A3PE600-FGG484 - ProASIC3E 600K-Gate Flash FPGA | Microchip
부품 번호: A3PE600-FGG484 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $89.5 | $89.50 |
| 10 | $80.55 | $805.50 |
| 100 | $71.6 | $7,160.00 |
| 500 | $62.65 | $31,325.00 |
| 1,000 | $53.7 | $53,700.00 |
A3PE600-FGG484 개요
A flash-based FPGA is a field-programmable gate array that stores its configuration in on-chip non-volatile flash memory rather than an external configuration device. Within the programmable-logic hierarchy (FPGA -> programmable logic IC -> CMOS digital semiconductor), ProASIC3E occupies the single-chip, reprogrammable segment, offering the live-at-power-up behavior of ASICs with the flexibility of SRAM FPGAs, but without the configuration bootloader or external flash requirement.
Key features include low total cost of ownership through a single-chip solution, 130 nm flash CMOS process technology, reprogrammability for in-field updates, and abundant advanced features such as embedded RAM blocks and high-performance I/O structures. The commercial temperature grading suits cost-sensitive volume applications.
Technically, ProASIC3E combines a Sea-of-Gates-style fabric with VersaTiles (each based on a 3-input lookup structure) and dedicated embedded SRAM blocks. Because configuration data resides in flash, the device is inherently secure against bitstream interception, has zero configuration time at power-up, and offers very low static power consumption compared with SRAM FPGAs of similar density.
Typical applications include industrial automation and motor control, aerospace and defense subsystems, communications bridging, medical instrumentation, and test equipment glue logic, where the 270 available user I/Os and flash persistence simplify board design.
A key design consideration is power supply ordering: with a flash fabric, the 1.5 V core rail should be stable before I/O banks ramp to avoid latch-up risk, and decoupling per the manufacturer power-up guidelines is mandatory. Signal integrity on the 1 mm-pitch FBGA requires careful via escape planning on high-layer-count boards.
This page synthesizes distributor pricing context, drop-in family alternatives, cross-reference information, and practical design notes not found in the manufacturer datasheet, providing a single decision-ready resource for FPGA sourcing engineers.
드롭인 대체품: A3PE600-FGG484 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3PE600-FGG484 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Configuration Memory, Operating Temperature, RoHS Status, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3PE600-FGG484I
✅ 드롭인✓ 재고 있음
$44.03 / 개
데이터시트 보기 →A3PE600-1FGG484
✅ 드롭인✓ 재고 있음
$44.9 / 개
데이터시트 보기 →A3PE600-FG484M
✅ 드롭인✓ 재고 있음
$68.9 / 개
데이터시트 보기 →A3PE600L-FGG484M
✅ 드롭인✓ 재고 있음
$79.9 / 개
데이터시트 보기 →A3PE600L-FG484M
✅ 드롭인✓ 재고 있음
$44.9 / 개
데이터시트 보기 →A3P600-FGG484
✅ 드롭인✓ 재고 있음
$44.75 / 개
데이터시트 보기 →A3PE600-FGG484 최대 정격 & 전기적 특성
| Family | ProASIC3E |
| System Gates | 600000 |
| Configurable Logic Blocks (CLBs) | 13824 |
| Logic Cells | 13824 |
| Embedded RAM | 110592 bits |
| User I/O | 270 |
| Maximum System Frequency | 350 MHz |
| Supply Voltage (Core) | 1.425 V to 1.575 V |
| Process Technology | 130 nm CMOS flash |
| Configuration Memory | On-chip flash (non-volatile, live at power-up) |
| 패키지 | FBGA-484 (PBGA484) |
| Package Dimensions | 23 x 23 mm, 2.23 mm height, 1 mm pitch |
| Terminal Type | Ball (BGA) |
| 장착 스타일 | Surface Mount |
| Temperature Grading | Commercial |
| Number of Pins / Balls | 484 |
A3PE600-FGG484 23 x 23 mm, 2.23 mm height, 1 mm pitch 핀 구성 가이드
A3PE600-FGG484(23 x 23 mm, 2.23 mm height, 1 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3PE600-FGG484.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3PE600-FGG484 적합 용도: 6 애플리케이션s: Industrial Automation and Motor Control, Aerospace and Defense Subsystems, Communications Bridging and Line Cards, Medical Instrumentation, Test and Measurement Equipment, Secure Embedded Control and IoT Gateways.
Industrial Automation and Motor Control
The A3PE600-FGG484 fits industrial automation because its 270 user I/Os can simultaneously drive multiple PWM channels, interface quadrature encoders, and bridge fieldbus transceivers without external glue logic. Its flash fabric is live within microseconds at power-up, enabling deterministic safety sequencing that SRAM FPGAs cannot match during configuration boot. With 13,824 CLBs and up to 350 MHz system performance, it handles multi-axis PWM generation, current-loop feedback math, and Modbus/CAN bridging in one 23 x 23 mm chip. Designers should place a 10 uF bulk capacitor per I/O bank and follow Microchip power-up sequencing so the 1.5 V core stabilizes before bank voltages ramp, avoiding I/O contention during startup in shared-bus installations.
추천
Aerospace and Defense Subsystems
Flash-based ProASIC3E devices are widely used in aerospace and defense because the on-chip flash configuration resists bitstream interception and eliminates external configuration memory - reducing failure points in radiation-sensitive and secure programs. The A3PE600-FGG484 provides 600K gates and 110592 bits of embedded RAM for telemetry framing, sensor fusion preprocessing, and bus protocol bridging (MIL-STD-1553 glue, ARINC interfaces at board level). The live-at-power-up behavior matters for mission sequencing where no configuration delay is acceptable. For extended-temperature programs, the pin-compatible A3PE600-FGG484I should be selected instead of the commercial-graded base part, since both share the identical FBGA-484 footprint and can be swapped with zero PCB or firmware redesign.
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Communications Bridging and Line Cards
In networking line cards and protocol bridges, the A3PE600-FGG484 maps packet-processing glue logic, status aggregation, and backplane interfacing into one device. The 270 user I/Os support wide parallel buses to PHYs and switch fabrics, while 13,824 CLBs implement state machines for flow control and framing at up to 350 MHz internal performance. Because configuration is stored in flash, line cards enumerate instantly at slot insertion, avoiding the configuration latency of SRAM FPGAs that can stall hot-swap bring-up. Designers should budget embedded RAM carefully at 110592 bits - deep packet buffering belongs in external memory, keeping this device focused on control-plane glue and low-latency datapath stitching where its zero-boot architecture delivers measurable availability gains.
추천
Medical Instrumentation
Medical diagnostic devices benefit from the A3PE600-FGG484's deterministic power-up: front-end acquisition boards become functional immediately, and the flash fabric's low static power reduces thermal noise contribution in sensitive analog neighborhoods. The 600K-gate fabric implements trigger logic, decimation filters, and interface translation between ADCs, USB/UART bridges, and display controllers using the 270 I/Os across independently supplied banks supporting 3.3 V, 2.5 V, and 1.8 V signaling. Its reprogrammability supports in-field firmware feature updates and calibration changes without device replacement - important for devices with long service lives and regulatory change cycles. Choose the industrial-grade FGG484I drop-in where equipment must tolerate broad ambient ranges in clinical environments.
추천
Test and Measurement Equipment
Bench instruments and automated test fixtures use the A3PE600-FGG484 for timing generation, pattern capture, and host-to-hardware interfacing. The 350 MHz system performance supports high-resolution event timing, while 13,824 CLBs implement pattern generators and comparators spanning up to 270 channels through the FBGA-484 I/O structure. Flash persistence eliminates reconfiguration delays between test sequences, improving throughput in rack-and-stack systems that power-cycle DUTs repeatedly. The 1 mm ball pitch simplifies escape routing to dense connector fields on 6-8 layer boards. For designs needing more capture depth, the pin-compatible A3PE3000L-FGG484 up-migration path requires no footprint change, letting one PCB platform span multiple instrument price points.
추천
Secure Embedded Control and IoT Gateways
The A3PE600-FGG484 suits secure embedded controllers where design IP protection matters: ProASIC3E flash configuration cannot be read back as a bitstream in the way SRAM FPGA data can during boot, raising the bar against design cloning. A gateway application typically uses 13,824 CLBs for sensor aggregation, custom serial protocols, and security state machines, with 110592 bits of embedded RAM for FIFO buffering between heterogeneous interfaces. Zero-configuration power-up means watchdog and safety interlock logic is active before a host microcontroller completes its own boot, enabling layered supervision. The 1.5 V core keeps static power low for always-on nodes; designers should verify bank voltage assignments early since 270 I/Os must be budgeted across supply domains deliberately.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3PE600-FGG484 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3PE600-FGG484I | A3PE600-1FGG484 | A3PE600-FG484 | A3PE600L-FGG484M | A3P600-FGG484 |
|---|---|---|---|---|---|---|
| Package | FBGA-484 (23 x 23 mm, 1 mm pitch) | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 | 600000 | 600000 |
| User I/O | 270 | 270 | 270 | 270 | 270 | 270 |
| CLBs / Logic Cells | 13824 | 13824 | 13824 | 13824 | 13824 | 13824 |
주요 차별점
- Zero-configuration flash architecture (vs A3P600-FGG484 (and all SRAM FPGAs))
- Extended-temperature availability on same footprint (vs A3PE600-FGG484I)
- Timing headroom within same package (vs A3PE600-1FGG484)
- Lower static power option (vs A3PE600L-FGG484M)
설계 노트
ProASIC3E flash FPGAs are live at power-up, so I/O behavior during rail ramp matters. Follow the Microchip ProASIC3E datasheet power-up sequencing guidance: allow the 1.5 V core rail (1.425 V to 1.575 V) to stabilize before I/O bank supplies ramp, and respect the specified rail ramp rates to avoid undefined I/O states or excess inrush. Place 10 uF bulk decoupling plus 0.1 uF ceramic capacitors at each bank supply, distributed near the FBGA-484 balls, and verify the total supply ramp sequence against your design in Libero timing/power simulation.
The 23 x 23 mm, 1 mm-pitch FBGA-484 requires disciplined escape routing. Plan at least one via-in-pad or dog-bone per inner ball on an 8-layer stackup, dedicating inner layers to a solid ground plane for return-current integrity across the 270 I/Os. Assign high-speed or wide buses to outer banks with short escape paths, and reserve board area around the device for bank supply decoupling. Reference the manufacturer package and ballout tables in the datasheet for exact ball coordinates before footprint generation.
Two recurring pitfalls with this part: (1) substituting the commercial-graded A3PE600-FGG484 into environments beyond its commercial temperature range - use the drop-in A3PE600-FGG484I instead, no redesign required; (2) under-budgeting the 110592-bit embedded RAM - deep buffering designs should shift storage to external memory or migrate up-family to the pin-compatible A3PE3000L-FGG484. Also confirm speed grade requirements early: upgrading to the -1 grade (A3PE600-1FGG484) is a drop-in, but downgrading timing-critical designs is not recoverable without redesign.
규정 준수 정보
Distributor data (FindIC/Jotrin) lists the package as GREEN, indicating RoHS-compliant lead-free, halogen-free construction. Formal material declarations should be requested from Microchip.
