5CSEBA4U23I7N - 40K Logic Elements SoC FPGA | Intel
부품 번호: 5CSEBA4U23I7N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $157.0583 | $157.06 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
5CSEBA4U23I7N 개요
An FPGA is a field-programmable gate array, an integrated circuit whose logic functions are configured after manufacturing. A system-on-chip FPGA, or SoC FPGA, combines programmable logic with processor, memory-controller, and peripheral subsystems. Within the semiconductor hierarchy, it spans FPGA, programmable logic device, SoC, and processor-based embedded system, allowing hardware parallelism and conventional software workloads to coexist.
The 5CSEBA4U23I7N is listed with 40,000 logic elements and 224 I/O. Its 800 MHz description and dual ARM Cortex-A9 MPCore with CoreSight support make it relevant to embedded processing, industrial control, and communications equipment. The 672-UBGA package provides a high-pin-count surface-mount interface, but exact supported I/O standards, transceiver counts, memory capacity, and processor frequency require manufacturer documentation not included in the verified data.
From an architecture perspective, the device separates the processor subsystem from the programmable FPGA fabric. This arrangement can accelerate deterministic control, interface bridging, or signal processing in programmable logic while an operating system runs on the ARM processor subsystem. Board design must provide the specified power rails, configuration storage, clocking, decoupling, and multilayer signal routing appropriate to a 672-pin BGA.
Typical applications include industrial automation controllers, communications infrastructure, machine-vision processing, and embedded systems that need both software control and FPGA logic. Its integration can reduce component count compared with a discrete processor-plus-FPGA design. The 672-UBGA 23 mm by 23 mm package requires careful PCB escape routing, controlled-impedance analysis, and thermal validation.
Designers should treat the 5CSEBA4U23I7N as a high-density BGA SoC FPGA rather than a simple logic IC. Confirm the complete pin assignment, power sequencing, supported memory interfaces, transceiver configuration, and thermal limits from the manufacturer datasheet before schematic release. The verified sources do not provide a complete pinout or those device-level limits.
This page combines verified ordering, package, inventory, and pricing information with explicit data-gap markers. It helps buyers and engineers distinguish confirmed attributes from parameters that must be checked in the Intel Cyclone V device documentation before a production design or cross-brand substitution.
드롭인 대체품: 5CSEBA4U23I7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 5CSEBA4U23I7N (동일 폼 팩터 및 풋프린트) — 차이점: Logic Elements, Package, Embedded Memory, HPS Peripherals, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
이 제품에는 사용 가능한 드롭인 대체품이 없습니다.
대체품 요청5CSEBA4U23I7N 최대 정격 & 전기적 특성
| Product Type | System on Chip (SoC) FPGA |
| FPGA Family | Cyclone V SE |
| Logic Elements | 40,000 |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight |
| Processor Cores | 2 |
| Operating Frequency | 800 MHz |
| I/O Count | 224 |
| 공급 전압 | 1.1 V |
| 패키지 | 672-pin UBGA |
| Package Dimensions | 23 mm x 23 mm |
| Package Type | FBGA |
| 실장 유형 | Surface Mount |
| Cell Count | 40,000 |
| RoHS 상태 | Compliant |
5CSEBA4U23I7N fbga 핀 구성 가이드
5CSEBA4U23I7N(fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 5CSEBA4U23I7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
5CSEBA4U23I7N 적합 용도: 6 애플리케이션s: Industrial Automation Controller, Communications Infrastructure, Machine Vision and Image Processing, Embedded Control Platform, Test and Measurement Equipment, Automotive Electronic Control.
Industrial Automation Controller
The 5CSEBA4U23I7N fits industrial automation controllers that need deterministic programmable logic alongside a software processor. Its 40,000 logic elements can implement machine-control state machines, timing, protocol conversion, and sensor-data processing, while the dual ARM Cortex-A9 MPCore with CoreSight can run communications stacks, diagnostics, and supervisory software. The 224 I/O provide a substantial interface budget for digital sensors, actuators, encoders, and industrial networks. The 1.1 V supply and 672-UBGA package require disciplined power and PCB design. Use the Intel Cyclone V reference design and exact-package pinout to validate I/O bank assignments, clocking, decoupling, and thermal behavior.
추천
Communications Infrastructure
The 5CSEBA4U23I7N is suitable for communications infrastructure that combines packet processing, hardware protocol handling, and embedded software. The FPGA fabric can accelerate framing, filtering, buffering, or interface conversion, while the dual ARM Cortex-A9 MPCore with CoreSight subsystem can manage control-plane tasks and network software. Its 40,000 logic elements and 224 I/O support moderate-complexity designs, but the verified data does not state transceiver count, supported I/O standards, or memory interfaces. Confirm those details in the manufacturer documentation before assigning high-speed lanes. The 672-UBGA package also requires controlled-impedance routing and careful return-path design.
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Machine Vision and Image Processing
The 5CSEBA4U23I7N can support machine-vision systems requiring parallel pixel processing and embedded control. Its 40,000 logic elements are appropriate for selected filtering, line buffering, format conversion, or camera-interface functions, while the dual ARM Cortex-A9 MPCore subsystem can manage acquisition, metadata, networking, and application software. The 224 I/O can connect image sensors, memories, converters, and control peripherals. Actual image throughput depends on logic implementation, clock frequency, memory bandwidth, and I/O configuration, none of which are fully specified in the verified web data. Validate timing and resource utilization with the Intel toolchain and target memory architecture before committing to the 672-UBGA device.
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Embedded Control Platform
The 5CSEBA4U23I7N is a strong fit for embedded control platforms that need both software flexibility and hardware determinism. The dual ARM Cortex-A9 MPCore with CoreSight supports operating-system, device-management, and communication functions, while the FPGA fabric can implement real-time control, data acquisition, and custom interfaces. The 40,000 logic elements provide capacity for moderate control algorithms, and 224 I/O support numerous external devices. Because the verified data does not provide processor clock, memory capacity, peripheral list, or temperature grade, those specifications require manufacturer confirmation. The 1.1 V device should be designed with the manufacturer’s power sequencing and thermal guidance.
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Test and Measurement Equipment
The 5CSEBA4U23I7N can serve in test and measurement equipment where hardware acquisition and embedded analysis must operate together. The 40,000 logic elements can implement timing, trigger logic, digital filtering, and acquisition control, while the dual ARM Cortex-A9 MPCore subsystem can run calibration, display, storage, and communications functions. The 224 I/O allow connections to converters, clocks, and control buses. Designers must verify signal integrity, supported I/O standards, memory interfaces, and operating temperature from the exact device documentation. The 672-UBGA 23 mm by 23 mm package demands a controlled stack-up, robust decoupling, and detailed signal-integrity review.
추천
Automotive Electronic Control
The 5CSEBA4U23I7N may be evaluated for automotive electronic-control designs that combine sensor processing, communications, and embedded software. The FPGA fabric can implement deterministic signal conditioning, protocol bridging, or actuator control, and the dual ARM Cortex-A9 MPCore with CoreSight can support system management and application software. The verified data does not confirm AEC-Q100 qualification, automotive temperature grade, or supported automotive interfaces, so the part should not be selected for safety-related or production automotive use without current Intel documentation. The 672-UBGA package also requires validated power integrity, thermal analysis, BGA assembly controls, and exact-ball verification.
추천
추천 제품 요약
엔지니어링 참조 데이터: 5CSEBA4U23I7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 |
|---|---|
| Package | 672-pin UBGA, 23 mm x 23 mm |
| Brand | Intel |
| Family | Cyclone V SE |
| Logic Elements | 40,000 |
| I/O | 224 |
| Listed Frequency | 800 MHz |
| Supply Voltage | 1.1 V |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight |
| RoHS | Compliant |
| Verified Drop-In Status | Target device |
주요 차별점
- Dual-core ARM Cortex-A9 MPCore with CoreSight integration (vs 5CSEBA4U23C8SN)
- 40,000-logic-element Cyclone V SE configuration (vs 5CSEBA2U23I7N)
- 800 MHz device listing (vs 5CSEBA4U23C7N)
설계 노트
The 672-UBGA package requires a controlled PCB stack-up and escape strategy. Use the manufacturer package drawing to map every ball before schematic capture, then verify the selected fan-out against the board fabricator’s via and microvia rules. Keep high-speed traces over continuous reference planes, minimize via stubs, and maintain uninterrupted return paths. The verified web data confirms 672 pins and 23 mm by 23 mm dimensions but does not provide ball coordinates, so no pin-specific placement should be inferred.
Treat 1.1 V as only the supply-voltage value explicitly present in the verified data. The complete device design may require additional or differently regulated rails for the FPGA fabric, processor subsystem, I/O, memory interfaces, and configuration circuitry. Use the Intel Cyclone V power-design guidance and power estimator to determine voltage tolerances, current demand, sequencing, and decoupling. Place local capacitors at the appropriate power balls and analyze rail droop during simultaneous logic and processor activity.
A 672-pin SoC FPGA requires thermal validation based on actual logic utilization, clock rates, toggle activity, and board airflow. The verified sources do not provide power consumption, thermal resistance, junction-temperature limits, or required airflow, so those values are not specified here. Use the manufacturer thermal model and post-layout simulation with the intended enclosure and operating temperature. Do not assume the 1.1 V supply value alone determines total dissipation.
Plan high-speed interfaces from the exact 5CSEBA4U23I7N datasheet, including supported I/O standards, bank rules, voltage levels, clocking, and any transceiver requirements. The supplied data confirms 224 I/O but does not list I/O-bank assignments or supported memory protocols. Route clocks and critical data with controlled impedance, keep differential pairs length-matched, avoid layer transitions without nearby return vias, and validate timing with the FPGA design tool and board-level signal-integrity model.
규정 준수 정보
The verified Ampheo result lists 5CSEBA4U23I7N as ROHS COMPLIANT. The supplied data does not provide REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations.
