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EP3C16F256C6 - 15,408-Cell 500 MHz FPGA | Altera
EP3C16F256C6

EP3C16F256C6 - 15,408-Cell 500 MHz FPGA | Altera

Altera EP3C16F256C6 is a Cyclone III field-programmable gate array (FPGA) with 15,408 logic cells, a listed maximum frequency of 500 MHz, and 168 I/Os in a 256-LBGA package. The device is manufactured on 65 nm technology and uses a listed 1.2 V supply, placing it in the FPGA & CPLD category as a configurable digital-logic semiconductor. An FPGA is a programmable logic device that replaces application-specific fixed digital logic with interconnected configurable logic, memory, and programmable I/O blocks. Engineers configure an FPGA for parallel processing, control logic, signal conditioning, communications, or general-purpose digital systems. The Cyclone III family combines these configurable resources with a high-pin-count ball-grid package intended for compact, high-density PCB assemblies. Key verified characteristics include 15,408 logic cells, 168 I/Os, 516,096 embedded-memory bits, and a maximum listed frequency of 500 MHz. The 256-LBGA package provides 256 package terminals and uses a lead-free construction identified as MS-034. The supplied operating-temperature information spans -40°C to +125°C, making the component relevant to industrial and extended-temperature equipment when the complete device qualification and system requirements are satisfied. The EP3C16F256C6 combines a 65 nm process node with a 1.2 V listed supply voltage. Its 256-terminal surface-mount package supports dense routing to external memory and peripherals, while 168 user I/Os provide interfaces for control buses, data acquisition, communications, and general-purpose logic. Available source data does not provide the full I/O standard list, memory architecture details, AC timing characteristics, or recommended operating conditions, so those parameters should be confirmed in the Cyclone III device handbook and datasheet before release. Typical uses include industrial automation controllers, communication interfaces, embedded signal-processing systems, test equipment, and network-interface designs. In each case, the FPGA can implement parallel datapaths and state machines while the 168 I/Os connect the programmable logic to converters, transceivers, memories, and control peripherals. Designs requiring deterministic interfaces, multiple voltage domains, or high-speed memory must verify the exact bank and pin constraints in the manufacturer documentation. A critical design consideration is that legacy FPGA availability and lifecycle plans should be checked before new production commitment. The verified distributor listings indicate current sourcing options, but they do not provide a formal lifecycle statement, long-term supply commitment, or automotive qualification. Engineering teams should therefore confirm procurement continuity, tooling support, and design-file compatibility before adopting this device in a new platform. This page consolidates verified distributor specifications, package information, sourcing data, and carefully qualified same-family alternatives. It also distinguishes directly verifiable facts from parameters that remain unavailable, helping engineers compare the EP3C16F256C6 without treating generic FPGA assumptions as manufacturer-specified characteristics.

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EP3C16F256C7 - 15,408-LC Cyclone III FPGA | Intel/Altera
EP3C16F256C7

EP3C16F256C7 - 15,408-LC Cyclone III FPGA | Intel/Altera

The Intel/Altera EP3C16F256C7 is a Cyclone III field-programmable gate array with 15,408 logic elements, 516,096 embedded memory bits, 168 user I/O, and a 256-pin low-profile ball grid array package. It combines a programmable logic fabric, programmable memory, and configurable I/O in one reconfigurable semiconductor for digital control, interface bridging, image processing, and embedded signal-processing systems. The verified distributor listing identifies the device as a 256-LBGA Cyclone III FPGA with a -40 °C to +125 °C operating-temperature range. An FPGA is a programmable digital semiconductor whose interconnect and logic resources can be configured after manufacture. Within the semiconductor hierarchy, a field-programmable gate array is a user-programmable logic device that sits above fixed-function application-specific integrated circuits when design flexibility is more valuable than a fixed hardware cost structure. The Cyclone III family provides a cost-optimized platform for designs requiring moderate logic density, dedicated block RAM, and multiple I/O standards without moving to a larger programmable-logic family. The EP3C16F256C7 provides 15,408 logic elements and 516,096 bits of embedded RAM, giving designers a defined resource budget for control state machines, packet buffers, data acquisition, and parallel image pipelines. Its 168 user I/O support interfaces to external converters, memory, transceivers, and displays. Because the device is packaged in a 256-LBGA, board assembly requires a fine-pitch PCB layout, careful via and escape-routing planning, and complete thermal analysis. The -40 °C to +125 °C rating supports industrial-temperature deployments. Typical uses include industrial automation controllers, multi-channel data-acquisition modules, communications-interface bridges, motor-control and power-system control, test-and-measurement front ends, and embedded video-processing subsystems. An FPGA is particularly useful when several peripherals or parallel data paths must be integrated without developing a custom ASIC. Design considerations center on pin assignment, power integrity, decoupling, and thermal management. Because complete pin names and bank power requirements were not present in the verified source data, engineers should use the Altera pinout and power-supply documentation for the exact 256-LBGA footprint before layout release. Configuration flash, clocking, decoupling, and every power ball must be planned together rather than added after routing. This page consolidates verified distributor specifications, package information, pricing evidence, and same-family replacement context into one engineering reference. It also distinguishes documented facts from parameters that still require confirmation from the manufacturer datasheet, reducing the risk of designing from distributor-search snippets alone.

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EP3C16F256C8 - 15,408-L Logic Cell Cyclone III FPGA | Altera
EP3C16F256C8

EP3C16F256C8 - 15,408-L Logic Cell Cyclone III FPGA | Altera

The Altera EP3C16F256C8 is a Cyclone III field-programmable gate array with 15,408 logic elements, 504 Kb of block RAM, 168 I/O pins, and a maximum operating frequency of 402 MHz. The device is supplied in a 256-LBGA F256 package measuring 17 mm by 17 mm and built on 65 nm CMOS technology with a 1.2 V core supply. A field-programmable gate array, or FPGA, is a programmable semiconductor that combines configurable logic blocks, memory, and input/output resources on one integrated device. An FPGA belongs to the broader programmable-logic hierarchy alongside CPLDs, while its parallel fabric supports higher logic density and more sophisticated clocking, signal processing, and communications designs than a conventional microcontroller or fixed-function logic device. The EP3C16F256C8 provides 516,096 embedded memory bits and 15,408 logic elements. Its 168 I/O pins support interfaces and board-level connections, while the C8 suffix identifies a commercial speed-grade configuration. The specified commercial junction-temperature range is 0 °C to 85 °C. The 256-LBGA package uses ball-grid-array interconnects and surface-mount assembly, supporting compact designs with many external connections. Its 65 nm Cyclone III architecture is intended for cost-sensitive programmable logic applications where flexible configuration, parallel processing, and moderate logic capacity are more important than the very high performance or power density associated with newer FPGA families. The advertised 402 MHz figure provides a concise indicator of the device's maximum performance class, but individual interfaces and designs operate according to their own timing constraints. Typical uses include industrial control, communications, instrumentation, embedded processing, and general-purpose digital logic. Its 15,408 logic elements make it suitable for control architectures requiring parallel datapaths, state machines, protocol handling, and local buffering. The 504 Kb of block RAM can support moderate data buffering, packet storage, or lookup tables without relying exclusively on external memory. Designers should verify every power rail, I/O standard, pin constraint, and timing requirement against the manufacturer datasheet before layout or programming. A 256-ball BGA also requires careful escape routing, layer-transition planning, clean supply distribution, and assembly-process control. Configuration, clocking, decoupling, and unused-pin treatment must be included in the complete design verification plan. This page combines verified Cyclone III resource, package, speed-grade, pricing, and sourcing information with application guidance, comparison tables, and practical FPGA design notes. It also distinguishes catalog substitutions from same-package alternatives and highlights which procurement and technical details still require manufacturer-datasheet confirmation.

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EP3C16F256I7 - 15,408-Logic-Cell Cyclone III FPGA | Intel
EP3C16F256I7

EP3C16F256I7 - 15,408-Logic-Cell Cyclone III FPGA | Intel

The Intel / Altera EP3C16F256I7 is a Cyclone III field-programmable gate array with 15,408 logic elements, 963 logic array blocks, 168 user I/Os, and 516,096 bits of embedded memory in a 256-pin LBGA package. It is identified as an industrial-temperature device operating from -40°C to 125°C, with a 1.2 V core supply and a listed maximum operating frequency of 437.5 MHz. The EP3C16F256I7 combines programmable digital logic, block RAM, and dedicated I/O resources in one reconfigurable semiconductor. A field-programmable gate array, or FPGA, is a programmable digital IC whose logic, memory, and signal paths can be configured after manufacture. Within the product hierarchy, an FPGA belongs to the semiconductor and programmable-logic categories, with the Cyclone III family positioned as a low-power FPGA family for embedded, communications, industrial, and test applications. Unlike a fixed-function microcontroller or application-specific integrated circuit, an FPGA can support parallel processing, custom interfaces, protocol bridging, control logic, and signal conditioning within one device. The Cyclone III architecture provides 15,408 logic elements organized into 963 logic array blocks. Each logic array block contains configurable logic capable of implementing combinational or registered Boolean functions. The device also includes 168 I/Os and 516,096 bits of memory, giving a design engineer a substantial amount of parallel data-processing and storage capacity. Its listed 1.2 V core voltage supports operation from a relatively low-voltage digital power domain. The industrial temperature designation makes the EP3C16F256I7 suitable for environments where commercial-temperature components may not provide adequate operating margin. The supplied distributor records identify a 256-pin LBGA package, while another distributor description identifies the same configuration as a 256-pin FBGA. Its 437.5 MHz operating-frequency listing indicates the performance grade associated with this orderable device, although application timing must still be evaluated against the manufacturer’s electrical characteristics. Typical uses include industrial control and automation, communications protocol conversion, embedded video or image processing, data acquisition, and test equipment. The 168 I/Os are useful for parallel control and high-speed digital interfaces, while the 516,096-bit memory resource supports buffering, packet storage, lookup tables, and intermediate data. Designers should also consider the 256-ball land pattern when assigning signals and planning escape routing. PCB implementation requires a land grid array footprint, careful ball assignment, multilayer-routing discipline, and thermal analysis appropriate for a leadless BGA package. Because the verified source data does not expose the complete manufacturer pin table, designers should obtain the official Cyclone III documentation before releasing PCB artwork or making pin-level substitutions. This product record combines verified distributor specifications, sourcing information, application context, and qualified same-family migration guidance. It separates confirmed EP3C16F256I7 attributes from unavailable detailed electrical, timing, memory, and pin-mapping data, helping engineers plan an initial design without treating incomplete distributor fields as authoritative design limits.

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EP3C16F256I7N - Cyclone III FPGA, 15K LEs, 256-FBGA | Intel
EP3C16F256I7N

EP3C16F256I7N - Cyclone III FPGA, 15K LEs, 256-FBGA | Intel

The Intel (formerly Altera) EP3C16F256I7N is a member of the Cyclone III family of low-power, high-volume field-programmable gate arrays (FPGAs), offering 15408 logic elements (15K LEs) in a 256-ball FineLine BGA (FBGA) package. The device integrates 516096 bits of embedded memory and supports up to 168 user I/O pins, with 56 embedded 18x18 multipliers enabling DSP-style signal processing on-chip. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells, all of which can be reconfigured by the end user after manufacture. Within the broader semiconductor hierarchy, FPGAs sit alongside microcontrollers, DSPs, and ASICs as a programmable logic category, with the Cyclone III family targeting low-power, cost-optimized applications in the sub-100 mW static power envelope. This part is a low-cost variant of the broader programmable logic taxonomy that includes SRAM-based, flash-based, and antifuse-based devices. Key features of the EP3C16F256I7N include support for multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS, RSDS, mini-LVDS, LVPECL, PCI, PCI-X), up to four general-purpose PLLs per device with fractional synthesis and spread-spectrum capability, and Cyclone III architecture with a logic capacity that maps efficiently to consumer, industrial, and communications designs. The device is fabricated on a TSMC low-leakage 60 nm process that reduces static power consumption by up to 50% compared to the prior generation. The architecture combines a fabric of 15408 logic elements arranged in columns and rows, 504 Kbit of M9K embedded memory blocks (totaling 516 Kbit), 56 18x18 hardware multipliers, and four PLLs. Each logic element contains a 4-input look-up table (LUT), a programmable register, and carry-chain logic for efficient arithmetic and address generation. This combination makes the Cyclone III family a balanced general-purpose FPGA for control-plane and moderate-throughput data-plane tasks. Typical applications include industrial motor control and factory automation, automotive driver assistance and infotainment, consumer video processing, software-defined radio, video surveillance, and telecom infrastructure. The Cyclone III series was widely adopted in designs where the design team wanted the flexibility of FPGA fabric but the unit cost of an ASIC, particularly for low-to-mid volume production. When designing with this part, engineers should reference the Cyclone III Device Handbook for I/O standard and pin assignment details, use the Quartus II design software (Web Edition is free) for synthesis and place-and-route, and provide a configuration memory such as an EPCS or EPCQ flash device on the board for non-volatile configuration. The "I7N" suffix denotes the industrial temperature grade (-40C to +100C junction) and lead-free / Pb-free terminal finish. This page synthesizes distributor pricing, drop-in same-package alternatives from the Cyclone III family, and practical FPGA design notes not found in the manufacturer datasheet.

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EP3C16F484C6 - Cyclone III FPGA, 16K LE, 484-BGA | Altera
EP3C16F484C6

EP3C16F484C6 - Cyclone III FPGA, 16K LE, 484-BGA | Altera

The Altera (Intel) EP3C16F484C6 is a Cyclone III Field Programmable Gate Array (FPGA) featuring 15,408 logic elements, 516,096 bits of embedded memory, and 346 user I/O pins, housed in a 484-ball FineLine BGA (FBGA) package. It is built on a low-power 65 nm process and is offered in the -C6 speed grade with commercial temperature rating (0C to +85C). What is a Cyclone III FPGA? The Cyclone III family is Altera's low-cost, low-power SRAM-based programmable logic family introduced in 2007, positioned between simple CPLDs and high-performance FPGAs such as Stratix. Cyclone III devices target cost-sensitive, high-volume applications where designers need moderate logic density, on-chip memory, and DSP blocks without paying for transceivers or hard processor cores. In the broader taxonomy, an FPGA is a programmable logic device (PLD) within the semiconductor category, used wherever fixed-function ASICs are too expensive or inflexible. Key features of the EP3C16F484C6 include 56 embedded 18x18 multipliers for DSP, four phase-locked loops (PLLs) for clock management, and support for external memory interfaces including DDR, DDR2, and QDRII SRAM. The 484-FBGA package exposes the maximum user I/O count of 346 pins, enabling wide parallel buses and high-pin-count peripheral connectivity. Configuration is supported through passive serial (AS), active serial (PS), fast passive parallel (FPP), and JTAG modes. The Cyclone III architecture uses 4-input look-up tables (LUTs) and embedded M9K memory blocks, providing a balanced resource mix for control-plane logic, state machines, and moderate DSP workloads. Compared to the previous Cyclone II generation, Cyclone III cuts dynamic power by approximately 50 percent and adds dedicated hardware multipliers and improved clock networks. Typical applications include industrial motor control, video processing and display bridging, telecom baseband glue logic, prototyping ASIC designs, and embedded vision systems. The wide 484-ball package also makes the EP3C16F484C6 suitable for development boards and evaluation platforms where pin access is valuable. When designing with this part, pay attention to configuration mode pin strapping (MSEL pins), JTAG chain ordering, and bank-based I/O voltage planning. The F484 package is the largest in the EP3C16 family and may require multi-layer PCB stack-ups for fan-out routing. This page synthesizes distributor pricing, package-compatible same-family alternatives, and design considerations not always collected in one place on the manufacturer datasheet.

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EP3C16F484C6N - Cyclone III FPGA 16K LE 484-FBGA | Intel
EP3C16F484C6N

EP3C16F484C6N - Cyclone III FPGA 16K LE 484-FBGA | Intel

The Intel EP3C16F484C6N is a Cyclone III Field-Programmable Gate Array (FPGA) featuring 15,408 logic elements, 504 Kbits of embedded memory, and 56 embedded 18x18 multipliers in a 484-ball FineLine BGA package. It operates from a 1.15V to 1.25V core supply with multi-standard I/O bank voltages supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL at up to 346 user I/O pins. The device runs at a core speed grade of -6 (commercial) and is RoHS/lead-free compliant per the N package suffix. An FPGA (Field-Programmable Gate Array) is a programmable semiconductor containing configurable logic blocks, programmable interconnect, and programmable I/O cells that engineers can customize after manufacture to implement custom digital logic. In the programmable logic hierarchy, FPGAs sit between fixed-function ASICs (lower flexibility, lower per-unit cost at volume) and microcontrollers (sequential execution, lower parallel throughput). The Cyclone III family targets the low-power, low-cost segment of the FPGA market using TSMC's 65 nm process node. Key features of the EP3C16F484C6N include four phase-locked loops (PLLs) for clock synthesis and skew management, 20 global clock networks, support for external memory interfaces including DDR, DDR2, and QDRII SRAM, and configuration via JTAG, passive serial, or fast passive parallel modes. The device also provides dedicated hardware blocks for PCI Express endpoint, gigabit Ethernet, and basic DSP functions. The Cyclone III architecture uses adaptive logic modules (ALMs) instead of legacy 4-input LUTs, yielding higher effective logic density per LE. The 484-FBGA (FineLine BGA) package uses a 1.0 mm ball pitch, supporting high-density PCB designs with standard surface-mount assembly. The N suffix indicates lead-free, RoHS-compliant packaging suitable for high-volume manufacturing. Typical applications include industrial motor control, video processing bridges, wireline telecommunications, automotive driver assistance, and embedded DSP. Designers use Quartus II or Quartus Prime design software for synthesis, place-and-route, and timing closure. When designing with this FPGA, ensure the PCB layout uses at least four PCB layers with dedicated power and ground planes for the core (1.2 V) and I/O supplies. Decoupling capacitors must be placed as close as possible to each supply pin per Quartus power delivery guidance, and unused I/O pins should be left floating or tied to ground per the configuration handbook. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

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EP3C16F484C7 - Cyclone III FPGA, 346 I/O, 484-FBGA | Altera
EP3C16F484C7

EP3C16F484C7 - Cyclone III FPGA, 346 I/O, 484-FBGA | Altera

The Altera EP3C16F484C7 is a Cyclone III field-programmable gate array with 15,408 logic elements, 346 I/Os, a 437.5 MHz maximum device speed, and a 1.2 V core supply in a 484-pin FBGA package. It is manufactured on 65 nm CMOS technology and is designed for programmable logic applications requiring substantial parallel processing capability, dedicated memory resources, and numerous general-purpose I/O. A field-programmable gate array is a semiconductor whose digital logic, interconnect, and configurable I/O behavior are defined after fabrication. Within the product hierarchy, an FPGA is a programmable-logic IC and a semiconductor. The Cyclone III family combines configurable logic elements with embedded memory and fixed or flexible I/O, allowing one package to implement parallel data processing, control, interface bridging, and signal-routing functions without changing the PCB. The verified device data identifies 15,408 logic elements, 963 logic array blocks, and 346 I/Os. These resources make the EP3C16F484C7 appropriate for image and signal pipelines, industrial control, communications infrastructure, data acquisition, and embedded protocol handling. Its 346 I/O provide substantial board-level connectivity in a single 484-FBGA package, while the 437.5 MHz speed figure supports designs requiring synchronous processing at relatively high logic rates. The device uses a 65 nm CMOS process and a 1.2 V core voltage. In a Cyclone III design, the FPGA's configurable logic fabric can implement parallel algorithms while block RAM stores samples, frame data, packet buffers, or lookup tables. Dedicated input/output registers support higher-throughput interfaces, while clock management, phase-locked loops, and on-chip memory work together to synchronize data paths and reduce the amount of external logic required. Typical uses include industrial automation and factory control, networking and communications equipment, instrumentation and data acquisition, test and measurement, embedded video, and general-purpose digital signal processing. The large I/O count can simplify board integration when multiple buses, control signals, and high-speed parallel interfaces must converge on one programmable device. Designs should still be checked against the specific I/O standards, speed grades, timing budgets, and power requirements documented for the selected Cyclone III device. The principal design consideration is that a 484-pin FBGA requires careful PCB layout, controlled escape routing, adequate power and ground planes, and assembly processes capable of handling its fine-pitch ball array. Designers should verify pin-compatible power, configuration, clock, and user-I/O assignments before schematic capture, then use the manufacturer's pinout and timing documentation to complete signal-integrity and power-distribution analysis. This product record consolidates verified distributor availability, pricing, Cyclone III resource data, and same-family replacement candidates while separating known specifications from unavailable details. That distinction helps engineers identify what can be used directly in initial design work and what must still be confirmed against the manufacturer datasheet, pinout, timing models, and PCB constraints.

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EP3C16F484C7N - Cyclone III FPGA, 15K LEs, 484-FBGA | Intel
EP3C16F484C7N

EP3C16F484C7N - Cyclone III FPGA, 15K LEs, 484-FBGA | Intel

The Intel (formerly Altera) EP3C16F484C7N is a low-power, low-cost Cyclone III Field-Programmable Gate Array (FPGA) fabricated on a 65 nm process and packaged in a 484-ball FineLine BGA (FBGA). It integrates 15,408 logic elements, 504 Kbits of embedded memory, 56 embedded 18x18 multipliers, 4 phase-locked loops (PLLs), and 346 user I/O pins. According to the Cyclone III device family datasheet, the device supports a core voltage of 1.2 V and offers up to 437.5 MHz internal operation. A Field-Programmable Gate Array (FPGA) is a programmable logic device that allows engineers to implement arbitrary digital circuits after PCB fabrication. FPGAs sit in the programmable logic hierarchy above simple PLDs and below ASICs, bridging the gap between fixed-function ICs and full-custom silicon. The Cyclone III family in particular targets cost-sensitive, high-volume applications where the per-board BOM cost of a traditional FPGA would be prohibitive, while still offering DSP blocks, on-chip RAM, and high-speed serial capability for parallel digital processing. Key features of the EP3C16F484C7N include 346 LVDS-capable user I/O pins arranged across eight I/O banks, configurable LVDS/LVCMOS/LVTTL support, and dedicated hardware multipliers (up to 56 18x18) for DSP pipelines. The device supports JTAG (IEEE 1149.1) boundary-scan configuration via the EPCS serial configuration device family, plus 4 PLLs for clock synthesis. Speed grade -7 places this part in the mid-performance bin of the Cyclone III family. Cyclone III architecture combines look-up tables (LUTs), embedded memory blocks (M9K), DSP blocks, and routing fabric. The 65 nm process node reduces static leakage versus the prior Cyclone generation, enabling the family to operate with typical power well under 0.5 W for many designs. Cyclone III is widely used in industrial control, motor drive, video processing, and prototyping applications. Typical applications include industrial machine vision, motor control and drive interfaces, low-cost video bridging, LED wall controllers, software-defined radio (SDR) front ends, and ASIC/SoC prototyping. The combination of DSP blocks and a generous logic budget makes the EP3C16F484C7N especially suited to DSP-centric embedded designs. When designing with this device, validate thermal performance for your specific I/O switching profile and ensure the configuration scheme (EPCS flash or JTAG) is provisioned in your PCB layout. Speed grade -7 provides balanced timing margin; faster -8 grades are not stocked for this part number.

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EP3C16F484C8 - 516K-Bit Cyclone III FPGA | Intel
EP3C16F484C8

EP3C16F484C8 - 516K-Bit Cyclone III FPGA | Intel

The Intel EP3C16F484C8 is a Cyclone III field-programmable gate array with 516,096 bits of programmable logic, 346 I/O, and a 484-pin FBGA package. The device operates from a 1.2 V core supply and is positioned for embedded systems requiring programmable logic, parallel processing, control, interface, and signal-routing functions in a single reconfigurable device. An FPGA is a semiconductor whose internal digital logic, interconnects, and I/O behavior are configured after manufacture. Within the product hierarchy, the EP3C16F484C8 is a Cyclone III FPGA, which is a low-complexity FPGA in the broader field-programmable logic device category. Compared with an application-specific integrated circuit, an FPGA allows design logic to be revised through programmable configuration rather than requiring a new mask set. The verified device data identifies 346 I/O, 516,096 logic bits, 15,408 logic elements, 484 package balls, and a 1.2 V supply. These resources allow multiple control and data-processing functions to be consolidated into one programmable component. The C8 suffix and associated ordering information identify the particular speed, temperature, and package configuration, but a complete decoded timing table was not included in the supplied source material. Cyclone III devices use configurable logic elements, programmable routing networks, memory blocks, and dedicated input/output resources. Depending on the selected Cyclone III density and configuration, these resources can support parallel data acquisition, protocol bridging, control logic, image processing, communications, and embedded processor implementations. Exact PLL, transceiver, memory, and I/O standards are not stated in the provided verified data and therefore require confirmation in the manufacturer documentation before design release. Typical uses include industrial control, communications infrastructure, test and measurement, audio and video processing, sensor acquisition, and networking equipment. In each case, the main benefit is reconfigurable logic that can consolidate multiple fixed-function devices while preserving the flexibility to update field behavior through a new configuration bitstream. Design planning should begin with the 484-ball footprint, 346 available I/O, 1.2 V core supply, and device-specific speed and temperature grade. Power, I/O standards, configuration pins, memory requirements, and timing must be checked against the exact Cyclone III datasheet. Because the supplied snippets do not expose the complete pin map or all electrical limits, those details should not be inferred from the package name alone. This product page consolidates verified distributor availability, exact catalog identifiers, package information, and practical sourcing context into a structured reference. It also distinguishes confirmed data from specifications that still require datasheet-level verification, helping engineers evaluate the EP3C16F484C8 without relying on incomplete distributor summaries.

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EP3C16F484C8N - Cyclone III FPGA 15K LE 484-BGA | Intel
EP3C16F484C8N

EP3C16F484C8N - Cyclone III FPGA 15K LE 484-BGA | Intel

The Intel (formerly Altera) EP3C16F484C8N is a Cyclone III family Field Programmable Gate Array (FPGA) with 15,408 logic elements, 504 Kbit embedded memory, and 346 user I/O pins, housed in a 484-ball FineLine BGA package. It is specified for commercial temperature range (0C to +85C) at speed grade 8, and is fabricated on a low-power 60 nm process that pairs high functionality with low static and dynamic power. Background Knowledge: A Field Programmable Gate Array (FPGA) is a programmable semiconductor that lets designers implement arbitrary digital logic - combinational, sequential, and memory - via a configuration bitstream. FPGAs sit within the broader taxonomy of programmable logic devices (PLD), bridging the gap between fixed-function ASICs (high NRE, high volume) and discrete glue logic. The Cyclone III family is positioned as a low-cost, low-power FPGA family from Intel/Altera, optimized for volume production in industrial, consumer, and communications applications rather than high-end signal processing. Key features include 15,408 logic elements organized in 963 LABs (Logic Array Blocks), 56 embedded 18x18 multipliers supporting up to 70 MHz DSP throughput, and 4 PLLs for clock management. The device also supports external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM through dedicated PHY blocks. Total on-chip RAM is 504 Kbit distributed across M9K memory blocks, sufficient for buffering moderate data streams. Architecturally, Cyclone III uses a LUT-based fabric with embedded multiplier blocks and hard memory controllers, providing deterministic timing and predictable performance across the commercial temperature range. The 60 nm process and 1.2 V core operation help reduce dynamic power versus prior Cyclone generations, making it suitable for thermally-constrained embedded systems. Typical applications include industrial motor control, video processing pipelines, automotive infotainment prototyping, telecommunications line cards, and consumer electronics requiring custom glue logic or moderate DSP. It also serves as a cost-effective prototyping vehicle for ASIC development. When designing with this device, careful attention must be paid to power sequencing, decoupling, and JTAG configuration routing. The 484-BGA package requires a 4-layer minimum PCB with controlled-impedance traces for high-speed interfaces. This page synthesizes distributor pricing, drop-in same-package alternatives from the Cyclone III family, and practical design notes not consolidated in the manufacturer datasheet alone.

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EP3C16F484I7 - Cyclone III FPGA, 16K LE, 484-BGA | Intel
EP3C16F484I7

EP3C16F484I7 - Cyclone III FPGA, 16K LE, 484-BGA | Intel

The Intel (formerly Altera) EP3C16F484I7 is a low-power Cyclone III Field Programmable Gate Array delivering 15,408 logic elements, 516,096 bits of embedded RAM, and 346 user I/Os in a 484-ball FineLine BGA package, operating across the industrial -40C to +100C temperature range. What is a Cyclone III FPGA? A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs), embedded memory blocks, multipliers, and programmable I/O cells that engineers can re-program in the field to implement arbitrary digital logic, glue logic, DSP pipelines, or even soft-processor systems-on-chip. Cyclone III sits at the low-power, cost-optimized end of Intel's FPGA portfolio, fabricated on a 60 nm TSMC process and tailored for high-volume, power-sensitive designs. Key features include 15,408 logic elements organized into 963 LABs, 504 Kbit of dedicated M9K embedded memory blocks (totaling 516,096 bits), 56 embedded 18x18 multipliers for DSP, four general-purpose PLLs, and Cyclone III's signature low-power architecture that consumes roughly half the static current of the prior Cyclone II generation. The 484-FBGA package exposes 346 user I/Os supporting LVDS, SSTL, HSTL, and LVCMOS standards at up to 640 Mbps LVDS. Cyclone III devices are configured via passive serial, fast passive parallel, active serial, fast active parallel, or JTAG modes using industry-standard Altera/Intel Quartus II or Quartus Prime design software. Bitstream encryption with AES is supported on Cyclone III LS variants, and the family uses SRAM-based configuration cells requiring an external boot PROM or JTAG source. Typical applications include industrial motor control and factory automation, video surveillance and image processing pipelines, low-cost software-defined radio front-ends, USB/Ethernet bridging, medical imaging pre-processing, and automotive infotainment prototypes. The combination of low unit cost and a robust Quartus toolchain makes Cyclone III a common choice for both prototypes and production runs of 10K-100K units. When designing with this device, ensure your power budget accounts for both static (always-on) consumption and dynamic toggle power, and follow Intel's cyclone III pin connection guidelines to leave unused I/Os properly biased. Bitstream configuration time at 40 MHz DCLK with a serial EPCS flash is typically under 50 ms for a full 16K LE design. This page synthesizes distributor pricing, drop-in Cyclone III speed-grade alternatives, and practical PCB and configuration design notes that complement the manufacturer datasheet.

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EP3C16F484I7N - 15408 LE Cyclone III FPGA, 484-FBGA | Altera (Intel)
EP3C16F484I7N

EP3C16F484I7N - 15408 LE Cyclone III FPGA, 484-FBGA | Altera (Intel)

The Altera (now Intel) EP3C16F484I7N is a Cyclone III family low-power Field-Programmable Gate Array (FPGA) with 15408 logic elements, 516096 bits of embedded memory, and 346 user I/Os, housed in a 484-ball FineLine BGA (FBGA) package. The 'I7' speed/temperature grade denotes an industrial temperature range (-40C to +100C case) with a 7 ns internal timing margin, and the 'N' suffix indicates a lead-free, RoHS-compliant tray packing. The Cyclone III family is fabricated on a 65 nm TSMC low-power process and operates from a 1.2 V core supply, making it one of the lowest-power mid-density FPGAs in its generation. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines an array of configurable logic blocks (LEs), routing channels, and embedded memory/DSP into a single semiconductor. The taxonomy is: FPGA -> programmable logic device -> logic IC -> integrated circuit -> semiconductor. Unlike ASICs, FPGAs are programmed in the field using HDL flows (Verilog/VHDL) and an SRAM configuration bitstream. FPGAs sit above microcontrollers and DSPs in flexibility but below ASICs in cost-per-volume, making them ideal for prototyping, low-volume production, and designs requiring parallel hardware acceleration. Key features of the EP3C16F484I7N include 4 transceivers of 156 MHz / 437.5 MHz PLL support (no multi-gigabit transceivers, but ample general-purpose LVDS), 20 global clock networks, 56 embedded 18x18 multipliers for DSP, and Cyclone III's signature 1.2 V core that delivers roughly 50% lower dynamic power than Cyclone II. Configuration is via serial passive (PS), JTAG, or Altera Fast Passive Parallel modes using the cyclone programming cable or USB-Blaster. The Cyclone III architecture uses an SRAM-based configuration cell backed by a multi-level routing hierarchy (L1/L2/L3/longlines), LAB-based logic array blocks containing 16 LEs each, and embedded M9K memory blocks (typically 56 blocks, 516 kbit total in this device). The 484-FBGA package is a 1.0 mm pitch BGA suitable for 4-6 layer PCBs, supporting high I/O count without demanding fine-line manufacturing. Typical applications include industrial motor control and PLCs, video processing and image filtering, low-cost software-defined radio front-ends, factory automation and machine vision, telecom line cards, and embedded control with Nios II soft-core processors. The 56 hardware multipliers and abundant RAM make it well-suited to DSP pipelines, while the 346 I/Os support parallel bus and high-pin-count industrial protocols. Design consideration: route configuration signals (nCONFIG, nSTATUS, CONF_DONE, MSEL, nCE) per Altera reference schematics and respect the JTAG chain. Use the Quartus II (or Quartus Prime Lite 18.x for legacy device support) software flow to compile, place-and-route, and generate the .sof/.pof bitstream. The 484-FBGA requires PCB fabrication with 0.4 mm via-in-pad or 0.6 mm dog-bone fanouts and impedance-controlled traces for LVDS. This page synthesizes distributor pricing, pin-compatible drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

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EP3C16M164C7N - Cyclone III FPGA, 15408 LE | Intel
EP3C16M164C7N

EP3C16M164C7N - Cyclone III FPGA, 15408 LE | Intel

The Intel EP3C16M164C7N is a Cyclone III field-programmable gate array with 15,408 logic elements, 92 I/O, and 504 Kb of block RAM in a 164-MBGA M164 package measuring 8 x 8 mm. It uses 65 nm CMOS technology, operates from a 1.2 V core supply with 2.5 V I/O, and is assigned speed grade 7 for commercial-temperature applications. A field-programmable gate array, or FPGA, is a programmable digital semiconductor used to implement logic functions, control systems, signal processing, and interface logic. An FPGA combines configurable logic blocks, programmable interconnects, memory resources, and input/output blocks on one integrated circuit. After configuration, the EP3C16M164C7N can execute parallel digital designs without the fixed function of a conventional application-specific integrated circuit. The Cyclone III device provides 15,408 logic elements, which the product listing also describes as 963 logic array blocks, plus 92 user I/O. Its 504 Kb block RAM supports buffering, data storage, and control logic that benefit from on-chip memory. The 164-MBGA package provides a compact surface-mount option for equipment where board area and interconnect density are important. The device is manufactured using 65 nm CMOS technology and separates its core and I/O supply requirements into 1.2 V and 2.5 V rails. Speed grade 7 identifies its performance class within the Cyclone III ordering system. The commercial temperature designation corresponds to a 0 °C to 85 °C junction-temperature range, making the device appropriate for commercial and industrial environments that remain within that limit. Typical design uses include industrial control systems, communications interfaces, embedded data acquisition, general-purpose digital logic, embedded storage control, and parallel signal processing. The combination of 15,408 logic elements, 92 I/O, and 504 Kb of block RAM makes the device useful for designs that require substantial configurable logic without moving to a larger FPGA family. Design planning should account for the M164 package, its 164-ball land pattern, separate core and I/O rails, configuration requirements, and pin-constrained user I/O. PCB design must follow the package ball map and power-decoupling guidance in the Intel Cyclone III handbook. Because this device is an older programmable-logic product, verify configuration device support, tool versions, and any last-time-buy considerations before starting a new production design. This page organizes the confirmed Cyclone III resource counts, package information, supply details, and same-package ordering alternatives into a practical engineering reference. It also distinguishes speed-grade and temperature-grade options, helping designers evaluate whether a lower or higher grade can be used without changing the PCB footprint.

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EP3C16M164C8N - 15408-Cell Cyclone III FPGA | Altera
EP3C16M164C8N

EP3C16M164C8N - 15408-Cell Cyclone III FPGA | Altera

Altera EP3C16M164C8N is a Cyclone III field-programmable gate array with 15,408 logic elements, 92 I/O, and a 164-TFBGA package. The device is manufactured on a 65 nm process and is associated with a 1.2 V core supply and a maximum clock frequency of 402 MHz. Its combination of programmable logic, embedded memory, and parallel I/O makes it suitable for digital control, interface, signal-processing, and embedded-system designs that require reconfigurable hardware. A field-programmable gate array is a semiconductor in which digital logic is configured after manufacture. An FPGA belongs to the programmable-logic hierarchy, where configurable logic elements, memory blocks, input/output resources, clock networks, and configuration interfaces form a flexible digital implementation platform. Compared with a fixed application-specific integrated circuit, an FPGA allows design revisions, field updates, and hardware customization without changing the printed circuit board. The EP3C16M164C8N provides 15,408 logic elements and 92 I/O in a compact 164-ball TFBGA package. Its 402 MHz maximum clock frequency provides useful timing headroom for control logic, protocol bridges, and parallel data-processing functions. The 92-I/O interface can support multiple external buses and peripheral connections, while the package keeps routing requirements within a dense, multilayer printed circuit board design. The device is based on 65 nm Cyclone III FPGA technology and operates from a 1.2 V core supply as identified for this device family. Configuration determines how the programmable logic, embedded memory, and I/O blocks are interconnected. Engineers must also account for the selected configuration scheme because package I/O resources can be assigned among user functions, dedicated configuration pins, clock inputs, and other dedicated functions. Typical applications include industrial control systems, communications infrastructure, test and measurement equipment, embedded video or image processing, motor and power-system controllers, and general-purpose digital prototyping. The FPGA can implement parallel algorithms, state machines, bus adapters, protocol converters, and custom interface logic, while its 92 I/O support external memories, transceivers, converters, and discrete digital components. The primary design consideration is the ball-grid footprint. A 164-TFBGA package requires a multilayer board with short, matched-routing escape paths, solid power distribution, and careful decoupling. Signal-integrity analysis is important for high-speed memory or external interfaces, and every unused configuration or power ball must follow the manufacturer’s package and board-layout requirements. Thermal performance should be checked against the actual clock, I/O, and core activity. This product page organizes the EP3C16M164C8N identification data, package characteristics, search-oriented technical questions, application guidance, and design cautions. It also distinguishes verified device facts from engineering fields that require confirmation with the manufacturer datasheet, helping engineers plan a board and determine whether a proposed substitution is truly pin-compatible before ordering samples.

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EP3C16Q240C8 - Cyclone III FPGA, 16K LE, 240-Pin PQFP | Intel
EP3C16Q240C8

EP3C16Q240C8 - Cyclone III FPGA, 16K LE, 240-Pin PQFP | Intel

The Intel (formerly Altera) EP3C16Q240C8 is a Cyclone III low-cost field-programmable gate array (FPGA) built on TSMC's 65 nm low-power process, offering 15,408 logic elements, 516,096 bits of embedded memory, and 160 user I/O pins in a 240-pin plastic QFP (240-BFQFP / PQFP-240) package with 0.5 mm pitch and 34.6 x 34.6 mm body. An FPGA (Field Programmable Gate Array) is a semiconductor device containing a matrix of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be reconfigured after manufacturing to implement arbitrary digital logic. FPGAs occupy a tier between fixed-function ASICs and microcontrollers: they offer hardware-level parallelism and deterministic timing without the per-unit mask cost of an ASIC, while providing far more logic capacity and I/O flexibility than a typical MCU. Cyclone III specifically targets cost-sensitive high-volume applications such as industrial control, video processing, and communications bridges. Key features include 15,408 logic elements arranged as 15408 CLBs, 516 kbits of embedded RAM, 56 embedded 18x18 multipliers, up to four PLLs for clock management, and 160 general-purpose user I/O pins supporting LVDS, LVTTL, LVCMOS, SSTL, and PCI signaling. The device operates from a 1.2 V core supply with separate VCCIO banks, supports up to 402 MHz internal operation, and is offered in commercial, industrial, and extended-temperature grades. The Cyclone III family is fabricated on a 60 nm low-power process node optimized for static and dynamic power reduction, delivering up to 50% lower power than the prior Cyclone II generation at the same performance. The architecture combines 4-input look-up tables (LUT4) with dedicated memory blocks (M9K), DSP blocks for arithmetic, and Coresight-based debug via JTAG. Designers typically use Quartus II / Quartus Prime to compile HDL into bitstreams that configure the SRAM-based logic at every power-up. Typical applications include industrial motor control and PLC interfaces, video format conversion and image processing pipelines, embedded display controllers, telecommunications line cards, USB and peripheral bridging, and cost-sensitive prototyping for ASIC replacement. The 240-pin QFP package supports hand-soldering and standard 1.0 mil trace/space PCB manufacturing, which simplifies low-volume prototypes and educational designs. When designing with this part, plan the power decoupling around the recommended 1.2 V core and VCCIO bank supplies, follow Altera's pin connection guidelines for unused and JTAG pins, and verify timing closure in Quartus before sign-off. The PQFP-240 footprint is non-trivial to rework, so first-spin prototypes should be carefully reviewed. This page synthesizes distributor pricing, lifecycle status, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

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EP3C16Q240C8N - Cyclone III FPGA 15K LEs PQFP-240 | Altera
EP3C16Q240C8N

EP3C16Q240C8N - Cyclone III FPGA 15K LEs PQFP-240 | Altera

The Altera EP3C16Q240C8N is a Cyclone III FPGA with 15,408 logic elements (LEs), 516,096 bits of embedded memory, and up to 160 user I/O pins, housed in a 240-pin fine-pitch Ball-Grid-Array-style QFP package (240-BFQFP / PQFP-240, 32x32 mm). It is fabricated in a low-cost 65-nm process and belongs to the commercial (C) temperature range with speed grade 8 (the most cost-effective speed bin in the family). A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of programmable logic blocks, routing resources, and embedded memory that designers configure in the field using HDL languages such as Verilog and VHDL. In the semiconductor hierarchy, the FPGA sits above fixed-function ASICs and ASSPs in flexibility, and the Cyclone III family targets the low-cost, low-power segment of that market. Key features of the EP3C16Q240C8N include 15,408 LEs organized as approximately 1,920 adaptive logic modules (ALMs), 516,096 bits (63 kbytes) of M9K embedded memory blocks, and up to 160 maximum user I/O including dedicated clock inputs. The M9K blocks support single- and dual-port operation with byte enables and initialization files, making FIFOs and line buffers easy to implement without external SRAM. Technically, the Cyclone III architecture uses 8-input fracturable look-up tables, a hierarchical multi-track interconnect, and a phase-locked-loop (PLL)-based clock network for on-chip frequency synthesis and jitter reduction. Configuration is supported through active serial (AS), passive serial (PS), and JTAG schemes, allowing standard EPCS serial configuration devices to load the bitstream at power-up. The Q240 package supports a maximum I/O count that may be reduced depending on the selected configuration scheme, per the Altera device package information data sheet. Typical applications include industrial motor-control and automation interfaces, video and image processing line cards, communications protocol bridging, and test/measurement glue logic. The 160-I/O budget and 65-nm low static power make it well suited to cost-sensitive volume products that do not need high-end transceivers. Design consideration: the PQFP-240 footprint is large and hand-solderable for prototypes, but its peripheral I/O ring limits signal counts versus BGA alternatives; plan I/O banking carefully to avoid mixing incompatible voltage standards on one bank. This page synthesizes verified distributor stock, drop-in same-package alternatives, pricing context, and practical design notes not found in the manufacturer datasheet.

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EP3C16U256C6 - 15,408 LEs, 256-LFBGA Cyclone III FPGA
EP3C16U256C6

EP3C16U256C6 - 15,408 LEs, 256-LFBGA Cyclone III FPGA

The Altera EP3C16U256C6 is a Cyclone III field-programmable gate array (FPGA) containing 15,408 logic elements, 168 I/O, and 516,096 bits of embedded memory in a 256-ball low-profile FBGA package. The device is positioned for general-purpose programmable logic, embedded control, communications, industrial automation, and test-equipment designs that require a reusable hardware architecture and parallel programmable I/O. Distributor listings identify it as the EP3C16U256C6 Cyclone III FPGA and provide current sourcing information as of 2026-10-30. A field-programmable gate array is a semiconductor whose digital logic, interconnect, and I/O behavior can be configured after fabrication. The FPGA category belongs to programmable-logic devices and sits within the broader semiconductor and embedded-systems hierarchy. Unlike a fixed-function application-specific integrated circuit, an FPGA allows designers to implement parallel interfaces, state machines, protocol controllers, signal processing, and control logic in one configurable device, potentially reducing board count and shortening product-development cycles. The verified device data identifies three headline characteristics: 15,408 logic elements, 168 I/O, and 516,096 bits of memory. These resources support moderately complex parallel designs and make the EP3C16U256C6 relevant to control systems, data-acquisition equipment, communications interfaces, industrial controllers, and embedded protocol bridges. Its 256-LFBGA package provides a high pin count in a compact surface-mount footprint, although the dense ball pitch demands careful PCB layout, inspection, and assembly planning. The Cyclone III architecture is based on configurable logic elements connected by programmable routing resources. Each logic element supports combinational and registered Boolean functions, while dedicated input and output paths connect the programmable core to package balls. The listed memory quantity is 516,096 bits, equivalent to 64,512 bytes when interpreted as binary memory. This embedded storage can support buffers, lookup tables, packet queues, and other on-chip data structures without relying entirely on external RAM. Typical uses include industrial automation and factory control, communications and network-interface equipment, instrumentation, embedded control, and general-purpose digital prototyping. The 168 available I/O are particularly useful when a design includes multiple parallel buses, status signals, capture inputs, or differential interface groups. Actual design suitability still depends on the required I/O standard, logic utilization, memory demand, timing closure, clocking architecture, power budget, and device programming method. Designers should treat BGA assembly and signal integrity as first-order concerns. The 256-ball package requires an HDI-capable PCB stack-up, exact land-pattern geometry, controlled impedance routing, and assembly-process qualification. Power rails should be decoupled close to the device, clock and high-speed nets should use short return paths, and unused balls should follow the manufacturer’s prescribed connectivity. Toolchain and board-support packages must also be checked against the exact Cyclone III device before committing the design. This page consolidates the verified distributor identity, package, logic-resource, I/O, memory, pricing, and sourcing data into an engineering-oriented product reference. It also distinguishes verified facts from unavailable electrical details and identifies same-brand, same-family drop-in candidates that require final validation against timing, temperature, lifecycle, and assembly requirements.

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EP3C16U256C7 - Cyclone III FPGA, 15408 LEs | Intel/Altera
EP3C16U256C7

EP3C16U256C7 - Cyclone III FPGA, 15408 LEs | Intel/Altera

The Intel/Altera EP3C16U256C7 is a Cyclone III field-programmable gate array with 15,408 logic elements, 516,096 RAM bits, and 168 user I/Os in a 256-LFBGA package. It combines programmable logic resources with 516,096 bits of embedded RAM in a low-cost FPGA device intended for control, interface, communications, and embedded-processing systems. An FPGA is a programmable-logic semiconductor whose internal lookup tables, registers, interconnect, and memory blocks can be configured after manufacture. Within the semiconductor hierarchy, this device belongs to the Cyclone III family of FPGAs and CPLDs, positioned below higher-density programmable-logic devices for cost-conscious designs that still need substantial parallel logic, on-chip memory, and flexible I/O allocation. The verified device data identifies 15,408 logic elements, 516,096 RAM bits, and 168 I/Os. Cross-reference information associates the device with the 65 nm Cyclone III process and lists a maximum clock frequency of 437.5 MHz, while one comparison listing reports a 1.2 V core supply. These figures make the EP3C16U256C7 suitable for parallel data acquisition, industrial control, protocol bridging, and general-purpose embedded logic rather than high-performance processor systems. The EP3C16U256C7 uses a 256-LFBGA package, making dense board routing and careful via-in-pad or microvia considerations important in multilayer PCB construction. Its 168 user I/Os provide connectivity for external memory, communication transceivers, sensors, and digital control signals. Configuration, clocking, and power-distribution details should be taken directly from the complete manufacturer device handbook and pin-connection guidelines. Typical uses include industrial automation modules, data-acquisition front ends, communication gateways, LED and display control, sensor aggregation, and embedded protocol converters. The 516,096 RAM bits can buffer sampled data or implement dual-port storage, while the 15,408 logic elements support parallel pipelines, state machines, protocol engines, and control logic. When designing the power system, budget for the 1.2 V core rail as well as bank-dependent I/O supplies, and separate high-current and sensitive routes to reduce coupling. Verify ball assignments, decoupling requirements, configuration-scheme support, and maximum I/O standards against the complete Cyclone III documentation before layout release. This page consolidates current distributor availability, sourced pricing, verified resource counts, and same-family replacement guidance into one engineering-focused view. It also distinguishes exact drop-in options from lower-speed or industrial-grade variants whose qualification and timing margin must be reviewed before schematic approval.

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EP3C16U256C7N - 15,408-Cell Cyclone III FPGA | Intel
EP3C16U256C7N

EP3C16U256C7N - 15,408-Cell Cyclone III FPGA | Intel

The Intel EP3C16U256C7N is a Cyclone III field-programmable gate array with 15,408 logic elements, 516,096 memory bits, a maximum operating frequency of 472.5 MHz, and a 256-ball BGA package. The universal-device designation and industrial 0°C to +85°C temperature range suit programmable control, signal-processing, communications, and embedded-system designs. An FPGA is a programmable logic device that combines configurable logic blocks, embedded memory, input/output resources, and programmable interconnect fabric. Within the semiconductor hierarchy, the EP3C16U256C7N is a field-programmable gate array, or FPGA, within the Cyclone III family of programmable logic devices. Its parallel architecture allows hardware functions to execute concurrently without relying on sequential software instructions. The device provides 168 logic elements according to its catalog listing, 15,408 logic cells, and 516,096 bits of embedded memory according to the manufacturer-related product information. A maximum frequency of 472.5 MHz supports clocked control logic, interface conditioning, and signal-processing pipelines. The 256-ball package uses a 0.80 mm ball pitch and occupies approximately 14 mm by 14 mm, enabling dense board integration without changing the functional architecture. The Cyclone III architecture is manufactured on a 65 nm CMOS process and operates from a 1.2 V core supply. Its universal-device suffix identifies a device intended for broader system-clock and I/O flexibility than speed-specific variants. Exact pin functions, I/O standards, bank voltage limits, configuration requirements, and recommended decoupling should be assigned from the manufacturer pin-description table and electrical-characteristics documentation. Typical applications include industrial control modules, communications interfaces, video and image-processing pipelines, sensor acquisition, and compact embedded systems. In these systems, parallel logic can implement protocol conversion, filtering, data formatting, and real-time control in hardware. The 472.5 MHz device class is particularly appropriate where predictable parallel processing and dedicated I/O resources matter more than software flexibility alone. Board design should preserve the recommended ball pattern, power and ground distribution, and high-speed routing geometry. Configuration signals, clock inputs, decoupling networks, and exposed thermal requirements must be checked against the exact package drawing before layout release. Because this is a large BGA device, assembly inspection and thermal-path planning are as important as logical design. This page combines package, capacity, speed, and temperature information with practical selection guidance, application analysis, and verified drop-in alternatives. It is intended to help engineers identify whether the EP3C16U256C7N matches the required logic density, memory capacity, package, and operating environment before beginning PCB implementation.

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EP3C16U256C8 - 15,408-LC Cyclone III FPGA | Intel
EP3C16U256C8

EP3C16U256C8 - 15,408-LC Cyclone III FPGA | Intel

The Intel EP3C16U256C8 is a Cyclone III field-programmable gate array containing 15,408 logic elements, 963 logic array blocks, 516,096 embedded memory bits, and 168 I/O in a 256-ball UFBGA package. The device is identified by the commercial temperature grade, 14 x 14 mm package, 2.20 mm height, and 0.80 mm ball pitch. An FPGA is a programmable semiconductor whose logic, interconnect, and memory resources can be configured after manufacture. Within the semiconductor hierarchy, an FPGA is a programmable logic device, combining digital logic blocks, embedded block RAM, programmable interconnects, and user I/O. It differs from a fixed-function application-specific integrated circuit because its behavior is defined by a configuration bitstream rather than permanent circuitry. The Cyclone III architecture provides 15,408 logic elements organized into 963 logic array blocks, together with 516,096 bits of embedded memory. The device provides 168 I/O, as listed by DigiKey, and is available in the compact 256-ball package described by the verified distributor data. These resources support parallel digital logic, control, data acquisition, signal processing, embedded-memory, and interface-intensive designs. The EP3C16U256C8 belongs to the EP3C16 device family, whose 16 designation corresponds to the 15,408 logic elements and 963 logic array blocks reported by the distributor sources. Its combination of a 256-ball package and 168 available I/O makes it suitable for designs requiring moderate logic density, substantial embedded memory, and a comparatively high pin count in a compact board footprint. Typical uses include industrial control, data-acquisition systems, communications equipment, embedded signal-processing modules, video and image pipelines, and general-purpose programmable-logic prototypes. Because it uses nonvolatile configuration memory, the device can retain its programmed logic across power cycles, allowing autonomous operation without an external configuration controller once the configuration image is stored. Board design must account for power sequencing, decoupling, signal integrity, thermal performance, and configuration-data integrity. The BGA-256 footprint requires careful escape routing, while high-speed interfaces demand controlled impedance and return paths. Designers should also confirm the exact power, temperature, and pinout requirements against the manufacturer documentation before layout or substitution. This page consolidates the verified distributor specifications, source links, pricing evidence, package data, same-family replacement candidates, and practical selection guidance for engineers evaluating the Intel EP3C16U256C8.

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EP3C16U256C8N - Cyclone III FPGA, 15K LE, 256-UBGA | Altera / Intel
EP3C16U256C8N

EP3C16U256C8N - Cyclone III FPGA, 15K LE, 256-UBGA | Altera / Intel

The Intel (formerly Altera) EP3C16U256C8N is a low-power Cyclone III Field-Programmable Gate Array (FPGA) built on a 65 nm low-k dielectric process, offering 15,408 logic elements, 516,096 bits of embedded RAM, and 168 user I/Os in a 256-ball Ultra FineLine BGA package (Ux256). The 'U256' suffix denotes the plastic Ultra FineLine BGA, and the 'C8' speed grade corresponds to an 8 ns commercial-grade timing classification with -40 °C to +85 °C operating junction range. A Cyclone III FPGA is a SRAM-based programmable logic device that belongs to the family of low-cost, low-power FPGAs targeting high-volume, power-sensitive designs. It sits in the broader hierarchy of programmable logic devices (PLD), positioned between CPLDs and high-performance FPGAs such as Cyclone V / Stratix. Its low static and dynamic power consumption makes it attractive for portable, industrial, and consumer applications that previously used ASICs or ASSPs. Key features of the EP3C16U256C8N include up to 168 single-ended user I/O pins (multi-voltage I/O standards including LVDS, SSTL, LVCMOS, and LVTTL), 56 embedded 18 x 18 multipliers for DSP, four PLLs per device, and 56 M9K memory blocks. The 1.2 V core (VCCINT) with separate VCCIO bank supplies allows mixed-voltage interfacing without external level shifters. Configuration is supported via JTAG, Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP) modes. Typical applications span industrial motor control, video processing pipelines, automotive infotainment prototypes, communication bridges, and consumer display controllers. The Cyclone III architecture is also a popular education platform due to its low cost and Quartus II / Quartus Prime tool support. When designing with this device, pay close attention to the BGA fan-out: the 256-ball U256 package requires microvia or via-in-pad PCB technology. Decoupling must include 0.1 µF caps per VCC pin and bulk caps on each supply rail. Use the Altera / Intel Quartus Prime software (free Lite edition) for synthesis, place-and-route, and configuration file generation. This page synthesizes distributor pricing, drop-in same-brand alternatives, and practical PCB design notes that go beyond what is printed in the manufacturer datasheet.

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EP3C16U256I7 - 16K LEs, 168 I/O FPGA | Altera
EP3C16U256I7

EP3C16U256I7 - 16K LEs, 168 I/O FPGA | Altera

The Altera EP3C16U256I7 is a Cyclone III field-programmable gate array with 16,320 logic elements, 168 I/O pins, and 516,096 RAM bits in a 256-LFBGA surface-mount package. The industrial-temperature device supports programmable logic for embedded control, signal processing, communications, and industrial automation designs. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, memory, and interconnect are configured after fabrication. An FPGA belongs to the programmable-logic hierarchy, where it combines configurable logic elements, block RAM, general-purpose I/O, clocking, and programmable routing. This implementation provides a compact alternative to combining multiple discrete logic devices while retaining design flexibility and field-updatable configurations. The verified device data identifies 16,320 logic elements, 516,096 RAM bits, 168 I/O pins, a 256-LFBGA package, and an industrial temperature grade. The 16,320 logic-element count provides substantial parallel processing capacity for control logic, interface bridging, protocol handling, and moderate-complexity digital signal processing. The 516,096 RAM bits add configurable storage for buffers, packet data, state machines, and lookup data. The Cyclone III architecture integrates programmable logic elements, embedded memory resources, and general-purpose input/output structures into one integrated device. These resources can be combined for parallel datapaths, finite-state machines, bus interfaces, and control engines. Because configuration and interconnect are programmable, engineers can adapt the same hardware platform across multiple product variants without changing the physical FPGA package. Typical uses include industrial factory controllers, communication equipment, test systems, embedded instrumentation, and network-interface subsystems. In an industrial controller, the 168 available I/O support connections among sensors, actuators, field buses, and status indicators. In a communication design, the logic elements can implement protocol framing while the RAM resources support packet buffering and temporary data storage. The 256-LFBGA package requires careful PCB layout because its 256 ball terminals provide limited escape routing and demand short, controlled-length connections to power, ground, configuration, clock, and user I/O. Adequate via access, solid plane connectivity, decoupling, and assembly-process control are essential for reliable implementation. Configuration storage and programming-device compatibility should also be reviewed before committing the design to production. This page combines verified distributor pricing and availability information with the device's reported FPGA resources, package details, application analysis, and a strict same-package replacement comparison. It also distinguishes confirmed drop-in candidates from family variants and flags technical details that require confirmation from the manufacturer datasheet.

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EP3C16U484C6 - Cyclone III FPGA, 15,408 Logic Cells | Altera
EP3C16U484C6

EP3C16U484C6 - Cyclone III FPGA, 15,408 Logic Cells | Altera

The Altera EP3C16U484C6 is a Cyclone III field-programmable gate array with 15,408 logic elements, 346 I/O, and a 484-ball FBGA package. The device provides 516,096 embedded RAM bits and is specified for industrial temperature operation from -40°C to +125°C. Its surface-mount FBGA construction supports compact embedded, communications, industrial control, and test-equipment designs where programmable logic is needed alongside multiple external interfaces. A field-programmable gate array is a digital semiconductor whose configurable logic blocks, memory resources, and programmable I/O form the physical foundation of an FPGA. FPGAs sit within programmable-logic devices and broader digital semiconductors. Unlike fixed-function application-specific integrated circuits, an FPGA can be reconfigured after manufacture to implement control logic, interfaces, protocol handling, signal conditioning, and parallel data-processing functions. The Cyclone III family combines 15,408 logic elements with 346 I/O in this device. The supplied distributor data identifies 516,096 bits of embedded memory and an operating-temperature range of -40°C to +125°C. Its lead-free 484-FBGA package exposes a high pin count while keeping the assembled device compact. The package is suitable for multilayer PCB construction using the manufacturer-specified ball pattern, power architecture, and decoupling requirements. The -40°C to +125°C industrial temperature grade distinguishes this C6 device from variants identified with the C8 suffix. The C6 designation indicates the device’s speed-grade and temperature-positioning family within the ordering system, but the supplied data does not provide a complete numerical operating-frequency table. Consequently, clocking and timing decisions must be checked against the relevant Cyclone III device handbook and the system’s external interface requirements. Typical uses include industrial automation, industrial networking, data-acquisition systems, communications equipment, and embedded control platforms. With 346 I/O, the FPGA can connect parallel sensors, converters, memory devices, transceivers, and control logic while programmable logic handles protocol conversion, filtering, timing, and system supervision. Its 516,096 embedded-memory bits support buffering, packet handling, and data paths that do not require external RAM. The primary design constraint is the 484-ball FBGA footprint. Layout should preserve continuous ground and power planes, place decoupling capacitors close to the supply balls, route high-speed signals according to the Cyclone III guidance, and follow the manufacturer’s ball-assignment and high-speed layout requirements. Because the supplied web excerpts do not provide a complete pinout, power rails, decoupling values, or differential I/O assignments, those details must be confirmed from the official documentation before layout release. This product page combines verified distributor specifications, current availability information, same-family migration options, and practical selection guidance. It also distinguishes verified facts from data gaps, helping engineers evaluate procurement, PCB compatibility, temperature grade, and FPGA resource requirements without relying on unverified assumptions.

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