A3PE600-FGG484 vs A3P600-FGG484 비교
다음의 상세 나란히 비교: A3PE600-FGG484 제조: Microchip Technology 및 A3P600-FGG484 제조: Microchip Technology. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Microchip Technology
A3PE600-FGG484 - ProASIC3E 600K-Gate Flash FPGA | Microchip
A3PE600-FGG484 ✓ 활성사양 비교
| 파라미터 | A3PE600-FGG484 | A3P600-FGG484 |
|---|---|---|
| 브랜드 | Microchip Technology | Microchip Technology |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $53.70 | $44.75 |
| Family | ProASIC3E | ProASIC3 |
| System Gates | 600000 | 600K |
| Configurable Logic Blocks (CLBs) | 13824 | — |
| Logic Cells | 13824 | — |
| Embedded RAM | 110592 bits | — |
| User I/O | 270 | — |
| Maximum System Frequency | 350 MHz | 231 MHz |
| Supply Voltage (Core) | 1.425 V to 1.575 V | — |
| Process Technology | 130 nm CMOS flash | 130 nm CMOS |
| Configuration Memory | On-chip flash (non-volatile, live at power-up) | Flash-based (non-volatile, single chip) |
| 패키지 | FBGA-484 (PBGA484) | 484-Pin FBGA (FGG484) |
| Package Dimensions | 23 x 23 mm, 2.23 mm height, 1 mm pitch | — |
| Terminal Type | Ball (BGA) | — |
| 장착 스타일 | Surface Mount | — |
| Temperature Grading | Commercial | — |
| RoHS 상태 | Green / [DATA_NEEDED: RoHS compliance detail] | Lead Free |
| Number of Pins / Balls | 484 | — |
| Core Supply Voltage | — | 1.5 V |
| User I/O Count | — | 235 |
| 실장 유형 | — | Surface Mount |
| Terminal Form | — | Ball |
| Package Shape | — | Square BGA |
| Temperature Grade | — | Commercial |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |
| Operating Temperature Minimum | — | 0 C |
| Operating Temperature Maximum | — | [DATA_NEEDED: maximum operating temperature] |
| Number of Logic Elements (LEs) | — | [DATA_NEEDED: logic element count] |
| Embedded Memory | — | [DATA_NEEDED: embedded SRAM capacity] |