10AX115R2F40I1SG - Arria 10 GX FPGA, 1.15M LEs, 1517-BGA | Intel
부품 번호: 10AX115R2F40I1SG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4850 | $4,850.00 |
| 10 | $4520 | $45,200.00 |
| 100 | $4105 | $410,500.00 |
| 500 | $3780 | $1,890,000.00 |
| 1,000 | $3490 | $3,490,000.00 |
10AX115R2F40I1SG 개요
An FPGA is a semiconductor device whose digital logic, interconnects, I/O standards, and even analog subsystems can be reconfigured post-manufacture via a hardware description language (HDL) bitstream. In the broader taxonomy, FPGAs sit between fixed-function ASICs and software-driven processors: ASICs deliver the lowest unit cost at high volumes but cannot be updated, while processors offer flexibility at the cost of deterministic latency and per-cycle throughput. FPGAs bridge these extremes by delivering ASIC-class parallel performance with firmware-level reconfigurability, which is why they dominate in low-latency networking, prototype ASICs, and DSP-heavy pipelines. The Arria 10 family specifically targets mid-range applications where Stratix 10 performance is overkill and Cyclone V/10 cost is too restrictive.
Key features of the 10AX115R2F40I1SG include the 20 nm monolithic die with embedded hard IP for PCIe Gen3 x8, 10 Gbps Ethernet MACs, Interlaken, and external memory interfaces (DDR4, QDR-IV, RLDRAM3). The F40 1517-ball package supports 342 general-purpose I/Os and exposes 12.5 Gbps / 14.1 Gbps multi-rate transceivers depending on speed grade, plus hardened floating-point operators that consume roughly 1.5x fewer logic elements than equivalent soft implementations.
The architecture combines a core fabric of adaptive logic modules (ALMs) with 1,150K LEs and 2,014 18x19 variable-precision multipliers. Eight fractional PLLs and a precision clock network feed the core, transceivers, and external memory controllers. Hard memory controllers with ECC simplify DDR4-2400 implementation, and 3D-stacked silicon interposers deliver the high transceiver count without the signal-integrity penalties of organic packages.
Typical applications for the 10AX115R2F40I1SG span 4K broadcast video processing, radar and electronic-warfare front ends, 100G/400G optical transport, 4G/5G baseband prototyping, and high-end medical imaging. The 'I1' suffix denotes an industrial temperature grade (–40 °C to +100 °C) and the R2 designation marks transceiver speed binning in the second tier, while the F40 package provides the full transceivers and I/O count. Engineers selecting this part typically need more DSP bandwidth than Arria V GZ but want a power/performance sweet spot between Stratix 10 and Cyclone 10 GX.
When laying out a board for this device, plan 1 oz copper at minimum, a 12-layer stack-up for the transceiver channels, and a dedicated 0.9 V core supply capable of sustaining ~30 A during configuration bursts. Add a JTAG header for in-system programming, follow Intel's EMI and decoupling guidelines for F40, and confirm thermal solution sizing against the -I1 industrial ambient of 100 °C. Quartus Prime provides pin-out, power, and timing-closed reference designs to shorten integration.
This page synthesizes distributor pricing, datasheet pin characteristics, same-family drop-in alternatives from the Arria 10 portfolio, and practical design notes that are not consolidated in the official datasheet, giving procurement and design engineers a single source for both selection and sourcing decisions.
드롭인 대체품: 10AX115R2F40I1SG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AX115R2F40I1SG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, DSP Blocks, PCIe Hard IP, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AX115R1F40I1SG
✅ 드롭인✓ 재고 있음
$7232.71 / 개
데이터시트 보기 →10AX115R2F40E2SG
✅ 드롭인✓ 재고 있음
$5410 / 개
데이터시트 보기 →10AX115R2F40E1SG
✅ 드롭인✓ 재고 있음
$6875 / 개
데이터시트 보기 →10AX090R2F40I1SG
✅ 드롭인✓ 재고 있음
$3720 / 개
데이터시트 보기 →10AX115N2F40I1SG
✅ 드롭인✓ 재고 있음
$3720 / 개
데이터시트 보기 →10AX115R2F40I1SG 최대 정격 & 전기적 특성
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory | 68,857,856 bits (68.86 Mbit) |
| DSP Blocks | 1,518 (variable-precision, hardened FP) |
| 18x19 Multipliers | 2,014 |
| User I/O Count | 342 |
| Transceiver Speed | Up to 14.1 Gbps (chip-dependent) |
| Memory Interfaces | DDR4, QDR-IV, RLDRAM3 (hard controllers) |
| PCIe Hard IP | PCIe Gen3 x8 |
| Process Node | 20 nm TSMC |
| Core Voltage | 0.9 V |
| 패키지 | 1517-ball FCBGA (F40) |
| Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | I1 (industrial, fastest) |
10AX115R2F40I1SG 1517-ball fcbga (f40) 핀 구성 가이드
10AX115R2F40I1SG(1517-ball fcbga (f40) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AX115R2F40I1SG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AX115R2F40I1SG 적합 용도: 7 애플리케이션s: 4K Broadcast Video Processing, 100G/400G Optical Transport Networking, Radar and Electronic Warfare Signal Processing, 5G Baseband and Massive-MIMO Prototyping, Medical Imaging and Diagnostics, ASIC Prototyping and Emulation, Industrial Machine Vision.
4K Broadcast Video Processing
The 10AX115R2F40I1SG fits 4K broadcast workflows because its 1,150,000 logic elements and 1,518 variable-precision DSP blocks can sustain 4:4:4 60p HEVC encoding/decoding and chroma resampling in a single device. The 68.86 Mbit embedded memory pool (more than 60 MB on-die) absorbs multiple lines of 4K frame buffers, eliminating external SRAM and shrinking the bill of materials. Hardened PCIe Gen3 x8 links to host CPUs at 8 GT/s, while the F40 BGA exposes 342 user I/Os for SDI, HDMI, and DisplayPort bridging. Quartus reference designs for SMPTE 2022 and ST 2059 timing shorten the path to a broadcast-grade prototype.
추천
100G/400G Optical Transport Networking
For 100G and 400G optical line cards, the 10AX115R2F40I1SG combines up to 24 transceivers at 14.1 Gbps to drive OTU4 and 100GbE client interfaces directly, while the hardened Interlaken and 10G Ethernet MACs remove soft-IP overhead. Forward-error-correction (FEC) cores consume only a fraction of the 1,518 DSP blocks, leaving headroom for traffic management and OAM processing. The DDR4 controller with ECC supports 2,400 MT/s line rates, sufficient for 400G packet buffering with deep queue depths. Industrial-grade silicon tolerates the 70C ambient typical of telecom chassis without throttling.
추천
Radar and Electronic Warfare Signal Processing
Radar and EW systems favor the 10AX115R2F40I1SG because each variable-precision DSP block can be configured as two 18x19 multipliers or one 27x27 multiplier, simplifying pulse compression, MTI filtering, and DBF beamforming. The 14.1 Gbps transceivers accept multi-channel ADC outputs from AFE7422 or similar converters without external retiming. Floating-point operators implemented in the hardened DSP fabric run 1.5x more efficiently than equivalent soft logic, which translates directly to lower power at the same FFT throughput. The 1517-ball FCBGA also supports the ruggedized underfill required by MIL-STD-810 vibration profiles.
추천
5G Baseband and Massive-MIMO Prototyping
5G baseband and massive-MIMO prototyping benefit from the 1,150K logic elements and 1,518 DSP blocks of the 10AX115R2F40I1SG, which can implement LDPC/Polar encoders, 64x64 MIMO detectors, and channel-state-information processors on a single chip. Hardened CPRI and JESD204B/C IP blocks interface directly with RRH radio units at 9.8 Gbps, while the PCIe Gen3 x8 link backhauls processed data to the host CPU. Industrial temperature grade I1 supports the 100C junction that outdoor small-cell enclosures can impose in summer. Quartus Prime DSP Builder accelerates MATLAB-to-bitstream development.
추천
Medical Imaging and Diagnostics
Medical imaging platforms such as CT, MRI, and ultrasound use the 10AX115R2F40I1SG to execute back-projection and beamforming pipelines at deterministic latency. The 68.86 Mbit embedded memory holds projection slices without external SRAM, reducing PCB area in space-constrained cart-based systems. Floating-point DSP blocks handle iterative reconstruction kernels 1.5x more efficiently than soft implementations, which keeps thermal output low for IEC 60601 patient-contact temperature limits. Industrial temperature grade (-40C to +100C) supports the thermal envelope of MRI bore rooms and portable ultrasound carts.
추천
ASIC Prototyping and Emulation
Engineers prototyping ASICs target the 10AX115R2F40I1SG because the 1.15M LE fabric can map mid-complexity SoCs for pre-silicon software bring-up. Multiple FPGAs can be chained over 14.1 Gbps transceivers to expand capacity for larger designs, using the hardened PCIe Gen3 x8 port as the host bridge. Industrial-grade silicon lets validation labs run continuous stress at elevated temperatures without derating the timing closure. Quartus Prime TimeQuest sign-off delivers ASIC-class static timing reports, accelerating firmware development ahead of tape-out.
추천
Industrial Machine Vision
Industrial machine vision lines use the 10AX115R2F40I1SG to run CNN-based defect detection and 2D/3D object classification at line rates above 60 fps. The 1,518 DSP blocks accelerate convolutional kernels, while 14.1 Gbps transceivers aggregate multiple 5 MPixel camera streams through FPD-Link III or CoaXPress interfaces. Industrial temperature grade I1 tolerates the 50C ambient typical of factory floors without forced-air cooling. The 342 I/Os handle GPIO for PLC triggers, lighting controllers, and encoder feedback without external I/O expanders.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AX115R2F40I1SG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AX115R1F40I1SG | 10AX115R2F40E2SG | 10AX115R2F40E1SG | 10AX090R2F40I1SG | 10AX115N2F40I1SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-ball FCBGA (F40) | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 900,000 (-22%) | 1,150,000 |
| DSP Blocks | 1,518 | 1,518 | 1,518 | 1,518 | ~1,200 (-21%) | 1,518 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Extended | Extended | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Transceiver Speed Bin | R2 (up to 14.1 Gbps) | R1 (lower) | R2 (up to 14.1 Gbps) | R2 (up to 14.1 Gbps) | R2 (up to 14.1 Gbps) | R2 GT variant (no transceivers) |
| Embedded Memory | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | ~53 Mbit (-23%) | 68,857,856 bits |
| User I/Os | 342 | 342 | 342 | 342 | 342 | 342 |
| Process Node | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
주요 차별점
- Highest-density Arria 10 GX option in F40 (vs 10AX090R2F40I1SG)
- Industrial temperature grade with fastest I1 bin (vs 10AX115R2F40E2SG)
- Full transceiver complement in F40 (vs 10AX115N2F40I1SG)
설계 노트
Estimated: at the worst-case configuration profile and 100C ambient for the I1 industrial grade, the F40 package's typical core power budget is roughly 30-40 W. Plan a heat-spreader or 4-layer thermal interface covering at least 60 percent of the package top, and keep junction-to-ambient thermal resistance below 2 C/W to stay within the 100C limit. Insufficient thermal headroom is the single most common cause of field failures on industrial Arria 10 designs.
Use a 12-layer stack-up with a dedicated transceiver reference layer directly beneath the F40 BGA, following Intel's AN 775 routing guidelines. Estimated: each 14.1 Gbps transceiver lane requires 100-ohm differential impedance controlled to within 10 percent, with a maximum pre-emphasis of -6 dB at the longest trace. Skip the reference plane under the BGA break-out vias to avoid crosstalk into adjacent transceiver channels. Always confirm the pinout in Quartus Prime before freezing the layout.
The Arria 10 device requires multiple rails (0.9 V core, 1.1 V transceiver, 1.8 V/2.5 V/3.3 V I/O) sourced from a sequence-controlled PMIC such as the LTM4677. Estimated inrush can spike to 30 A for 5-10 ms during configuration, so size the input bulk capacitor bank to at least 1,500 uF of low-ESR ceramic. Decoupling must place 0.1 uF and 1 uF capacitors within 2 mm of every power pin pair; missed pins cause rail collapse and silent JTAG failures.
Do not confuse the Arria 10 GX (R) and GT (N) variants - the GT part (10AX115N2F40I1SG) substitutes the transceivers with a different mix of memory and DSP and is not a true drop-in for high-speed serial interfaces. Also avoid mixing industrial (I) and extended (E) speed grades on the same PCB unless the Quartus fitter explicitly tolerates it; pin-compatible does not always mean timing-compatible. Always re-run TimeQuest sign-off when swapping speed bins.
규정 준수 정보
RoHS and REACH compliance per Intel product page. AEC-Q100 not applicable (industrial-grade FPGA, not automotive-qualified).