EP2AGX260EF29I3G - 244K LE Arria II GX FPGA, 780-FCBGA | Intel
부품 번호: EP2AGX260EF29I3G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 100 | $1620 | $162,000.00 |
| 500 | $1540 | $770,000.00 |
| 1,000 | $1480 | $1,480,000.00 |
EP2AGX260EF29I3G 개요
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and high-speed transceivers, all interconnected by a programmable routing fabric. FPGAs sit within the broader category of programmable logic devices (PLDs) > digital integrated circuits > semiconductors. The Arria II GX family specifically targets mid-range applications requiring a balance of logic density, transceiver bandwidth, and power efficiency, placing it between Cyclone (low-cost) and Stratix (high-performance) families within Intel's (formerly Altera's) FPGA portfolio.
Key features of the EP2AGX260EF29I3G include 244,188 logic elements, 12 Mbits of embedded memory, integrated transceivers supporting multi-gigabit serial interfaces, on-chip multipliers for DSP operations, and a 0.9 V core supply. The 40 nm process technology provides an optimal balance between static and dynamic power consumption, which is critical for thermally constrained embedded systems.
The architecture combines a lookup-table-based logic fabric with hard DSP blocks, block RAM (M9K/M144K), and high-speed serial transceivers. This heterogeneous structure enables designers to implement complex signal processing pipelines, packet processing engines, and high-speed interface bridging without sacrificing logic utilization.
Typical applications include wireless baseband processing, high-definition video broadcast equipment, military secure communications, industrial machine vision, and high-speed serial protocol bridging (PCI Express, Serial RapidIO, Gigabit Ethernet). The industrial temperature grade (-40C to +100C) makes it appropriate for harsh-environment deployments.
When designing with this device, ensure proper power decoupling and thermal management. The 780-ball FCBGA package requires controlled-impedance PCB stackup and high-quality BGA assembly processes. Designers should reference the manufacturer datasheet for transceiver channel placement, PLL configuration, and I/O standard support.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: EP2AGX260EF29I3G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2AGX260EF29I3G (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Speed Grade, Process Technology, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2AGX260EF29C6N
✅ 드롭인✓ 재고 있음
$1395 / 개
데이터시트 보기 →EP2AGX260EF29C6G
✅ 드롭인✓ 재고 있음
$1395 / 개
데이터시트 보기 →EP2AGX260EF29C5N
✅ 드롭인✓ 재고 있음
$1565 / 개
데이터시트 보기 →EP2AGX260EF29C4N
✅ 드롭인✓ 재고 있음
$1295 / 개
데이터시트 보기 →EP2AGX260EF29C5G
✅ 드롭인✓ 재고 있음
$2515 / 개
데이터시트 보기 →EP2AGX260EF29C4G
✅ 드롭인✓ 재고 있음
$1955.55 / 개
데이터시트 보기 →EP2AGX260EF29I3G 최대 정격 & 전기적 특성
| Series | Arria II GX |
| Family | Arria II GX |
| Logic Elements / Cells | 244,188 |
| Total RAM Bits | 12,038,144 |
| Number of I/O | 372 |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| Operating Frequency (max) | 500 MHz |
| 동작 온도 | -40C to +100C (Industrial) |
| 패키지 / 케이스 | 780-BBGA, FCBGA |
| 실장 유형 | Surface Mount |
EP2AGX260EF29I3G 780-bbga, fcbga 핀 구성 가이드
EP2AGX260EF29I3G(780-bbga, fcbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2AGX260EF29I3G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2AGX260EF29I3G 적합 용도: 6 애플리케이션s: Wireless Baseband Processing, High-Definition Video Broadcast Equipment, Military Secure Communications, Industrial Machine Vision, High-Speed Serial Protocol Bridging, Test and Measurement Instrumentation.
Wireless Baseband Processing
The EP2AGX260EF29I3G is well suited for wireless baseband signal processing chains. Its 244,188 logic elements and high-speed DSP blocks enable implementation of multi-carrier FFT/iFFT pipelines, channel estimation, and MIMO processing. The integrated multi-gigabit transceivers move digitized RF data between the FPGA and ADC/DAC chips at rates typical of LTE and 5G NR fronthaul. The 500 MHz fabric performance provides timing headroom for complex baseband algorithms. Industrial temperature grade supports outdoor base-station deployments.
추천
High-Definition Video Broadcast Equipment
Broadcast video routers, multi-format converters, and contribution encoders benefit from the EP2AGX260EF29I3G's combination of 372 user I/O pins and 12 Mbits of embedded memory. The FPGA can interface with SDI, HDMI, DisplayPort, and SMPTE 2022 IP simultaneously. Its block RAM supports line buffers and frame stores needed for up/down/cross-conversion at 3G-SDI and 4K UHD resolutions. High-density logic fabric handles multi-stream transcoding without external companion chips.
추천
Military Secure Communications
The industrial temperature rating (-40C to +100C) and 40 nm process make the EP2AGX260EF29I3G attractive for tactical radios, software-defined radio platforms, and encrypted datalink modems. Its high-speed transceivers support encrypted waveform generation at multi-gigabit rates, while the abundant logic fabric accommodates complex cryptographic pipelines. Designers can implement bulk encryption (AES-256, ChaCha20) alongside modem DSP without external co-processors.
추천
Industrial Machine Vision
Machine vision systems requiring CoaXPress, Camera Link, or GigE Vision interfaces leverage the EP2AGX260EF29I3G's transceiver channels and abundant logic. Frame buffers stored in 12 Mbits of embedded block RAM allow real-time image pre-processing, edge detection, and ROI extraction. The 372 user I/O pins connect multiple camera streams, lighting controllers, and gigabit Ethernet uplinks simultaneously. Industrial temperature grade fits factory-floor deployments.
추천
High-Speed Serial Protocol Bridging
PCI Express Gen1/Gen2 endpoint and root-port designs, Serial RapidIO bridges, and 10 Gigabit Ethernet MACs all map efficiently to the EP2AGX260EF29I3G's transceiver and logic resources. Hard IP cores for these protocols (licensed separately in Quartus II) consume minimal fabric, leaving abundant headroom for application logic. The 500 MHz core clock supports line-rate processing at full protocol throughput.
추천
Test and Measurement Instrumentation
High-speed oscilloscopes, protocol analyzers, and arbitrary waveform generators use the EP2AGX260EF29I3G for real-time DSP, triggering, and display pipelines. The combination of multi-gigabit transceivers, dense logic, and abundant memory is ideal for 10+ GSPS real-time acquisition systems. Industrial temperature grade supports bench and portable instruments that must operate in labs without climate control.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2AGX260EF29I3G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2AGX260EF29C6N | EP2AGX260EF29C6G | EP2AGX260EF29C5N | EP2AGX260EF29C5G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 780-BBGA, FCBGA | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same |
| Logic Elements | 244,188 | 244,188 (same) | 244,188 (same) | 244,188 (same) | 244,188 (same) |
| Total RAM Bits | 12,038,144 | 12,038,144 (same) | 12,038,144 (same) | 12,038,144 (same) | 12,038,144 (same) |
| Number of I/O | 372 | 372 (same) | 372 (same) | 372 (same) | 372 (same) |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Speed Grade | -3 | -6 (slower) | -6 (slower) | -5 (slower) | -5 (slower) |
| Process Technology | 40 nm | 40 nm (same) | 40 nm (same) | 40 nm (same) | 40 nm (same) |
| Core Voltage | 0.9 V | 0.9 V (same) | 0.9 V (same) | 0.9 V (same) | 0.9 V (same) |
주요 차별점
- Industrial temperature grade (-40C to +100C) (vs EP2AGX260EF29C6N)
- Speed grade -3 (highest performance) (vs EP2AGX260EF29C5N)
- 244,188 logic elements (largest Arria II GX density) (vs EP2AGX190FF35I5N)
설계 노트
Estimated: at full fabric utilization (~80% LE, 70% RAM, 100% transceiver activity) the EP2AGX260EF29I3G can dissipate 8-12 W. The 780-FCBGA package has no exposed top-side heatsink; thermal management must use a heat spreader attached via thermal interface material (TIM) to the package lid, plus a heatsink or forced-air cooling. For sealed enclosures, derate to 6-8 W total or risk thermal runaway of the FPGA core.
The 780-ball FCBGA requires a controlled-impedance PCB stackup (typically 8-12 layers for high-speed transceiver channels). Use a 1.0 mm or 1.27 mm pitch BGA land pattern per JEDEC standards and follow Intel's recommended via-in-pad or microvia escape patterns. Power plane decoupling requires 0402/0201 capacitors within 100 mil of each power ball, plus bulk decoupling on each voltage rail.
Do not confuse speed grade designators: -3 (fastest, lowest temperature delay), -4, -5, -6 (slowest). Higher number = slower device. Also note that 'N' suffix indicates Pb-free/RoHS while absence of 'N' indicates SnPb ball finish. Industrial temperature parts (I) cannot be substituted into commercial-grade thermal environments without re-qualifying timing closure, though fabric and pinout are identical.
규정 준수 정보
RoHS, REACH, lead-free, halogen-free, and conflict-minerals status were not returned in the verified distributor data. For EPC2AGX260EF29I3G without N suffix, ball finish may be SnPb; parts with N suffix (e.g. EP2AGX260EF29C6N) are typically Pb-free. Request the latest Intel material declaration certificate before shipping into regulated markets.