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EP3C10F256I7N - 10K LE Cyclone III FPGA, 256-FBGA | Intel
EP3C10F256I7N

EP3C10F256I7N - 10K LE Cyclone III FPGA, 256-FBGA | Intel

The Intel (Altera) EP3C10F256I7N is a low-power, low-cost FPGA from the Cyclone III family built on a 65 nm process, offering 10,320 logic elements, 423,936 bits of embedded memory, and 182 user I/O pins in a 256-ball FineLine BGA package with 1.2 V core operation. It targets high-volume, cost-sensitive designs where FPGA flexibility is required but ASIC-like NRE costs are not justified. A Field-Programmable Gate Array (FPGA) is a programmable logic device whose architecture consists of an array of configurable logic blocks (CLBs), programmable routing fabric, dedicated DSP blocks, and embedded memory blocks (M9K/M144K). FPGAs belong to the larger programmable logic hierarchy: FPGA -> programmable logic -> digital logic IC -> semiconductor. Cyclone III devices specifically target the low-power end of the FPGA market, delivering ASIC-like fabric density while preserving in-system reprogrammability for design iteration and field upgrades. Key features of the EP3C10F256I7N include 182 maximum user I/O pins (supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards), 46 embedded 18x18 multipliers for DSP functions, two PLLs per device for clock management, and up to 1.4 Mbits of RAM. The device operates across an industrial temperature range of -40C to +125C with a 1.2 V core supply, and its 65 nm process technology yields substantially lower static and dynamic power than its Cyclone II predecessor. Architecturally, the Cyclone III device uses a Look-Up Table (LUT)-based fabric with M9K memory blocks and dedicated 18x18 multipliers. The 65 nm process enables tight integration while keeping die cost low, and the FineLine BGA-256 package provides high signal density within a 17x17 mm footprint suitable for space-constrained PCBs. Typical applications include industrial motor control, video processing, automotive driver assistance, software-defined radio, consumer display controllers, and embedded system prototyping. The device is well suited for parallel processing and signal-integrating tasks. When designing with the EP3C10F256I7N, careful attention to power rail sequencing (1.2 V core and 2.5 V/3.3 V I/O supplies) and JTAG configuration is required. Configuration via Altera/Intel Quartus II software supports JTAG, Active Serial (AS), and Passive Serial (PS) modes for flexible boot options. This page synthesizes distributor pricing, drop-in alternative listings from same-family Cyclone III devices, and practical design notes not found in the manufacturer datasheet.

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EP3C10M164C7N - 10,320-LC Cyclone III FPGA | Intel
EP3C10M164C7N

EP3C10M164C7N - 10,320-LC Cyclone III FPGA | Intel

The Intel EP3C10M164C7N is a Cyclone III field-programmable gate array with 10,320 logic elements, 106 I/O pins, 423,936 embedded-memory bits, and a maximum switching frequency of 437.5 MHz, packaged in a 164-TFBGA package. It also uses a 65 nm process and operates from a 1.2 V core supply. This combination places the device in the low-density programmable-logic segment for embedded control, interface bridging, data acquisition, and general-purpose parallel processing. A field-programmable gate array, or FPGA, is a reconfigurable semiconductor whose logic blocks and programmable interconnect can be configured after manufacture. FPGAs sit between fixed-function logic devices and software-programmable processors in the broader digital-semiconductor hierarchy. Unlike an application-specific integrated circuit, an FPGA can implement multiple interface protocols, control functions, and data-processing pipelines in one device while retaining the ability to update its configuration during product maintenance. The EP3C10M164C7N provides 10,320 logic elements and 106 I/O pins, making it suitable for designs requiring substantial parallel logic without the resource level of a large FPGA. Its 437.5 MHz maximum switching frequency supports clocked control, communication, and signal-processing functions. The 423,936 embedded-memory bits add on-chip storage for buffers, lookup tables, state machines, and temporary data paths, reducing dependence on external memory for modest workloads. The 164-TFBGA package supports a dense, board-level FPGA implementation with 164 package balls. Because ball-grid packages expose connections on multiple sides and may include thermal and power-distribution balls, designers should follow the manufacturer's package and device-pin documentation when assigning power, ground, configuration, clock, and user I/O connections. Exact ball names and configuration requirements should be taken directly from the manufacturer pin-assignment tables. Typical applications include industrial control modules, communications interface adapters, instrumentation control, embedded test equipment, and industrial networking. The 106 available I/O positions are particularly relevant to parallel buses, digital control interfaces, and multi-channel acquisition systems. Designers should also account for configuration flash or another supported configuration source and verify board-level voltage compatibility before committing the FPGA to a design. A key design consideration is resource balancing. The device combines 10,320 logic elements with 423,936 embedded-memory bits, so a design that consumes most available memory may still lack logic capacity, while a logic-heavy design may require external memory. Timing closure should be evaluated with the intended clock, I/O standards, and device speed grade rather than from the maximum frequency alone. This product page combines the exact orderable MPN, device characteristics, package information, sourcing guidance, and cross-reference review into an engineering-oriented resource. It also highlights where replacement decisions require direct comparison of package balls, speed-grade suffix, configuration behavior, and design resource usage.

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EP3C10M164I7N - 10,320 LEs, 164-Ball Cyclone III FPGA | Altera
EP3C10M164I7N

EP3C10M164I7N - 10,320 LEs, 164-Ball Cyclone III FPGA | Altera

Altera EP3C10M164I7N is a Cyclone III field-programmable gate array with 10,320 logic elements, 423,936 kbit of embedded memory, up to 106 I/Os, and a maximum operating frequency of 437.5 MHz. The device is supplied in a 164-ball TFBGA/MBGA package and operates from a 1.15 V to 1.25 V core supply. Its industrial temperature range extends from -40 °C to 100 °C. A field-programmable gate array is a semiconductor device whose digital logic is configured after manufacture. An FPGA belongs to the programmable-logic hierarchy, combining configurable logic elements, embedded memory, programmable I/O, and dedicated clock resources on one integrated circuit. Cyclone III devices are positioned as low-cost FPGAs for control, communications, signal-processing, and embedded-system designs where deterministic logic and flexible post-build configuration are valuable. The EP3C10M164I7N combines 10,320 logic elements with 423,936 kbit of embedded memory, providing a compact implementation platform for control logic, protocol handling, state machines, and small data-processing pipelines. Its 106 user I/Os support connections to external memory, converters, transceivers, and digital peripherals. The 437.5 MHz maximum operating frequency gives designers substantial timing headroom for synchronous control logic and moderately parallelized datapaths. The 1.15 V to 1.25 V operating supply range places this device in the low-voltage domain typical of modern programmable logic. Configuration data determines the implemented circuit, allowing design revisions, field updates, and product differentiation without changing the PCB. The combination of embedded memory and logic elements is particularly useful when the design benefits from hardware-resident lookup tables, packet buffers, or parallel arithmetic pipelines. Typical uses include industrial control modules, network interface controllers, data-acquisition front ends, embedded communications equipment, and compact test systems. In these applications, the FPGA can merge sampling, filtering, protocol conversion, and supervisory control into one device while keeping the external component count and board area relatively low. Board design should preserve clean power distribution to the 1.2 V core domain and provide suitable decoupling around the FPGA. Signal-integrity and timing work should include controlled clock routing, series termination for external high-speed links, and I/O-standard selection that matches each connected device. The 164-ball BGA also requires a PCB footprint and assembly process capable of fine-pitch ball inspection and soldering. This product overview combines the verified electrical, environmental, packaging, and sourcing attributes with application guidance, package considerations, and drop-in replacement analysis. It is intended to help engineers determine whether the Cyclone III resource set, industrial temperature grade, and 164-ball package fit a specific programmable-logic design before detailed FPGA design and PCB review begin.

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EP3C10U256C6 - 10,320-Cell 500 MHz FPGA | Altera
EP3C10U256C6

EP3C10U256C6 - 10,320-Cell 500 MHz FPGA | Altera

The Altera EP3C10U256C6 is a Cyclone III field-programmable gate array with 10,320 logic cells, a 500 MHz maximum device speed, 65 nm process technology, a 1.2 V supply, and a 256-ball low-profile fine-pitch BGA package. It is designed for embedded systems requiring programmable logic, parallel interfaces, control functions, and moderate on-chip I/O density. The EP3C10U256C6 combines a reconfigurable FPGA fabric with embedded fixed-function resources, making it suitable for industrial control, communications, instrumentation, consumer electronics, and embedded processing systems. An FPGA is a semiconductor device whose digital logic and interconnect structure can be programmed after manufacture. The Cyclone III family occupies the FPGA and CPLD hierarchy within programmable logic devices, offering a practical balance between logic capacity, I/O availability, power consumption, and design cost. Unlike a fixed-function application-specific integrated circuit, an FPGA can be updated during development to add interfaces, revise control sequences, or consolidate several supporting functions into one device. The verified device data identifies 10,320 logic cells, 500 MHz operation, 65 nm fabrication, and a 1.2 V core supply. Its 256-LFBGA package provides 256 external terminals and supports compact board-level integration where routing density is important. The LFBGA form factor can also make inspection and prototype rework more demanding than a leaded package, so land-grid alignment, assembly capability, and package documentation should be checked before layout release. Cyclone III devices are commonly used where design flexibility matters more than the very highest programmable logic capacity. Typical logic blocks can implement state machines, bus controllers, data acquisition logic, protocol interfaces, and peripheral bridges. Because the exact pin assignment, memory configuration, supported I/O standards, and bank power requirements are not included in the supplied verified data, they must be confirmed against the manufacturer device documentation before schematic capture or PCB layout. The EP3C10U256C6 is appropriate for industrial automation modules, compact communications equipment, test and measurement products, video-processing interfaces, and embedded control systems. It is particularly attractive when multiple fixed functions need consolidated logic or when a late design change must be implemented without changing the PCB. Quartus compilation, pin assignment, timing closure, and programming-file generation should be performed using the supported Altera or Intel FPGA toolchain for the selected device. Power, decoupling, and pin planning are critical in a 256-ball BGA implementation. Follow the manufacturer power-supply and decoupling guidance, route each supply plane carefully, and validate signal integrity and heat dissipation on the assembled PCB. Do not infer I/O voltage limits, pin names, or power-up requirements from the abbreviated distributor listings; obtain the complete device and package documentation before design release. This product page consolidates the verified 10,320-cell, 500 MHz, 65 nm, 1.2 V, and 256-LFBGA attributes with sourcing links, application guidance, package considerations, and documented data gaps. It is intended to accelerate initial device selection while clearly separating verified specifications from information that still requires manufacturer documentation.

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EP3C10U256C6N - 10,320-Cell Cyclone III FPGA | Altera
EP3C10U256C6N

EP3C10U256C6N - 10,320-Cell Cyclone III FPGA | Altera

The Altera EP3C10U256C6N is a Cyclone III field-programmable gate array with 10,320 logic cells, 182 I/O, a maximum device speed of 500 MHz, and a 1.2 V core supply in a 256-LFBGA package. It is a configurable digital-logic device that combines programmable logic, embedded memory, and fixed-function blocks in one semiconductor package. An FPGA is a field-programmable gate array, a reconfigurable digital semiconductor within the broader FPGA and CPLD category. Unlike a fixed application-specific integrated circuit, an FPGA allows its interconnect and logic configuration to be loaded after manufacture. Cyclone III devices are positioned for low-cost, low-power embedded systems where designers need flexible parallel logic, interface adaptation, or product revisions without changing the PCB layout. The principal specifications reported for the EP3C10U256C6N include 10,320 logic cells, 182 I/O, a 500 MHz device speed, 1.2 V operation, and a 256-LFBGA package. The 182 I/O provide substantial external connectivity for memory interfaces, control signals, communications, and general-purpose digital logic. The 256-ball package also supports compact integration in systems that need substantial programmable logic without moving to a larger package. The device uses 65 nm process technology, placing it in Altera's Cyclone III family and balancing programmable functionality with cost and power considerations. The EP3C10U256C6N designation identifies a 10,320-cell Cyclone III device in the U256 package configuration. Its C6 speed designation corresponds to the listed 500 MHz rating, while the N suffix identifies the exact ordering code used by the manufacturer and distributors. Typical uses include industrial control logic, communications equipment, embedded video and interface processing, data-acquisition systems, and general-purpose prototype platforms. Its combination of 182 I/O and 10,320 logic cells makes it particularly useful when a design requires several peripheral interfaces or substantial parallel data movement. Engineers can implement control, arbitration, packet processing, and protocol conversion within a single programmable device. PCB design should account for power integrity, decoupling, clock routing, and high-speed signal integrity across the 256-ball BGA. The 1.2 V core rail should be supplied with the decoupling and distribution specified by the Cyclone III design guidance. Programming, configuration, reset, and clock requirements must also be verified against the manufacturer pin-description table before finalizing the board layout. This product page combines device specifications, package details, sourcing guidance, replacement analysis, and practical PCB considerations. It is designed to help engineers determine whether the EP3C10U256C6N fits a logic-design requirement and to identify the exact document locations needed for pin assignment, configuration, and PCB implementation.

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EP3C10U256C7 - 10,320-Cell Cyclone III FPGA | Intel
EP3C10U256C7

EP3C10U256C7 - 10,320-Cell Cyclone III FPGA | Intel

The Intel EP3C10U256C7 is a Cyclone III field-programmable gate array with 10,320 logic elements, 423,936 embedded memory bits, 182 user I/O, and a 256-LFBGA package. It is manufactured using 65 nm FPGA technology with a 1.2 V core supply. The device combines programmable logic, dedicated memory resources, and configurable I/O in one compact surface-mount package, making it suitable for embedded control, communications, industrial automation, and general-purpose programmable logic designs. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic can be configured after manufacture. An FPGA belongs to the programmable-logic device hierarchy and provides a flexible alternative to application-specific integrated circuits. Designers combine lookup-table-based logic, flip-flops, block RAM, multipliers, and I/O standards in software, allowing functional revisions and product differentiation without changing the underlying silicon or PCB layout. The EP3C10U256C7 provides 10,320 logic elements and 423,936 bits of embedded memory for state machines, control logic, data buffering, packet handling, and interface bridging. Its 182 user I/O provide substantial connectivity for external memories, communications transceivers, converters, and display or industrial-control peripherals. The 256-LFBGA package supports compact surface-mount assembly while preserving high pin and I/O density. The device uses 65 nm Cyclone III FPGA technology and a 1.2 V core voltage, combining a relatively large programmable logic capacity with low-voltage operation. Because FPGA performance depends on the selected clock, I/O standard, memory configuration, and design constraints, designers should evaluate timing with their actual Quartus II implementation rather than relying on device capacity alone. The verified cross-reference data identifies the commercial EP3C10U256C6 and industrial EP3C10U256I7N as package-compatible family alternatives. Typical applications include industrial automation controllers, protocol bridges, data-acquisition systems, embedded communications equipment, motor-control interfaces, and general digital signal-processing front ends. Its 182 I/O make it especially useful where an FPGA must connect multiple sensors, converters, memories, and communication transceivers while performing real-time control or filtering in parallel. PCB design should account for the 256-ball package, power and ground distribution, decoupling near the supply pins, and high-speed routing constraints. Designers should use the manufacturer’s pin and package documentation to confirm ball assignments, voltage requirements, supported I/O standards, and exposed thermal or power-management connections before layout. This page consolidates distributor inventory, verified family cross-references, package information, pricing references, and practical replacement guidance. It is intended to help engineers identify genuine same-package alternatives while clearly separating verified facts from parameters that still require confirmation from the manufacturer datasheet.

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EP3C10U256C7N - 10,320-Cell 437.5MHz FPGA | Altera
EP3C10U256C7N

EP3C10U256C7N - 10,320-Cell 437.5MHz FPGA | Altera

Altera EP3C10U256C7N is a Cyclone III field-programmable gate array with 10,320 logic elements, 182 I/Os, 645 logic array blocks, and a maximum operating frequency of 437.5 MHz. The FPGA operates from a 1.15 V to 1.25 V core supply and is packaged in a surface-mount 256-LFBGA. Its 256-ball construction provides a compact platform for parallel data acquisition, control, communications, image processing, and embedded system logic. A field-programmable gate array, or FPGA, is a reconfigurable semiconductor categorized within programmable logic devices, digital logic ICs, and semiconductors. Unlike a fixed-function application-specific integrated circuit, an FPGA combines programmable logic elements, memory resources, and I/O blocks in one device. Designers can implement control logic, signal processing, protocol handling, and hardware acceleration, then update the configuration to support design revisions or field adaptation. The Cyclone III architecture provides 10,320 logic cells organized into 645 logic array blocks. With 182 available I/Os, the EP3C10U256C7N can support substantial external connectivity while retaining the low power consumption associated with a 1.15 V to 1.25 V supply range. The stated 437.5 MHz maximum frequency establishes the device's speed class, although achievable system clock rates depend on the selected logic, routing requirements, memory interface, I/O standards, and timing constraints. This 256-LFBGA version is identified with the N suffix and uses a 256-ball surface-mount package. The package is intended for compact embedded boards where a large leaded package would be impractical. Because the density of programmable interconnect and power connections makes PCB layout and thermal design important, engineers should follow the manufacturer's pin-connection, decoupling, configuration, and PCB-layout guidance when creating a new carrier board. Typical uses include industrial automation, data acquisition, communications infrastructure, test and measurement equipment, and embedded control systems. The combination of 10,320 logic cells and 182 I/Os suits parallel interface logic, state machines, protocol bridges, and custom signal-processing pipelines. The 1.2 V-class supply also helps reduce power requirements compared with higher-voltage programmable logic families. The primary design consideration is configuration and power integrity. Follow the Cyclone III power-supply recommendations, place decoupling capacitors according to the manufacturer pin table, and route configuration signals away from sensitive high-speed inputs. Verify every BGA escape route, voltage level, and I/O standard before fabrication because package-level changes can invalidate an otherwise compatible design. This product page combines the core device specifications, package constraints, application guidance, and verified same-footprint alternatives. It also highlights replacement decisions that require review of package construction, logic resources, I/O count, temperature grade, and configuration compatibility rather than relying on the family name alone.

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EP3C10U256C8 - 10,320-Cell Cyclone III FPGA | Intel
EP3C10U256C8

EP3C10U256C8 - 10,320-Cell Cyclone III FPGA | Intel

The Intel EP3C10U256C8 is a Cyclone III embedded field-programmable gate array with 10,320 logic elements, 182 I/O, a 472.5 MHz maximum stated frequency, and a 256-LFBGA package measuring 14 x 14 mm with 0.80 mm pitch. The device is manufactured using 65 nm CMOS technology and operates from a 1.2 V core supply, according to the verified distributor and datasheet-index records. A field-programmable gate array is a semiconductor in which the digital logic, memory blocks, and I/O assignments are configured after fabrication. An FPGA belongs to the broader programmable-logic hierarchy, combining parallel programmable logic with fixed or configurable input/output resources. The EP3C10U256C8 therefore provides a compact platform for parallel data processing, control, interface bridging, embedded protocol handling, and general-purpose digital logic. The principal verified features are 10,320 logic elements, 182 I/O, a 65 nm CMOS process, and a 472.5 MHz frequency figure. The 256-LFBGA package also supports compact board layouts, although its 0.80 mm pitch requires fine-pitch assembly and inspection. The C8 ordering code distinguishes this configuration from other speed, temperature, and package variants, so engineers should confirm the complete ordering information before substituting related MPNs. The supplied records inconsistently describe the package terminology as LFBGA, PBGA, and UBGA while consistently identifying a 256-pin, 14 x 14 mm device with 0.80 mm pitch. The 182-I/O count describes usable signal assignments rather than the total physical ball count. Exact architecture details, memory capacity, embedded hard IP, supported interfaces, power ratings, and AC timing data were not present in the verified excerpts and are therefore not inferred here. Typical uses include industrial control, communications infrastructure, test equipment, embedded video, and general embedded processing. The device can be selected when a design needs substantially more parallel logic than a small microcontroller while retaining post-fabrication field programmability. A board-level design must also account for configuration storage, power sequencing, signal conditioning, and programming-chain implementation. The most important design precaution is to preserve the exact footprint, ball assignment, core voltage, configuration method, and speed-grade requirements. Related Cyclone III devices may share the family and 256-ball format, but a similar bill of materials does not prove that every pin, timing specification, or operating grade is interchangeable. This page consolidates verified distributor specifications, package details, sourcing links, family alternatives, and engineering-oriented selection guidance. It distinguishes verified values from missing technical fields so procurement and hardware teams can evaluate the EP3C10U256C8 without confusing near-family MPNs with guaranteed drop-in replacements.

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EP3C10U256I7 - 10,320-Cell Industrial FPGA | Intel
EP3C10U256I7

EP3C10U256I7 - 10,320-Cell Industrial FPGA | Intel

The Intel EP3C10U256I7 is a Cyclone III field-programmable gate array with 10,320 logic cells, 182 I/O, 423,936 RAM bits, and a maximum clock frequency of 437.5 MHz. The device is manufactured in 65 nm technology, operates from a 1.2 V core supply, and is supplied in a square 256-LFBGA surface-mount package. Its ordering code identifies an industrial-temperature option in the 256-ball package configuration. A field-programmable gate array is a semiconductor device whose digital logic, memory, and interface functions are configured after manufacture. FPGAs belong to the broader programmable-logic hierarchy, which includes CPLDs, mask-programmable logic, and application-specific integrated circuits. Unlike a fixed-function microcontroller, an FPGA can implement parallel data paths, protocol bridges, signal processing, control logic, and hardware acceleration in one configurable device. The Cyclone III name identifies Intel's low-cost FPGA family. The verified device information identifies 10,320 logic cells and 182 user I/O, providing a substantial parallel-logic resource for industrial control, communications, image processing, and embedded systems. The device includes 423,936 RAM bits for buffers, lookup tables, packet storage, and data-path state. Its 437.5 MHz maximum frequency supports high-speed digital logic, although practical system performance also depends on the selected design, I/O standard, memory interface, and timing constraints. The EP3C10U256I7 uses a 65 nm process and a 1.2 V core voltage, combining a relatively compact logic implementation with a large ball-grid package. The 256-LFBGA package provides 256 physical balls and a square footprint intended for surface-mount assembly. Because the supplied source describes the package as LFBGA while another search result describes the device as UBGA, engineers should confirm the exact ball map, ball-pitch dimensions, and mechanical drawing against the manufacturer documentation before releasing a PCB footprint. Typical applications include industrial control modules, programmable logic controllers, networking interfaces, motor-control systems, data-acquisition equipment, and embedded video or image-processing designs. The 182 I/O count can support multiple external interfaces, while the logic-element and RAM resources allow parallel control and buffering functions to be consolidated into a single FPGA. PCB design should account for all 256 package balls, including power, ground, configuration pins, and user I/O. The design must provide clean 1.2 V core power, suitable I/O voltage domains, decoupling, and a compatible configuration interface. Signal-integrity, thermal, and board-layout decisions should follow the official Cyclone III device documentation rather than distributor summaries alone. This product record combines verified distributor pricing, device attributes, package information, and application-oriented engineering guidance. It also distinguishes a documented no-lead package option from broader FPGA alternatives that use different packages, densities, or architectures and therefore are not treated as drop-in replacements.

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EP3C120F484C7N - Cyclone III FPGA 119K LE 484-FBGA | Intel
EP3C120F484C7N

EP3C120F484C7N - Cyclone III FPGA 119K LE 484-FBGA | Intel

The Intel (formerly Altera) EP3C120F484C7N is a high-density Cyclone III Field-Programmable Gate Array (FPGA) delivering 119,088 logic elements, 3,981,312 bits of embedded memory, and 283 embedded 18x18 multipliers in a 484-ball FineLine BGA package. Fabricated on a low-power 65 nm process, the device operates from a 1.2 V core supply and supports I/O voltages from 1.2 V to 3.3 V via eight I/O banks. A Field-Programmable Gate Array (FPGA) is a class of programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM and DSP blocks. FPGAs occupy a unique position in the digital hierarchy between fixed-function ASICs (more integration, higher NRE) and microcontrollers (less flexibility, lower performance), offering hardware-level parallelism and reconfigurable logic for high-throughput signal processing, glue logic, and rapid prototyping. Key features of the EP3C120F484C7N include up to 472 MHz internal operation, four phase-locked loops (PLLs) for clock management, 20 global clock networks, and support for external memory interfaces including DDR, DDR2, QDRII, and RLDRAM II. The 484-pin FBGA package (23 x 23 mm, 1.0 mm pitch) provides robust thermal and electrical performance suitable for industrial-temperature designs, while the Cyclone III family architecture eliminates the need for dedicated configuration devices when using active serial (AS) configuration from low-cost EPCS flash. Architecturally, the EP3C120F484C7N combines logic elements organized into Logic Array Blocks (LABs), each containing 16 LEs plus associated carry and control logic. The embedded multiplier blocks support 18x18 signed multiplication natively, and the M9K memory blocks deliver true dual-port operation at 315 MHz, enabling simultaneous read/write access to the same storage location without arbitration. Typical applications include industrial motor control, video processing and display controllers, software-defined radio, telecommunications line cards, ASIC prototyping, and embedded vision systems. The combination of high logic density and low static power consumption also makes Cyclone III devices attractive for portable and thermally constrained designs where larger FPGAs would be impractical. When designing with this device, carefully plan I/O bank assignments to avoid mixed-voltage conflicts and ensure the PLL reference clock inputs meet the jitter specifications of the targeted data rate. The Quartus II design software (version 13.0 and earlier) is the canonical toolchain for compilation, fitting, and timing closure. This page synthesizes distributor pricing, same-brand Cyclone III drop-in alternatives, and practical Quartus II design notes not found in the manufacturer datasheet alone.

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EP3C120F484I7 - 119K LEs Cyclone III FPGA 484-FBGA | Intel
EP3C120F484I7

EP3C120F484I7 - 119K LEs Cyclone III FPGA 484-FBGA | Intel

The Intel (formerly Altera) EP3C120F484I7 is a high-density Cyclone III Field-Programmable Gate Array delivering 119,088 logic elements, 3,981,312 bits of embedded memory, and 283 user I/Os in a 484-ball FineLine BGA package. Built on a low-power 65 nm process, the device operates from a 1.2 V core supply and supports industrial temperature grades from -40C to +100C. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device that lets engineers implement arbitrary digital logic, memory blocks, and DSP functions on a single die after manufacturing. Within the broader taxonomy, an FPGA sits under programmable logic devices (PLD) -> logic ICs -> integrated circuits, sitting alongside CPLDs and ASICs as a flexible alternative to fixed-function chips. FPGAs such as Cyclone III are commonly used in cost-sensitive, high-volume applications where ASIC NRE is unjustified but ASSP flexibility is insufficient. Key specifications of the EP3C120F484I7 include 119,088 logic elements, 3,981,312 bits of RAM, 576 embedded 18x18 multipliers, and 4 PLLs for clock management. The 484-FBGA package measures 23 x 23 mm with a 1.0 mm ball pitch and supports up to 283 user I/Os across 8 I/O banks. Peripherals and hard IP blocks include embedded memory blocks (M9K), a configuration interface, and high-speed LVDS support on selected pins. The Cyclone III architecture uses an SRAM-based LUT fabric with dedicated routing, M9K memory blocks, and 18x18 multiplier blocks for DSP workloads. Compared to earlier Cyclone generations, Cyclone III introduced a 65 nm process node that cut core power by roughly 50 percent while raising logic density, making the EP3C120F484I7 suitable for power-sensitive designs that still need very large logic capacity. Typical applications include industrial motor control, video processing pipelines, software-defined radio prototyping, and high-volume telecom line cards. The 283 available user I/Os also enable rich external connectivity for memory expansion, parallel sensor buses, and high-speed LVDS interfaces. When designing with the EP3C120F484I7, ensure all eight I/O banks are powered from rails within their respective VCCIO ranges and that decoupling follows Altera's power distribution network guidance. Configuration via JTAG or a passive serial EPCS device should be planned early to minimize board rework. This page consolidates distributor pricing, drop-in same-package alternatives from the Cyclone III family, and practical design notes that supplement the manufacturer datasheet with information useful for sourcing and second-source decisions.

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EP3C120F484I7N - Cyclone III FPGA 119K LE | 484-FBGA | Intel
EP3C120F484I7N

EP3C120F484I7N - Cyclone III FPGA 119K LE | 484-FBGA | Intel

The Intel (formerly Altera) EP3C120F484I7N is a high-density Cyclone III Field-Programmable Gate Array delivering 119,088 logic elements, 3,981,312 bits of embedded memory, and 283 18x18 multipliers in a 484-pin FineLine BGA (FBGA-484) package. It is built on a low-power 65 nm TSMC process and supports internal operating frequencies up to 472 MHz. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream rather than at the factory. FPGAs sit between general-purpose microcontrollers and fixed ASICs in the programmable-logic hierarchy: microcontrollers run software sequentially, FPGAs run massively parallel custom hardware, and ASICs are faster but cannot be reconfigured. Cyclone III belongs to Intel's low-cost, low-power FPGA family, optimized for high-volume cost-sensitive applications. Key features include 119,088 logic elements distributed across 7,443 logic array blocks (LABs), 4 M9K embedded memory blocks totaling approximately 4 Mbits, 288 18x18 hardware multipliers for DSP, and 8 user I/O banks supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards. The device operates from a 1.15 V to 1.25 V core supply with separate VCCIO banks for I/O flexibility. Cyclone III uses a logic-element (LE) based fabric with 4-input LUTs, dedicated carry chains for arithmetic, and embedded RAM blocks. The -I7 speed grade places the part in the mid-fast tier; the -I7N suffix denotes the industrial temperature range (-40 °C to +100 °C ambient) and lead-free / Pb-free packaging. The 484-pin FBGA measures 23 mm x 23 mm with 1.0 mm pitch. Typical applications include industrial motor control, video processing pipelines, automotive driver-assistance prototypes, software-defined radio baseband, and high-volume consumer signal conditioning. Cyclone III FPGAs are pin-compatible across density grades within the same package, allowing board reuse as designs migrate from EP3C25 to EP3C120. When designing with the EP3C120F484I7N, ensure that all four dedicated clock input pins are routed cleanly and that the JTAG chain (TCK, TMS, TDI, TDO) is accessible for in-system programming with a USB-Blaster or compatible download cable. Decoupling follows the Quartus II reference schematic: 0.1 uF and 10 uF capacitors near each power pin. This page synthesizes distributor pricing, same-package alternatives, and Quartus II design considerations not found in the standalone datasheet.

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EP3C120F780C7AD - Cyclone III FPGA 119K LE FBGA-780 | Intel
EP3C120F780C7AD

EP3C120F780C7AD - Cyclone III FPGA 119K LE FBGA-780 | Intel

The Intel (formerly Altera) Cyclone III EP3C120F780C7AD is a low-power, high-volume SRAM-based Field-Programmable Gate Array (FPGA) integrating 119,088 logic elements in a 780-pin FineLine Ball-Grid Array (FBGA) package. Built on TSMC's 65nm low-power process, this Cyclone III variant delivers up to 3.9 Mb of embedded memory, four phase-locked loops (PLLs), 531 multipliers, and 20 global clock networks, while consuming as little as 0.5 W of dynamic power at typical clock rates. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that allows designers to configure digital logic blocks, interconnect, and I/O after fabrication. FPGAs sit within the broader hierarchy: programmable logic -> logic IC -> integrated circuit -> semiconductor, occupying the same engineering space as CPLDs, but offering far higher logic density, embedded RAM/DSP blocks, and high-speed transceivers in larger devices. Cyclone III specifically targets cost-sensitive, power-conscious volume applications such as video processing, motor control, automotive driver assistance, and industrial communication. Key features of the EP3C120F780C7AD include 119,088 logic elements (LEs), 3,981 Kbits (approximately 498 Kbytes) of embedded RAM organized as M9K blocks, 288 18x18 hardware multipliers for DSP, and four PLLs. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards across up to 20 global clock networks, with user I/O counts in the 400+ range depending on package pinout. Configuration is supported through JTAG, Active Serial, and Passive Serial modes, with on-chip encryption (AES) for design security. The Cyclone III architecture uses a logic-element fabric with 8-input adaptive look-up tables (ALUTs), each capable of implementing any 6-input function or two independent 4-input functions. Embedded M9K memory blocks support true dual-port, simple dual-port, and single-port modes with parity bits, enabling efficient buffering, FIFO, and shift-register implementations. The DSP blocks natively support 18x18 multiplication with optional add/subtract/accumulate, eliminating the need for soft-multiplier inference in DSP pipelines. Typical applications for the EP3C120F780C7AD span HD video bridging and image processing, industrial motor control and servo drives, automotive infotainment and driver-assistance modules, telecommunications line cards, software-defined radio (SDR) baseband, and embedded industrial protocols such as EtherCAT, PROFINET, and EtherNet/IP. The combination of high logic count, on-chip DSP, and low power also makes it suitable for portable medical instrumentation and handheld test equipment. When designing with the EP3C120F780C7AD, plan the power budget across core, I/O, and PLL rails. Use the Quartus II PowerPlay early power estimator before layout to size decoupling and rail sequencing. Maintain controlled-impedance PCB traces for high-speed LVDS links, and route clock and PLL analog supplies through dedicated ferrite filters to minimize jitter.

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EP3C120F780C7N - 119K Logic Element Cyclone III FPGA | Intel / Altera
EP3C120F780C7N

EP3C120F780C7N - 119K Logic Element Cyclone III FPGA | Intel / Altera

The Intel (formerly Altera) Cyclone III EP3C120F780C7N is a high-density, low-power Field Programmable Gate Array (FPGA) built on a 65 nm low-k dielectric process, delivering 119,088 logic elements, 3,981,312 bits of embedded memory, and 531 hardware multipliers inside a 780-pin FineLine BGA (FBGA) package. The 'C7' speed grade supports a core clock rate up to 437.5 MHz while operating from a 1.2 V core supply, and the 'N' suffix denotes lead-free / Pb-free terminations compliant with RoHS. Cyclone III positioned the family for cost-sensitive, high-volume applications where Cyclone II was too small and Stratix families were over-spec. A field-programmable gate array (FPGA) is a type of programmable logic device (PLD) that lets designers implement arbitrary digital logic, memory blocks, and DSP functions by loading a configuration bitstream after PCB assembly. Within the broader semiconductor taxonomy, the EP3C120F780C7N sits inside the hierarchy programmable logic -> FPGA -> SRAM-based FPGA -> low-cost FPGA. Unlike ASICs, FPGAs can be reconfigured in the field, enabling rapid prototyping, late-stage design changes, and hardware reuse across product variants without respinning silicon. Key features of the EP3C120F780C7N include up to 531 embedded 18x18 multipliers for DSP, 4 PLLs with multiple outputs, support for external memory interfaces including DDR, DDR2, and QDR II SRAM, and 8 phase-locked clock networks. The device exposes up to 429 user I/O pins depending on configuration scheme and supports hot-socketing, joint Test Action Group (JTAG) boundary-scan, and Active Serial / Fast Active Parallel configuration modes via the dedicated configuration pins. Cyclone III also introduced dedicated hard IP for PCIe Gen1 soft cores implemented in fabric. Technically, the Cyclone III architecture uses 4-input look-up tables (LUT4) clustered into logic array blocks (LABs), with embedded M9K memory blocks that can be configured as RAM, ROM, or shift registers. The 65 nm process and 1.2 V core reduce dynamic power consumption versus the prior Cyclone II generation while increasing logic density roughly 4x. The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards and provides on-chip termination (OCT) for signal-integrity-critical interfaces. Typical applications include industrial motor control and machine vision, automotive driver-assistance ADAS prototypes, video processing and broadcast equipment, software-defined radio (SDR) baseband, low-cost DSP front ends, and PCI Express endpoint cards. Designers select the EP3C120F780C7N when they need Stratix-class capacity at Cyclone-class pricing and power budgets. When designing with this part, note that 780-pin FBGA requires high-density PCB routing with microvia stack-ups, the dedicated configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL[3:0]) must be pulled correctly for the chosen configuration mode, and unused I/O banks must be powered and grounded per the datasheet to prevent floating inputs. This page synthesizes distributor inventory data, parametric drop-in candidates, and practical layout notes that complement the official Cyclone III Device Handbook rather than replace it.

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EP3C120F780C7NAD - Cyclone III FPGA, 119K LEs, 780-FBGA | Altera
EP3C120F780C7NAD

EP3C120F780C7NAD - Cyclone III FPGA, 119K LEs, 780-FBGA | Altera

The Altera (Intel Programmable Solutions Group) EP3C120F780C7NAD is a Cyclone III family Field-Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA package (FBGA-780, 23 × 23 mm, 1.0 mm pitch). It integrates 119,088 logic elements, 3,981 Kbits of embedded memory, and 4 PLLs in a low-power 60-nm process node, targeting cost-sensitive high-volume applications. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic fabric, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream after manufacture. In the broader taxonomy, this part sits at FPGA → programmable logic device (PLD) → digital IC → semiconductor. Cyclone III devices are positioned below the high-end Stratix family and above legacy Cyclone II; they are widely used where designers need tens of thousands of logic elements, hardware parallelism, and moderate DSP capability without the power and price of high-end FPGAs. Key features of this device include 119,088 logic elements, 3,981 Kbits of embedded RAM (M9K blocks), 4 phase-locked loops, 531 user I/O pins, and 4 embedded multiplier blocks (18 × 18). It supports multiple I/O standards including LVDS, LVCMOS, SSTL, and HSTL, with per-pin dynamic impedance and slew-rate control. The C7 speed grade operates with internal clock frequencies up to 472 MHz and supports commercial temperature operation. The Cyclone III architecture combines an LAB (Logic Array Block) structure built from adaptive logic modules (ALMs), an island-style routing network, and column/row-based embedded memory and multiplier blocks. Power consumption is reduced by leveraging a 1.2 V core voltage, low-k dielectric process, and programmable power-on-demand per LAB. Configuration is supported via JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes using Altera/Intel Quartus II design software. Typical applications include industrial motor control, video processing and image aggregation, communications protocol bridging, automotive infotainment pre-processing, and portable test & measurement equipment. The Cyclone III family is also commonly deployed in display controllers, software-defined radio front-ends, and as a companion processor to ASICs/SoCs for glue logic and parallel DSP tasks. When designing with this part, ensure the Quartus II device fitting is reviewed for the selected speed grade, and verify that I/O bank voltage references match the connected peripherals. The N suffix on the part number indicates lead-free / Pb-free termination, and the AD suffix typically denotes a specific Altera internal ordering code variant. This page synthesizes distributor pricing, package diagrams, and practical design notes not found in the manufacturer datasheet, helping engineers shorten their selection and sourcing cycle.

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EP3C120F780C8N - Cyclone III FPGA, 119K Logic | Intel
EP3C120F780C8N

EP3C120F780C8N - Cyclone III FPGA, 119K Logic | Intel

Intel EP3C120F780C8N is a Cyclone III field-programmable gate array (FPGA) with 119,088 logic elements, 531 user I/O pins, 3,981,312 embedded-memory bits, and a 780-ball flip-chip ball grid array package. Verified distributor listings identify a 1.2 V core supply and a maximum internal frequency of 402 MHz to 472 MHz, depending on the cited source. The device belongs to the low-cost Cyclone III family and is intended for configurable digital logic, embedded processing, control, and high-density interface designs. An FPGA is a semiconductor device containing programmable logic blocks, programmable interconnects, memory resources, and I/O cells. Engineers configure these resources after PCB assembly to implement combinational logic, sequential state machines, communications interfaces, processors, and application-specific accelerators. In the hierarchy of programmable devices, an FPGA sits below application-specific integrated circuits in flexibility but above fixed-function controllers in implementation speed and density. Cyclone III extends this model with a power-conscious architecture for cost-sensitive applications. The headline density of 119,088 logic elements supports larger state machines, parallel datapaths, and multiple interface functions in one programmable device. A total of 3,981,312 embedded-memory bits provides distributed or block-oriented storage for FIFOs, buffers, lookup tables, and packet processing. The device also exposes 531 user I/O pins, enabling broad connectivity in systems that aggregate memory buses, communications links, sensors, or control peripherals. Its 780-ball FBGA package uses a 1 mm pitch and occupies approximately 23 mm by 23 mm with a 2.60 mm height. The Cyclone III architecture combines programmable logic fabric with embedded memory and configurable I/O structures. Configuration data defines both logic behavior and routing, allowing the same physical component to serve different functions through a new bitstream. The 1.2 V operating point is central to power estimation, regulator selection, signal integrity, and thermal design. A design should not use either published frequency value as an unconditional system-clock guarantee; timing closure depends on the implemented logic, constraints, I/O standards, placement, routing, and selected speed grade. Typical systems include industrial control and automation equipment, communications infrastructure, video and image processing, test and measurement hardware, and embedded controllers. The logic density is useful when a design must integrate many parallel functions without an ASIC development cycle. Broad I/O availability also suits boards that bridge processor buses, external memory, converters, and high-speed peripheral interfaces. Before layout, verify the exact ball map, supported I/O standards, configuration scheme, power requirements, and timing limits in the manufacturer documentation. Decoupling, continuous core-power planes, clock distribution, signal-return paths, and configuration-interface integrity directly affect operation. The published frequency figures describe device capability but do not replace static timing analysis. This data consolidates verified distributor specifications, package information, inventory and ordering evidence, practical architecture context, and a drop-in comparison. Because the supplied cross-reference search returned no verified pin-compatible substitutes, no alternative is asserted as a drop-in replacement without package, pinout, density, voltage, and timing evidence.

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EP3C120F780C8NAE - Cyclone III FPGA, 119K LE, 780-BGA | Altera
EP3C120F780C8NAE

EP3C120F780C8NAE - Cyclone III FPGA, 119K LE, 780-BGA | Altera

The Altera (Intel) EP3C120F780C8NAE is a Cyclone III family Field-Programmable Gate Array (FPGA) featuring 119,088 logic elements, 3,981,312 bits of embedded memory, and 531 18x18 hardware multipliers, housed in a 780-ball FineLine BGA package. The part operates with a core speed grade of 8 (commercial) and is rated for industrial temperature use, delivering a balance of high functionality, low static power, and low unit cost that made Cyclone III a workhorse for high-volume programmable logic designs. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose digital logic fabric, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream rather than at the foundry. FPGAs occupy a tier above general-purpose microcontrollers for high-throughput parallel DSP, high-speed serial interfacing, and custom glue logic. Within Altera's (now Intel PSG) portfolio, the Cyclone III family sits between the low-cost Cyclone II and the higher-end Cyclone IV/Arria/Cyclone V families, combining a 65 nm TSMC process, M9K memory blocks, and embedded 18x18 multipliers for DSP. Key features of the EP3C120F780C8NAE include four phase-locked loops (PLLs) for clock management, up to 531 user I/O pins, support for external memory interfaces such as DDR, DDR2, and QDR II SRAM, dedicated LVDS channels, and a configuration scheme supporting JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes. The C8 speed grade places it in the moderate-performance tier, while the 'N' suffix confirms lead-free / Pb-free assembly and the 'AE' suffix denotes an alternate, enhanced or specific temperature-grade variant per Altera's ordering scheme. Architecturally, the device integrates column- and row-based M9K memory blocks (9 Kbits each) totaling 3,981,312 bits, variable-precision DSP blocks that can be configured as 9x9, 18x18, or 36x36 multipliers, and a routing fabric engineered for predictable timing closure. The 780-FBGA FineLine BGA package provides a compact 29x29 mm footprint with 1.0 mm ball pitch, enabling dense board layouts while preserving signal-integrity headroom for LVDS and DDR signaling. Typical applications include industrial motor control, video processing pipelines, software-defined radio, telecom line cards, test and measurement instrumentation, and embedded display controllers. The large logic and memory capacity also makes it suitable for ASIC prototyping and high-channel-count data acquisition front-ends. When designing with the EP3C120F780C8NAE, ensure the Quartus II / Quartus Prime toolchain is matched to the device family revision, and budget for the device's 1.0 V core supply plus separate PLL and I/O bank voltages; the FBGA's 0.4 W typical static power should be validated against the system's thermal envelope. This page synthesizes distributor pricing, drop-in alternatives, and design considerations not found in the manufacturer datasheet alone, helping engineers verify availability, choose compatible substitutes, and accelerate board bring-up.

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EP3C120F780I7 - 119K LE Cyclone III FPGA 780-FBGA | Altera/Intel
EP3C120F780I7

EP3C120F780I7 - 119K LE Cyclone III FPGA 780-FBGA | Altera/Intel

The Altera/Intel EP3C120F780I7 is a high-density member of the Cyclone® III family of low-cost FPGAs, offering 119,088 logic elements, 531 user I/O pins, and 3,981,312 bits of embedded memory in a 780-ball FineLine BGA package. The "I7" speed grade and "F780" package suffix identify an industrial temperature-range device (-40C to +100C junction) in the 29x29 mm FBGA with 1.0 mm ball pitch. According to the Altera Cyclone III Device Handbook, the EP3C120 is fabricated on a 65 nm low-power CMOS process and is supported by the Quartus II design software. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by a programmable interconnect matrix, surrounded by programmable I/O cells. FPGAs sit at the top of the programmable logic hierarchy (CPLD -> FPGA -> SoC FPGA) and are used to implement arbitrary digital circuits, from glue logic and bus bridges to high-throughput parallel DSP pipelines and soft-core microprocessors. Unlike a fixed ASIC, the function is defined by a user-supplied bitstream stored in external configuration memory. Key features of the EP3C120F780I7 include up to 531 user I/O pins, 4 PLLs for clock management, dedicated 18x18 hardware multipliers for DSP, and support for external memory interfaces including DDR/DDR2/QDRII SRAM. The device family provides up to 288 embedded 9x9 multipliers and 4 Mbits of on-chip RAM, making it suitable for cost-sensitive mid-density designs. Configuration is supported via passive serial, fast passive parallel, active serial (EPCS), and JTAG modes. Architecturally, the Cyclone III EP3C120 uses a logic-array-based fabric with row and column interconnect, 8-input adaptive logic modules (ALMs), and per-MLAB distributed memory. Process technology is TSMC 65 nm low-power CMOS with 1.2 V core supply, giving a favorable performance-per-watt ratio compared to earlier Cyclone II and Stratix generations. The 780-FBGA package uses a wire-bond die with a controlled-impedance substrate, supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards across 8 I/O banks. Typical applications include industrial motor control and machine vision, video processing and display controllers, telecom line cards and baseband prototyping, low-cost software-defined radio, and PCI/PCI Express endpoint bridges. The wide operating temperature range also makes it attractive for military and aerospace subsystems where extended-temperature commercial-grade FPGAs are acceptable. When designing with the EP3C120F780I7, plan configuration memory carefully: the uncompressed bitstream exceeds 25 Mbits, so a 64-Mbit EPCS or parallel flash is typically required. Use the Quartus II PowerPlay analyzer early to model thermal dissipation, and follow the Altera pin connection guidelines for unused I/O banks to avoid leakage. Decoupling should follow the Altera reference design with 100 nF plus 10 µF bulk capacitors per power pin pair. This page synthesizes distributor pricing, drop-in same-family alternatives from the Cyclone III family, and practical design notes not found in the manufacturer datasheet alone.

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EP3C120F780I7N - Cyclone III FPGA, 119K LEs, 780-FBGA | Intel
EP3C120F780I7N

EP3C120F780I7N - Cyclone III FPGA, 119K LEs, 780-FBGA | Intel

The Intel (formerly Altera) EP3C120F780I7N is a high-density, low-power Cyclone® III Field-Programmable Gate Array (FPGA) delivering 119,088 logic elements, 3,981,312 bits of embedded memory, and 531 maximum user I/O in a 780-ball FineLine BGA package. Built on TSMC's 65 nm low-power process, the EP3C120F780I7N supports up to 472 MHz internal operation with a 1.2 V core supply. A Field-Programmable Gate Array (FPGA) is a class of programmable logic device (PLD) that combines configurable logic blocks (CLBs), programmable interconnect, and embedded memory/DSP blocks into a single semiconductor die. FPGAs sit hierarchically between ASICs (custom-designed but expensive and non-reprogrammable) and general-purpose microcontrollers (fixed-architecture, software-driven). Within the Intel FPGA portfolio, the Cyclone III family targets cost-sensitive, power-conscious high-volume applications such as industrial control, video processing, and communications infrastructure, while Stratix parts target high-performance signal processing. Key features include up to 288 embedded 18×18 multipliers for DSP, dedicated external memory interfaces supporting DDR/DDR2/QDRII SRAM, 4 PLLs per device for clock management, and a wide range of LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The 'I' speed grade and industrial temperature range (-40 °C to +100 °C) make the EP3C120F780I7N well suited for thermally and electrically harsh environments. Architecturally, the Cyclone III fabric uses 4-input look-up tables (LUTs), M9K embedded memory blocks, and a perimeter I/O ring with up to 8 I/O banks. Configuration is supported via passive serial (AS), active serial (AP), JTAG, and Fast Passive Parallel modes. Designers can use the Quartus II / Quartus Prime design suite for synthesis, place-and-route, and timing closure. Typical applications include industrial motor control, video surveillance image processing, software-defined radio (SDR), prototyping ASIC replacement, and high-speed serial protocol bridging. The 531 user I/O and ~4 Mbit on-chip memory enable large state machines, multi-channel buffering, and parallel DSP pipelines. When designing with this device, ensure the 780-FBGA PCB layout uses 1.0 mm ball pitch with microvia or via-in-pad technology for reliable assembly. The 65 nm process requires careful decoupling (multiple 0.1 µF + bulk 47 µF per rail) to suppress simultaneous switching noise on the I/O banks. Thermal management must consider the ~6 W typical device dissipation at high toggle rates. This page synthesizes distributor pricing, drop-in Cyclone III family alternatives, and PCB layout guidance not aggregated in a single manufacturer document.

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EP3C16E144C7 - Cyclone III FPGA, 84 I/O | Intel | Industrial
EP3C16E144C7

EP3C16E144C7 - Cyclone III FPGA, 84 I/O | Intel | Industrial

The Intel EP3C16E144C7 is a Cyclone III field-programmable gate array in a 144-LQFP exposed-pad package, with 84 user I/O and a 516096-bit embedded-memory specification reported by its distributor listing. This device combines programmable digital logic, general-purpose I/O, embedded memory, and configurable interface resources in a single FPGA package. It is intended for designs requiring adaptable parallel logic, control, communications, and signal-processing functions without changing the physical PCB layout. A field-programmable gate array is a digital semiconductor whose logic, interconnections, and selected I/O behavior are configured after manufacture. FPGA belongs to the programmable-logic hierarchy: FPGA → programmable-logic device → digital semiconductor. Compared with a fixed-function application-specific integrated circuit, an FPGA permits design revisions, faster prototyping, and consolidation of multiple control blocks into one configurable device. The Cyclone III family targets general industrial, communications, consumer, and embedded-control applications. The EP3C16E144C7 provides 84 I/O in a 144-terminal surface-mount LQFP package. The exposed pad supports thermal dissipation by connecting the package thermal structure to a PCB copper plane, although the exact exposed-pad dimensions and recommended land pattern must be checked in the official device documentation. Its device marking combines the Cyclone III EP3C16 designation with package, speed, and temperature option codes, so engineers should verify the complete ordering information before substitution. The verified distributor records identify this part as an FPGA IC with 84 I/O, 516096 bits of embedded memory, 15408, and a 144-LQFP exposed-pad package. The supplied search record does not expose the complete definition of every numeric field, so detailed logic-element, voltage, timing, and thermal figures should not be inferred from the search snippets. The listed manufacturer designation is Altera, now part of Intel's programmable-solutions portfolio. Typical uses include industrial control logic, data-acquisition systems, embedded communications, test equipment, and general-purpose digital signal processing. The 84 available I/O make the device suitable for designs connecting external sensors, converters, memories, transceivers, and human-interface logic while keeping timing and behavior programmable. Designers should establish timing closure and resource utilization with the appropriate Intel Quartus or equivalent FPGA development environment. The main design consideration is package-level thermal management. The 144-LQFP exposed pad requires the PCB footprint and copper area to follow the official package drawing, including thermal-via recommendations where specified. Signal integrity also depends on assigning pins according to the device's bank rules, supply requirements, and supported I/O standards rather than treating all 84 I/O as electrically interchangeable. This page consolidates distributor availability, package information, verified pricing, same-family drop-in options, and practical selection guidance. It also distinguishes confirmed facts from parameters that still require confirmation in the official Cyclone III device handbook or datasheet, helping engineers avoid unsupported assumptions when planning a prototype or production transition.

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EP3C16E144C8 - 15,408-Cell 402 MHz Cyclone III FPGA | Intel
EP3C16E144C8

EP3C16E144C8 - 15,408-Cell 402 MHz Cyclone III FPGA | Intel

The Intel EP3C16E144C8 is a Cyclone III field-programmable gate array with 15,408 logic cells, 84 I/O, 516,096 bits of embedded memory, and a maximum clock frequency of 402 MHz. It is manufactured on a 65 nm process, operates from a 1.2 V core supply, and is supplied in a 144-pin LQFP package with an exposed pad. A field-programmable gate array, or FPGA, is a reconfigurable digital semiconductor in which the logic, memory, and I/O behavior is defined by a programmable configuration file. Within the semiconductor hierarchy, an FPGA belongs to the programmable-logic and programmable-device families. The Cyclone III architecture combines configurable logic elements, embedded RAM, dedicated multipliers, and general-purpose I/O to implement control, interface, signal-processing, and embedded-system functions without changing the physical PCB. The EP3C16E144C8 provides 15,408 logic cells and 516,096 bits of embedded RAM, giving a designer moderate logic and storage capacity on a single device. Its stated 402 MHz maximum clock supports demanding control logic, communications interfaces, industrial automation, and embedded processing systems. The 84-I/O count provides substantial connectivity for external memories, converters, transceivers, and industrial peripherals. Cyclone III devices use programmable configuration data to establish the FPGA's internal circuit paths after power-up. Configuration storage must preserve the valid bitstream during operation and reload it after power is restored. Designers must also account for the 1.2 V core supply, the package's exposed thermal pad, and the voltage requirements of attached I/O banks when implementing the power architecture. Typical uses include industrial factory controllers, communication equipment, test and measurement instruments, embedded control systems, and interface adapters. The 144-pin LQFP package is also easier to inspect and rework than many fine-pitch ball-grid-array packages, making the device useful where prototype visibility, manual assembly, or cost-controlled fabrication is important. The most important design trade-off is that this device is an older Cyclone III FPGA whose lifecycle, tool support, and availability should be confirmed before a new production commitment. Designs should also verify the exact speed, temperature, and qualification requirements rather than assuming that similarly named EP3C16 variants are interchangeable. This page consolidates the supplied distributor specifications, package information, pricing availability, and verified cross-reference candidates with engineering guidance focused on migration, pin compatibility, configuration, power delivery, and sourcing risk. It also distinguishes verified drop-in options from unverified functional substitutes.

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EP3C16E144C8N - 16K LE Cyclone III FPGA, 144-LQFP | Intel / Altera
EP3C16E144C8N

EP3C16E144C8N - 16K LE Cyclone III FPGA, 144-LQFP | Intel / Altera

The Intel / Altera (formerly Altera Corporation) EP3C16E144C8N is a Cyclone III family Field Programmable Gate Array (FPGA) with 15,408 logic elements, 516,096 bits of embedded memory, and 84 user I/O pins, fabricated on a 65 nm low-power process and housed in a 144-pin LQFP package with exposed thermal pad. An FPGA (Field Programmable Gate Array) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by a user-loaded configuration bitstream rather than fixed at the fab. FPGAs occupy a unique tier in the digital design hierarchy: above fixed-function microcontrollers in parallelism and I/O flexibility, below ASICs in per-unit cost and power efficiency. Within Intel's FPGA portfolio, Cyclone III sits in the low-power, low-cost segment targeting volume applications where ASIC-like integration economics are required but design flexibility must be retained. Key features include 15,408 logic elements (LEs), 516,096 bits (63 Kbytes) of embedded RAM, 56 embedded 18x18 multipliers for DSP functions, four phase-locked loops (PLLs) for clock management, and 84 general-purpose I/Os supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device supports commercial temperature grade operation (0C to +85C junction range per the C8 speed-grade ordering code) and operates from a 1.2 V core supply with separate I/O bank supplies for mixed-voltage interfacing. Architecturally, the Cyclone III family uses a 65 nm TSMC process with a logic-array-based LE fabric, M9K embedded memory blocks arranged in columns, and dedicated multiplier blocks adjacent to memory columns to maximize DSP throughput. The four PLLs support frequency synthesis, phase shifting, and external clock compensation, enabling robust clock-tree design across multiple I/O banks. Typical applications include industrial motor control, video processing pipelines, low-density glue logic replacement, LED display controllers, and embedded control systems. The Cyclone III family is widely deployed in factory automation and consumer-electronics designs where cost per logic element is the primary design constraint. When designing with this part, verify that the LQFP-144 footprint matches the target PCB land pattern; the exposed pad must be soldered to the board for thermal dissipation. Quartus II (legacy) or Quartus Prime (current) software is required for design entry, synthesis, place-and-route, and bitstream generation. This page consolidates Cyclone III device parameters, drop-in same-family alternatives, and practical design notes that supplement the manufacturer datasheet with distributor pricing and pinout references.

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EP3C16E144I7 - 15,408 L-Cell Cyclone III FPGA | Intel
EP3C16E144I7

EP3C16E144I7 - 15,408 L-Cell Cyclone III FPGA | Intel

Intel EP3C16E144I7 is a Cyclone III field-programmable gate array with 15,408 logic cells, 84 I/O, and a 144-LQFP exposed-pad package. The device uses a 20 x 20 mm square package with a 0.40 mm pitch and is specified for industrial-temperature operation. It is a programmable logic device rather than a fixed-function controller, allowing parallel logic, interface, control, and signal-processing functions to be consolidated in one FPGA. An FPGA is a reconfigurable digital semiconductor. Its lookup logic, registers, programmable interconnect, and memory resources can be configured after manufacture to implement a defined digital circuit. Within the product hierarchy, the EP3C16E144I7 is a Cyclone III FPGA, a member of the field-programmable gate array and programmable-logic semiconductor family. It is selected when designers need hardware-level parallelism and updateable logic rather than the fixed peripheral set and sequential execution model of a microcontroller. The verified device listing identifies 15,408 logic cells, 84 I/O, and a 144-LQFP exposed-pad package. Its industrial temperature grade supports equipment intended for factory, industrial-control, communications, and embedded-processing environments. The exposed thermal pad provides a direct thermal path from the device to the PCB, but designers still need an appropriate land pattern, vias, and copper area to dissipate junction heat effectively. The 144-pin package is described in the verified data as a 20 x 20 mm square LFQFP with 0.40 mm pitch and 144 terminals. Fine pitch requires careful PCB design, particularly for via-in-pad avoidance, solder-paste control, assembly cleaning, and inspection. The exposed pad should be connected to the intended ground plane according to the manufacturer's package guidance and should not be treated as an interchangeable thermal-only feature without checking the land pattern. Typical uses include industrial automation, communications infrastructure, embedded control, video and image processing, test equipment, and general-purpose digital prototyping. Because the logic fabric is programmable, the same FPGA family can support multiple interface standards and parallel data paths. The 84 available I/O are particularly relevant for designs requiring parallel sensors, data buses, control signals, status indicators, or high-speed external interfaces. Before layout or sourcing, engineers should download the Cyclone III device handbook and EP3C16 device documentation, then verify the exact pin names, bank voltages, power requirements, configuration method, and exposed-pad connection against the intended design. The supplied search evidence confirms the core identity and package but does not include a complete pin table or electrical limits, so those details must not be inferred from the 144-pin count alone. This product record combines verified distributor identity, package, logic-cell, and I/O information with same-package migration guidance, selection criteria, and practical design considerations. It distinguishes confirmed attributes from unavailable specifications, helping engineers identify candidates without confusing a package-compatible option with a fully verified functional replacement.

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EP3C16E144I7N - Cyclone III FPGA, 16K LEs, 144-LQFP | Intel/Altera
EP3C16E144I7N

EP3C16E144I7N - Cyclone III FPGA, 16K LEs, 144-LQFP | Intel/Altera

The Intel / Altera EP3C16E144I7N is a Cyclone III Field Programmable Gate Array (FPGA) delivering 15,408 logic elements, 516,096 bits of embedded memory, and 84 maximum user I/O pins in a 144-pin LQFP Exposed Pad package. Built on a low-power 65 nm process, this industrial-temperature-grade device targets cost-sensitive, high-volume applications that require programmable logic without the overhead of high-end Stratix devices. An FPGA (Field Programmable Gate Array) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable routing channels, and dedicated hard IP blocks such as memory, PLLs, and transceivers. Unlike a fixed-function ASIC, an FPGA's logic and interconnects are defined after manufacture via a hardware description language such as VHDL or Verilog. FPGAs occupy the middle ground between microcontrollers and ASICs in the programmable logic hierarchy, with Cyclone III specifically positioned at the low-power, low-cost end of the FPGA market. Key features of the EP3C16E144I7N include 56 embedded 18x18 multipliers for DSP-style arithmetic, four general-purpose PLLs for clock management, and support for external memory interfaces including DDR, DDR2, SDR, and QDRII SRAM. The 144-LQFP exposed-pad package provides robust thermal dissipation and is compatible with standard SMT assembly lines, eliminating the need for fine-pitch BGA rework. Cyclone III FPGAs use a 1.2 V core supply with separate VCCIO banks that can be set to 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, or 3.3 V for mixed-voltage interfacing. The 'I7' speed grade and industrial temperature range (-40C to +100C junction) make this part suitable for harsh-environment deployments, while the 'N' suffix indicates a lead-free, RoHS-compliant terminal finish. Typical applications include industrial motor control, video processing pipelines, software-defined radio front-ends, automotive driver assistance subsystems, and prototyping bridges for ASIC migration. The combination of 16K logic elements and embedded multipliers enables mid-complexity DSP, encoder/decoder, and state-machine designs. When designing with this device, allocate sufficient PCB copper area under the exposed pad for thermal relief - Cyclone III devices can dissipate several watts under heavy logic utilization. Use Quartus II (or the current Intel Quartus Prime Lite) for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, drop-in Cyclone III variants, and practical design notes not found in the manufacturer datasheet.

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