EP2AGX260EF29I5 - Arria II GX 260K LE FPGA, 780-FCBGA | Intel
부품 번호: EP2AGX260EF29I5 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1478.4 | $1,478.40 |
| 10 | $1410 | $14,100.00 |
| 50 | $1340 | $67,000.00 |
| 100 | $1295 | $129,500.00 |
| 500 | $1235 | $617,500.00 |
EP2AGX260EF29I5 개요
An FPGA (Field Programmable Gate Array) is a programmable semiconductor device whose logic architecture consists of an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and routing resources. Within the broader taxonomy, FPGAs belong to programmable logic devices (PLDs) and are widely used as flexible alternatives to ASICs in designs that require parallel processing, high I/O throughput, or hardware-accelerated signal paths.
Key features include eight high-speed transceivers capable of up to 3.75 Gbps for serial connectivity, up to 736 Kbits of distributed RAM per LAB block, support for DDR2/DDR3/QDRII+ external memory interfaces, and dedicated 18x18 multipliers for DSP applications. The Arria II GX family also integrates PCI Express hard IP blocks (x1, x2, x4 lanes Gen1/Gen2) and supports serial RapidIO, providing protocol-aware interfaces that simplify high-bandwidth designs.
The EP2AGX260EF29I5 architecture leverages 10,260 LABs (Logic Array Blocks) built on Intel's adaptive logic module structure, paired with 256 DSP blocks for high-throughput arithmetic. The 0.9 V core voltage combined with 40 nm process technology achieves a balance between logic density and power efficiency, making the part attractive for mid-density, mid-bandwidth designs.
Typical applications include high-speed data acquisition, wireless baseband processing, broadcast video processing, defense radar, medical imaging, and high-performance networking equipment where PCI Express, serial RapidIO, or multi-gigabit transceivers are needed without resorting to high-end Stratix-class devices.
When designing with the EP2AGX260EF29I5, ensure the PCB layout uses high-density signal integrity practices: matched impedance for the 3.75 Gbps transceivers, sufficient decoupling near each power pin, and proper thermal vias under the FCBGA to remove heat from the 780-ball package.
This page synthesizes distributor pricing, same-family Arria II GX alternatives, and design considerations that go beyond the manufacturer datasheet.
드롭인 대체품: EP2AGX260EF29I5 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2AGX260EF29I5 (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Mounting Type, Process Technology, Embedded Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2AGX260EF29I3N
✅ 드롭인✓ 재고 있음
$2120 / 개
데이터시트 보기 →EP2AGX260EF29I3G
✅ 드롭인✓ 재고 있음
$1480 / 개
데이터시트 보기 →EP2AGX260EF29C6N
✅ 드롭인✓ 재고 있음
$1395 / 개
데이터시트 보기 →EP2AGX260EF29C5N
✅ 드롭인✓ 재고 있음
$1565 / 개
데이터시트 보기 →EP2AGX260EF29C4N
✅ 드롭인✓ 재고 있음
$1295 / 개
데이터시트 보기 →EP2AGX260EF29I5 최대 정격 & 전기적 특성
| Manufacturer | Intel (formerly Altera) |
| Family | Arria II GX |
| Logic Elements (LE) | 244,188 |
| Adaptive Logic Modules (ALM) | 244,188 |
| Logic Array Blocks (LAB) | 10,260 |
| Embedded Memory | 12,038,144 bits |
| User I/O Count | 372 |
| Process Technology | 40 nm CMOS |
| Core Voltage | 0.9 V |
| Maximum Core Frequency | 500 MHz |
| Transceivers | 8 high-speed transceivers up to 3.75 Gbps |
| DSP Blocks | 256 |
| 패키지 | 780-pin FCBGA (Flip-Chip Ball Grid Array) |
| 동작 온도 | Industrial -40C to +100C |
| PCIe Hard IP | Yes, Gen1/Gen2 |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
EP2AGX260EF29I5 780-pin fcbga (flip-chip ball grid array) 핀 구성 가이드
EP2AGX260EF29I5(780-pin fcbga (flip-chip ball grid array) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2AGX260EF29I5.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2AGX260EF29I5 적합 용도: 6 애플리케이션s: Wireless Baseband Processing, High-Speed Data Acquisition, Broadcast Video Processing, Medical Imaging Systems, Defense Radar Signal Processing, Industrial Networking Equipment.
Wireless Baseband Processing
The EP2AGX260EF29I5 is well-suited for wireless baseband signal processing thanks to its 244,188 logic elements, 256 18x18 DSP blocks, and 8 multi-gigabit transceivers supporting up to 3.75 Gbps. The high DSP count enables parallel channelization, FFT/iFFT operations, and channel coding for LTE, WiMAX, or proprietary OFDM waveforms at baseband. Its integrated PCI Express hard IP allows direct connection to baseband SoCs or DSP co-processors, while the 12 Mbits of embedded memory buffer symbols between FFT blocks and rate-matching modules without external memory round-trips. The 780-FCBGA package provides ample user I/O for antenna interfaces, ADC/DAC links, and CPRI/OBSAI backhaul connections. Designers can choose this FPGA to consolidate baseband and pre-FFT processing onto a single mid-density device, reducing PCB area versus discrete DSP plus ASIC partitioning.
추천
High-Speed Data Acquisition
For data acquisition systems digitizing multiple analog channels, the EP2AGX260EF29I5 offers the I/O count, memory bandwidth, and DSP resources required to capture and process multiple gigabit-class ADC streams. With 372 user I/Os, designers can pair the FPGA with multiple high-speed ADCs (such as 12-/14-bit at 250+ MSPS), while the 12 Mbits of internal memory serves as a low-latency FIFO before packetization. The eight 3.75 Gbps transceivers enable high-throughput backhaul to storage or compute resources via PCI Express Gen2 x4 or custom serial protocols. Industrial temperature grading (-40C to +100C) suits test and measurement equipment deployed in harsh environments such as factory floors, power plants, and outdoor instrumentation cabinets. The 0.9 V core voltage combined with 40 nm process keeps the device within manageable thermal envelopes even at 244,188 LE utilization.
추천
Broadcast Video Processing
Broadcast and professional video systems benefit from the EP2AGX260EF29I5's large memory capacity and high DSP throughput. The 12 Mbits of embedded memory supports line buffers for video scaling, deinterlacing, and frame-rate conversion without external SDRAM access, reducing latency and pin count. The 256 DSP blocks accelerate color space conversion, scaling filters, and compression/decompression algorithms. Serial transceivers handle SDI, HDMI, and DisplayPort interfaces, while 372 I/Os are sufficient for parallel video buses plus audio, GPIO, and control channels. The industrial temperature grade supports deployment in studio and outdoor broadcast environments. Designers typically use the Arria II GX here to consolidate scaling, mixing, and overlay functions on a single chip while avoiding higher-cost Stratix-class devices.
추천
Medical Imaging Systems
Medical imaging equipment such as ultrasound, CT, and MRI front-ends require deterministic real-time processing across many channels - an ideal fit for the EP2AGX260EF29I5. The 244,188 logic elements handle beamforming, demodulation, and image reconstruction for multi-element transducer arrays, while the 256 DSP blocks accelerate FIR/IIR filters and matrix math operations. The 12 Mbits of embedded memory cache image slices for post-processing before display. Industrial temperature grading is important for cart-mounted or operating-room equipment where thermal conditions can vary. PCI Express hard IP enables high-speed transfer of reconstructed images to host CPUs or GPUs for rendering. The 780-FCBGA package delivers the high pin count needed for parallel ADC interfaces and image display outputs in a single chip.
추천
Defense Radar Signal Processing
Defense and aerospace radar systems use the EP2AGX260EF29I5 for pulse compression, Doppler processing, and target detection thanks to its 256 18x18 DSP blocks and high I/O count. With 244,188 LE, designers can implement multiple parallel signal-processing chains on a single FPGA. The 8 transceivers support rapid digitizer-to-FPGA data paths and high-speed backplane connectivity, while 12 Mbits of internal memory buffer range-Doppler maps. Industrial temperature grading allows deployment in ground-vehicle and shipboard enclosures where ambient temperatures can vary widely. The 0.9 V core voltage combined with 40 nm process technology keeps power dissipation manageable for sealed enclosures. Engineers can use this part for lower-cost radar variants where full Stratix-V performance is unnecessary but Arria II GX density and DSP count suffice.
추천
Industrial Networking Equipment
Industrial routers, switches, and protocol converters leverage the EP2AGX260EF29I5 for wire-speed packet processing and protocol bridging. The PCI Express hard IP block supports standard NIC interfaces, while 8 multi-gigabit transceivers can be configured for SFP+/XAUI links or bonded Ethernet channels. 244,188 logic elements handle routing tables, ACL matching, and encryption offload, while 256 DSP blocks accelerate crypto and compression operations. With 372 I/Os and 12 Mbits of embedded memory, the FPGA can buffer packet bursts before DMA to host processors. The industrial temperature range (-40C to +100C) supports deployment in factory-floor and outdoor cabinets. The 780-FCBGA package provides the thermal mass and pin density required for high-IO networking designs.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2AGX260EF29I5 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2AGX260EF29I3N | EP2AGX260EF29I3G | EP2AGX260EF29C6N | EP2AGX260EF29C5N | EP2AGX260EF29C4N |
|---|---|---|---|---|---|---|
| Package | 780-FCBGA (EF29) | 780-FCBGA (EF29) - same | 780-FCBGA (EF29) - same | 780-FCBGA (EF29) - same | 780-FCBGA (EF29) - same | 780-FCBGA (EF29) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 244,188 LE | 244,188 LE | 244,188 LE | 244,188 LE | 244,188 LE | 244,188 LE |
| Embedded Memory | 12,038,144 bits | 12,038,144 bits | 12,038,144 bits | 12,038,144 bits | 12,038,144 bits | 12,038,144 bits |
| Speed Grade | I5 (industrial, mid speed) | I3 (industrial, slower) | I3 (industrial, slower) | C6 (commercial, fastest) | C5 (commercial, equivalent) | C4 (commercial, slower) |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| DSP Blocks | 256 | 256 | 256 | 256 | 256 | 256 |
| Transceivers | 8 x 3.75 Gbps | 8 x 3.75 Gbps | 8 x 3.75 Gbps | 8 x 3.75 Gbps | 8 x 3.75 Gbps | 8 x 3.75 Gbps |
| Approximate Unit Price (qty-1, 2026-09-08) | $1,478 - $2,740 | Lower than I5 (slower speed grade) | Lower than I5 (slower speed grade) | Higher than I5 (faster grade, commercial) | Similar to I5 (commercial temp) | Lower than I5 (slower grade, commercial) |
주요 차별점
- Highest density in Arria II GX with 244,188 LE and 12 Mbits memory (vs EP2AGX125EF29I5G)
- Industrial temperature grade for harsh environments (vs EP2AGX260EF29C5N)
- Drop-in compatibility within 780-FCBGA family (vs EP2AGX260EF29I3N)
설계 노트
Estimated: with 244,188 LE at high toggle rates, dynamic power can reach 6-8 W on the 40 nm core; the 780-FCBGA package thermal resistance is typically below 1 C/W with proper PCB thermal via array under the exposed die area. Designers should implement a minimum 6x6 thermal via pattern (0.3 mm pitch, 0.2 mm drill) per Intel's Arria II GX PCB guidelines. For sealed enclosures, attach a heatsink or heat-spreader to maintain junction below 100C at industrial temperature.
The 3.75 Gbps transceivers require controlled-impedance differential traces (100 ohm +/-10 percent) on the PCB, with length-matched pairs within 150 microns per the Intel Arria II GX transceiver user guide. Reference planes must be continuous beneath the transceiver channels. Use a high-frequency PCB material (e.g., Megtron 6, FR408HR) above 3 Gbps to minimize insertion loss over the channel length.
Recommended: 780-FCBGA requires 1.0 mm or 0.8 mm ball pitch PCB footprint. Use microvia (laser-drilled, stacked) stack-up under the BGA fanout to route signals out without dog-bone traces. Provide at least 8 layers: signal, GND, signal, GND, signal, power, signal, GND. Decoupling capacitors (10 uF, 1 uF, 0.1 uF) per Intel PDN guidelines must be placed within 5 mm of each power pin pair.
Recommended: the 0.9 V core rail requires a low-noise buck regulator with +/-3 percent tolerance under load transients. Sequence the 3.0 V, 2.5 V, 1.5 V, and 0.9 V rails per the Arria II GX power sequencing diagram; failure to sequence correctly can cause inrush currents and damage to the core. Use a dedicated sequencer IC or power management controller.
Critical: do not confuse the EF29 780-FCBGA with the FF35 1152-FCBGA (used on 190K Arria II GX variants); the FF35 cannot be substituted because it has a different pin map. When migrating between speed grades (I5, I3, C6, C5, C4), verify that the Quartus II timing model is updated - older compile results will not reflect the new speed grade Fmax values.
규정 준수 정보
RoHS compliant per Intel product page. Lead-free FCBGA package. AEC-Q100 not applicable - this is a programmable logic device, not an automotive-grade IC qualification.
