EP2AGX45CU17C6G - Arria II GX FPGA 42KLE, 156 I/O | Intel
부품 번호: EP2AGX45CU17C6G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $215 | $21,500.00 |
| 500 | $195 | $97,500.00 |
| 1,000 | $178 | $178,000.00 |
EP2AGX45CU17C6G 개요
An FPGA (Field Programmable Gate Array) is a reprogrammable digital logic device whose internal logic blocks, routing fabric, and I/O buffers are configured by loading a user-defined bitstream into on-chip SRAM configuration cells. Unlike ASICs, FPGAs enable rapid hardware iteration; Arria II GX specifically targets mid-bandwidth applications that need high-speed serial transceivers, embedded memory, and DSP blocks, sitting between Cyclone (low-cost) and Stratix (high-performance) in the Intel FPGA portfolio.
Key features include 156 user I/O pins, dedicated multi-gigabit serial transceivers supporting protocols such as PCIe Gen1, XAUI, and Serial RapidIO, embedded transceivers with CDR support, on-chip memory bandwidth sufficient for high-throughput buffering, and integrated PLLs for clock management. The 0.9 V core reduces dynamic power compared with the 90 nm prior generation, while the 358-ball FCBGA package provides robust thermal performance for transceiver-rich designs.
The architecture combines an FPGA fabric of adaptive logic modules, embedded RAM blocks, DSP blocks, and a high-speed serial interface subsystem, all built on the 40 nm process. Configuration is JTAG-based with AES encryption bitstream support, and the device supports partial reconfiguration in select system designs.
Typical applications include telecom baseband processing, video broadcast and switching, radar signal preprocessing, high-speed serial protocol bridging, industrial imaging pipelines, and test-and-measurement front ends. The 3.75 Gbps transceiver support makes it a strong fit for PCIe Gen1 and XAUI backplanes in line cards.
Designers should consider transceiver reference clock jitter, decoupling for the 0.9 V core rail, and signal-integrity on the FCBGA break-out layer when laying out the PCB. Power estimation through the Early Power Estimator is recommended before final pin assignment.
This page synthesizes distributor stock data, drop-in FPGA alternatives, and transceiver-aware design notes not collected in the manufacturer handbook, providing engineers a one-stop reference for the EP2AGX45CU17C6G.
드롭인 대체품: EP2AGX45CU17C6G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2AGX45CU17C6G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Logic Elements, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2AGX45CU17C5N
✅ 드롭인✓ 재고 있음
$262 / 개
데이터시트 보기 →EP2AGX45CU17C5G
✅ 드롭인✓ 재고 있음
$228.5 / 개
데이터시트 보기 →EP2AGX45CU17C4G
✅ 드롭인✓ 재고 있음
$145.75 / 개
데이터시트 보기 →EP2AGX45CU17C6G 최대 정격 & 전기적 특성
| Device Family | Arria II GX |
| Logic Elements | 42,959 |
| Total RAM Bits | 3,517,440 |
| User I/O Count | 156 |
| 패키지 | 358-LFBGA (FCBGA) |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm |
| Operating Frequency | up to 400 MHz |
| Transceivers | Multi-gigabit transceivers up to 3.75 Gbps |
| 공급 전압 | 0.9 V core |
| Number of Terminals | 358 |
| Terminal Form | Ball (BGA) |
| Package Code | LFBGA |
| Package Shape | Square |
| RoHS 상태 | Lead free / RoHS Compliant |
EP2AGX45CU17C6G square 핀 구성 가이드
EP2AGX45CU17C6G(square 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2AGX45CU17C6G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2AGX45CU17C6G 적합 용도: 6 애플리케이션s: Telecom Line Card Baseband Processing, Video Broadcast Switching and Processing, Industrial Imaging and Machine Vision Pipelines, Radar Signal Preprocessing, Test and Measurement Front End, High-Speed Serial Protocol Bridging.
Telecom Line Card Baseband Processing
The EP2AGX45CU17C6G's 42,959 logic elements and 3.5 Mbit of embedded RAM make it a strong fit for telecom line cards where baseband DSP, framing, and packet classification run in parallel. Its multi-gigabit transceivers at 3.75 Gbps support common telecom backplane rates including XAUI and Serial RapidIO, removing the need for external PHY chips. The 156 user I/O accept glue-logic connections to network processors and TDM framers. Designers typically run the FPGA at 200-300 MHz core clocks while the transceivers handle serialization, achieving deterministic latency for backhaul links. The 40 nm process keeps dynamic power under typical telecom thermal budgets even at full I/O toggling.
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Video Broadcast Switching and Processing
The EP2AGX45CU17C6G is well suited to broadcast video routing and processing where multi-stream SD/HD-SDI aggregation, color-space conversion, and frame buffering must run in real time. The 3.5 Mbit of embedded RAM is enough to double-buffer several SDI streams without external DDR. Transceivers above 1.5 Gbps can drive SDI at 270 Mbps or 1.485 Gbps with low jitter, and the 156 I/O can interface to HDMI receivers, video DACs, and audio embedder chips. The Arria II GX DSP blocks perform chroma resampling and deinterlacing efficiently, freeing logic for control-plane glue. Compared with an ASSP broadcast switch, this FPGA enables proprietary timing and processing pipelines.
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Industrial Imaging and Machine Vision Pipelines
Industrial machine vision systems use the EP2AGX45CU17C6G to ingest Camera Link or CoaXPress data and run real-time image processing. The transceivers handle CoaXPress at up to 3.125 Gbps per lane, while the FPGA fabric runs Bayer demosaic, color correction, and edge detection pipelines. With 156 I/O the device accepts triggers, encoders, and GPIO from the conveyor line. The 42KLE of logic is sufficient for multi-camera synchronization with hardware timestamping. Designers typically pair this FPGA with DDR2 or DDR3 memory for full-frame buffering, and use the on-chip DSP blocks to accelerate convolutional filters at video rates.
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Radar Signal Preprocessing
Defense and weather-radar front ends use the EP2AGX45CU17C6G to digitize, downconvert, and pulse-compress RF data before handing it to a DSP processor. The transceivers accept LVDS or serialized ADC outputs at hundreds of MHz, while the FPGA fabric runs matched filters and moving target indication (MTI) algorithms. The 3.5 Mbit of block RAM is enough to hold multiple range bins in fast succession, and the 156 I/O can interface to FMC digitizer cards. The 40 nm process provides predictable timing closure for radar pulse scheduling, and the 358-LFBGA package offers the thermal headroom needed for sealed ruggedized enclosures with limited airflow.
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Test and Measurement Front End
Test instruments such as protocol analyzers and logic-analyzer backends use the EP2AGX45CU17C6G to capture and time-stamp high-speed serial traffic. The transceivers decode PCIe Gen1, XAUI, SATA, and USB 3.0 signaling, while the FPGA fabric builds protocol-aware state machines for trigger generation. With 156 user I/O and ample block RAM, the device can simultaneously capture multiple lanes and run CRC/error counters. Engineers value the JTAG-based configuration for fast bring-up and the AES bitstream encryption to protect proprietary test IP. Compared with an ASSP, this FPGA adapts quickly to new protocol revs via bitstream update.
추천
High-Speed Serial Protocol Bridging
Protocol bridge cards use the EP2AGX45CU17C6G to convert between PCIe, XAUI, Serial RapidIO, and SRIO fabrics in legacy migration scenarios. Each multi-gigabit transceiver can be configured independently, allowing asymmetric rates such as PCIe Gen1 in and XAUI out. The 156 I/O accommodate side-band signals like PERST, REFCLK, and SMBus. The 42KLE of logic is sufficient for transport-layer adaptation, while the 3.5 Mbit of RAM holds packet headers during rate-matching. Industrial and military customers rely on this FPGA for long-lifecycle bridges because Arria II GX has a stable, multi-year product roadmap.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2AGX45CU17C6G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2AGX45CU17C5N | EP2AGX45CU17C5G | EP2AGX45CU17C4G |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 358-LFBGA (FCBGA) | 358-LFBGA - same | 358-LFBGA - same | 358-LFBGA - same |
| Logic Elements | 42,959 | 42,959 | 42,959 | 42,959 |
| Total RAM Bits | 3,517,440 | 3,517,440 | 3,517,440 | 3,517,440 |
| Speed Grade | 6 (fastest) | 5 | 5 | 4 |
| User I/O | 156 | 156 | 156 | 156 |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| RoHS / Lead-Free | Lead-free / RoHS | Lead-free / RoHS | Lead-free / RoHS | Lead-free / RoHS |
| 1-piece Price (USD, 2026-09-08) | ~285 | ~245 | ~245 | ~225 |
주요 차별점
- Highest speed grade (6) in the 358-LFBGA Arria II GX family (vs EP2AGX45CU17C5N)
- Lead-free and RoHS compliant for worldwide deployment (vs EP2AGX45CU17C5N)
- Same 42KLE silicon as other 358-LFBGA variants (vs EP2AGX260FF35C6G)
설계 노트
Estimated: at 0.9 V core and 100KLE utilization, the static current is roughly 0.5-1.0 A; dynamic current scales with toggle rate and clock frequency. Use the Quartus Early Power Estimator before PCB layout. Decouple each VCCINT pin with a 0.1 uF X7R capacitor placed within 100 mils, and add bulk 47 uF polymer or 220 uF tantalum capacitors at the regulator outputs. Transceiver supplies (VCCA_PLL, VCCA_TX, VCCR) require separate low-noise LDOs, not shares with VCCINT.
The 358-LFBGA package has a full array of balls on a 1.0 mm pitch - design the PCB with at least 4 layers plus dedicated ground planes. Microvias (8-12 mil laser-drilled) are recommended to break out the inner rows; through-via dog-bones can also work but consume more area. Match differential transceiver trace lengths within 5 mil for PCIe and within 10 mil for XAUI. Maintain a continuous reference plane under each transceiver lane to control impedance at 100 ohm differential.
Transceiver reference clocks must come from a low-jitter oscillator (typical phase noise < -100 dBc/Hz at 100 kHz offset). Route clocks on the top layer over a continuous ground plane and keep them isolated from switching I/O. For multi-lane protocols, lane-to-lane skew should be < 1 ps per cm of trace length difference. Use the Arria II GX handbook's eye-diagram templates to validate SI before tape-out.
Do not enable a transceiver channel until its reference clock is stable - hot-plug events can latch-up the CDR. Always assert the nPERST or equivalent reset after power-up completes. Confirm the JTAG chain order in the Quartus programmer before generating the bitstream; mismatched BSDL files are the most common bring-up failure. Verify the bitstream encryption key matches the device's programmed key, otherwise configuration will silently fail.
규정 준수 정보
Lead-free and RoHS compliant per the Intel product page and distributor listings. AEC-Q100 does not apply (industrial/commercial FPGA). Halogen-free and conflict-mineral status not stated in available data.
