A3PE600-1FGG256 - ProASIC3E Flash FPGA 600K Gates | Microchip
부품 번호: A3PE600-1FGG256 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $62.5 | $62.50 |
| 10 | $56.25 | $562.50 |
| 100 | $48.75 | $4,875.00 |
| 500 | $43.1 | $21,550.00 |
| 1,000 | $38.9 | $38,900.00 |
A3PE600-1FGG256 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks, routing resources, and I/O cells that designers program to implement custom digital circuits. Unlike SRAM-based FPGAs, the ProASIC3E family stores its configuration in on-chip flash, making it a single-chip, live-at-power-up solution that needs no external boot PROM and offers high resistance to configuration tampering.
Key features include flash-based, reprogrammable fabric on a 130-nm, 7-layer-metal (6 copper) CMOS process, true dual-port SRAM of up to 504 kbits across the family, single-chip operation with Live-At-Power-Up Level 0 support, and a low total cost of ownership as an ASIC replacement. The -1 speed grade balances performance with power, and FG256/FG484 packages are footprint-compatible, easing future migration.
The ProASIC3E architecture combines programmable logic tiles with embedded flash switching, delivering deterministic, instant-on behavior suited to glue logic consolidation, bus bridging, and secure control functions. Differential I/O support reduces single-ended I/O counts by two per pair when used.
Typical applications include consumer electronics, networking and communications equipment, computing platforms, industrial control, and avionics subsystems, where its instant-on flash fabric and single-chip footprint simplify power sequencing and board design.
A key design consideration: each differential pair consumes two single-ended I/Os, so budget I/O accordingly; voltage-referenced standards require one VREF pin per I/O minibank.
This page synthesizes distributor availability data, same-package drop-in variants, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: A3PE600-1FGG256 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3PE600-1FGG256 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Configuration Memory, Operating Temperature, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3PE600-1FGG256I
✅ 드롭인✓ 재고 있음
$33.5 / 개
데이터시트 보기 →A3PE600-FGG256
✅ 드롭인✓ 재고 있음
$19.6 / 개
데이터시트 보기 →A3PE600-FGG256I
✅ 드롭인✓ 재고 있음
$41.8 / 개
데이터시트 보기 →A3PE600-2FGG256
✅ 드롭인✓ 재고 있음
$33.15 / 개
데이터시트 보기 →A3PE600-2FGG256I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
M1AFS600-1FGG256
✅ 드롭인✓ 재고 있음
$191.1 / 개
데이터시트 보기 →M7AFS600-1FGG256
✅ 드롭인✓ 재고 있음
$92 / 개
데이터시트 보기 →A3PE600-1FGG256 최대 정격 & 전기적 특성
| Family | ProASIC3E |
| System Gates | 600000 |
| Logic Elements | 7K LEs |
| User I/O | 165 |
| Registers | 110592 |
| Core Supply Voltage | 1.5 V |
| Maximum System Frequency | 272 MHz |
| Process Technology | 130-nm, 7-layer metal (6 copper) flash-based CMOS |
| Configuration Memory | On-chip flash (single-chip, live-at-power-up) |
| Speed Grade | -1 |
| 동작 온도 | 0 C to +70 C |
| 패키지 | 256-LBGA (FBGA-256, 1 mm ball pitch) |
| 실장 유형 | Surface Mount |
| Logic Family | CMOS |
| Embedded Memory (family max) | Up to 504 kbits True Dual-Port SRAM |
| Power-Up Support | Live-At-Power-Up Level 0 |
| Reprogrammability | Yes (flash-based, in-system reprogrammable) |
A3PE600-1FGG256 256-lbga (fbga-256, 1 mm ball pitch) 핀 구성 가이드
A3PE600-1FGG256(256-lbga (fbga-256, 1 mm ball pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3PE600-1FGG256.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3PE600-1FGG256 적합 용도: 6 애플리케이션s: Networking and Communications Equipment, Avionics and Defense Subsystems, Industrial Control and Automation, Computing Platforms and Server Backplanes, Consumer Electronics, ASIC Prototyping and Emulation.
Networking and Communications Equipment
The A3PE600-1FGG256 fits switch, router, and backplane control-plane designs where 165 user I/Os bridge multiple bus domains and the flash fabric comes up instantly at power-on - no configuration PROM means line cards meet tight power-on-to-ready windows. Its 272 MHz (-1 grade) system performance handles packet framing, status aggregation, and LED/PHY supervision, while true dual-port SRAM buffers descriptor queues. Because it is single-chip, board BOM cost and sequencing risk drop versus SRAM FPGAs. Use the differential I/O capability for clock pairs, remembering each pair consumes two single-ended I/Os from the 165 available.
추천
Avionics and Defense Subsystems
Flash-based configuration gives the A3PE600-1FGG256 inherent immunity to bitstream tampering and single-event configuration upsets that affect SRAM FPGAs, which is why Microchip targets the ProASIC3E family at avionics markets. In mission-computer I/O, sensor-interface, and ARINC-style bus glue logic, the live-at-power-up fabric removes boot sequencing from the safety case, and the single-chip solution reduces board-level parts counts. The 600K system gates absorb protocol bridges and discrete-discrete interfaces; select the A3PE600-1FGG256I industrial variant and consult Microchip for program-specific screening when temperature or quality flow-down applies.
추천
Industrial Control and Automation
In PLC I/O modules, motor-control supervisory logic, and machine-vision trigger engines, the A3PE600-1FGG256 consolidates glue logic that previously needed several CPLDs and discrete parts. Its flash configuration survives brown-outs and powers up instantly, so machinery resumes deterministic behavior after faults - no reload from external memory. The 1.5V core keeps dynamic power low in always-on panels, and 165 I/Os interface 24V-buffered logic, encoders, and HMI buses. Designers should hold I/O-bank voltages within datasheet limits and reserve VREF pins per minibank when voltage-referenced standards are used on mixed-voltage boards.
추천
Computing Platforms and Server Backplanes
Server and storage backplanes use the A3PE600-1FGG256 as a system-management fabric: it aggregates SMBus/PMBus status, drives FRU EEPROM access, sequences power-supply enables, and implements hot-swap handshake logic. The flash fabric is live before the main CPUs boot, letting the FPGA enforce correct power-up order - a task SRAM FPGAs cannot perform without external boot memory. The 272 MHz class performance covers management-bus Bridging comfortably, and true dual-port SRAM implements small FIFOs between asynchronous clock domains. Footprint compatibility with FG484 variants gives a migration path when channel counts grow.
추천
Consumer Electronics
Microchip positions ProASIC3E as a cost-effective ASIC replacement for consumer products, and the A3PE600-1FGG256 fits display timing controllers, interface translation, and feature-bridging roles where ASIC NRE is unjustified. The single-chip flash solution eliminates the configuration flash that inflates BOM cost on consumer boards, and reprogrammability lets one PCB serve multiple SKUs through different programmed images. Low static power suits battery-adjacent and standby-path circuitry. For cost-down production runs, the standard-speed A3PE600-FGG256 variant in the same FBGA-256 footprint drops in without layout changes when timing margin allows.
추천
ASIC Prototyping and Emulation
Design teams use the A3PE600-1FGG256 to prototype ASIC control blocks before committing to masks: the 600K-gate fabric absorbs RTL at moderate scale, the flash fabric loads at power-up for bench bring-up, and reprogrammability supports iterative verification. The 1 mm-pitch FBGA-256 keeps the prototype board compact, and footprint compatibility across FG256/FG484 lets a single carrier board host multiple member sizes when the design grows. True dual-port SRAM models embedded memories from the ASIC netlist. Remember that each differential pair consumes two of the 165 single-ended I/Os, so plan pin multiplexing for probe access early.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3PE600-1FGG256 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3PE600-1FGG256I | A3PE600-FGG256 | A3PE600-2FGG256 | M1AFS600-1FGG256 |
|---|---|---|---|---|---|
| Package | 256-LBGA (FBGA-256) | 256-LBGA (FBGA-256) - same | 256-LBGA (FBGA-256) - same | 256-LBGA (FBGA-256) - same | 256-LBGA (FBGA-256) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 | 600K-class (Fusion) |
| Speed Grade / Max Frequency | -1 / 272 MHz class | -1 / 272 MHz class | Standard (slower than -1) | -2 (faster than -1) | -1 (Fusion family) |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V core (plus analog supplies) |
| Configuration Memory | On-chip flash (single-chip) | On-chip flash | On-chip flash | On-chip flash | On-chip flash (Fusion) |
| Extra Features | None (pure fabric) | None | None | None | Analog peripherals: ADC, eRAM, RTC |
주요 차별점
- Instant-on flash configuration - no boot PROM (vs SRAM-based competitor FPGAs (Xilinx/Intel equivalents))
- Footprint migration path within same package (vs A3PE600-1FGG484 family members)
- Trade-off: lower fabric performance than SRAM FPGAs (vs A3PE600-2FGG256)
설계 노트
The A3PE600-1FGG256 core runs from 1.5V while I/O banks take separate rails (supporting multiple standards). Because the flash fabric is live-at-power-up, all rails must respect the datasheet power-up ramp and sequencing requirements - avoid uncontrolled rail contention during hot-socket or staged power events. Decouple each supply pin pair with at least 0.1 uF ceramic capacitors placed within 2 mm of the ball via, plus bulk 10 uF per rail. Verify actual core current with your design in Libero power analysis; 130-nm flash fabric has low static current but switching current scales with clock activity.
The 1 mm-pitch FBGA-256 requires a controlled-impedance stackup and via-in-pad or dog-bone escape patterns; plan at least one buried via layer for inner-row ball escapes. FG256 and FG484 are footprint-compatible per the datasheet, so a carrier layout that anticipates FG484 enables future density migration. Keep configuration and JTAG traces short and, in noisy environments, protect TCK with series termination. Reserve a VREF pin per I/O minibank whenever voltage-referenced standards (e.g., SSTL-class) are assigned in that bank.
Two frequently missed datasheet constraints: (1) each used differential I/O pair reduces the single-ended I/O count by two, so a design heavy on LVDS-style pairs can silently exceed the 165-I/O budget - perform I/O budgeting before pin placement; (2) the -1 speed grade tops out around the 272 MHz class, so high-throughput paths may fail timing and require the -2 grade - same footprint, but confirm timing in static analysis, not estimates. Also, the commercial-grade part is rated 0 C to +70 C only; use the "I" industrial variant for extended temperature environments rather than relying on derating.
규정 준수 정보
Verified web data did not include compliance certificates. Microchip's current production ProASIC3E devices are generally offered in RoHS-compliant packaging - request the material declaration from Microchip or your distributor before ordering.
