10AX115U2F45E1SG vs 10AX115U3F45E2SG 비교
다음의 상세 나란히 비교: 10AX115U2F45E1SG 제조: Intel 및 10AX115U3F45E2SG 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | 10AX115U2F45E1SG | 10AX115U3F45E2SG |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $13,900.00 | $5,800.00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 1,150,000 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (bits) | 68,857,600 | — |
| Embedded Memory (Mbits) | 68.86 Mbit | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | Variable-precision, hardened floating-point |
| 18x18 Multipliers | 1,518 | — |
| User I/O Pins | 480 | — |
| Transceiver Channels | 24 | — |
| Max Transceiver Data Rate | 17.4 Gbps (chip-to-chip/backplane) | — |
| Hard Memory Controllers | 6 (DDR4/DDR3/QDRII+/RLDRAM3) | 2 (DDR4/DDR3/QDRII+/RLDRAM3) |
| PCIe Hard IP | PCIe Gen3 x8 | — |
| Process Node | TSMC 20 nm | 20 nm Tri-Gate (Intel) |
| Core Voltage | 0.9 V | — |
| 패키지 | 1932-ball FCBGA, 45 x 45 mm, 1.0 mm pitch | 1932-ball FCBGA (F45, 45×45 mm, 1.0 mm pitch) |
| Grade | E1 (extended industrial, -40C to +100C) | — |
| RoHS 상태 | Compliant | — |
| Logic Elements (LE) | — | 1,150,000 |
| Adaptive Logic Modules (ALM) | — | 427,200 |
| Embedded Memory Bits | — | 68,857,856 (≈ 52.99 Mbit) |
| Number of Transceivers | — | [DATA_NEEDED: per-die transceiver count, F45 package variant] |
| Maximum Transceiver Data Rate | — | 17.4 Gbps |
| Hard PCIe Gen3 IP Blocks | — | 2 × PCIe Gen3 (x8/x4/x2/x1) |
| Speed Grade | — | -2 (E2 commercial/extended) |
| 동작 온도 | — | Industrial (junction -40 °C to +100 °C) – device grade U |
| Supply Voltage Core | — | [DATA_NEEDED: VCC/VCCP core voltage] |
| Configuration Method | — | FPGA configuration via serial/parallel flash, JTAG |
| RoHS Compliance | — | Compliant |
| MSL 레벨 | — | [DATA_NEEDED: MSL rating per JEDEC J-STD-020] |