A3PE3000L-1FGG896 vs A3PE3000L-1FGG896I 비교

다음의 상세 나란히 비교: A3PE3000L-1FGG896 제조: Microchip Technology 및 A3PE3000L-1FGG896I 제조: Microchip Technology. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

Microchip Technology
A3PE3000L-1FGG896 A3PE3000L-1FGG896 - 3M-Gate ProASIC3L Flash FPGA | Microchip

A3PE3000L-1FGG896 - 3M-Gate ProASIC3L Flash FPGA | Microchip

A3PE3000L-1FGG896 ✓ 활성
Microchip Technology
A3PE3000L-1FGG896I A3PE3000L-1FGG896I - 3M Gate Low-Power Flash FPGA | Microchip

A3PE3000L-1FGG896I - 3M Gate Low-Power Flash FPGA | Microchip

A3PE3000L-1FGG896I ✓ 활성

사양 비교

파라미터 A3PE3000L-1FGG896 A3PE3000L-1FGG896I
브랜드 Microchip Technology Microchip Technology
카테고리 FPGA & CPLD FPGA & CPLD
수명 주기 상태 활성 활성
재고 상태 In Stock In Stock
단가 (USD) $255.00 $0.00
Family ProASIC3L ProASIC3L (Flash FPGAs with Flash*Freeze)
System Gates 3000000 3000000
Logic Cells 75264 —
User I/O 620 620
Total Bits of RAM [DATA_NEEDED: Total embedded RAM bits] —
Core Voltage 1.2 V (supports 1.2 V to 1.5 V) 1.2 V to 1.5 V
I/O Voltage As low as 1.2 V —
Speed Grade -1 -1
Process Technology 130 nm flash 130-nm, 7-layer metal (6 copper), flash-based CMOS
Configuration Memory Nonvolatile flash (single-chip) —
Special Features Flash*Freeze technology —
패키지 896-ball FBGA (FGG896), 1.00 mm pitch 896-ball FBGA, 1 mm pitch
실장 유형 Surface Mount Surface Mount
Packaging Tray —
Terminal Pitch 1.00 mm —
Technology Base CMOS flash —
Dynamic Power Reduction vs ProASIC3 Approx. 40% —
Static Power Reduction vs ProASIC3 Approx. 50% —
Embedded SRAM — 504 kbits true dual-port
PLLs — 6
Maximum System Performance — Approx. 272 MHz
Configuration Technology — Nonvolatile flash, single-chip, Instant On
Low Power Feature — Flash*Freeze Technology
동작 온도 — -40C to +85C (industrial, I suffix)
Logic Family — CMOS
Power-Up Support — Live at Power-Up Level 0
RoHS 상태 — [DATA_NEEDED: RoHS status]

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