A3PE3000L-1FGG896 - 3M-Gate ProASIC3L Flash FPGA | Microchip
부품 번호: A3PE3000L-1FGG896 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $350 | $350.00 |
| 10 | $325 | $3,250.00 |
| 100 | $298 | $29,800.00 |
| 500 | $275 | $137,500.00 |
| 1,000 | $255 | $255,000.00 |
A3PE3000L-1FGG896 개요
A field-programmable gate array (FPGA) is an integrated circuit that engineers configure after manufacturing to implement custom digital logic. Within the power-management hierarchy of programmable logic, the ProASIC3L family sits in Microchip's (formerly Microsemi/Actel) flash FPGA lineup, distinguished from SRAM FPGAs by its nonvolatile flash configuration cells, which eliminate the external boot flash and enable true single-chip operation with instant-on power-up.
Key features of the A3PE3000L-1FGG896 include Flash*Freeze technology, which dramatically cuts dynamic and static power while retaining SRAM state and running I/Os; 1.2 V to 1.5 V core and I/O operation with I/O rails as low as 1.2 V; 130 nm flash process technology; and reprogrammability with secure, live-at-power-up configuration. Compared with the equivalent ProASIC3 device, the ProASIC3L reduces dynamic power by roughly 40% and static power by about 50%.
Technically, the fabric is built from Versatile logic elements organized into 75,264 cells, supporting both sequential and combinational designs, with embedded memory blocks and high-performance I/O structures supporting multiple single-ended and differential standards. The -1 speed grade balances performance against power for mainstream designs; FPGAkey lists the family clock-related figure of 892.86 MHz for the underlying technology parameters.
Typical applications include portable and battery-powered instrumentation, industrial control, medical monitoring equipment, communications line cards, and aerospace subsystems where single-chip, low-static-power programmable logic is required.
A key design consideration is thermal and power budgeting: although the Flash*Freeze mode minimizes consumption, designers must still verify I/O bank voltage assignments and ensure adequate decoupling on the multiple VCC/VCCI rails.
This page synthesizes distributor pricing, drop-in alternatives, comparison data, and practical design notes not found in the manufacturer datasheet, providing a complete sourcing and engineering reference.
드롭인 대체품: A3PE3000L-1FGG896 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3PE3000L-1FGG896 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Family, Process Technology, Configuration Memory, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3PE3000L-FGG896
✅ 드롭인✓ 재고 있음
$55 / 개
데이터시트 보기 →A3PE3000L-1FGG896I
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →A3PE3000L-FG896
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →A3PE3000L-FG896I
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →A3PE3000L-1FG896YM
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A3PE3000L-1FGG896M
✅ 드롭인✓ 재고 있음
$432 / 개
데이터시트 보기 →A3PE3000L-1FGG896 최대 정격 & 전기적 특성
| Family | ProASIC3L |
| System Gates | 3000000 |
| Logic Cells | 75264 |
| User I/O | 620 |
| Core Voltage | 1.2 V (supports 1.2 V to 1.5 V) |
| I/O Voltage | As low as 1.2 V |
| Speed Grade | -1 |
| Process Technology | 130 nm flash |
| Configuration Memory | Nonvolatile flash (single-chip) |
| Special Features | Flash*Freeze technology |
| 패키지 | 896-ball FBGA (FGG896), 1.00 mm pitch |
| 실장 유형 | Surface Mount |
| Packaging | Tray |
| Terminal Pitch | 1.00 mm |
| Technology Base | CMOS flash |
| Dynamic Power Reduction vs ProASIC3 | Approx. 40% |
| Static Power Reduction vs ProASIC3 | Approx. 50% |
A3PE3000L-1FGG896 896-ball fbga (fgg896), 1.00 mm pitch 핀 구성 가이드
A3PE3000L-1FGG896(896-ball fbga (fgg896), 1.00 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3PE3000L-1FGG896.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3PE3000L-1FGG896 적합 용도: 6 애플리케이션s: Portable and Battery-Powered Instrumentation, Industrial Control and Automation, Medical Monitoring and Diagnostic Equipment, Communications Line Cards and Network Processing, Aerospace and Defense Subsystems, Test and Measurement Equipment.
Portable and Battery-Powered Instrumentation
The A3PE3000L-1FGG896 fits portable instrumentation because its ProASIC3L fabric cuts static power roughly 50% versus standard ProASIC3 and its Flash*Freeze mode drops the 3M-gate device into ultra-low-power standby while retaining SRAM state and live I/Os. The 1.2 V core and I/O rails as low as 1.2 V minimize dynamic power, which scales with the square of voltage. In a handheld data logger or field tester, the FPGA processes sensor interfaces continuously, then enters Flash*Freeze between measurement cycles, extending battery life substantially. Nonvolatile flash configuration also means no boot energy is spent loading a bitstream, an advantage over SRAM FPGAs in duty-cycled systems.
추천
Industrial Control and Automation
In industrial controllers, motor-communication gateways, and factory automation nodes, the A3PE3000L-1FGG896 provides 75,264 logic cells and 620 user I/Os to glue together PLC backplanes, fieldbus transceivers, and safety interlocks on a single chip. The nonvolatile flash fabric powers up instantly and functional at power-up - critical for machinery that must be operational immediately after energization, without a configuration controller. The -1 speed grade balances timing performance with power, and industrial-temperature sibling A3PE3000L-1FGG896I covers harsh environments. Multiple I/O banks operating down to 1.2 V let one device bridge legacy 3.3 V signals and modern low-voltage peripherals.
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Medical Monitoring and Diagnostic Equipment
Medical patient monitors, ultrasound front ends, and diagnostic analyzers benefit from the A3PE3000L-1FGG896's combination of density (3M gates, 75,264 cells) and quiet, low-power operation. The flash-based fabric generates no configuration bus switching noise at power-up and supports instant-on operation required for devices that must respond immediately in clinical settings. The 620 I/Os interface high-channel-count sensor arrays, while the 1.2 V I/O banks connect directly to modern low-voltage ADCs. Flash*Freeze lets bedside devices remain responsive to wake-up events while dramatically reducing standby draw, extending operation on battery backup during patient transport.
추천
Communications Line Cards and Network Processing
For telecom and networking line cards, the A3PE3000L-1FGG896 implements protocol bridging, framing, and backplane interface logic where 620 I/Os enable wide parallel data paths to PHYs and framers. The ProASIC3L fabric's reduced static power matters in racks where hundreds of cards are energized continuously; Flash*Freeze provides additional savings on standby or lightly utilized ports. Nonvolatile configuration means a card is live within microseconds of slot insertion, simplifying hot-swap sequencing versus SRAM FPGAs that must be configured over a bus. Multiple voltage banks (down to 1.2 V) interface directly with modern low-voltage transceiver components.
추천
Aerospace and Defense Subsystems
Microsemi (now Microchip) flash FPGAs have a long heritage in aerospace payloads and defense electronics, and the A3PE3000L-1FG896YM military-grade ordering variant of this same die serves those programs. The single-chip, nonvolatile flash configuration eliminates the configuration-store attack surface and improves boot reliability in radiation-prone or secure environments. The 3M-gate density handles sensor preprocessing, telemetry formatting, and bus interface (MIL-STD-class functions implemented in fabric), while Flash*Freeze supports duty-cycled satellite payloads where average power is strictly budgeted. Designers should consult Microchip's aerospace documentation for the appropriate qualified variant and flow.
추천
Test and Measurement Equipment
Bench instruments, automated test equipment (ATE), and logic analyzers exploit the A3PE3000L-1FGG896's 75,264 logic cells for real-time trigger engines, pattern generators, and timing-correlation logic. The 620 user I/Os connect to dense channel arrays, and the 1.00 mm pitch 896-ball FBGA escapes signals across multiple board layers with 8+ layer stackups typical of T&M hardware. Instant-on flash configuration lets the instrument be measurement-ready the moment power is applied - an ergonomic advantage for bench users. The -1 speed grade provides ample timing margin for channel rates typical of mainstream instrumentation while keeping power and cost below faster speed grades.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3PE3000L-1FGG896 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3PE3000L-FGG896 | A3PE3000L-1FGG896I | A3PE3000L-FG896 | A3PE3000L-1FG896YM | A3PE3000L-1FGG896M |
|---|---|---|---|---|---|---|
| Package | 896-ball FBGA (FGG896), 1.00 mm pitch | 896-ball FBGA (FGG896) - same | 896-ball FBGA (FGG896) - same | 896-ball FBGA (FG896) - same footprint, standard finish | 896-ball FBGA (FG896) - same footprint | 896-ball FBGA (FGG896) - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| Logic Cells | 75264 | 75264 | 75264 | 75264 | 75264 | 75264 |
| User I/O | 620 | 620 | 620 | 620 | 620 | 620 |
| Speed Grade | -1 | different (no -1 suffix) | -1 | different (no -1 suffix) | -1 | -1 |
| Core Voltage | 1.2 V (1.2 V to 1.5 V) | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V |
| Flash*Freeze Technology | Yes | Yes | Yes | Yes | Yes | Yes |
| Configuration | Nonvolatile flash (single-chip) | Nonvolatile flash | Nonvolatile flash | Nonvolatile flash | Nonvolatile flash | Nonvolatile flash |
주요 차별점
- Low-power ProASIC3L fabric with Flash*Freeze (vs A3PE3000-FGG324I)
- Nonvolatile single-chip flash configuration (vs SRAM FPGAs (functional class))
- Maximum I/O count in the family package (vs A3PE3000L-FGG324I)
- Trade-off: speed grade (vs A3PE3000L-FGG896)
설계 노트
Plan the power tree around the ProASIC3L's dual-rail scheme: a 1.2 V to 1.5 V core rail (1.2 V recommended for lowest dynamic power) and per-bank VCCI rails that may go as low as 1.2 V. Power scales roughly with the square of voltage, so running core and I/O at 1.2 V instead of 1.5 V yields significant savings in a 3M-gate design. Use Flash*Freeze aggressively for idle states - it retains SRAM and keeps I/Os live - and sequence the Flash*Freeze pin through controlled logic so the device never enters the mode while timing-critical transactions are in flight.
The 896-ball FBGA at 1.00 mm pitch requires a fine-pitch capable assembly process and an 8+ layer PCB with microvia or via-in-pad fanout. Follow the manufacturer datasheet's recommended land pattern and ball-map escape routing (fanout typically on 0.5 mm via grids). Assign I/O banks before finalizing the schematic: each bank has a VCCI rail, and mixing voltage standards within one bank is not permitted. Reserve ground balls adjacent to high-toggle I/O clusters and place 0.1 uF ceramic decoupling capacitors on the underside directly under the BGA, plus bulk capacitance at each rail.
Do not confuse ordering-code variants: FGG denotes lead-free ball finish and FG the standard finish; -I is industrial temperature, Y the military variant, and the -1 digit is the speed grade. Substituting across these requires verifying temperature and finish requirements, and any speed-grade change may break worst-case timing closure - re-run static timing analysis in Libero after any substitution. Also verify via the current Microchip datasheet revision that your chosen part status is active, since the family originated at Actel/Microsemi and some ordering codes have been consolidated.
규정 준수 정보
The FGG suffix denotes lead-free/RoHS ball metallurgy per Microchip ordering-code convention; Mouser lists A3PE3000L-FGG896 as LEAD FREE. REACH, halogen-free, and conflict-minerals status not stated in provided data.
