EP3C10M164C7N - 10,320-LC Cyclone III FPGA | Intel
부품 번호: EP3C10M164C7N ✓ 활성EP3C10M164C7N 개요
A field-programmable gate array, or FPGA, is a reconfigurable semiconductor whose logic blocks and programmable interconnect can be configured after manufacture. FPGAs sit between fixed-function logic devices and software-programmable processors in the broader digital-semiconductor hierarchy. Unlike an application-specific integrated circuit, an FPGA can implement multiple interface protocols, control functions, and data-processing pipelines in one device while retaining the ability to update its configuration during product maintenance.
The EP3C10M164C7N provides 10,320 logic elements and 106 I/O pins, making it suitable for designs requiring substantial parallel logic without the resource level of a large FPGA. Its 437.5 MHz maximum switching frequency supports clocked control, communication, and signal-processing functions. The 423,936 embedded-memory bits add on-chip storage for buffers, lookup tables, state machines, and temporary data paths, reducing dependence on external memory for modest workloads.
The 164-TFBGA package supports a dense, board-level FPGA implementation with 164 package balls. Because ball-grid packages expose connections on multiple sides and may include thermal and power-distribution balls, designers should follow the manufacturer's package and device-pin documentation when assigning power, ground, configuration, clock, and user I/O connections. Exact ball names and configuration requirements should be taken directly from the manufacturer pin-assignment tables.
Typical applications include industrial control modules, communications interface adapters, instrumentation control, embedded test equipment, and industrial networking. The 106 available I/O positions are particularly relevant to parallel buses, digital control interfaces, and multi-channel acquisition systems. Designers should also account for configuration flash or another supported configuration source and verify board-level voltage compatibility before committing the FPGA to a design.
A key design consideration is resource balancing. The device combines 10,320 logic elements with 423,936 embedded-memory bits, so a design that consumes most available memory may still lack logic capacity, while a logic-heavy design may require external memory. Timing closure should be evaluated with the intended clock, I/O standards, and device speed grade rather than from the maximum frequency alone.
This product page combines the exact orderable MPN, device characteristics, package information, sourcing guidance, and cross-reference review into an engineering-oriented resource. It also highlights where replacement decisions require direct comparison of package balls, speed-grade suffix, configuration behavior, and design resource usage.
드롭인 대체품: EP3C10M164C7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3C10M164C7N (동일 폼 팩터 및 풋프린트) — 차이점: Embedded Memory, Package, Process Technology.
EP3C10M164C8N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP3C10M164C7N 최대 정격 & 전기적 특성
| Device Type | Cyclone III Field Programmable Gate Array (FPGA) |
| Logic Elements | 10,320 cells |
| Embedded Memory | 423,936 bits |
| User I/O | 106 pins |
| Maximum Switching Frequency | 437.5 MHz |
| Process Technology | 65 nm |
| Core Supply Voltage | 1.2 V |
| 패키지 | 164-TFBGA |
| Device Family | Cyclone III |
EP3C10M164C7N 164-tfbga 핀 구성 가이드
EP3C10M164C7N(164-tfbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3C10M164C7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3C10M164C7N 적합 용도: 6 애플리케이션s: Industrial Control Logic, Communications Interface Adapter, Data Acquisition Front End, Programmable Test and Measurement, Network Edge and Protocol Gateway, Custom Embedded Interface Controller.
Industrial Control Logic
The EP3C10M164C7N fits industrial control modules that require parallel digital inputs, sequencing logic, and moderate local data handling. Its 106 I/O positions can support control signals and field-bus interfaces, while 10,320 logic elements provide capacity for state machines, interlocks, timing logic, and supervisory functions. The 437.5 MHz maximum switching frequency supports clocked processing where required. Designers should allocate I/O standards, verify clock-domain requirements, and preserve timing margin when compiling control paths. Because manufacturing lifecycle and environmental requirements matter in industrial equipment, confirm the exact temperature grade, supply configuration, and long-term availability before a production release.
Communications Interface Adapter
The EP3C10M164C7N is suitable for compact communications adapters that translate between a host processor and one or more peripheral interfaces. Its 106 user I/O positions allow several parallel buses or serial transceiver interfaces to share one programmable fabric, and 423,936 embedded-memory bits can support packet buffering, command queues, and interface state tracking. The 10,320 logic elements provide parallel lanes, framing logic, CRC processing, and protocol state machines. For robust performance, use the device timing report to constrain clocks and external interfaces, and verify the electrical characteristics of every connected transceiver rather than assuming compatibility from the FPGA family name.
Data Acquisition Front End
The EP3C10M164C7N can implement digital control and parallel data movement around external converters in a data-acquisition front end. With 106 I/O positions, the device can support multiple converter data buses, capture control, channel enables, and interface timing, while 10,320 logic elements can implement filtering, decimation, or formatting pipelines. Its maximum switching frequency of 437.5 MHz provides a useful ceiling for parallel datapaths, although practical acquisition rates remain limited by external converter timing, input standards, and system clocking. Use registered I/O paths, synchronize asynchronous inputs where required, and complete timing analysis for the complete converter-to-processing chain.
Programmable Test and Measurement
The EP3C10M164C7N fits compact test and measurement products requiring configurable stimulus generation, status sequencing, and parallel instrument interfaces. Its 10,320 logic elements can implement counters, timing patterns, result processing, and control sequences, while 423,936 embedded-memory bits can hold test vectors or short capture buffers. The 106 I/O positions allow connection to multiple measurement peripherals and backplane signals. For instrumentation, isolate clock domains carefully, account for input threshold and slew requirements, and avoid routing sensitive analog functions directly through the FPGA. Configuration persistence and field update requirements should also be addressed so an instrument can retain or reload its bitstream as intended.
Network Edge and Protocol Gateway
The EP3C10M164C7N can support edge devices that terminate one network-oriented interface and translate it into a local parallel or serial interface. The 106 I/O positions and 10,320 logic elements permit header parsing, flow control, framing, checksums, and local arbitration, while the 423,936 embedded-memory bits provide buffer space for short traffic bursts. Its 437.5 MHz maximum switching frequency supports moderate parallel processing rates. A gateway design should establish clock domains for each external interface, use appropriate I/O standards, and include reset and configuration behavior in system verification. Resource utilization and timing margins should be reviewed with realistic traffic rather than peak benchmark activity.
Custom Embedded Interface Controller
The EP3C10M164C7N is suitable for a dedicated interface controller that replaces several fixed-function glue devices with one configurable FPGA. Its 10,320 logic elements can implement multiple command decoders, FIFOs, protocol converters, and status monitors, while 423,936 embedded-memory bits support buffering between domains with different transfer rates. The 106 I/O positions allow several external peripherals to remain connected without a large external bridge. To maximize reliability, constrain each interface independently, register slow external signals, synchronize asynchronous controls, and verify reset behavior across every supported operating mode. A prototype should also confirm that configuration storage and power sequencing fit the complete board design.
엔지니어링 참조 데이터: EP3C10M164C7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3C10M164C8N |
|---|---|---|
| Brand | Intel | Altera |
| Package | 164-TFBGA | 164-TFBGA |
| Device Family | Cyclone III | Cyclone III |
주요 차별점
- Established low-density Cyclone III resource balance (vs EP3C10M164C8N)
- 106 user I/O positions in a 164-TFBGA package (vs EP3C10M164C8N)
- 437.5 MHz maximum switching frequency (vs EP3C10M164C8N)
설계 노트
Treat the 164-TFBGA layout as a complete power-and-ground assignment rather than a 164-user-I/O package. Place the manufacturer-specified bypass capacitors adjacent to their relevant supply balls, use short ground returns, and preserve continuous return paths beneath the device. Follow the manufacturer package documentation for ball pitches, solder-mask design, via-in-pad use, and reflow profiles. Validate escape routing for clocks, configuration signals, and high-speed interfaces using the actual board stack-up.
Budget the 1.2 V core rail for dynamic consumption determined by the design's logic activity, I/O loading, and clocking. Estimated: core dissipation equals 1.2 V multiplied by the measured core current; total board dissipation also includes external I/O and configuration circuitry. Use a supply with suitable transient response and sequence the rails according to the manufacturer guidelines. Do not derive thermal margin from maximum switching frequency alone, since a lightly used clocked design and a fully utilized design can have substantially different activity factors.
Constrain every clock and high-speed interface path in the FPGA timing tool, and use the device-specific timing reports rather than the 437.5 MHz headline frequency as a guaranteed system rate. Synchronize asynchronous control inputs, register boundary crossings, and constrain external interface timing against the actual peripheral devices. Pay particular attention to output-drive strength, input threshold, slew rate, and I/O-standard compatibility, because a pin may be present on the package without supporting the electrical standard assumed by the design.
Do not substitute EP3C10M164C8N for EP3C10M164C7N solely because the base family, 164-TFBGA package, and I/O count appear similar. Confirm the meaning of the speed-grade suffix, electrical limits, temperature rating, configuration behavior, and every affected ball assignment in the manufacturer documentation. Also avoid designing to the complete package-ball count as if all balls were user I/O; power, ground, clock, configuration, and dedicated balls reduce the 106 user-I/O figure.
규정 준수 정보
The manufacturer documentation cited for this product does not explicitly establish RoHS, REACH, lead-free, halogen-free, or conflict-minerals status. The part is not presented as an AEC-Q100-qualified automotive device.
