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EP2AGX260EF29C6 - Arria II GX 244K Logic Elements FPGA | Intel
EP2AGX260EF29C6

EP2AGX260EF29C6 - Arria II GX 244K Logic Elements FPGA | Intel

The Intel EP2AGX260EF29C6 is a high-density Arria II GX field-programmable gate array (FPGA) delivering 244,188 logic elements, 12,038,144 memory bits, and integrated transceivers in a 780-ball FC-FBGA (EF29) package. Built on TSMC's 40nm process, the Arria II GX family targets mid-range applications requiring a balance of logic density, memory bandwidth, and serial connectivity at low total system cost. The device combines a high-performance FPGA fabric with up to 12.5 Gbps transceivers and dedicated DSP blocks. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs belong to the broader category of programmable logic devices (PLDs) within the integrated circuits taxonomy: FPGA -> PLD -> logic IC -> semiconductor. Unlike fixed-function ASICs, FPGAs can be reconfigured after the application is deployed, enabling hardware-level parallelism, rapid prototyping, and post-sale design updates. The Arria II GX family sits between Cyclone (low-cost) and Stratix (high-performance) in Intel's FPGA lineup. Key features of the EP2AGX260EF29C6 include 244,188 logic elements, 12,038,144 bits of embedded memory, 612 embedded 18x18 multipliers for DSP, 12 transceiver channels supporting data rates up to 6.375 Gbps, and 372 general-purpose I/O pins. The device operates from a 0.9 V core supply and supports commercial temperature grades (0C to +85C). The 780-ball FC-FBGA package integrates flip-chip interconnect for high signal integrity at multi-gigabit speeds. Architecturally, the Arria II GX uses 8-input adaptive logic modules (ALMs), each containing two combinational adaptive LUTs (ALUTs) and four dedicated registers. This structure delivers fine-grained logic utilization and efficient implementation of wide fan-in functions. The transceiver blocks integrate physical coding sublayer (PCS) and physical medium attachment (PMA) layers, supporting protocols such as PCIe Gen1/Gen2, Serial RapidIO, GPON, and CPRI. Hard memory controllers and PLLs reduce fabric utilization for common system tasks. Typical applications include high-definition video processing, wireless baseband, military radar signal processing, ASIC prototyping, and high-speed serial interface bridging. The combination of transceiver bandwidth and DSP resources makes this device particularly well-suited for systems requiring real-time signal processing with multi-gigabit I/O. When designing with this part, plan PCB layout for the FC-FBGA package using microvia and via-in-pad technology; signal integrity on transceiver channels depends on controlled-impedance routing and proper decoupling. Quartus II design software is required for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in same-package alternatives drawn from the Arria II GX family, and PCB-layout design notes not duplicated in the manufacturer datasheet.

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EP2AGX260EF29C6G - Arria II GX FPGA 244K LE, 780-FCBGA | Intel
EP2AGX260EF29C6G

EP2AGX260EF29C6G - Arria II GX FPGA 244K LE, 780-FCBGA | Intel

The Intel (formerly Altera) EP2AGX260EF29C6G is a high-density Arria II GX Field Programmable Gate Array (FPGA) fabricated on a 40 nm process, integrating 244,188 logic elements, 12,038,144 RAM bits, and 372 embedded 18x18 multipliers in a 780-ball FineLine BGA (FC-FBGA) package. The device is part of Intel's mid-range Arria II GX family targeting transceiver-rich applications such as video broadcast, wireless infrastructure, and high-speed serial connectivity. It operates from a 0.9 V core supply and supports transceiver data rates and a -6 commercial speed grade. What is a mid-range FPGA? A Field Programmable Gate Array is a semiconductor device built around an array of configurable logic blocks (CLBs), dedicated DSP blocks, on-chip memory, and programmable interconnect that can be reconfigured by the customer after manufacture. The Arria II GX family occupies the mid-density, mid-performance segment between Intel's low-cost Cyclone and high-end Stratix families, balancing logic capacity, transceiver performance, and cost for mainstream applications. With 244K logic elements, it provides substantial DSP and memory resources in a single device. Key features include integrated transceivers supporting multi-gigabit serial protocols, 12 Mb of embedded RAM for buffering high-bandwidth data streams, 372 hardware DSP blocks accelerating fixed- and floating-point operations, and dedicated PLL and clocking infrastructure for jitter-sensitive designs. The 780-ball FC-FBGA package enables high I/O density on multi-layer PCBs with controlled-impedance routing. The -6 speed grade designates a faster commercial-temperature timing bin than the -7 or -8 grades. The Arria II GX architecture combines a logic fabric, M9K/M144K memory blocks, variable-precision DSP blocks, and PCI Express hard IP, optimized for data-path heavy applications where deterministic throughput matters more than absolute peak frequency. The 40 nm process provides favorable power-performance scaling relative to earlier 65 nm and 90 nm FPGA generations. Typical applications include broadcast video processing and encoding, wireless baseband and RF signal processing, industrial imaging and machine vision, high-speed serial protocol bridging, military radar and signal intelligence, and PCI Express endpoint or root-complex designs. The combination of density and embedded transceivers makes the EP2AGX260EF29C6G well-suited for prototyping of mid-volume designs. When designing with this device, careful attention must be paid to transceiver channel placement to meet signal-integrity requirements, and the Quartus II / Intel Quartus Prime toolchain must be used for synthesis, place-and-route, and timing closure. Power estimation via the PowerPlay early power estimator should precede PCB layout to avoid post-layout surprises. This page consolidates real-time distributor pricing, drop-in compatible Arria II GX variants, and Quartus Prime design considerations that complement the official datasheet. Cross-references and lifecycle status are kept current against Intel product change notifications.

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EP2AGX260EF29C6N - Arria II GX FPGA 244K LE 780-FCBGA | Intel
EP2AGX260EF29C6N

EP2AGX260EF29C6N - Arria II GX FPGA 244K LE 780-FCBGA | Intel

The Intel (Altera) EP2AGX260EF29C6N is a high-density Arria II GX Field-Programmable Gate Array (FPGA) built on a 40 nm low-power process and housed in a 780-ball FineLine BGA (FC-FBGA, 29 x 29 mm). It integrates 244,188 logic elements (LEs), approximately 12,038,144 bits of embedded memory (M9K blocks plus MLAB), 372 user I/O pins, and a rich collection of hardened intellectual property including up to 16 transceivers capable of 6.375 Gbps operation for protocols such as PCIe Gen2, CPRI, OBSAI, Serial RapidIO, and 10G Ethernet. A core voltage of 0.9 V with on-chip regulators simplifies power-tree design. An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated hardware resources (memory, DSP, transceivers) into a single silicon fabric. FPGAs sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs), offering hardware-level parallelism and sub-microsecond reconfiguration. Arria II GX belongs to Altera's mid-range transceiver-equipped FPGA family, optimized for cost-sensitive high-speed serial I/O designs, bridging between the lower-cost Cyclone families and the high-end Stratix families. Key features of the EP2AGX260EF29C6N include hardened PCI Express Gen2 x1/x2/x4 endpoints, dedicated 6.375 Gbps transceivers with physical coding sublayer (PCS) and physical medium attachment (PMA) blocks, up to 1,148 embedded 18x18 multipliers (variable by device variant), and 32-bit DDR3 SDRAM external memory interfaces with integrated PHY. The -C6N speed grade provides a balanced trade-off between Fmax and power consumption, while the industrial-grade 'I' option and 0.9 V core simplify PCB power distribution when paired with high-efficiency switching controllers. The 780-ball FCBGA package exposes 8 transceiver channels per side in dedicated GXB banks. Architecturally, the EP2AGX260EF29C6N organizes logic into Adaptive Logic Modules (ALMs) of 8-input fracturable look-up tables with dedicated arithmetic and register resources, paired with high-speed routing lines between LABs and column/row interfaces. Transceiver channels integrate serializer/deserializer, PLL, and equalization, allowing direct connection to SFP+, SFP, and backplane SERDES without external PHY. The 40 nm process technology, combined with Altera's Quartus Prime toolchain, delivers timing closure on complex multi-channel serial designs. Typical applications for the EP2AGX260EF29C6N include wireless baseband processing in LTE/WiMAX base stations, broadcast video routers with SMPTE 259M/292M/424M SDI, defense signal-intelligence front ends, medical imaging preprocessing pipelines (CT, MRI, ultrasound beamforming), industrial high-speed data acquisition, and ASIC prototyping for networking line cards. The high logic density and PCIe Gen2 hard IP make it ideal for system controller and co-processing daughter cards on ATCA/AMC platforms. When designing with this device, plan the power-tree for the 0.9 V core with adequate decoupling (multiple 0.1 uF + 10 uF + bulk ceramic capacitors) and assign high-speed transceiver pins early in PCB layout to keep loss budget under control. Quartus Prime provides synthesis, place-and-route, and SignalTap logic analyzer integration, with optional Qsys platform designer for system-level IP assembly. This page consolidates distributor pricing, drop-in alternatives, and practical design notes that are not aggregated in the manufacturer datasheet, helping procurement and design engineers quickly assess this part.

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EP2AGX260EF29I3G - 244K LE Arria II GX FPGA, 780-FCBGA | Intel
EP2AGX260EF29I3G

EP2AGX260EF29I3G - 244K LE Arria II GX FPGA, 780-FCBGA | Intel

The Intel EP2AGX260EF29I3G is a high-performance, low-power Arria II GX Field Programmable Gate Array (FPGA) with 244,188 logic elements and 12,038,144 bits of embedded memory, fabricated on a 40 nm process node and housed in a 780-ball Flip-Chip BGA (FCBGA) package. It supports a maximum internal operating frequency of up to 500 MHz across its logic fabric and incorporates 372 user I/O pins, making it suitable for high-throughput digital designs. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and high-speed transceivers, all interconnected by a programmable routing fabric. FPGAs sit within the broader category of programmable logic devices (PLDs) > digital integrated circuits > semiconductors. The Arria II GX family specifically targets mid-range applications requiring a balance of logic density, transceiver bandwidth, and power efficiency, placing it between Cyclone (low-cost) and Stratix (high-performance) families within Intel's (formerly Altera's) FPGA portfolio. Key features of the EP2AGX260EF29I3G include 244,188 logic elements, 12 Mbits of embedded memory, integrated transceivers supporting multi-gigabit serial interfaces, on-chip multipliers for DSP operations, and a 0.9 V core supply. The 40 nm process technology provides an optimal balance between static and dynamic power consumption, which is critical for thermally constrained embedded systems. The architecture combines a lookup-table-based logic fabric with hard DSP blocks, block RAM (M9K/M144K), and high-speed serial transceivers. This heterogeneous structure enables designers to implement complex signal processing pipelines, packet processing engines, and high-speed interface bridging without sacrificing logic utilization. Typical applications include wireless baseband processing, high-definition video broadcast equipment, military secure communications, industrial machine vision, and high-speed serial protocol bridging (PCI Express, Serial RapidIO, Gigabit Ethernet). The industrial temperature grade (-40C to +100C) makes it appropriate for harsh-environment deployments. When designing with this device, ensure proper power decoupling and thermal management. The 780-ball FCBGA package requires controlled-impedance PCB stackup and high-quality BGA assembly processes. Designers should reference the manufacturer datasheet for transceiver channel placement, PLL configuration, and I/O standard support. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet.

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EP2AGX260EF29I3N - Arria II GX FPGA, 244K LE, 780-FBGA | Intel (Altera)
EP2AGX260EF29I3N

EP2AGX260EF29I3N - Arria II GX FPGA, 244K LE, 780-FBGA | Intel (Altera)

The Intel (formerly Altera) EP2AGX260EF29I3N is a high-density Arria II GX field-programmable gate array (FPGA) delivering 244,188 logic elements (LE) and 12,038,144 bits of embedded memory in a 780-ball fine-pitch BGA package. The device is fabricated on a 40 nm low-power process and operates from a 0.9 V core supply with industrial temperature grade (-40 °C to +100 °C). What is a mid-range FPGA? A field-programmable gate array is a semiconductor IC containing an array of configurable logic blocks (CLBs), dedicated block RAM, DSP slices, and high-speed transceivers that can be reprogrammed post-manufacture to implement custom digital logic, signal-processing pipelines, or interface protocols. Within the programmable-logic hierarchy, the Arria II GX sits between the lower-cost Cyclone family and the high-end Stratix family, targeting transceiver-rich applications such as wired communications, broadcast video, and high-performance DSP. Key features include 372 maximum user I/O, up to 12 transceiver channels supporting rates up to 6.375 Gbps, 8 PLLs, dedicated DDR2/DDR3 memory controllers with hardened PHY, and 8.7 Mbit of M20K block RAM. The Arria II GX architecture combines a 6-input adaptive logic module (ALM) with variable-precision DSP blocks, achieving up to 244,188 LEs and up to 1,023 embedded 18×18 multipliers for high-throughput DSP workloads. The integrated transceivers support CPRI, PCIe Gen1/Gen2, Gigabit Ethernet, Serial RapidIO, and Serial Digital Interface (SDI), enabling direct connectivity to backplanes, optical modules, and ASIC/ASSP co-processors without external PHY. The hard PCIe Gen2 IP block and multi-gigabit SERDES make the part especially attractive in communications infrastructure and high-end industrial imaging designs. Typical applications include wireless baseband processing, 3G/4G remote radio heads (RRH), SD/HD-SDI broadcast video routers, 40G/100G line-card prototyping, PCIe Gen2 endpoint cards, high-speed digitizers, and military/defense signal processing. The 780-ball FCBGA package provides the I/O density required by transceiver-heavy designs while remaining manufacturable on standard PCB substrates. When designing with this FPGA, follow Intel's Quartus Prime power-estimator and pin-connection guidelines: provide adequate decoupling on every transceiver and PLL supply rail, route the high-speed serial channels with controlled-impedance striplines, and respect the 0.9 V ±5 % core voltage tolerance to avoid logic failures under transient loading. This page synthesizes distributor pricing, verified drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

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EP2AGX260EF29I5 - Arria II GX 260K LE FPGA, 780-FCBGA | Intel
EP2AGX260EF29I5

EP2AGX260EF29I5 - Arria II GX 260K LE FPGA, 780-FCBGA | Intel

The Intel (formerly Altera) EP2AGX260EF29I5 is a high-density Arria II GX Field Programmable Gate Array delivering 244,188 logic elements, 244,188 adaptive logic modules, and up to 12,038,144 bits of embedded memory in a 780-pin FCBGA package with 372 user I/O pins. The device is fabricated on a 40 nm low-power CMOS process and operates at a core voltage of 0.9 V with a maximum core frequency of 500 MHz. An FPGA (Field Programmable Gate Array) is a programmable semiconductor device whose logic architecture consists of an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and routing resources. Within the broader taxonomy, FPGAs belong to programmable logic devices (PLDs) and are widely used as flexible alternatives to ASICs in designs that require parallel processing, high I/O throughput, or hardware-accelerated signal paths. Key features include eight high-speed transceivers capable of up to 3.75 Gbps for serial connectivity, up to 736 Kbits of distributed RAM per LAB block, support for DDR2/DDR3/QDRII+ external memory interfaces, and dedicated 18x18 multipliers for DSP applications. The Arria II GX family also integrates PCI Express hard IP blocks (x1, x2, x4 lanes Gen1/Gen2) and supports serial RapidIO, providing protocol-aware interfaces that simplify high-bandwidth designs. The EP2AGX260EF29I5 architecture leverages 10,260 LABs (Logic Array Blocks) built on Intel's adaptive logic module structure, paired with 256 DSP blocks for high-throughput arithmetic. The 0.9 V core voltage combined with 40 nm process technology achieves a balance between logic density and power efficiency, making the part attractive for mid-density, mid-bandwidth designs. Typical applications include high-speed data acquisition, wireless baseband processing, broadcast video processing, defense radar, medical imaging, and high-performance networking equipment where PCI Express, serial RapidIO, or multi-gigabit transceivers are needed without resorting to high-end Stratix-class devices. When designing with the EP2AGX260EF29I5, ensure the PCB layout uses high-density signal integrity practices: matched impedance for the 3.75 Gbps transceivers, sufficient decoupling near each power pin, and proper thermal vias under the FCBGA to remove heat from the 780-ball package. This page synthesizes distributor pricing, same-family Arria II GX alternatives, and design considerations that go beyond the manufacturer datasheet.

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EP2AGX260EF29I5G - Arria II GX FPGA 244K LE | Intel | 780-FBGA
EP2AGX260EF29I5G

EP2AGX260EF29I5G - Arria II GX FPGA 244K LE | Intel | 780-FBGA

The Intel (formerly Altera) EP2AGX260EF29I5G is a high-density Arria II GX Field Programmable Gate Array with 244,188 logic elements, 12,038,144 memory bits, and 372 maximum user I/Os, housed in a 780-ball FC-FBGA package measuring 29x29 mm. It is fabricated on a 40 nm process node and operates at a core voltage of 0.87 V to 0.93 V. The device integrates up to 12 transceiver channels (6.375 Gbps), making it suitable for high-speed serial I/O applications such as PCIe Gen1/Gen2, Gigabit Ethernet, Serial RapidIO, and CPRI/OBSAI backhaul. An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device consisting of an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable interconnect fabric. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) and are widely used to implement parallel digital logic, custom I/O protocols, hardware-accelerated DSP, and prototyping of ASICs. The Arria II GX family in particular combines high logic density with embedded transceivers, occupying the mid-range position between Altera's Stratix high-end series and the lower-cost Cyclone series. Key features include 1,026 embedded multiplier blocks (18x18) for DSP-intensive workloads, 8.55 Mbits of embedded memory (triple-mode with parity support), and dedicated hardware for PCI Express hard IP. The device supports configuration via JTAG, passive serial, fast passive parallel, and Active Serial (EPCS) modes, with built-in error correction for configuration memory. The EP2AGX260EF29I5G uses Altera's 40 nm low-power process, providing a balance between performance and dynamic power. Quartus II software with Arria II device support is used for synthesis, place-and-route, timing closure, and power estimation. Hard IP blocks accelerate common functions including PCIe Gen2 x8 endpoints, multi-gigabit transceivers, and external memory controllers for DDR3, DDR2, and QDR II+ memories. Typical applications include wireless baseband processing, software defined radio (SDR), broadcast video processing, industrial imaging and machine vision, military secure communications, and high-performance compute accelerators. The integrated transceivers also make it well-suited for protocol bridging between PCIe, Ethernet, and Serial RapidIO. When designing with this device, pay close attention to transceiver reference clock routing, decoupling capacitor placement around the FBGA, and thermal management - the device can dissipate tens of watts in dense transceiver-driven designs. Use Altera's Quartus II power analyzer early in the design cycle. This page synthesizes distributor pricing, drop-in alternatives from the Arria II GX family, and practical design notes not consolidated in any single manufacturer document. All cross-brand equivalents are sourced from published web references.

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EP2AGX260EF29I5N - Arria II GX FPGA, 244K LE, 780-FBGA | Intel
EP2AGX260EF29I5N

EP2AGX260EF29I5N - Arria II GX FPGA, 244K LE, 780-FBGA | Intel

The Intel (Altera) EP2AGX260EF29I5N is a high-density Arria II GX Field-Programmable Gate Array delivering 244,188 logic elements, 12,038,144 bits of embedded memory, and 1,152 18x18 multipliers in a 780-ball flip-chip BGA (FCBGA) package measuring 29 mm x 29 mm. The device integrates up to 12 high-speed transceivers operating at data rates up to 3.75 Gbps (CPLL) or 5 Gbps (channel PLL), making it suitable for PCI Express Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, and Serial Digital Interface (SDI) serial links. Industrial temperature grade (-40C to +100C) and speed grade 5 place it in the mid-speed tier of the Arria II GX family. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows designers to implement arbitrary digital logic, memory blocks, DSP blocks, and high-speed serial interfaces on a single silicon die. FPGAs sit hierarchically within semiconductor devices as integrated circuits that combine the flexibility of software-configurable hardware with deterministic parallel processing. The Arria II GX family targets mid-range applications that bridge the gap between Cyclone low-cost devices and Stratix high-performance devices, offering a balance of logic density, transceiver bandwidth, and power efficiency for communications, broadcast, and military/aerospace systems. Key features include 372 user I/O pins, 12 transceivers arranged in 4 transceiver blocks, support for DDR2/DDR3/QDRII/QDRII+ external memory interfaces, and dedicated PLL resources per quadrant. The device fabric uses Altera's adaptive logic module (ALM) architecture with 8-input fracturable look-up tables (LUTs), enabling efficient mapping of complex combinational and sequential logic. The 780-ball FCBGA package exposes 372 general-purpose I/O plus dedicated high-speed serial, clock, and configuration pins. The Arria II GX architecture pairs a robust logic fabric with hardened intellectual property (IP) blocks such as PCIe Gen2 hard IP, external memory controllers, and on-chip termination (OCT) calibration. This integration reduces soft-IP overhead and frees fabric resources for application logic. Transceivers support multiple bonding configurations and reference clock topologies (including differential and single-ended) to accommodate a wide variety of PCB layouts. Typical applications include wireless baseband processing, broadcast video processing, radar and electronic warfare signal chains, military secure communications, industrial imaging, and high-speed serial protocol bridging. Designers also use Arria II GX in test and measurement equipment where deterministic latency and flexible I/O are required. When designing with this FPGA, plan for JTAG-based configuration using an Altera/Intel download cable (USB-Blaster or equivalent) and ensure the PCB includes clean transceiver analog supply rails (VCCA, VCCP, VCCR) with proper decoupling. The 780-FCBGA package requires a multilayer PCB with controlled-impedance routing for the transceiver channels and matched-length lanes within each transceiver bank. This page synthesizes distributor pricing, industrial temperature and speed grade variants, and practical design notes not found in the manufacturer datasheet.

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EP2AGX260FF35C4 - Arria II GX FPGA 244K LE, 1152-FCBGA | Intel
EP2AGX260FF35C4

EP2AGX260FF35C4 - Arria II GX FPGA 244K LE, 1152-FCBGA | Intel

The Intel (formerly Altera) EP2AGX260FF35C4 is a high-density Arria II GX field-programmable gate array (FPGA) from the 40 nm Arria II GX family, integrating 244,188 logic elements, 612 user I/O, 12,038,144 bits of embedded memory, and 612 embedded 18x18 multipliers in a 1152-ball FC-FBGA package. It is specified at the C4 commercial speed grade with a 0.9 V core supply and supports transceiver-rich designs requiring both high logic capacity and high-speed serial I/O. According to the Arria II GX Device Data Sheet referenced on Altera/Intel documentation portals, the FF35 package denotes the 35 mm FC-BGA footprint used for the highest-density Arria II GX members. The Arria II GX family occupies the mid-to-high tier of Altera/Intel FPGAs and is positioned between the lower-power Cyclone families and the high-end Stratix families. FPGAs in this class are typically used in applications that demand hundreds of thousands of logic elements together with multi-gigabit transceivers, on-chip memory blocks, and DSP multipliers, all without migrating to a Stratix-class device. The Arria II GX line introduced integrated transceivers operating up to 6.375 Gbps and hard PCIe Gen2 IP blocks, making it attractive for cost-sensitive yet transceiver-rich designs. Key features of the EP2AGX260FF35C4 include 244,188 logic elements organized into 10,260 logic array blocks (LABs), 612 maximum user I/O pins routed through 12 I/O banks supporting multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL), and 612 18x18 hardware multipliers for DSP. The FF35 speed/package combination delivers the highest logic density and pin count in the family while maintaining the commercial junction temperature range. Typical applications include high-definition video broadcast equipment, wireless baseband processing, PCIe Gen2 endpoint/root-port designs, ASIC prototyping, and high-speed serial interface aggregation (e.g., multi-channel SATA, SAS, or CPRI). The FF35 package is also widely used in defense and test-and-measurement platforms where dense, transceiver-capable FPGAs are required. Designers should consult the Arria II GX handbook and AN551 guidance for transceiver channel placement and PCB stack-up recommendations when targeting multi-gigabit links. When designing with this device, pay close attention to transceiver reference clock architecture, PLL configuration, and decoupling strategies; the FF35 package's 1152-ball count requires careful escape routing. Quartus II software (with Arria II GX device support) is the required toolchain for synthesis, place-and-route, and configuration bitstream generation.

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EP2AGX260FF35C4G - Arria II GX FPGA 244K LE, 6.375Gbps, FC-FBGA-1152 | Intel
EP2AGX260FF35C4G

EP2AGX260FF35C4G - Arria II GX FPGA 244K LE, 6.375Gbps, FC-FBGA-1152 | Intel

The Intel (formerly Altera) EP2AGX260FF35C4G is a high-density Arria II GX Field-Programmable Gate Array with 244,188 logic elements, 12,038,144 embedded memory bits, and integrated transceivers capable of up to 6.375 Gbps, housed in a 1152-pin FC-FBGA package. Built on a 40nm low-power process with a 0.9V core voltage, the device targets mid-range applications requiring a balance of logic density, on-chip memory bandwidth, and multi-gigabit serial I/O. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O elements that the designer can reconfigure after manufacturing. Within the broader taxonomy, the EP2AGX260FF35C4G belongs to the Arria II GX mid-range transceiver family, which sits between Cyclone (low-cost) and Stratix (high-performance) in Intel/Altera's portfolio. Arria II GX parts integrate transceivers and PCML-capable I/O on-chip, replacing what would otherwise require a discrete PHY plus an FPGA. Key features include 244,188 logic elements, 612 user I/O, 12 Mbits of embedded memory, 4 PCI Express hard IP blocks, and 8 transceivers supporting protocols such as PCI Express Gen1/Gen2, Serial RapidIO, and CPRI. The device supports up to 1,152 pins in a wire-bond-compatible FC-FBGA with high-speed serial channels, allowing a single-chip implementation for high-bandwidth serial links. Additional silicon features include dedicated DSP blocks, variable-precision multipliers, and embedded memory blocks configurable as RAM, ROM, or FIFO. The Arria II GX architecture combines hard intellectual property (PCIe Gen2, 10-Gbps-capable transceivers, and external memory controllers) with a fabric of 8-input adaptive logic modules (ALMs) that optimize register and LUT packing. This yields high logic efficiency and lets the device hit DSP throughput targets (up to ~300 GMACs at 500 MHz) without consuming excessive fabric resources. The transceiver blocks incorporate adaptive equalization and clock-data-recovery to handle backplane losses at multi-Gbps rates. Typical applications include wireless baseband processing (LTE, WiMAX, CPRI front-haul), industrial video and broadcast interfaces, PCI Express Gen1/Gen2 endpoint and root-port designs, and high-speed serial backplane bridges in telecom and defense equipment. The combination of integrated transceivers and hard PCIe cores eliminates companion chips in many systems, reducing both BOM and board complexity. When designing with this device, ensure the PCB supports the FC-FBGA-1152 ball grid with controlled-impedance routing for the transceiver channels. Reference design guidance for transceiver channel layout, decoupling, and JTAG is provided in the device handbook, and designers should plan power sequencing around the 0.9V core rail with the supported 1.1V / 2.5V / 3.0V auxiliary rails. This page synthesizes distributor pricing, drop-in same-package alternatives (Arria II GX speed-grade variants), and practical design notes that go beyond what is summarized in the manufacturer datasheet, helping engineers shortlist a part number without having to compare datasheets line-by-line.

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EP2AGX260FF35C4N - Arria II GX 244K LE FPGA, 612 I/O, FCBGA-1152
EP2AGX260FF35C4N

EP2AGX260FF35C4N - Arria II GX 244K LE FPGA, 612 I/O, FCBGA-1152

The Altera (Intel) EP2AGX260FF35C4N is a high-density Arria II GX Field-Programmable Gate Array (FPGA) built on a 40 nm process, integrating 244,188 logic elements and 12,038,144 bits of embedded memory in a 1152-ball FineLine BGA (FC-FBGA) package. It supports up to 612 user I/O, 8 transceiver channels at up to 5 Gbps, and a core voltage of 0.9 V with a -4 speed grade suitable for commercial-temperature designs. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device containing an array of configurable logic blocks, dedicated DSP blocks, on-chip memory, and high-speed transceivers, all interconnected by a programmable routing fabric. FPGAs belong to the broader hierarchy of programmable logic devices (PLDs) within the integrated circuit / semiconductor taxonomy, and are widely used for parallel processing, custom digital logic, and high-speed serial interface implementation where ASICs would be uneconomical or too slow to design. Key features include 8 transceivers at up to 5 Gbps for PCI Express Gen2, Serial RapidIO, and CPRI links, integrated PCI Express hard IP blocks, and up to 612 user I/O supporting LVDS, LVTTL, LVCMOS, HSTL, and SSTL standards. The device also provides dedicated 18x18 multipliers and variable-precision DSP blocks for high-performance DSP pipelines. The 1152-ball FC-FBGA package enables high I/O density while supporting both single-ended and differential signaling at multi-gigabit data rates. Arria II GX FPGAs target mid-range applications where Stratix-class performance is not required but transceiver integration and DSP throughput remain essential. The 40 nm process node balances static and dynamic power, and the architecture supports hard IP for PCIe Gen2 x1/x4 and external memory interfaces including DDR3, DDR2, and QDRII+. The combination of high logic density, embedded transceivers, and dedicated DSP silicon makes the EP2AGX260 well-suited for communications infrastructure, broadcast video, and test-and-measurement platforms. Typical applications include wireless baseband processing, software-defined radio (SDR) prototyping, video broadcast and encoding platforms, 4G/LTE protocol stacks, radar and beamforming front-ends, industrial PCIe cards, and high-performance DSP co-processing. The integrated transceivers also suit SATA, CPRI/OBSAI, and Serial RapidIO interconnect fabrics in telecom infrastructure. When designing with the EP2AGX260FF35C4N, ensure the PCB has matched-impedance routing for all transceiver lanes, sufficient decoupling (typically 0402/0201 ceramics) at every power pin, and a thermal solution sized for the application power envelope. Confirm Quartus II support for the FF35C4N variant and that your transceiver reference clock meets the jitter requirements of the targeted serial protocol. This page synthesizes drop-in alternative MPNs, application-specific design notes, and a parameter-by-parameter comparison that complement - but do not replace - the manufacturer datasheet.

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EP2AGX260FF35C5 - Arria II GX FPGA 260K LE, 612 I/O FCBGA-1152 | Intel / Altera
EP2AGX260FF35C5

EP2AGX260FF35C5 - Arria II GX FPGA 260K LE, 612 I/O FCBGA-1152 | Intel / Altera

The Intel / Altera EP2AGX260FF35C5 is a high-density Arria II GX Field-Programmable Gate Array (FPGA) built on a 40 nm low-power process, delivering up to 244,188 logic elements (244K LE), 12,038,144 bits of embedded memory (about 1.5 MBytes), and 612 user I/O pins housed in a 1152-ball Fine-pitch Chip-Scale BGA (FCBGA-1152 / FBGA-1152) package. Arria II GX FPGAs are mid-range programmable logic devices (PLDs) that combine high-performance digital signal processing (DSP) blocks with multi-gigabit transceivers (MGTs) for serial connectivity. In the broader component taxonomy they sit under programmable logic -> FPGA -> PLD -> semiconductor, and they are complemented by fixed-function ASICs in cost-down high-volume applications and by microcontrollers in software-driven control tasks. The Arria II family specifically bridges the gap between Cyclone (low-cost) and Stratix (high-performance) families by targeting designs that need transceiver-based serial I/O plus sufficient logic density for parallel DSP and memory-intensive algorithms. Key features of the EP2AGX260FF35C5 include eight 6.375 Gbps multi-gigabit transceivers (C5 speed grade), embedded transceivers supporting PCIe Gen1/Gen2 and multiple SRIO / Serial RapidIO / 10G Ethernet protocols, hard PCI Express hard IP blocks, dedicated DSP blocks for high-speed arithmetic, programmable logic fabric supporting up to 244,188 equivalent logic elements, 12 Mbit of on-chip block RAM, and the FCBGA-1152 package with exposed thermal lid for efficient thermal dissipation. Operating supply voltages are typically 0.9 V core and 1.1 V / 2.5 V / 3.3 V I/O rails with the C5 commercial temperature grade (0 C to +85 C). Architecturally, the EP2AGX260FF35C5 uses an SRAM-based lookup-table (LUT) logic fabric with column- and row-based routing, dedicated memory block RAM (M20K) tiles, and variable-precision DSP blocks. Each transceiver channel includes clock-data recovery (CDR), serializer / deserializer (SERDES) hardware, and protocol-aware PCS logic to support industry-standard serial interfaces. The device is configured via JTAG or active/passive serial flash, and design entry uses Quartus II / Quartus Prime software. Typical applications include high-speed serial interface prototyping cards, PCIe Gen2 endpoint adapters, 10G Ethernet line cards, broadcast video processing, military / aerospace signal processing, and ASIC / ASSP prototyping. The wide transceivers and DSP capability make the device a frequent choice for DSP-heavy FPGA-based mezzanine cards (FMC / VITA-57). When selecting the EP2AGX260FF35C5, designers should plan for a multi-layer PCB with controlled-impedance transceiver lanes, a robust power distribution network with multiple decoupling caps per rail, and thermal relief through via arrays under the package lid. Quartus Prime design software (with device support for Arria II) is required for synthesis, place-and-route, and bitstream generation. This page consolidates distributor pricing, same-package drop-in alternatives, and practical design considerations - a synthesis not found in any single manufacturer datasheet, distributor product page, or parametric database.

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EP2AGX260FF35C5G - Arria II GX FPGA 244K LE, 612 I/O | Intel
EP2AGX260FF35C5G

EP2AGX260FF35C5G - Arria II GX FPGA 244K LE, 612 I/O | Intel

The Intel EP2AGX260FF35C5G is a high-density Arria II GX Field-Programmable Gate Array (FPGA) delivering 244,188 logic elements, 12,038,144 bits of embedded memory, and 612 user I/O in a 1152-ball FineLine BGA (FCBGA) package. As a member of Intel's (formerly Altera) mid-range Arria II GX family, this device targets cost-sensitive, transceiver-rich applications with up to 16 high-speed transceivers and embedded transceivers operating at data rates from 600 Mbps to 6.375 Gbps. The "C5" speed grade and commercial temperature rating position this part for mainstream design cycles where engineering-grade thermal envelopes are acceptable. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be reconfigured by the customer after manufacturing to implement virtually any digital logic function. FPGAs sit in the programmable logic taxonomy: FPGA -> programmable logic -> logic IC -> digital IC -> integrated circuit -> semiconductor. Arria II GX FPGAs occupy the mid-density tier between Cyclone (low-cost) and Stratix (high-performance) families, integrating transceivers, DSP blocks, and on-chip memory for signal-processing and protocol-bridging designs. Key features of the EP2AGX260FF35C5G include 8-input adaptive logic modules (ALMs), 312 hardware DSP blocks with up to 18x18-bit multipliers and accumulators, 244K logic elements, and 9.4 Mbits of internal RAM distributed across M20K blocks. Peripherals include PCI Express hard IP, external memory interfaces supporting DDR2/DDR3/QDRII/RLDRAM, and up to 16 embedded transceivers. The 1152-ball FCBGA package provides high pin density for high-bandwidth I/O. The Arria II GX architecture pairs a logic fabric with 6.375 Gbps transceivers, 8-bit SERDES, and hard PCIe Gen1/Gen2 IP, allowing engineers to consolidate protocol bridging, video processing, and DSP functions on a single chip. The C5 speed grade delivers a balance of Fmax and timing margin for cost-driven commercial systems. Typical applications include video broadcast infrastructure, wireless baseband processing, telecom backhaul, industrial imaging, and PCI Express adapter cards. This combination of high logic density, on-chip transceivers, and embedded DSP makes the EP2AGX260FF35C5G particularly suited for systems that previously required a discrete ASSP plus an FPGA. When designing with this part, ensure your PCB accommodates 1 mm pitch BGA routing with proper microvia stack-ups, and validate thermal envelopes against the FCBGA junction-to-ambient resistance. Plan power-rail sequencing around the Arria II GX POR (power-on-reset) requirements and verify transceiver reference-clock jitter budgets before tape-out. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical PCB/timing design notes not found in the manufacturer datasheet alone.

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EP2AGX260FF35C5N - 244K LE Arria II GX FPGA | Intel | 1152-FBGA
EP2AGX260FF35C5N

EP2AGX260FF35C5N - 244K LE Arria II GX FPGA | Intel | 1152-FBGA

The Intel EP2AGX260FF35C5N is a high-density Arria II GX Field Programmable Gate Array (FPGA) delivering 244,188 logic elements, 12,038,144 bits of embedded memory, and 736 (18x18) hardware multipliers in a 1152-ball flip-chip BGA package. It integrates 612 user I/Os, 48 SERDES channels, and 8 phase-locked loops (PLLs) supporting transceiver rates up to 3.75 Gbps, enabling high-throughput serial connectivity for digital signal processing, video bridging, and high-speed data aggregation systems. The C5 speed grade and -40C to +85C operating temperature range target industrial-grade applications requiring deterministic timing closure. What is an FPGA? A Field Programmable Gate Array is a semiconductor device containing programmable logic blocks, interconnect fabric, and I/O elements that engineers can configure after manufacture to implement custom digital circuits. FPGAs occupy a unique position in the silicon hierarchy: more flexible than Application-Specific Integrated Circuits (ASICs), lower-latency than microprocessors for parallel workloads, and increasingly competitive with Graphics Processing Units (GPUs) for streaming compute tasks. The Arria II GX family specifically adds hardened multi-gigabit transceivers, positioning it for protocols such as PCIe Gen1, Serial RapidIO, Gbps Ethernet, and CPRI/OBSAI in wireless backhaul. Key features include 10260 Logic Array Blocks (LABs), 4 fractional PLLs plus 4 general-purpose PLLs, dedicated DDR2/DDR3 memory controllers with hard PHY, and on-chip tri-speed Ethernet MACs. The 1152-pin FCBGA package uses Intel's flip-chip interconnect technology to deliver superior electrical performance and thermal dissipation for high-utilization designs. The EP2AGX260FF35C5N uses a 40nm process node, balancing static power consumption with 8-input adaptive logic modules (ALMs) that deliver up to 1.7x the performance of previous-generation 6-input LUT architectures. The integrated transceiver block achieves jitter performance below 2 ps RMS, making the device suitable for synchronous Ethernet and SONET/SDH interfaces. Typical applications include wireless baseband processing, military radar signal processing, medical imaging systems, high-definition video broadcast equipment, and ASIC prototyping platforms. The 48 transceiver channels support multiple CPRI links to remote radio heads in 4G LTE base stations, while the embedded memory bandwidth suits FFT engines for OFDM modulation/demodulation. When designing with the EP2AGX260FF35C5N, designers must use Intel Quartus II (or the newer Quartus Prime) design software for synthesis, place-and-route, and timing analysis. The 1152-ball FCBGA package requires high-density PCB fabrication (typically 8-12 layers with microvia stack-ups) and assembly with BGA-grade SMT processes. Power estimation should account for the dynamic power of 48 high-speed transceivers running at full rate.

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EP2AGX260FF35C6 - Arria II GX 244K LE FPGA, 612 I/O, FC-FBGA-1152 | Intel (Altera)
EP2AGX260FF35C6

EP2AGX260FF35C6 - Arria II GX 244K LE FPGA, 612 I/O, FC-FBGA-1152 | Intel (Altera)

The Intel (Altera) EP2AGX260FF35C6 is a high-density, transceiver-equipped Field Programmable Gate Array (FPGA) from the Arria II GX family, housed in a 1152-ball FC-FBGA (Flip-Chip Fine-pitch Ball Grid Array) package with 612 user I/O pins. Built on a 40 nm low-power process, it integrates approximately 244,188 logic elements and 12,038,144 memory bits, delivering mid-range density combined with multi-gigabit transceivers and an 18x18 multiplier count that makes it well-suited for DSP-intensive designs. According to distributor data, this device is part of the Arria II GX family of mid-range FPGAs targeting serial connectivity, video processing, and wireless baseband. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing to implement arbitrary digital logic. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs), themselves a sub-category of digital integrated circuits. Within Intel's product portfolio, Arria II GX occupies the mid-range tier between low-power Cyclone series and high-performance Stratix series, balancing cost, performance, and transceiver capability. The 40 nm process node enables lower static and dynamic power than the previous 65 nm generation while preserving up to 612 user I/O for high-bandwidth parallel interfaces. Key features of the EP2AGX260FF35C6 include 244,188 logic elements organized into 10,260 Logic Array Blocks (LABs), 12,038,144 bits of embedded memory for buffers and FIFO implementations, dedicated 18x18 hardware multipliers for DSP pipelines, integrated multi-gigabit transceivers operating up to 6.375 Gbps for protocols such as PCIe Gen2, Serial RapidIO, and Gigabit Ethernet, a hard PCI Express Gen2 controller block, and rich clock management with PLLs. The -C6 speed grade and 0.9 V core supply place this part in the commercial-grade mid-speed tier of the family. With 1152 balls in a 35 mm FC-FBGA package, the device requires multilayer PCB design with controlled-impedance routing and BGA assembly capability. From an architectural perspective, the Arria II GX series employs an island-style logic fabric with dedicated carry chains, distributed M9K memory blocks, MLAB logic-mode blocks, and variable-precision DSP blocks. Transceivers integrate hard PCS (Physical Coding Sublayer) and PMA (Physical Medium Attachment) layers, allowing soft logic to focus on user data-plane processing rather than low-level serialization. Hard memory controllers and the PCIe Gen2 controller further reduce soft-logic overhead, shortening time-to-market for designers. Typical applications include wireless baseband and digital pre-distortion (DPD) for radio units, broadcast video processing and switching, PCIe Gen2 endpoint cards, high-speed serial backplane aggregation, and industrial imaging pipelines. The combination of mid-density logic, embedded transceivers, and PCI-SIG-certified hard IP explains why Arria II GX remains attractive for cost-sensitive serial-connectivity designs even after the family was transitioned to legacy status. Designers should note that the FF35 FC-FBGA-1152 package requires a substantial PCB escape area and a stackup capable of routing 1.0 mm pitch BGA fanout. Multi-gigabit transceiver channels demand strict impedance control, length matching, and AC-coupling capacitor selection per Intel's Arria II GX Transceiver Layout Guidelines. Power-rail sequencing (1.0 V core, 2.5 V/3.3 V I/O banks, PLL analog supplies) must follow the datasheet Power-On Reset (POR) requirements to avoid latch-up during ramp. This page synthesizes distributor pricing, drop-in pin-compatible speed-grade alternatives, and practical high-speed BGA layout notes that go beyond the manufacturer datasheet alone.

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EP2AGX260FF35C6G - Arria II GX FPGA 244K LE | Intel | 1152-FCBGA
EP2AGX260FF35C6G

EP2AGX260FF35C6G - Arria II GX FPGA 244K LE | Intel | 1152-FCBGA

The Intel EP2AGX260FF35C6G is a high-performance, low-power Arria II GX Field-Programmable Gate Array (FPGA) housed in a 1152-ball FineLine BGA (FCBGA) package. It integrates 244,188 logic elements, 12,038,144 bits of embedded memory, 612 embedded 18x18 multipliers, and 16 transceivers supporting data rates up to 6.375 Gbps. The device targets mid-range applications that need both logic density and multi-gigabit serial I/O without sacrificing power efficiency. An FPGA is a reconfigurable integrated circuit whose logic, memory, and I/O blocks are defined by a configuration bitstream rather than fixed masks. The Arria II GX family sits within Intel's (formerly Altera) mid-range product hierarchy: FPGA -> programmable logic -> PLD -> semiconductor. Compared with CPLDs, FPGAs offer far higher logic density and block-RAM; compared with ASICs, FPGAs provide rapid prototyping and post-silicon field upgrades through partial reconfiguration. Key features include 8 PLLs for clock management, support for DDR2/DDR3/QDRII+ external memory interfaces, integrated PCI Express hard IP blocks, and transceivers compliant with PCIe Gen1/Gen2, GIGE, XAUI, and Serial RapidIO protocols. Hard DSP blocks accelerate fixed- and floating-point operations, while the Quartus II design suite provides synthesis, place-and-route, and timing closure for the device. The C6 speed grade denotes a mid-tier performance bin optimized for industrial and commercial designs. The Arria II GX architecture uses a 40 nm process node, delivering sub-watt static power and dynamic power gated through the Quartus PowerPlay tool. Distributed and column-based M20K memory blocks deliver up to 612 embedded multipliers for high-throughput DSP pipelines, while 24 global clock networks support complex multi-clock-domain SoC designs. Typical applications include wireless baseband processing, high-speed serial bridge and protocol conversion, broadcast video processing, industrial machine vision, and PCI Express endpoint cards. The transceiver count and protocol support also make the part suitable for telecom backhaul aggregation and test-and-measurement instrumentation front ends. When designing with the EP2AGX260FF35C6G, allocate adequate PCB area for the FCBGA escape routing and a minimum 8-layer stack-up for transceiver signal integrity. Use the Quartus II transceiver toolkit for pre-emphasis and equalization tuning, and verify the JTAG chain against the BSDL file before bringing up prototype boards. This page synthesizes current distributor pricing, package-matched drop-in alternatives from the same Arria II GX family, and design notes that complement the official datasheet.

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EP2AGX260FF35C6N - Arria II GX 244K LE FPGA, 1152-FBGA | Intel
EP2AGX260FF35C6N

EP2AGX260FF35C6N - Arria II GX 244K LE FPGA, 1152-FBGA | Intel

The Intel (Altera) EP2AGX260FF35C6N is a high-density Arria II GX Field Programmable Gate Array (FPGA) delivering 244,188 logic elements, 612 user I/O, and 10,260 Logic Array Blocks (LABs) in a 1152-ball FineLine Ball-Grid Array (FBGA) package. Built on a 40 nm CMOS process with 0.9 V core supply, it operates at up to 400 MHz and integrates up to 12,038,144 bits of embedded memory plus dedicated transceivers for high-speed serial I/O. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit built from an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect. FPGAs occupy a distinct tier in the programmable logic hierarchy (FPGA -> programmable logic -> ASIC prototyping -> digital IC -> semiconductor), enabling parallel hardware execution, deterministic latency, and post-fabrication reprogrammability. Compared with general-purpose microcontrollers, FPGAs deliver substantially higher I/O throughput and per-clock computation for data-path intensive workloads. Key differentiating features of the EP2AGX260FF35C6N include its 244K logic-element capacity, integrated PCI Express hard IP, multi-gigabit transceivers (MGTs) supporting protocols such as PCIe Gen2, Serial RapidIO, XAUI, and CPRI, and on-chip memory blocks with hardware FIFO controllers. The 1152-FCBGA package exposes 612 user I/O pins to support wide parallel buses, external memory interfaces (DDR2/DDR3/QDRII+/RLDRAM II), and multiple high-speed serial links simultaneously. Architecturally, the device uses a heterogeneous fabric that combines 4-input ALMs (Adaptive Logic Modules), M9K and M144K memory blocks, MLABs, and DSP blocks operating at 400 MHz fabric speed. The transceiver block delivers up to 6.375 Gbps data rate, while the hard PCIe Gen2 controller supports x1/x4 lane configurations, eliminating soft-logic timing closure on the most demanding serial interfaces. Typical applications include high-speed serial interface bridging, digital video broadcasting, wireless baseband processing, defense and aerospace signal processing, and ASIC prototyping. The combination of high logic density, embedded transceivers, and large on-chip memory makes it well suited to throughput-bound designs that would otherwise require multiple discrete components. When designing with this part, plan power-rail decoupling carefully - the 0.9 V core, 1.1 V PLL, and 2.5 V/3.3 V I/O supplies each require bulk and high-frequency ceramic capacitors near the balls. Use Intel Quartus II or Quartus Prime for place-and-route, and respect simultaneous-switching-output (SSO) guidelines for the 612 I/O to maintain signal-integrity margins. This page synthesizes distributor pricing, drop-in alternatives, and practical design considerations not consolidated on any single distributor page, providing engineers with an actionable decision-support reference.

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EP2AGX260FF35I3G - Arria II GX FPGA, 244K LE, 1152-FBGA | Intel
EP2AGX260FF35I3G

EP2AGX260FF35I3G - Arria II GX FPGA, 244K LE, 1152-FBGA | Intel

The Intel (formerly Altera) EP2AGX260FF35I3G is a high-density Arria II GX Field-Programmable Gate Array (FPGA) built on a 40 nm process, integrating 244,188 logic elements, 12,038,144 bits of embedded memory, and 612 user I/O pins in a 1152-ball FineLine Ball-Grid Array (FC-FBGA) package. The Arria II GX family is engineered for high-throughput serial connectivity, providing up to 16 transceivers at data rates suitable for PCI Express Gen2, Serial RapidIO, and multi-gigabit serial interfaces in a single programmable device. The device operates from a 0.9 V core supply with separate transceiver and auxiliary rails, and the speed grade 3 (I3) variant balances timing margin and maximum frequency for industrial temperature operation. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks, programmable interconnect, and dedicated hard IP such as transceivers and memory blocks. FPGAs occupy the top of the programmable-logic taxonomy: PLA -> CPLD -> FPGA -> SoC FPGA, and are widely used when time-to-market and design flexibility outweigh the per-unit cost advantage of an ASIC. The Arria II GX family specifically targets the mid-range transceiver-integrated segment between Cyclone (low cost) and Stratix (highest performance). Key features include embedded transceivers, hard PCI Express Gen2 IP cores, embedded memory blocks with byte-enable parity, dedicated DSP blocks for high-throughput signal processing, and configuration support via JTAG, Active Serial, Passive Serial, and Fast Passive Parallel modes. The device supports hot-socketing and in-system programming for production-line flexibility. Industrial temperature grade (I3 suffix) supports -40 C to +100 C operation, while the trailing G indicates lead-free / RoHS-compliant lead finish on the BGA balls. Typical applications include wireless baseband processing, high-speed serial bridging between ASICs, military radar signal processing, broadcast video engines, and PCI Express endpoint / root-port prototyping. For new designs, designers should consider migrating to Intel Cyclone V GT, Arria V GX, or Arria 10 GX families, as Arria II GX is in its end-of-life window and is increasingly sourced through distributors rather than direct Intel channels. A practical design tip: Arria II GX transceivers require careful attention to reference-clock jitter and PCB stack-up for the channel. Use the Quartus II transceiver toolkit to characterize link margin, and de-rate the line rate by at least 10-15% during board bring-up to absorb manufacturing tolerance. This page synthesizes distributor stock and pricing, parametric alternatives, and design notes not found in the Altera Arria II GX Device Handbook, providing an at-a-glance procurement reference for engineers and NPI buyers evaluating this legacy high-density FPGA.

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EP2AGX260FF35I3N - 244K LE Arria II GX FPGA | Intel (Altera)
EP2AGX260FF35I3N

EP2AGX260FF35I3N - 244K LE Arria II GX FPGA | Intel (Altera)

The Intel (formerly Altera) EP2AGX260FF35I3N is a high-density Arria II GX field-programmable gate array (FPGA) integrating 244,188 logic elements, 12,038,144 bits of embedded memory, and 612 user I/Os in a 1152-ball flip-chip BGA (FCBGA, 35 x 35 mm) package. The Arria II GX family targets mid-range applications requiring integrated transceivers for high-speed serial connectivity, combining a hardened 6.375 Gbps transceiver PHY with a low-power adaptive logic module (ALM) fabric to deliver a balanced power/performance profile for protocol bridging, video processing, and DSP-intensive designs. An FPGA (field-programmable gate array) is a reconfigurable semiconductor device whose logic functionality is defined after manufacture by the user. Architecturally the FPGA sits within the broader category of programmable logic devices (PLDs) and competes with CPLDs on the low end and ASICs on the high end. FPGAs consist of an array of configurable logic blocks (ALMs/LEs), programmable interconnect, embedded memory (block RAM), DSP blocks, clock management PLLs, and high-speed transceiver/IO tiles. They are widely used to prototype logic, accelerate parallel algorithms, and provide reconfigurable interfaces in telecom, broadcast, defense, and industrial systems. Key features of the EP2AGX260FF35I3N include 10260 LABs/CLBs, 612 I/O pins, embedded 6.375 Gbps multi-gigabit transceivers for protocols such as PCIe Gen1/Gen2, Serial RapidIO, XAUI, CPRI, and Gbps Ethernet, hard PCIe Gen1/Gen2 IP blocks, up to 16 global clock networks, and dynamic on-chip termination (OCT). The device operates from a 1.0 V core supply, supports configuration via fast passive parallel (FPP), active serial (AS), passive serial (PS), and JTAG modes, and is rated for the industrial temperature range (-40 C to +100 C case). The Arria II GX architecture uses an adaptive logic module (ALM) building block that combines 8-input fracturable look-up tables with dedicated arithmetic and register chains, increasing effective logic density by approximately 25 % over previous-generation 4-input LUT architectures. Multi-track routing and optimized pipeline registers enable sustained DSP throughput above 300 MHz, which is essential for wireless baseband and video codec pipelines. Hard memory controllers and variable-precision DSP blocks coexist with user-configurable fabric, allowing designers to instantiate high-bandwidth packet buffers and FFT engines without consuming programmable logic. Typical applications include wireless baseband processing (LTE, WiMAX), video infrastructure (broadcast encoders, transcoders, display controllers), high-speed serial protocol bridging (PCIe, Serial RapidIO, Gbps Ethernet), test and measurement instrumentation, and radar signal processing. Designers typically pair the FPGA with DDR2/DDR3 SDRAM, external flash for configuration storage, and an FPGA power supply such as the Intel Enpirion EN63A0QI or Linear Technology (Analog Devices) LTM4620/LTM4644 multi-rail controller to meet the 1.0 V core and 2.5 V/3.3 V aux rail requirements. When designing with this device, ensure 0.1 uF + 10 uF decoupling is placed adjacent to every power pin, follow the FCBGA escape and via-in-pad recommendations in the Arria II device handbook, and use Quartus II (or the later Quartus Prime) for synthesis, place-and-route, and timing closure. Estimating: total power at full transceiver utilization approaches 15-20 W and requires a multi-layer PCB with at least 2 oz copper and a thermal management plan (heat spreader or heatsink with controlled airflow) to keep the junction temperature within limits. This page synthesizes distributor pricing, same-package drop-in alternatives drawn from the Site MPN list, and practical FPGA design notes not found in a single datasheet reference, giving design engineers a one-stop engineering summary for the EP2AGX260FF35I3N.

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EP2AGX260FF35I3NAA - Arria II GX FPGA 260K LE | Altera | BGA
EP2AGX260FF35I3NAA

EP2AGX260FF35I3NAA - Arria II GX FPGA 260K LE | Altera | BGA

The Altera (Intel) EP2AGX260FF35I3NAA is a high-density Arria II GX Field-Programmable Gate Array (FPGA) integrating 244,188 logic elements, 12,038,144 embedded memory bits, and 612 hardware multipliers in a 1152-ball FineLine BGA (FBGA-1152) package. Built on a 40 nm process, the device delivers up to 8.5 Gbps transceiver operation across 12 transceivers for high-bandwidth serial I/O, making it a system-on-chip solution for performance-critical embedded designs. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks, programmable interconnect, and dedicated hardware resources such as block RAM, DSP slices, and (in modern families) high-speed transceivers. FPGAs sit at the same level in the broader taxonomy as ASICs and microcontrollers, but unlike ASICs they can be re-programmed in the field to implement custom digital logic, glue logic, parallel processing pipelines, or even entire soft-core processor systems. The Arria II GX family targets mid-range applications that require a balance of logic density, on-chip memory, and integrated multi-gigabit transceivers without the power and cost of a Stratix-class device. Key features of the EP2AGX260FF35I3NAA include 8 user I/O banks supporting a wide range of single-ended and differential I/O standards (LVDS, LVPECL, HSTL, SSTL), dedicated DDR2/DDR3 memory controller hard IP, and 6 PLLs for clock management. The device operates across an industrial temperature range of -40C to +100C and supports the FF35 speed grade with I3 (-40C to +100C industrial) designation. The integrated transceivers support protocols including PCI Express Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, XAUI, and CPRI, eliminating the need for external PHY chips in many designs. Typical applications include telecom baseband processing, software-defined radio (SDR), military radar signal processing, video broadcast infrastructure, and high-speed serial protocol bridging. The combination of 244K logic elements with 12 Mbit embedded RAM makes the EP2AGX260 particularly well suited for data path intensive functions such as FFT processing, packet classification, and digital up/down conversion. When designing with this 1152-ball FBGA device, careful PCB layout with microvia stack-up, matched-length high-speed traces, and a robust power distribution network with multiple decoupling capacitors are mandatory. Thermal management should account for the industrial temperature grade and possible high transceiver utilization. This page synthesizes distributor pricing, drop-in alternative cross-references within the Arria II GX family, and practical design notes not consolidated in the manufacturer datasheet alone.

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EP2AGX260FF35I5 - Arria II GX FPGA, 244K LE, 612 IO | Intel
EP2AGX260FF35I5

EP2AGX260FF35I5 - Arria II GX FPGA, 244K LE, 612 IO | Intel

The Intel (formerly Altera) EP2AGX260FF35I5 is a high-density Arria II GX Field Programmable Gate Array (FPGA) with 244,188 logic elements, 612 user I/Os, 12,038,144 memory bits, and integrated transceivers, housed in a 1152-ball Flip-Chip BGA (FCBGA) package. Built on a 40nm process, it operates from a 0.9V core supply and is specified for the industrial temperature range (-40C to +100C, I5 grade). The FF35 device code indicates the 35mm package footprint with the industrial speed/temperature grade. What is a FPGA? A Field-Programmable Gate Array is a semiconductor device containing programmable logic blocks (logic elements, LABs, DSP blocks, and memory blocks) interconnected by a configurable routing matrix. FPGAs sit at the top of the programmable logic hierarchy (PLD -> CPLD -> FPGA) and deliver hardware-level parallelism that microcontrollers cannot match. The Arria II GX family specifically targets mid-range applications that require embedded transceivers, making them part of the transceiver-equipped FPGA category alongside Stratix and Cyclone families. Key specifications include up to 16 transceivers with rates from 600 Mbps to 6.375 Gbps, dedicated DSP blocks for high-performance fixed/floating-point math, embedded hard IP for PCIe Gen2 and external memory interfaces (DDR3, QDRII+, RLDRAM2), and 12.5 Gbps LVDS support. The 35x35mm FCBGA package uses flip-chip technology for high pin density and superior thermal performance, enabling sustained operation in industrial environments. The Arria II GX architecture combines a logic fabric with hard IP for transceivers, PCI Express, and memory controllers, balancing flexibility with deterministic performance. Its 40nm low-power process reduces static and dynamic power relative to the prior Stratix IV generation, while the GX variant's integrated transceivers eliminate the need for external PHY chips in serial-protocol designs. Typical applications include high-speed serial-protocol bridging (PCIe, SATA, CPRI, XAUI), wireless baseband processing, broadcast video processing, military/aerospace signal processing, and industrial imaging. The combination of 244K logic elements and embedded transceivers suits mid-volume designs where ASIC NRE cost is prohibitive but microcontrollers or DSPs lack required throughput. Design consideration: the 0.9V core and multiple auxiliary rails require careful power-sequence design; failure to follow Intel's recommended ramp ordering may cause latch-up. The 1152-ball BGA also demands controlled-impedance PCB stackup and assembly via X-ray inspection. This page synthesizes distributor pricing, drop-in Arria II GX alternatives, and practical design considerations beyond the datasheet - giving engineers a fast procurement and selection reference for high-density FPGA designs.

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EP2AGX260FF35I5G - Arria II GX FPGA, 244K LE, 1152-FCBGA | Intel
EP2AGX260FF35I5G

EP2AGX260FF35I5G - Arria II GX FPGA, 244K LE, 1152-FCBGA | Intel

The Intel (formerly Altera) EP2AGX260FF35I5G is a high-density Arria II GX Field Programmable Gate Array (FPGA) built on a 40nm process, delivering 244,188 logic elements, 612 user I/O pins, and 12,038,144 bits of embedded memory in a 1152-ball FC-FBGA package. It integrates up to 12 transceiver channels supporting multi-gigabit serial connectivity, making it a mid-range, transceiver-rich platform for high-speed serial and parallel digital designs. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP blocks such as transceivers, memory controllers, and DSP slices. FPGAs belong to the broader family of programmable logic devices (PLDs) and are positioned in the system hierarchy as: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. Unlike ASICs, FPGAs are reprogrammable in-system, enabling rapid prototyping, hardware acceleration, and design iteration without NRE cost. The EP2AGX260FF35I5G core operates at 0.9V with up to 500 MHz internal performance. Key features include embedded 18x18 multipliers for DSP, dedicated high-speed transceivers (CPRI, PCIe, Gigabit Ethernet, Serial RapidIO), on-chip memory, and PLL-based clock management. The Arria II GX architecture balances logic density, transceiver bandwidth, and power efficiency, targeting mid-volume applications. Designed on TSMC's 40nm process, the device combines a high-logic-count fabric with multi-gigabit transceivers in a single die, reducing board area versus multi-chip implementations. The FF35 package designation indicates a 35 mm body size FCBGA with fine-pitch BGA balls optimized for high-speed signal integrity at transceiver rates. Typical applications include wireless baseband processing, telecom backhaul, military radar, broadcast video processing, and high-performance computing accelerators. The device is well suited for designers transitioning from ASIC to FPGA for low-volume production or for systems requiring field upgradability. When designing with this FPGA, pay attention to transceiver channel placement constraints, reference clock architecture, and thermal dissipation - the high transceiver count requires multi-layer PCB stackups and careful power delivery. Quartus II design software with Arria II GX device support is required for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, drop-in same-package alternatives drawn from the Arria II GX family, and practical design notes drawn from the manufacturer datasheet, providing engineering insight not duplicated on individual distributor product pages.

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EP2AGX260FF35I5N - Arria II GX FPGA 244K LE, 612 IO | Intel
EP2AGX260FF35I5N

EP2AGX260FF35I5N - Arria II GX FPGA 244K LE, 612 IO | Intel

The Intel (formerly Altera) EP2AGX260FF35I5N is a high-density Arria II GX field-programmable gate array (FPGA) integrating 244,188 logic elements, 12,038,144 bits of embedded SRAM, and 8 transceivers capable of up to 6.375 Gbps operation, housed in a 1152-ball FC-FBGA package. The device targets mid-range serial connectivity, digital signal processing, and high-throughput data-pipeline applications that demand deterministic performance at industrial temperature grades. A field-programmable gate array (FPGA) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), programmable interconnect, embedded memory, and hardened IP such as transceivers, DSP blocks, and PLLs. FPGAs sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs) in the design hierarchy: unlike microcontrollers they execute logic in parallel hardware, and unlike ASICs they can be reconfigured after fabrication. The Arria II GX family specifically targets designs requiring integrated transceivers, making it a popular mid-density solution for protocol bridging and high-speed serial I/O. The EP2AGX260FF35I5N features 612 user I/Os, 8 integrated transceiver channels supporting data rates up to 6.375 Gbps, and 10260 Adaptive Logic Modules (ALMs) providing efficient 6-input LUT-based logic implementation. The 0.9 V core supply and industrial -40 C to +100 C operating range position this device for telecom, industrial imaging, and military/aerospace embedded applications where temperature tolerance is mandatory. The device is built on a 40 nm process and supports 18x18 multipliers, 64-bit external memory interfaces (DDR3/QDRII+/RLDRAM II), and PCI Express Gen1/Gen2 hard IP blocks. The integrated transceivers support protocols including PCIe Gen1/2, Gigabit Ethernet, Serial RapidIO, and Common Public Radio Interface (CPRI), eliminating the need for external PHY devices in many designs. Typical applications include wireless baseband processing, software-defined radio front-ends, high-speed serial protocol bridges, ASIC prototyping, and embedded military signal-processing platforms. The industrial temperature grade and 1152-ball FCBGA package make it suitable for ruggedized systems and 6U VPX backplane designs. When designing with this FPGA, ensure proper power-rail sequencing and use the Quartus II design software (version 13.1 or earlier for legacy Arria II support) for synthesis, place-and-route, and timing closure. The FC-FBGA-1152 package requires a multilayer PCB stackup with controlled-impedance routing for transceiver channels. This page synthesizes real-time distributor pricing, drop-in package-compatible alternatives drawn from the Arria II GX family, and design-in considerations not found in the standalone manufacturer datasheet.

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EP2AGX45CU17C4G - Arria II GX FPGA, 42K LE, 156 I/O, 358-BGA | Intel
EP2AGX45CU17C4G

EP2AGX45CU17C4G - Arria II GX FPGA, 42K LE, 156 I/O, 358-BGA | Intel

The Intel EP2AGX45CU17C4G is a 40nm Arria II GX Field-Programmable Gate Array (FPGA) integrating 42,959 logic elements, 3,517,440 bits of embedded memory, and transceivers in a 358-ball FCBGA/LFBGA package. Operating with a 0.9V core supply and a -4 speed grade, this Arria II GX device targets cost-sensitive mid-range applications that need high-speed serial I/O without migrating to a larger family. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), dedicated DSP blocks, embedded RAM, and programmable I/O elements interconnected by a programmable routing fabric. FPGAs sit at the top of the digital logic hierarchy between discrete gate arrays and full ASICs, providing hardware-timed parallelism that microcontrollers cannot match. Within the Altera/Intel portfolio, the Arria II GX family occupies the mid-range transceiver-capable tier above Cyclone and below Stratix, optimized for protocols such as PCI Express Gen1/Gen2, Gigabit Ethernet, Serial RapidIO, and CPRI/OBSAI common in wireless backhaul. Key features include 42,959 logic elements, 2,365 Kbits of dedicated RAM, embedded 18x18 multipliers, 156 user I/Os, and 3.5 Mbits of total embedded memory. The device integrates transceivers supporting data rates up to 3.75 Gbps, hardened PCI Express Gen1/Gen2 endpoints, and a DDR2/DDR3 memory controller interface. Configuration is supported through passive serial (PS), fast passive parallel (FPP), and JTAG modes with built-in decompression and encryption via the AES-128 bitstream security engine. Architecturally, the EP2AGX45CU17C4G uses a 40nm low-power process with adaptive logic modules (ALMs) that combine look-up tables and registers into 8-input fracturable structures. The transceiver tiles integrate the PHY, PCS, and bonding clocking for protocol portability, while the variable-precision DSP blocks accelerate fixed- and floating-point math for signal processing pipelines. Typical applications include wireless baseband processing, broadcast video encoders, medical imaging accelerators, industrial motor control, and high-speed serial interface bridging. Engineers select this Arria II GX device when designs need more logic density than Cyclone V but not the full transceiver bandwidth of Stratix IV. When designing with this FPGA, ensure 0.9V core and 2.5V/3.3V auxiliary rails use low-noise LDO regulators placed within 25mm of the package. A multi-layer PCB with continuous ground planes and matched-length transceiver traces is required for signal integrity above 1 Gbps. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

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