EP2AGX45DF25C4N - Arria II GX FPGA, 42K LE, 252 I/O | Intel
부품 번호: EP2AGX45DF25C4N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $685 | $685.00 |
| 10 | $640 | $6,400.00 |
| 100 | $575 | $57,500.00 |
| 500 | $510 | $255,000.00 |
| 1,000 | $460 | $460,000.00 |
EP2AGX45DF25C4N 개요
An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnects, dedicated DSP slices, and block RAM into a single silicon die. FPGAs occupy the middle ground between fixed-function ASICs and software-driven microcontrollers, delivering hardware-level parallelism and reconfigurable I/O for compute-intensive, I/O-rich, or latency-sensitive workloads. The Arria II GX family extends this model with up to 16 integrated transceivers, hardening 6.375 Gbps backplane interfaces for protocols such as PCIe Gen1/Gen2, Gigabit Ethernet, Serial RapidIO, and CPRI. The Arria II GX device fits the broader taxonomy of programmable logic devices (PLD) -> FPGA -> mid-range FPGA -> transceiver-enabled FPGA.
Key specifications of the EP2AGX45DF25C4N include 1,805 LABs (logic array blocks), 56 embedded 18x18 multipliers, 273 M9K memory blocks, eight PLLs, and 16 dedicated transceivers. The core operates at 0.9 V, while the I/O banks support multiple single-ended and differential standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL. The 572-ball FC-FBGA package is supplied in a lead-free, Pb-free finish compliant with RoHS.
Architecturally, the device integrates transceiver hard IP, variable-precision DSP blocks, and triplicated register logic for soft error mitigation, all interconnected by Altera's adaptive logic module (ALM) fabric. This combination allows the EP2AGX45DF25C4N to perform simultaneous high-speed serial I/O, parallel DSP pipelines, and general-purpose logic without external bridge chips.
Typical applications include telecommunications baseband processing, industrial video broadcast equipment, low-cost wireless backhaul, medical imaging pre-processing, and military secure communications. Engineers also select this part for protocol bridging (PCIe-to-Ethernet, Serial RapidIO aggregation) where a small, integrated FPGA reduces board area and BOM.
Design considerations include power estimation with the Intel Quartus Early Power Estimator, thermal analysis under worst-case transceivers-active duty cycles, and PCB layout for impedance-controlled serial channels. Decoupling must follow the reference design's stackup guidance; otherwise, jitter budget can degrade transceiver link margin.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the standalone manufacturer datasheet.
드롭인 대체품: EP2AGX45DF25C4N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2AGX45DF25C4N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Transceivers, Operating Temperature, Logic Elements.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2AGX45DF25C6N
✅ 드롭인✓ 재고 있음
$263.5 / 개
데이터시트 보기 →EP2AGX45DF25C4G
✅ 드롭인✓ 재고 있음
$205 / 개
데이터시트 보기 →EP2AGX45DF25I4N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP2AGX45DF25C5N
✅ 드롭인✓ 재고 있음
$258.2 / 개
데이터시트 보기 →EP2AGX45CU17C6G
✅ 드롭인✓ 재고 있음
$178 / 개
데이터시트 보기 →EP2AGX45DF25C4N 최대 정격 & 전기적 특성
| Family | Arria II GX |
| Series | EP2AGX45 |
| Logic Elements | 42,959 |
| Logic Array Blocks (LABs) | 1,805 |
| Total Embedded RAM Bits | 3,517,440 |
| M9K Memory Blocks | 273 |
| Embedded 18x18 Multipliers | 56 |
| User I/O Pins | 252 |
| Maximum User I/O (per datasheet) | 252 (FBGA-572 device) |
| Transceivers | 16 channels (data rates up to 3.75 Gbps, per family) |
| PLLs | 8 |
| Global Clock Networks | 16 |
| Maximum Operating Frequency | 500 MHz (per third-party listing) |
| Process Technology | 40 nm |
| Core Supply Voltage | 0.9 V |
| 동작 온도 | 0C to +85C (commercial, 'C' grade) |
| Speed Grade | C4 |
| 패키지 | 572-ball FC-FBGA (DF25) |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant (Pb-free 'N' suffix) |
| Configuration Interface | Serial / JTAG |
EP2AGX45DF25C4N 572-ball fc-fbga (df25) 핀 구성 가이드
EP2AGX45DF25C4N(572-ball fc-fbga (df25) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2AGX45DF25C4N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2AGX45DF25C4N 적합 용도: 6 애플리케이션s: Telecommunications Baseband Processing, Industrial Video Broadcast Equipment, PCIe Gen2 Protocol Bridging, Medical Imaging Pre-Processing, Wireless Backhaul Aggregation, Test and Measurement Instrumentation.
Telecommunications Baseband Processing
The EP2AGX45DF25C4N's 16 transceivers up to 3.75 Gbps and 56 embedded 18x18 multipliers suit it for mid-tier baseband signal processing in small-cell and LTE backhaul designs. The 42,959 logic elements host PHY-layer DSP, while the 3.5 Mbit block RAM buffers IQ samples without external memory in some configurations. Placed adjacent to a baseband SoC, the Arria II GX performs digital pre-distortion and crest-factor reduction, offloading compute from the main processor. Compared to discrete DSP + transceiver implementations, the integrated hard IP reduces board area and BOM.
추천
Industrial Video Broadcast Equipment
The EP2AGX45DF25C4N's 252 user I/O and high-speed transceivers support SDI/HDMI-to-IP bridging in broadcast video infrastructure. The 40 nm low-power process node keeps the 42,959-LE fabric within 10 W total power under typical video pipeline loading. Compared to software-only media processors, the FPGA pipeline delivers deterministic latency required by SMPTE 2022 and uncompressed 4K workflows. Placed as a co-processor to a host CPU, the Arria II GX performs chroma resampling, scaling, and JPEG-XS encoding in real time.
추천
PCIe Gen2 Protocol Bridging
The Arria II GX family provides a hard PCIe Gen2 IP block with up to x4 lane support, making the EP2AGX45DF25C4N suitable for bridging PCIe to Gigabit Ethernet, Serial RapidIO, or proprietary backplanes. With 16 transceivers and 3.5 Mbit of on-chip memory, the device handles protocol state machines and packet buffering without external memory. Compared to an FPGA soft-IP PCIe implementation on a non-transceiver FPGA, the Arria II GX reduces latency by approximately 50 ns and frees logic resources for user data path.
추천
Medical Imaging Pre-Processing
The EP2AGX45DF25C4N's 56 hardware multipliers and 273 M9K memory blocks accelerate front-end image processing for ultrasound and endoscopy systems. At 500 MHz maximum fabric frequency, the FPGA computes FFTs, beamforming, and image-enhancement filters in real time with deterministic latency. The 252 user I/O interface to CMOS image sensors, ADC channels, and LVDS display panels. Compared to DSP-only architectures, the Arria II GX FPGA reduces system BOM and lowers power per operation in image-pipeline workloads.
추천
Wireless Backhaul Aggregation
The EP2AGX45DF25C4N's CPRI/OBSAI protocol support and multi-gigabit transceivers fit it for small-form-factor wireless backhaul units aggregating multiple remote radio heads. The 40 nm low-power process node and 0.9 V core supply keep board thermal design within passive-cooling limits for outdoor pole-mount enclosures. Compared to ASIC-based backhaul ASICs, the Arria II GX FPGA delivers flexible protocol support and field-upgradable bitstreams for evolving CPRI line rates.
추천
Test and Measurement Instrumentation
The EP2AGX45DF25C4N serves as a flexible pattern generator and protocol analyzer in bench-top test equipment. With 16 transceivers and 252 user I/O, the FPGA aggregates multiple instrument channels and provides arbitrary stimulus generation up to 500 MHz fabric frequency. The 3.5 Mbit embedded RAM captures waveform samples without external memory in some applications. Compared to fixed-function test ASICs, the FPGA allows instrumentation vendors to ship a single hardware platform and customize via bitstream, reducing SKUs.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2AGX45DF25C4N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2AGX45DF25C6N | EP2AGX45DF25C4G | EP2AGX45DF25I4N | EP2AGX45DF25C5N | EP2AGX45CU17C6G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 572-ball FC-FBGA (DF25) | 572-ball FC-FBGA (DF25) - same | 572-ball FC-FBGA (DF25) - same | 572-ball FC-FBGA (DF25) - same | 572-ball FC-FBGA (DF25) - same | 672-ball UBGA (CU17) - differs |
| Logic Elements | 42,959 | 42,959 | 42,959 | 42,959 | 42,959 | 42,959 |
| Total RAM Bits | 3,517,440 | 3,517,440 | 3,517,440 | 3,517,440 | 3,517,440 | 3,517,440 |
| Speed Grade | C4 | C6 (faster) | C4 | I4 (industrial temp) | C5 | C6 (faster) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | -40C to +100C (industrial) | 0C to +85C | 0C to +85C |
| Lead-Free / RoHS | Pb-free (N suffix) | Pb-free (N suffix) | Pb-free, RoHS (G suffix) | Pb-free (N suffix) | Pb-free (N suffix) | Pb-free, RoHS (G suffix) |
주요 차별점
- C4 speed grade offers best cost-timing trade-off for mid-density designs (vs EP2AGX45DF25C6N)
- Pb-free RoHS compliance with N suffix (vs EP2AGX45DF25C4 (legacy Pb-bearing variant))
- Mid-range density avoids oversize BGA cost (vs EP2AGX125DF25C6G (125K LE))
설계 노트
Estimated: The Arria II GX 40 nm process dissipates approximately 5-10 W under typical transceiver-active workloads with 50% logic utilization. The 572-ball FC-FBGA exposes a thermal pad for thermal-via arrays; design PCB with at least 1 square inch of copper pour and 9 thermal vias under the die flag to keep junction temperature below 100C. Use Intel Quartus Early Power Estimator (EPE) for design-specific numbers, and always profile on a hardware thermal plate before finalizing cooling solution.
Transceiver channels require controlled-impedance differential routing (typically 100 ohm differential) with matched lengths within the channel bonding tolerance. Reference the Arria II GX device datasheet pin connection guidelines and the relevant Altera/Intel layout macro for the exact via geometry. Use a 4-6 layer stackup with continuous ground reference planes under high-speed serial traces; signal integrity margins collapse quickly when ground planes are split under BGA breakouts.
The 0.9 V core supply must be low-noise with peak transients under 30 mVpp; decouple with 10 uF bulk + 1 uF + 0.1 uF + 0.01 uF ceramic capacitor arrays placed within 100 mils of each VCC pin. Auxiliary supplies (VCCPD, VCCIO) require their own decoupling networks following the same rule. Estimated: a fully loaded 42K-LE design draws roughly 4 A on VCCINT alone; budget for at least 6 A peak current from the core regulator.
Do not reuse the EP2AGX45DF25C4N bitstream on EP2AGX45DF25C6N parts without recompiling - speed-grade-aware IP blocks (transceivers, PLLs, DSP) may violate timing. Always lock the device pin assignment file (QSF) to prevent pin swaps across design iterations. Never disable the CRC error check in the configuration scheme; silent bitstream corruption on BGA assembly rework is a common root cause of 'dead on arrival' FPGAs in production.
규정 준수 정보
RoHS compliance confirmed by the 'N' suffix in EP2AGX45DF25C4N. AEC-Q100 is not applicable to FPGAs (this is an automotive IC qualification standard for discrete/power devices). Halogen-free status not explicitly stated in the verified web data.
