices (PLD) -> FPGA -> mid-range FPGA -> transceiver-enabled FPGA. Key specifications of the EP2AGX45DF25C4N include 1,805 LABs (logic array blocks), 56 embedded 18x18 multipliers, 273 M9K memory blocks, eight PLLs, and 16 dedicated transceivers. The core operates at 0.9 V, while the I/O banks support multiple single-ended and differential standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL. The 572-ball FC-FBGA package is supplied in a lead-free, Pb-free finish compliant with RoHS. Architecturally, the device integrates transceiver hard IP, variable-precision DSP blocks, and triplicated register logic for soft error mitigation, all interconnected by Altera's adaptive logic module (ALM) fabric. This combination allows the EP2AGX45DF25C4N to perform simultaneous high-speed serial I/O, parallel DSP pipelines, and general-purpose logic without external bridge chips. Typical applications include telecommunications baseband processing, industrial video broadcast equipment, low-cost wireless backhaul, medical imaging pre-processing, and military secure communications. Engineers also select this part for protocol bridging (PCIe-to-Ethernet, Serial RapidIO aggregation) where a small, integrated FPGA reduces board area and BOM. Design considerations include power estimation with the Intel Quartus Early Power Estimator, thermal analysis under worst-case transceivers-active duty cycles, and PCB layout for impedance-controlled serial channels. Decoupling must follow the reference design's stackup guidance; otherwise, jitter budget can degrade transceiver link margin. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the standalone manufacturer datasheet.