5CSEBA4U23C7N vs 5CSEBA4U23I7N 비교
다음의 상세 나란히 비교: 5CSEBA4U23C7N 제조: Intel 및 5CSEBA4U23I7N 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | 5CSEBA4U23C7N | 5CSEBA4U23I7N |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $124.50 | $0.00 |
| Family | Cyclone V SE SoC FPGA | — |
| Device Variant | 5CSEA4 (Logic Element density) | — |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| Logic Elements | 40,000 | 40,000 |
| HPS Maximum Core Frequency | 800 MHz | — |
| DSP Blocks (18x18) | 224 | — |
| Embedded Memory | Approximately 2.7 Mbits (M10K + M9K) | — |
| 패키지 | 672-ball UBGAs (UBGA), 23x23 mm | 672-pin UBGA |
| Core Voltage | 1.1 V | — |
| User I/O Count | 364 | — |
| High-Speed Transceivers | 6 (up to 3.125 Gbps) | — |
| PCIe Hard IP | 2 Gen2 blocks | — |
| 동작 온도 | Commercial 0C to +85C (C7 speed grade) | [DATA_NEEDED: operating temperature range] |
| 실장 유형 | Surface Mount (BGA) | Surface Mount |
| RoHS 상태 | Compliant | Compliant |
| Process Technology | TSMC 28 nm low-power | [DATA_NEEDED: process technology] |
| HPS Memory Interface | DDR3, DDR3L, LPDDR2 (16-bit + ECC option) | — |
| Product Type | — | System on Chip (SoC) FPGA |
| FPGA Family | — | Cyclone V SE |
| Processor Subsystem | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Processor Cores | — | 2 |
| Operating Frequency | — | 800 MHz |
| I/O Count | — | 224 |
| 공급 전압 | — | 1.1 V |
| Package Dimensions | — | 23 mm x 23 mm |
| Package Type | — | FBGA |
| Cell Count | — | 40,000 |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Status | — | [DATA_NEEDED: AEC-Q100 qualification] |
| Lead-Free Status | — | [DATA_NEEDED: lead-free status] |
| Transceiver Count | — | [DATA_NEEDED: transceiver count] |
| On-Chip Memory | — | [DATA_NEEDED: on-chip memory capacity] |
| Configuration Method | — | [DATA_NEEDED: configuration method] |